CN105470220A - Cooling fin surface mount package part capable of preventing material overflow - Google Patents
Cooling fin surface mount package part capable of preventing material overflow Download PDFInfo
- Publication number
- CN105470220A CN105470220A CN201510902393.XA CN201510902393A CN105470220A CN 105470220 A CN105470220 A CN 105470220A CN 201510902393 A CN201510902393 A CN 201510902393A CN 105470220 A CN105470220 A CN 105470220A
- Authority
- CN
- China
- Prior art keywords
- fin
- surface mount
- package part
- mount package
- etching groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
Abstract
The invention discloses a cooling fin surface mount package part capable of preventing material overflow. The package part comprises a carrier plate, a chip and a plastic package body, wherein cooling fins are connected and solidified to the upper part of the plastic package body; and half-etching grooves are formed in the peripheral edges of the cooling fins to prevent the problem of material overflow during plastic package.
Description
Technical field
The invention belongs to integrated antenna package field, specifically a kind of fin surface mount package part preventing flash.
Background technology
Integrated circuit is the core of information industry and new and high technology, and integrated antenna package is the chief component of integrated circuit technique.
Current partial encapsulation product heat-sinking capability is not enough, can by increasing fin to improve heat-sinking capability on plastic-sealed body.The fin that this technique uses is based on copper material, and special processing is done in copper material two faces, after the process of face and plastic packaging material combination, goes for anti-oxidation, printing etc. after another side process.Usually the size of this fin is determined by the size of the plastic-sealed body of product own.Plastic packaging material can be caused to flow to the non-plastic packaging material contact-making surface of fin through the space of plastic package die and fin due to many reasons in this fin attachment process, produce flash, stain fin and to leak outside one side, cause product appearance bad.
Summary of the invention
For above-mentioned prior art Problems existing, the invention provides a kind of fin surface mount package part preventing flash, under stopping plastic packaging material flash situation, not affecting product effective coverage by adding half-etching groove in fin surrounding.
Prevent a fin surface mount package part for flash, described packaging part includes support plate, chip and plastic-sealed body, and plastic-sealed body top connects and is solidified with fin, and there is half-etching groove described fin edge.
The shape of described fin edge half-etching groove is " F " type.
The shape of described fin edge half-etching groove is " U " type.
The shape of described fin edge half-etching groove is " L " type.
Accompanying drawing explanation
Fig. 1 is that in the present invention, half-etching groove shapes is the fin front view of " F " type;
Fig. 2 is that in the present invention, half-etching groove shapes is the fin vertical view of " F " type;
Fig. 3 is that in the present invention, half-etching groove shapes is the fin front view of " U " type;
Fig. 4 is that in the present invention, half-etching groove shapes is the fin vertical view of " U " type;
Fig. 5 is that in the present invention, half-etching groove shapes is the fin front view of " L " type;
Fig. 6 is that in the present invention, half-etching groove shapes is the fin vertical view of " L " type.
Embodiment
Prevent a fin surface mount package part for flash, described packaging part includes support plate, chip and plastic-sealed body, and plastic-sealed body top connects and is solidified with fin, and there is half-etching groove described fin edge.
Described fin edge has the shape of half-etching groove to be " F " type, as shown in Figure 1 and Figure 2.
Described fin edge has the shape of half-etching groove to be " U " type, as shown in Figure 3, Figure 4.
Described fin edge has the shape of half-etching groove to be " L " type, as shown in Figure 5, Figure 6.
The present invention is by adding half-etching groove in fin surrounding, and the degree of depth of etched recesses and width are determined by the size of the granularity of plastic packaging material, and plastic packaging material, flowing in way, effective coverage, flows in etched recesses, avoids plastic packaging material to flow to effective coverage further.Like this, when product has flash, flash will not affect product effective coverage.
Claims (4)
1. can prevent a fin surface mount package part for flash, described packaging part includes support plate, chip and plastic-sealed body, and plastic-sealed body top connects and is solidified with fin, it is characterized in that, there is half-etching groove described fin edge.
2. a kind of fin surface mount package part preventing flash according to claim 1, is characterized in that, the shape of described fin edge half-etching groove is " F " type.
3. a kind of fin surface mount package part preventing flash according to claim 1, is characterized in that, the shape of described fin edge half-etching groove is " U " type.
4. a kind of fin surface mount package part preventing flash according to claim 1, is characterized in that, the shape of described fin edge half-etching groove is " L " type.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510902393.XA CN105470220A (en) | 2015-12-09 | 2015-12-09 | Cooling fin surface mount package part capable of preventing material overflow |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510902393.XA CN105470220A (en) | 2015-12-09 | 2015-12-09 | Cooling fin surface mount package part capable of preventing material overflow |
Publications (1)
Publication Number | Publication Date |
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CN105470220A true CN105470220A (en) | 2016-04-06 |
Family
ID=55607778
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201510902393.XA Pending CN105470220A (en) | 2015-12-09 | 2015-12-09 | Cooling fin surface mount package part capable of preventing material overflow |
Country Status (1)
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CN (1) | CN105470220A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105470211A (en) * | 2015-12-25 | 2016-04-06 | 华天科技(西安)有限公司 | Heat sink mounting packaging piece capable of preventing flashing |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2596547Y (en) * | 2002-12-25 | 2003-12-31 | 立卫科技股份有限公司 | Semiconductor packaging structure with radiating fin |
US20100084761A1 (en) * | 2008-10-06 | 2010-04-08 | Masatoshi Shinagawa | Semiconductor device and fabrication method of the same |
CN104900612A (en) * | 2015-06-09 | 2015-09-09 | 华进半导体封装先导技术研发中心有限公司 | Package stack heat radiating structure with recessed heat radiating plate base and manufacturing method thereof |
-
2015
- 2015-12-09 CN CN201510902393.XA patent/CN105470220A/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2596547Y (en) * | 2002-12-25 | 2003-12-31 | 立卫科技股份有限公司 | Semiconductor packaging structure with radiating fin |
US20100084761A1 (en) * | 2008-10-06 | 2010-04-08 | Masatoshi Shinagawa | Semiconductor device and fabrication method of the same |
CN104900612A (en) * | 2015-06-09 | 2015-09-09 | 华进半导体封装先导技术研发中心有限公司 | Package stack heat radiating structure with recessed heat radiating plate base and manufacturing method thereof |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105470211A (en) * | 2015-12-25 | 2016-04-06 | 华天科技(西安)有限公司 | Heat sink mounting packaging piece capable of preventing flashing |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20160406 |
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WD01 | Invention patent application deemed withdrawn after publication |