CN203826368U - Integrated circuit double-base-island seven-pin structure and rib-cutting mould - Google Patents
Integrated circuit double-base-island seven-pin structure and rib-cutting mould Download PDFInfo
- Publication number
- CN203826368U CN203826368U CN201420102257.3U CN201420102257U CN203826368U CN 203826368 U CN203826368 U CN 203826368U CN 201420102257 U CN201420102257 U CN 201420102257U CN 203826368 U CN203826368 U CN 203826368U
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- Prior art keywords
- pin
- mould
- cutting
- base
- island
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- Expired - Lifetime
Links
- 210000003205 muscle Anatomy 0.000 claims description 7
- 238000007599 discharging Methods 0.000 claims description 5
- 230000008034 disappearance Effects 0.000 claims description 2
- 230000015556 catabolic process Effects 0.000 abstract description 15
- 238000004806 packaging method and process Methods 0.000 abstract description 8
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 abstract 2
- 238000005538 encapsulation Methods 0.000 description 13
- 238000005516 engineering process Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000007774 longterm Effects 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 101100028951 Homo sapiens PDIA2 gene Proteins 0.000 description 1
- 102100036351 Protein disulfide-isomerase A2 Human genes 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
Landscapes
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
The utility model provides an integrated circuit double-base-island seven-pin structure and a rib-cutting mould, and the technical objective is to provide a novel integrated circuit double-base-island seven-pin structure and a rib-cutting mould. The structure comprises double base islands which are provided with chips. The chips are provided with seven lead wire pins. Distance of a gap between the base islands is 0.5mm, and distance of the gap between the lead wire pins and the base islands is 0.4mm. Distance between two adjacent external pins lacking one pin outside a packaging body is 2.54mm. The rib-cutting forming mould comprises a pin-cutting convex mould which is arranged on a pin-cutting convex mould fixing block. A pin-cutting convex mould gasket sheet is arranged below the pin-cutting convex mould fixing block. The rib-cutting forming mould also comprises a pin-cutting convex mould material-unloading inlaying member, a pin-cutting concave mould gasket sheet, a convex mould gasket plate, a convex mould fixing base, a material-unloading inlaying member base, a concave mould base, a slide-way, a first slide-way cover plate, a lower mould plate and a slide-way inlaying block. Gap discharge voltage value is greatly enhanced, gap air breakdown intensity is greatly reduced and packaging of a high-power driving IC is met.
Description
Technical field
The utility model relates to a kind of integrated antenna package lead frame structure, formed product is cut muscle mould and newly designed, in particular, relate to a kind of double-basis island 7 pin configuration and sealed in unit of integrated circuit, make encapsulated integrated circuit product have better high voltage differential performance.
Background technology
Along with developing rapidly of integrated circuit process industry, portable type electronic product has occupied increasing market, and integrated circuit encapsulation and integrationization has become a vital link in portable type electronic product system.Wherein, the packaged type of chip is the key of determining product size, shape, weight and performance index.High power drive IC is through after one section of long-term develop rapidly, nowadays in the display section that is widely used in the fields such as finance, traffic, amusement, physical culture.Along with the fast development of panel display screen, there is the screen drive IC of the title of panel display screen " heart " also to experience the development improvement period of one long-term, except function day by day variation and become better and approaching perfection day by day, its packing forms is miniaturization and seriation gradually also, in the world, flat panel display screen drive IC producer is more and more, its product is also more and more abundanter, the encapsulation of IC has also realized variation, there are SOP, SSOP, TSSOP, PDIP, QFN etc., can meet the demand to various encapsulation on market.SSOP-1.0mm and these two kinds of packing forms of SSOP-0.635mm of adopting in the market more.Due to its starting early, circulation is extensive, these two kinds of encapsulation simultaneously also have