CN103400813B - Flexible substrate package structure and envelope irrigation method thereof - Google Patents
Flexible substrate package structure and envelope irrigation method thereof Download PDFInfo
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- CN103400813B CN103400813B CN201310334122.XA CN201310334122A CN103400813B CN 103400813 B CN103400813 B CN 103400813B CN 201310334122 A CN201310334122 A CN 201310334122A CN 103400813 B CN103400813 B CN 103400813B
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Abstract
The invention provides a kind of flexible substrate package structure, effectively can prevent the leakage of Embedding Material, the Embedding Material avoiding leakage forms pollution to other regions of substrate, ensure that and follow-up plant normally carrying out of ball and test technology, it comprises flexible base, board, described flexible base, board is provided with central die, first chip and the second chip, it is characterized in that: described first chip is superimposed upon in described central die together with described flexible base, board is bending, the back side of the corresponding described flexible base, board of described first chip is provided with mold plastic layer, the corresponding described flexible base, board of described second chip is bending is arranged on described mold plastic layer side, shaping G shape encapsulating structure, described mold plastic layer closes described G shape encapsulating structure opening, invention also provides a kind of envelope irrigation method of flexible substrate package structure.
Description
Technical field
The present invention relates to microelectronic industry substrate package technical field, be specifically related to a kind of flexible substrate package structure and envelope irrigation method thereof.
Background technology
Along with the development of microelectric technique, the complexity of microelectronics processing capacity, variation, make the integration density of electronic component in microelectronic substrate increasing, be bound to the volume adding microelectronic package, have impact on the encapsulation of microelectronic substrate and carry, a kind of flexible electronic technology has been developed in prior art, microelectronic substrate adopts flexible base, board, flexible base, board not only has the feature of the insulating properties of conventional rigid substrate, also there is the feature that the rigid substrates such as pliability do not have, substrate itself is made to have foldability, substantially reduce the volume of packaging body, ensure that the encapsulation of microelectronic substrate and carry, in order to reduce the volume of microelectronic package further, have employed the package body structure of multiple-level stack, see Fig. 1, a kind of package body structure of G shape bending, this kind of structure interface 1 place does not close, open breach is more difficult to carry out conventional dosing technology, more easily cause spilling of Embedding Material, to other regions of substrate, especially pad is tested, the positions such as UBM are formed pollutes, affect and follow-up plant ball and test technology carries out.
Summary of the invention
For the problems referred to above, the invention provides a kind of flexible substrate package structure and envelope irrigation method thereof, effectively can prevent the leakage of Embedding Material, the Embedding Material avoiding leakage forms other regions of substrate and pollutes, and ensure that follow-up to plant normally carrying out of ball and test technology.
Its technical scheme is such: a kind of flexible substrate package structure, it comprises flexible base, board, described flexible base, board is provided with central die, the first chip and the second chip, it is characterized in that: described first chip is superimposed upon in described central die together with described flexible base, board is bending, the back side of the corresponding described flexible base, board of described first chip is provided with mold plastic layer, the corresponding described flexible base, board of described second chip is bending is arranged on described mold plastic layer side, shaping G shape encapsulating structure, described mold plastic layer closes described G shape encapsulating structure opening.
It is further characterized in that, in described G shape encapsulating structure, both sides bending edge arranges envelope and fills with material.
Present invention also offers a kind of envelope irrigation method of flexible substrate package structure, it is characterized in that: it comprises the following steps:
(1), central die, the first chip and the second chip be arranged on on flexible base, board, carries out two dimension encapsulate with flexible base, board;
(2), the corresponding aperture position of substrate back carries out molding, shaping mold plastic layer, the solidification of mold plastic layer;
(3), mold plastic layer and central die upper surface are coated with Heraeus;
(4), to carry out first time bending to the described flexible base, board of shaping mold plastic layer end together with described first chip fixing, solidification;
(5) together with described second chip, second time bending is carried out to described flexible base, board fixing, solidification;
Described second chip is placed on mold plastic layer structure side, shaping G shape flexible substrate package structure;
(6) carry out embedding to G shape flexible substrate package structure both sides shaping in step (5) bending edge, solidification, completes.
In said structure of the present invention, first chip is superimposed upon in central die together with flexible base, board is bending, the back side of the corresponding flexible base, board of the first chip is provided with mold plastic layer, the corresponding flexible base, board of second chip is bending is arranged on mold plastic layer side, shaping G shape encapsulating structure, mold plastic layer closes G shape encapsulating structure opening, chip forms multiple-layer stacked, the volume of further reduction microelectronic package, mold plastic layer closes G shape encapsulating structure opening simultaneously, in envelope filling process, effectively prevent the leakage of Embedding Material, the Embedding Material avoiding leakage forms pollution to other regions of substrate, ensure that and follow-up plant normally carrying out of ball and test technology.
Accompanying drawing explanation
Fig. 1 is existing flexible substrate package structural representation;
Fig. 2 is flexible substrate package structural representation of the present invention;
Fig. 3 is the envelope irrigation method schematic diagram of flexible substrate package structure of the present invention.
