CN103400814B - A kind of flexible substrate package structure and envelope irrigation method thereof - Google Patents
A kind of flexible substrate package structure and envelope irrigation method thereof Download PDFInfo
- Publication number
- CN103400814B CN103400814B CN201310334123.4A CN201310334123A CN103400814B CN 103400814 B CN103400814 B CN 103400814B CN 201310334123 A CN201310334123 A CN 201310334123A CN 103400814 B CN103400814 B CN 103400814B
- Authority
- CN
- China
- Prior art keywords
- chip
- board
- plastic layer
- flexible base
- central die
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The invention provides a kind of flexible substrate package structure, effectively can prevent the leakage of Embedding Material, the Embedding Material avoiding leakage forms pollution to other regions of substrate, ensure that and follow-up plant normally carrying out of ball and test technology, it comprises flexible base, board, central die on described flexible base, board, first chip and the second chip, it is characterized in that: in described central die, the bending position of corresponding described flexible base, board two ends in described central die is provided with mold plastic layer, described central die and described mold plastic layer are provided with sheet glue-line, described mold plastic layer both sides are by the first chip described in described flexible base, board brake forming and described second chip, described first chip and described second chip are molded on described glue in central die described in described mold plastic layer both sides, invention also provides a kind of envelope irrigation method of flexible substrate package structure.
Description
Technical field
The present invention relates to microelectronic industry substrate package technical field, be specifically related to a kind of flexible substrate package structure and envelope irrigation method thereof.
Background technology
Along with the development of microelectric technique, the complexity of microelectronics processing capacity, variation, to make in microelectronics the integration density of electronic component in substrate increasing, be bound to the volume adding microelectronic package, have impact on the encapsulation of microelectronic substrate and carry, a kind of flexible electronic technology has been developed in prior art, microelectronic substrate adopts flexible base, board, flexible base, board not only has the feature of the insulating properties of conventional rigid substrate, also there is the feature that the rigid substrates such as pliability do not have, substrate itself is made to have foldability, substantially reduce the volume of packaging body, ensure that the encapsulation of microelectronic substrate and carry, see Fig. 1, flexible material is utilized existing, formed in the packaging body of three-dimensional stacking structure by bending, because the flexible base, board seam 1 after bending does not close, when therefore carrying out inner embedding, from then on Embedding Material often spills in gap, to other regions of substrate, especially pad is tested, the positions such as UBM are formed pollutes, affect and follow-up plant ball and test technology carries out.
Summary of the invention
For the problems referred to above, the invention provides a kind of flexible substrate package structure and envelope irrigation method thereof, effectively can prevent the leakage of Embedding Material, the Embedding Material avoiding leakage forms other regions of substrate and pollutes, and ensure that follow-up to plant normally carrying out of ball and test technology.
Its technical scheme is such: a kind of flexible substrate package structure, it comprises flexible base, board, described flexible base, board is provided with central die, first chip and the second chip, in central die, the bending position of corresponding described flexible base, board two ends in described central die is provided with mold plastic layer, described central die and described mold plastic layer are provided with sheet glue-line, described mold plastic layer both sides are by the first chip described in described flexible base, board brake forming and described second chip, described first chip and described second chip are molded on described glue-line in central die described in described mold plastic layer both sides.
It is further, and the length of described central die equals the total length of described first chip, described second chip and described mold plastic layer.
Present invention also offers a kind of envelope irrigation method of flexible substrate package structure, it comprises the following steps:
(1), central die, the first chip and the second chip be arranged on on flexible base, board, carries out two dimension encapsulate with flexible base, board;
(2), central die upper surface carries out molding, shaping mold plastic layer, the solidification of mold plastic layer;
(3), mold plastic layer and central die upper surface are coated with paster glue-line;
(4), to described flexible base, board fix together with described first chip and described second chip bending, solidification.Described first chip and described second chip are placed on described glue-line in central die described in mold plastic layer structure both sides, shaping flexible substrate package structure;
(5) carry out embedding to shaping flexible substrate package structure both sides bending edge, solidification, completes.
Present invention also offers a kind of flexible substrate package elongate configuration, it comprises multiple above-mentioned flexible substrate package structure, and described flexible base, board is overall structure.
It is further: described flexible substrate package elongate configuration both sides are respectively arranged with embedding mouth.