smaller and more exquisite than standard, the advantages such as suitable wiring, dominate on market gradually, with these the two kinds pcb boards that are encapsulated as standard also gradually become the public plate of main flow on market.Panel display screen manufacture is with production field in occupation of critical role, and under this favourable situation, significant progress also plays in screen drive IC field in enterprise.As for the encapsulation of IC, out of habit, mostly adopt the more common SSOP-1.0mm in market and SSOP-0.635mm, this point is conducive to the fast development of enterprise, designs and develops the seriation road of enterprise but also limited IC simultaneously.This is also a short slab of IC design companies, does not walk the seriation of product, and the product developing ability of itself also can weaken, and has its limitation.Along with the requirement to panel display screen on market is more and more higher, the sharpening of display screen, become more meticulous, the demand of smoothnessization can more and more highlight, this links that panel display screen is produced all can propose new demand, and particularly to integrated circuit high power performance and the demand of high reliability more, original traditional SOP encapsulation can not meet the package requirements of flat panel display drive IC to high power, high reliability, sign in this High Pressure Difference SOP7pin encapsulation technology that we have designed utility model.In traditional SOP double-basis island encapsulating lead design, in packaging body, the gap between Ji Dao Ji Ji island and pin is 0.2mm, and gap discharge magnitude of voltage is 1401V, and clearance air breakdown strength is 70V/dmm (note: 1dmm=0.01mm); Outside packaging body, between Pin7 and pin8, spacing is 1.27mm, and gap discharge magnitude of voltage is 2195V, and clearance air breakdown strength is 17.28V/dmm (note: 1dmm=0.01mm).
Summary of the invention
Technical purpose of the present utility model is in order to solve fine pitch voltage breakdown atmospherical discharges phenomenon, overcome traditional SOP double-basis island and encapsulate the deficiency to fine pitch voltage breakdown atmospherical discharges, the utility model provides a kind of double-basis island 7 pin configuration of new integrated circuit and has cut muscle mould.
Double-basis island 7 pin configuration of integrated circuit, include double-basis island, and described Ji Dao is provided with chip, and described chip is provided with 7 terminal pins, and the clearance distance between base island is 0.5mm, and between terminal pins Yu Ji island, clearance distance is 0.4mm; Outside plastic-sealed body, adjacent two outer pin-pitch of disappearance one pin are 2.54mm.
Double-basis island 7 pin configuration of integrated circuit cut muscle mould, comprising: pin cuts off punch, pin cuts off punch and is located at pin and cuts off on punch fixed block, and pin cuts off punch fixed block below and is provided with pin and cuts off punch pad, convex mould pad, punch holder, also include pin and cut off punch discharging mold insert; Pin cuts off punch below and is provided with pin and cuts off die pad, discharging mold insert seat, die, die socket, slideway, slideway cover plate one, lower bolster, slideway and insert.
Encapsulation technology of the present utility model compared with prior art has following useful technique effect: in the utility model, integrated circuit (IC) design is become to 7 terminal pins.Adopt hybrid package method, original Dan Ji island is designed to double-basis island structure, can encapsulate two chips simultaneously, save packaging cost, encapsulated in the past the function that two chips just can reach, adopted this encapsulation to complete encapsulation at a packaging body, reduce encapsulation power consumption, improve electric property, saved printed circuit board cost, reduced small product size.Gap, framework Liang Ji island and gap, pin Yu Ji island are significantly strengthened, and have greatly reduced the voltage breakdown atmospherical discharges phenomenon risk producing because spacing is too small; Gap discharge magnitude of voltage improves greatly, and clearance air breakdown strength reduces greatly, meets the encapsulation of high power drive IC.
Brief description of the drawings
Fig. 1 is the structural representation of the lead frame of an embodiment of the utility model.
Fig. 2 is that the pin of an embodiment of the utility model cuts off punch position view.
Fig. 3 be an embodiment of the utility model cut muscle set of molds structural representation.
