CN105470220A - Cooling fin surface mount package part capable of preventing material overflow - Google Patents

Cooling fin surface mount package part capable of preventing material overflow Download PDF

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Publication number
CN105470220A
CN105470220A CN201510902393.XA CN201510902393A CN105470220A CN 105470220 A CN105470220 A CN 105470220A CN 201510902393 A CN201510902393 A CN 201510902393A CN 105470220 A CN105470220 A CN 105470220A
Authority
CN
China
Prior art keywords
fin
surface mount
package part
mount package
etching groove
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201510902393.XA
Other languages
Chinese (zh)
Inventor
王虎
郭小伟
谢建友
刘宇环
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huatian Technology Xian Co Ltd
Original Assignee
Huatian Technology Xian Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huatian Technology Xian Co Ltd filed Critical Huatian Technology Xian Co Ltd
Priority to CN201510902393.XA priority Critical patent/CN105470220A/en
Publication of CN105470220A publication Critical patent/CN105470220A/en
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367Cooling facilitated by shape of device

Abstract

The invention discloses a cooling fin surface mount package part capable of preventing material overflow. The package part comprises a carrier plate, a chip and a plastic package body, wherein cooling fins are connected and solidified to the upper part of the plastic package body; and half-etching grooves are formed in the peripheral edges of the cooling fins to prevent the problem of material overflow during plastic package.

Description

A kind of fin surface mount package part preventing flash
Technical field
The invention belongs to integrated antenna package field, specifically a kind of fin surface mount package part preventing flash.
Background technology
Integrated circuit is the core of information industry and new and high technology, and integrated antenna package is the chief component of integrated circuit technique.
Current partial encapsulation product heat-sinking capability is not enough, can by increasing fin to improve heat-sinking capability on plastic-sealed body.The fin that this technique uses is based on copper material, and special processing is done in copper material two faces, after the process of face and plastic packaging material combination, goes for anti-oxidation, printing etc. after another side process.Usually the size of this fin is determined by the size of the plastic-sealed body of product own.Plastic packaging material can be caused to flow to the non-plastic packaging material contact-making surface of fin through the space of plastic package die and fin due to many reasons in this fin attachment process, produce flash, stain fin and to leak outside one side, cause product appearance bad.
Summary of the invention
For above-mentioned prior art Problems existing, the invention provides a kind of fin surface mount package part preventing flash, under stopping plastic packaging material flash situation, not affecting product effective coverage by adding half-etching groove in fin surrounding.
Prevent a fin surface mount package part for flash, described packaging part includes support plate, chip and plastic-sealed body, and plastic-sealed body top connects and is solidified with fin, and there is half-etching groove described fin edge.
The shape of described fin edge half-etching groove is " F " type.
The shape of described fin edge half-etching groove is " U " type.
The shape of described fin edge half-etching groove is " L " type.
Accompanying drawing explanation
Fig. 1 is that in the present invention, half-etching groove shapes is the fin front view of " F " type;
Fig. 2 is that in the present invention, half-etching groove shapes is the fin vertical view of " F " type;
Fig. 3 is that in the present invention, half-etching groove shapes is the fin front view of " U " type;
Fig. 4 is that in the present invention, half-etching groove shapes is the fin vertical view of " U " type;
Fig. 5 is that in the present invention, half-etching groove shapes is the fin front view of " L " type;
Fig. 6 is that in the present invention, half-etching groove shapes is the fin vertical view of " L " type.
Embodiment
Prevent a fin surface mount package part for flash, described packaging part includes support plate, chip and plastic-sealed body, and plastic-sealed body top connects and is solidified with fin, and there is half-etching groove described fin edge.
Described fin edge has the shape of half-etching groove to be " F " type, as shown in Figure 1 and Figure 2.
Described fin edge has the shape of half-etching groove to be " U " type, as shown in Figure 3, Figure 4.
Described fin edge has the shape of half-etching groove to be " L " type, as shown in Figure 5, Figure 6.
The present invention is by adding half-etching groove in fin surrounding, and the degree of depth of etched recesses and width are determined by the size of the granularity of plastic packaging material, and plastic packaging material, flowing in way, effective coverage, flows in etched recesses, avoids plastic packaging material to flow to effective coverage further.Like this, when product has flash, flash will not affect product effective coverage.

Claims (4)

1. can prevent a fin surface mount package part for flash, described packaging part includes support plate, chip and plastic-sealed body, and plastic-sealed body top connects and is solidified with fin, it is characterized in that, there is half-etching groove described fin edge.
2. a kind of fin surface mount package part preventing flash according to claim 1, is characterized in that, the shape of described fin edge half-etching groove is " F " type.
3. a kind of fin surface mount package part preventing flash according to claim 1, is characterized in that, the shape of described fin edge half-etching groove is " U " type.
4. a kind of fin surface mount package part preventing flash according to claim 1, is characterized in that, the shape of described fin edge half-etching groove is " L " type.
CN201510902393.XA 2015-12-09 2015-12-09 Cooling fin surface mount package part capable of preventing material overflow Pending CN105470220A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201510902393.XA CN105470220A (en) 2015-12-09 2015-12-09 Cooling fin surface mount package part capable of preventing material overflow

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201510902393.XA CN105470220A (en) 2015-12-09 2015-12-09 Cooling fin surface mount package part capable of preventing material overflow

Publications (1)

Publication Number Publication Date
CN105470220A true CN105470220A (en) 2016-04-06

Family

ID=55607778

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201510902393.XA Pending CN105470220A (en) 2015-12-09 2015-12-09 Cooling fin surface mount package part capable of preventing material overflow

Country Status (1)

Country Link
CN (1) CN105470220A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105470211A (en) * 2015-12-25 2016-04-06 华天科技(西安)有限公司 Heat sink mounting packaging piece capable of preventing flashing

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2596547Y (en) * 2002-12-25 2003-12-31 立卫科技股份有限公司 Semiconductor packaging structure with radiating fin
US20100084761A1 (en) * 2008-10-06 2010-04-08 Masatoshi Shinagawa Semiconductor device and fabrication method of the same
CN104900612A (en) * 2015-06-09 2015-09-09 华进半导体封装先导技术研发中心有限公司 Package stack heat radiating structure with recessed heat radiating plate base and manufacturing method thereof

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2596547Y (en) * 2002-12-25 2003-12-31 立卫科技股份有限公司 Semiconductor packaging structure with radiating fin
US20100084761A1 (en) * 2008-10-06 2010-04-08 Masatoshi Shinagawa Semiconductor device and fabrication method of the same
CN104900612A (en) * 2015-06-09 2015-09-09 华进半导体封装先导技术研发中心有限公司 Package stack heat radiating structure with recessed heat radiating plate base and manufacturing method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105470211A (en) * 2015-12-25 2016-04-06 华天科技(西安)有限公司 Heat sink mounting packaging piece capable of preventing flashing

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Legal Events

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20160406

WD01 Invention patent application deemed withdrawn after publication