An envelope irrigation method for flexible substrate package elongate configuration, it comprises the following steps:
(1), multiple central die, the first chip and the second chip on flexible substrates correspondence carry out two dimension encapsulation;
(2), the central die upper surface of whole piece flexible base, board carries out one-shot forming mold plastic layer, the solidification of mold plastic layer;
(3), at mold plastic layer and all central die upper surfaces painting paster glue-line of whole piece flexible base, board;
(4), to whole flexible base, board fix together with the first chip and described second chip bending, solidification, the first chip and the second chip are placed on the sheet glue in the central die of mold plastic layer structure both sides, shaping flexible substrate package elongate configuration;
(6), to by flexible substrate package elongate configuration both sides shaping in step (5) bending edge 7 carry out embedding, solidification, completes;
It is further characterized in that: whole piece flexible base, board two edge shaping in step (3) excises two fillets, and in step (4), whole piece flexible base, board two edge excises two fillet nature folding forming embedding mouths;
It is further characterized in that: flexible substrate package elongate configuration shaping in step (6) is cut into independently flexible substrate package structure.
In said structure of the present invention, in central die, the bending position of corresponding flexible base, board two ends in central die is provided with mold plastic layer, central die and mold plastic layer are provided with sheet glue-line, mold plastic layer both sides are by flexible base, board brake forming first chip and the second chip, first chip and the second chip are molded on the sheet glue-line in the central die of mold plastic layer both sides, due to the sealing function of mold plastic layer, flexible base, board seam after bending seals naturally, when shaping packaging body carries out inner embedding, effectively prevent the leakage of Embedding Material, the Embedding Material avoiding leakage forms pollution to other regions of substrate, ensure that and follow-up plant normally carrying out of ball and test technology.
Accompanying drawing explanation
Fig. 1 is existing flexible substrate package structural representation;
Fig. 2 is flexible substrate package structural representation of the present invention;
Fig. 3 is the envelope irrigation method schematic diagram of flexible substrate package structure of the present invention;
Fig. 4 is multiple central die, the first chip and the second chip carry out two dimension encapsulation schematic diagram on flexible substrates;
Fig. 5 is that central die upper surface carries out one-shot forming mold plastic layer schematic diagram;
Fig. 6 is that flexible base, board two edge excises two fillet schematic diagrames;
Fig. 7 is the A-A cutaway view of Fig. 6;
Fig. 8 is flexible base, board brake forming flexible substrate package elongate configuration schematic diagram;
Fig. 9 is that flexible substrate package elongate configuration is cut into independently flexible substrate package structural representation;
Figure 10 is the B-B cutaway view of Fig. 9.
Embodiment
Embodiment 1:
As shown in Figure 2,
A kind of flexible substrate package structure, it comprises flexible base, board 1, flexible base, board 1 is provided with central die 2, first chip 3 and the second chip 4, in central die 2, the bending position of corresponding flexible base, board 1 two ends in central die 2 is provided with mold plastic layer 5, central die 2 and mold plastic layer 5 are provided with sheet glue-line 6, mold plastic layer 5 both sides are by flexible base, board 1 brake forming first chip 3 and the second chip 4, first chip 3 and the second chip 4 are molded on described glue-line 6 in the central die of mold plastic layer 5 both sides 2, the length of central die 2 equals the first chip 3, the total length of the second chip 4 and mold plastic layer 5.
In the present invention mold plastic layer 5 not only flexible base, board play flexible base, board bend after the sealing function of seam crossing, Mold plastic layer 5 structure is placed both sides chip has assist location effect.
See Fig. 3, present invention also offers a kind of envelope irrigation method of flexible substrate package structure, it comprises the following steps:
(1), central die 2, first chip 3 and the second chip 4 arrange on a flexible substrate 1, carries out two dimension encapsulate with flexible base, board 1;
(2), central die 2 upper surface carries out molding, and shaping mold plastic layer 5, mold plastic layer 5 solidifies;
(3), mold plastic layer 5 and central die 2 upper surface are coated with paster glue-line 6;
(4), to flexible base, board 1 fix together with the first chip 3 and the bending of 4, the second core, solidification, the first chip 3 and the second chip 4 are placed on the sheet glue 6 in mold plastic layer 5 structure both sides central die 2, shaping flexible substrate package structure 9;
(5), flexible substrate package structure both sides bending corner 7 place shaping to step (4) carry out embedding, and solidification, completes.