Embodiment
In conjunction with Fig. 1 to Fig. 3, double-basis island 7 pin configuration of the utility model integrated circuit, main is to have changed product fine pitch voltage breakdown atmospherical discharges problem, has greatly improved the reliability of product; In order to improve breakdown voltage value in product plastic-sealed body, in the design of double-basis island, the clearance distance between double-basis island is designed to 0.5mm, clearance distance between pin Yu Ji island is designed to 0.4mm; Outside product plastic-sealed body, pins of products is designed to 7pin, in order to strengthen the spacing between 6pin and 7pin, spacing is designed to 2.54mm.Gap, framework Liang Ji island and gap, pin Yu Ji island are significantly strengthened, and have greatly reduced the voltage breakdown atmospherical discharges phenomenon risk producing because spacing is too small.In Fig. 2, the lead frame base island gap design of the utility model encapsulation technology scheme is 0.5mm, minimum break-down voltage value is: 1811V, between Ji Dao and pin, gap design is 0.4mm, minimum break-down voltage value is: 1761V, solve minim gap atmospherical discharges breakdown problem, greatly improved product reliability.In Fig. 2, provide the position of pin cut-out punch 100.
The utility model has also produced a design that high power 7 pin cut muscle mould, in Fig. 3, provide pin and cut off punch 100 and pin cut-out die 102, pin cuts off punch discharging mold insert 101, solved relevant flash and plastic-sealed body problem of Cracking, make it can be stable production.In the 7 pin double-basis island encapsulating lead designs of the utility model high power, in packaging body, the gap between Ji Dao Ji Ji island and pin is respectively 0.5mm and 0.4mm, and gap discharge magnitude of voltage is respectively the each 1761V of 1811V; Clearance air breakdown strength is respectively 36V/dmm (note: 1dmm=0.01mm and 44 V/dmm (note: 1dmm=0.01mm); Outside packaging body, between Pin6 and Pin7, spacing is 2.54mm, and gap discharge magnitude of voltage is 2830V, and clearance air breakdown strength is 11.14V/dmm (note: 1dmm=0.01mm).
Claims (2)
1. double-basis island 7 pin configuration of integrated circuit, include double-basis island, it is characterized in that: described Ji Dao is provided with chip, and described chip is provided with 7 terminal pins, and the clearance distance between base island is 0.5mm, and between terminal pins Yu Ji island, clearance distance is 0.4mm; Outside plastic-sealed body, adjacent two outer pin-pitch of disappearance one pin are 2.54mm.
2. cut muscle mould for double-basis island 7 pin configuration of integrated circuit claimed in claim 1, it is characterized in that: comprise that pin cuts off punch, pin cuts off punch and is located at pin and cuts off on punch fixed block, and pin cuts off punch fixed block below and is provided with pin and cuts off punch pad, convex mould pad, punch holder, also include pin and cut off punch discharging mold insert; Pin cuts off punch below and is provided with pin and cuts off die pad, discharging mold insert seat, die, die socket, slideway, slideway cover plate one, lower bolster, slideway and insert.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420102257.3U CN203826368U (en) | 2014-03-07 | 2014-03-07 | Integrated circuit double-base-island seven-pin structure and rib-cutting mould |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420102257.3U CN203826368U (en) | 2014-03-07 | 2014-03-07 | Integrated circuit double-base-island seven-pin structure and rib-cutting mould |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203826368U true CN203826368U (en) | 2014-09-10 |
Family
ID=51481838
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420102257.3U Expired - Lifetime CN203826368U (en) | 2014-03-07 | 2014-03-07 | Integrated circuit double-base-island seven-pin structure and rib-cutting mould |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203826368U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103871995A (en) * | 2014-03-07 | 2014-06-18 | 气派科技股份有限公司 | Double-base-island seven-pin structure of integrated circuit (IC) and rib cutting die |
-
2014
- 2014-03-07 CN CN201420102257.3U patent/CN203826368U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103871995A (en) * | 2014-03-07 | 2014-06-18 | 气派科技股份有限公司 | Double-base-island seven-pin structure of integrated circuit (IC) and rib cutting die |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140910 |
|
| CX01 | Expiry of patent term |