Embodiment
See Fig. 2, a kind of flexible substrate package structure of improvement, it comprises flexible base, board 2, flexible base, board 1 is provided with central die 3, first chip 4 and the second chip 5, first chip 4 is superimposed upon in central die 3 together with flexible base, board 2 is bending, the back side of the corresponding flexible base, board 2 of the first chip 4 is provided with mold plastic layer 6, the corresponding flexible base, board of second chip 42 is bending is arranged on mold plastic layer 6 side, shaping G shape encapsulating structure 7, mold plastic layer 5 is closed bending angle 8 place in G shape encapsulating structure opening 1, G shape encapsulating structure 7 and is arranged envelope filling material 9.
See Fig. 3, present invention also offers a kind of envelope irrigation method of flexible substrate package structure, it comprises the following steps:
(1), central die 3, first chip 4 and the second chip 5 be arranged on on flexible base, board 2, carries out two dimension encapsulate with flexible base, board 2;
(2), the corresponding aperture position in flexible base, board 2 back side carries out molding, and shaping mold plastic layer 6, mold plastic layer 6 solidifies;
(3), mold plastic layer 6 and central die 3 upper surface are coated with Heraeus 10;
(4), to carry out first time bending to the flexible base, board 2 of shaping mold plastic layer 6 end together with described first chip 4 fixing, solidification;
(5) together with described second chip 5, second time bending is carried out to described flexible base, board 2 fixing, solidification; Second chip 5 is placed on mold plastic layer 6 structure side, shaping flexible substrate package structure 7; Mold plastic layer 6 structure is placed the second chip 5 has assist location effect;
(6) carry out second step embedding to bending corner 8 place, flexible substrate package structure 7 both sides shaping in step (5), solidification, completes.
Mold plastic layer 6 structure not only to the sealing of G shape encapsulating structure 7 opening, and has assist location effect to the second chip 5 placement.
Molding is plastic packaging, shaping mold plastic layer.
Claims (2)
1. a flexible substrate package structure, it comprises flexible base, board, described flexible base, board is provided with central die, first chip and the second chip, it is characterized in that: described first chip is superimposed upon in described central die together with described flexible base, board is bending, the back side of the corresponding described flexible base, board of described first chip is provided with mold plastic layer, the corresponding described flexible base, board of described second chip is bending is arranged on described mold plastic layer side, shaping G shape encapsulating structure, described mold plastic layer closes described G shape encapsulating structure opening, in described G shape encapsulating structure, both sides bending edge arranges envelope and fills with material.
2. realize the envelope irrigation method of flexible substrate package structure according to claim 1, it is characterized in that: it comprises the following steps: (1), central die, the first chip and the second chip are arranged on on flexible base, board, carry out two dimension with flexible base, board and encapsulate; (2), the corresponding aperture position of substrate back carries out molding, shaping mold plastic layer, the solidification of mold plastic layer;
(3), mold plastic layer and central die upper surface are coated with Heraeus;
(4), to carry out first time bending to the described flexible base, board of shaping mold plastic layer end together with described first chip fixing, solidification;
(5), to carry out second time bending to described flexible base, board together with described second chip fixing, solidification; Described second chip is placed on mold plastic layer structure side, shaping G shape flexible substrate package structure;
(6), to G shape flexible substrate package structure both sides shaping in step (5) bending edge carry out embedding, solidification, completes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201310334122.XA CN103400813B (en) | 2013-08-02 | 2013-08-02 | Flexible substrate package structure and envelope irrigation method thereof |
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| CN201310334122.XA CN103400813B (en) | 2013-08-02 | 2013-08-02 | Flexible substrate package structure and envelope irrigation method thereof |
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| CN103400813A CN103400813A (en) | 2013-11-20 |
| CN103400813B true CN103400813B (en) | 2015-10-28 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104445055B (en) * | 2014-12-01 | 2016-01-13 | 华中科技大学 | A kind of flexible electronic fluid encapsulation method improving ductility |
| US11246230B2 (en) * | 2016-07-21 | 2022-02-08 | Xcelsis Corporation | Configurable smart object system with methods of making modules and contactors |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103094256A (en) * | 2011-11-08 | 2013-05-08 | 中国科学院微电子研究所 | Packaging system |
| CN103117252A (en) * | 2013-02-25 | 2013-05-22 | 中国科学院微电子研究所 | Method for three-dimensionally folding and packaging two-dimensionally packaged flexible substrate |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2000307055A (en) * | 1999-04-21 | 2000-11-02 | Seiko Epson Corp | Semiconductor device, its manufacture, circuit substrate, and electronics |
| JP2001217388A (en) * | 2000-02-01 | 2001-08-10 | Sony Corp | Electronic device and method for manufacturing the same |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103094256A (en) * | 2011-11-08 | 2013-05-08 | 中国科学院微电子研究所 | Packaging system |
| CN103117252A (en) * | 2013-02-25 | 2013-05-22 | 中国科学院微电子研究所 | Method for three-dimensionally folding and packaging two-dimensionally packaged flexible substrate |
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