Embodiment two:
See Fig. 9, Figure 10:
Because the molding of single substrate may have difficulties, and productive rate is not high, therefore consider, can by the method for rectangular layout, once complete bending and the embedding of multiple structure, the invention provides a kind of flexible substrate package elongate configuration 8, it comprises multiple substrate encapsulation structure 9, and the flexible base, board 1 in substrate encapsulation structure is overall structure; Flexible substrate package elongate configuration both sides are respectively arranged with embedding mouth 11.
An encapsulating method for flexible substrate package elongate configuration, its processing step is as follows:
See Fig. 4: (1), multiple central die 2, first chip 3 and the second chip 4 on a flexible substrate 1 correspondence carry out two dimension encapsulation;
See Fig. 5: the central die upper surface of (2), whole piece flexible base, board 1 carries out molding, shaping mold plastic layer 5a, mold plastic layer 5a solidify;
See Fig. 6, Fig. 7: (3), be coated with paster glue-line 6 at the mold plastic layer 5a of whole piece flexible base, board and all central die 1 upper surface;
See Fig. 6: (4), whole piece flexible base, board two edge shaping in step (3) excise two fillets 10;
See Fig. 8: (5), to whole flexible base, board 1 together with the first chip 3 and the bending of 4, the second core fixing, solidification, first chip 3 and 4, the second core are placed on the sheet glue-line 6 in mold plastic layer 5a structure both sides central die 2, shaping flexible substrate package elongate configuration 8, whole piece flexible base, board two edge excises two fillets 10 and goes out nature folding forming embedding mouth 11.
See Fig. 9, Figure 10: (6), to by flexible substrate package elongate configuration both sides shaping in step (5) bending edge 7 carry out embedding, solidification, complete;
See Fig. 9, Figure 10: (7), cut by flexible substrate package elongate configuration shaping in step (6)
Become independently substrate encapsulation structure 9.
Molding is plastic packaging, shaping mold.
In the present embodiment, in step (4): whole piece flexible base, board two edge shaping in step (3) excises two fillets 10, whole flexible base, board is fixed together with described first chip and described second chip bending, during solidification, two breach are formed in shaping flexible substrate package elongate configuration both sides, for the embedding of flexible substrate package elongate configuration, the embedding of certain flexible substrate package elongate configuration also can use similar underfill technique, pour into the Embedding Material of good fluidity, as long as the object of the embedding of flexible substrate package elongate configuration can be arrived, it is all protection scope of the present invention.
The foregoing is only and working of an invention mode is described; be not limited to the present invention, for a person skilled in the art, within the spirit and principles in the present invention all; any amendment of doing, equivalent replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (4)
1. a flexible substrate package elongate configuration, it is characterized in that: it comprises multiple flexible substrate package structure, described flexible base, board is overall structure, described flexible substrate package structure comprises flexible base, board, described flexible base, board is provided with central die, first chip and the second chip, in described central die, the bending position of corresponding described flexible base, board two ends in described central die is provided with mold plastic layer, described central die and described mold plastic layer are provided with sheet glue-line, described mold plastic layer both sides are by the first chip described in described flexible base, board brake forming and described second chip, described first chip and described second chip are molded on described glue-line in central die described in described mold plastic layer both sides, described flexible base, board is overall structure.
2. realize an envelope irrigation method for the flexible substrate package elongate configuration of claim 1, it is characterized in that: it comprises the following steps:
(1), multiple central die, the first chip and the second chip on flexible substrates correspondence carry out two dimension encapsulation;
(2), the central die upper surface of whole piece flexible base, board carries out one-shot forming mold plastic layer, the solidification of mold plastic layer;
(3), at mold plastic layer and the central die upper surface painting paster glue-line of whole piece flexible base, board;
(4), whole piece flexible base, board is fixed together with described first chip and described second chip bending, solidification, described first chip and described second chip respectively correspondence are placed on the sheet glue-line in the central die of mold plastic layer structure both sides, shaping flexible substrate package elongate configuration;
(5), to by flexible substrate package elongate configuration both sides shaping in step (4) bending edge carry out embedding, solidification, completes.
3. the envelope irrigation method of a kind of flexible substrate package elongate configuration according to claim 2, it is characterized in that: whole piece flexible base, board two edge shaping in step (3) excises two fillets, in step (4), whole piece flexible base, board two edge excises two fillet nature folding forming embedding mouths.
4. the envelope irrigation method of a kind of flexible substrate package elongate configuration according to claim 2 or 3, is characterized in that: flexible substrate package elongate configuration shaping in step (5) is cut into independently substrate encapsulation structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310334123.4A CN103400814B (en) | 2013-08-03 | 2013-08-03 | A kind of flexible substrate package structure and envelope irrigation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310334123.4A CN103400814B (en) | 2013-08-03 | 2013-08-03 | A kind of flexible substrate package structure and envelope irrigation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103400814A CN103400814A (en) | 2013-11-20 |
| CN103400814B true CN103400814B (en) | 2016-02-03 |
Family
ID=49564412
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310334123.4A Active CN103400814B (en) | 2013-08-03 | 2013-08-03 | A kind of flexible substrate package structure and envelope irrigation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103400814B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104445055B (en) * | 2014-12-01 | 2016-01-13 | 华中科技大学 | A kind of flexible electronic fluid encapsulation method improving ductility |
| CN113274688B (en) * | 2021-05-14 | 2022-05-10 | 合肥工业大学 | Long jump testing system based on flexible electronic switch array |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103400809A (en) * | 2013-08-02 | 2013-11-20 | 华进半导体封装先导技术研发中心有限公司 | Flexible substrate packaging structure and filling process thereof |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101467253A (en) * | 2006-06-16 | 2009-06-24 | 皇家飞利浦电子股份有限公司 | Stacked IC encapsulation with interconnected top and bottom |
| US8050047B2 (en) * | 2007-07-12 | 2011-11-01 | Stats Chippac Ltd. | Integrated circuit package system with flexible substrate and recessed package |
| KR101174056B1 (en) * | 2007-09-19 | 2012-08-13 | 닛본 덴끼 가부시끼가이샤 | Semiconductor device and its fabrication method |
-
2013
- 2013-08-03 CN CN201310334123.4A patent/CN103400814B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103400809A (en) * | 2013-08-02 | 2013-11-20 | 华进半导体封装先导技术研发中心有限公司 | Flexible substrate packaging structure and filling process thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103400814A (en) | 2013-11-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102376672B (en) | Foundation island-free ball grid array packaging structure and manufacturing method thereof | |
| CN101958300A (en) | Double-sided graphic chip inversion module packaging structure and packaging method thereof | |
| CN106971985A (en) | Semiconductor packages and its manufacture method | |
| CN107636814A (en) | Systems, devices and methods for the embedded 3D components with interconnection structure | |
| CN103400814B (en) | A kind of flexible substrate package structure and envelope irrigation method thereof | |
| WO2011150879A2 (en) | Method for encapsulating semiconductor and structure thereof | |
| CN103367264B (en) | A kind of encapsulating carrier plate avoiding glue material overflow | |
| CN105224137A (en) | A kind of method touching aobvious product and upper glass FPC binding sealing thereof | |
| CN105518850A (en) | Semiconductor apparatus and manufacturing method for same | |
| TWM505698U (en) | Pre molded can package | |
| CN205564734U (en) | Encapsulation of chip level | |
| CN207183254U (en) | A kind of encapsulating structure of raising BGA product reliability | |
| CN103400813B (en) | Flexible substrate package structure and envelope irrigation method thereof | |
| CN103400809B (en) | A kind of flexible substrate package structure and envelope thereof fill with technique | |
| CN103762200A (en) | Chip packaging part and packaging method of chip packaging part | |
| CN207265013U (en) | The operation gauge of scaling powder | |
| CN201838581U (en) | Encapsulation structure without pin around | |
| CN206116378U (en) | Semiconductor encapsulation construction | |
| CN103779300A (en) | Package substrate and chip package component | |
| CN104051373B (en) | Heat dissipation structure and manufacturing method of semiconductor package | |
| CN103811359A (en) | Method for manufacturing semiconductor package | |
| CN206401303U (en) | A kind of chip-packaging structure for hindering glue | |
| CN206864454U (en) | Semiconductor package part | |
| CN204361080U (en) | Circuits System and chip package thereof | |
| CN203312266U (en) | Flexible substrate packaging device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |