CN105161393B - 电子光学排布结构、多电子分束检验系统和方法 - Google Patents
电子光学排布结构、多电子分束检验系统和方法 Download PDFInfo
- Publication number
- CN105161393B CN105161393B CN201510512550.6A CN201510512550A CN105161393B CN 105161393 B CN105161393 B CN 105161393B CN 201510512550 A CN201510512550 A CN 201510512550A CN 105161393 B CN105161393 B CN 105161393B
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- China
- Prior art keywords
- electron beam
- pattern
- holes
- particle
- magnetic field
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J1/00—Details of electrodes, of magnetic control means, of screens, or of the mounting or spacing thereof, common to two or more basic types of discharge tubes or lamps
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement
- H01J37/09—Diaphragms; Shields associated with electron or ion-optical arrangements; Compensation of disturbing fields
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement
- H01J37/10—Lenses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement
- H01J37/10—Lenses
- H01J37/14—Lenses magnetic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement
- H01J37/153—Electron-optical or ion-optical arrangements for the correction of image defects, e.g. stigmators
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/26—Electron or ion microscopes; Electron or ion diffraction tubes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/26—Electron or ion microscopes; Electron or ion diffraction tubes
- H01J37/28—Electron or ion microscopes; Electron or ion diffraction tubes with scanning beams
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/3002—Details
- H01J37/3007—Electron or ion-optical systems
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
- H01J37/3174—Particle-beam lithography, e.g. electron beam lithography
- H01J37/3177—Multi-beam, e.g. fly's eye, comb probe
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/04—Means for controlling the discharge
- H01J2237/043—Beam blanking
- H01J2237/0435—Multi-aperture
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/04—Means for controlling the discharge
- H01J2237/045—Diaphragms
- H01J2237/0451—Diaphragms with fixed aperture
- H01J2237/0453—Diaphragms with fixed aperture multiple apertures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/04—Means for controlling the discharge
- H01J2237/047—Changing particle velocity
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/04—Means for controlling the discharge
- H01J2237/047—Changing particle velocity
- H01J2237/0473—Changing particle velocity accelerating
- H01J2237/04735—Changing particle velocity accelerating with electrostatic means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/04—Means for controlling the discharge
- H01J2237/047—Changing particle velocity
- H01J2237/0475—Changing particle velocity decelerating
- H01J2237/04756—Changing particle velocity decelerating with electrostatic means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/06—Sources
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/10—Lenses
- H01J2237/14—Lenses magnetic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/26—Electron or ion microscopes
- H01J2237/28—Scanning microscopes
- H01J2237/2813—Scanning microscopes characterised by the application
- H01J2237/2817—Pattern inspection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/30—Electron or ion beam tubes for processing objects
- H01J2237/317—Processing objects on a microscale
- H01J2237/3175—Lithography
- H01J2237/31774—Multi-beam
Landscapes
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Nanotechnology (AREA)
- Crystallography & Structural Chemistry (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Mathematical Physics (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electron Beam Exposure (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US50025603P | 2003-09-05 | 2003-09-05 | |
| US60/500,256 | 2003-09-05 | ||
| CN2004800255289A CN101103417B (zh) | 2003-09-05 | 2004-09-07 | 粒子光学系统和排布结构,以及用于其的粒子光学组件 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2004800255289A Division CN101103417B (zh) | 2003-09-05 | 2004-09-07 | 粒子光学系统和排布结构,以及用于其的粒子光学组件 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105161393A CN105161393A (zh) | 2015-12-16 |
| CN105161393B true CN105161393B (zh) | 2018-03-27 |
Family
ID=34272938
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2004800255289A Expired - Fee Related CN101103417B (zh) | 2003-09-05 | 2004-09-07 | 粒子光学系统和排布结构,以及用于其的粒子光学组件 |
| CN201210111707.0A Expired - Lifetime CN102709143B (zh) | 2003-09-05 | 2004-09-07 | 电子光学排布结构、多电子分束检验系统和方法 |
| CN201510512550.6A Expired - Fee Related CN105161393B (zh) | 2003-09-05 | 2004-09-07 | 电子光学排布结构、多电子分束检验系统和方法 |
Family Applications Before (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2004800255289A Expired - Fee Related CN101103417B (zh) | 2003-09-05 | 2004-09-07 | 粒子光学系统和排布结构,以及用于其的粒子光学组件 |
| CN201210111707.0A Expired - Lifetime CN102709143B (zh) | 2003-09-05 | 2004-09-07 | 电子光学排布结构、多电子分束检验系统和方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (7) | US7244949B2 (enExample) |
| EP (10) | EP2579273B8 (enExample) |
| JP (6) | JP4794444B2 (enExample) |
| KR (1) | KR101051370B1 (enExample) |
| CN (3) | CN101103417B (enExample) |
| WO (1) | WO2005024881A2 (enExample) |
Families Citing this family (230)
| Publication number | Priority date | Publication date | Assignee | Title |
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| KR101051370B1 (ko) * | 2003-09-05 | 2011-07-22 | 어플라이드 머티리얼즈 이스라엘 리미티드 | 입자광 시스템 및 장치와 이와 같은 시스템 및 장치용입자광 부품 |
| EP1619495A1 (en) * | 2004-07-23 | 2006-01-25 | Nederlandse Organisatie voor toegepast-natuurwetenschappelijk Onderzoek TNO | Method and Apparatus for inspecting a specimen surface and use of fluorescent materials |
| GB0425290D0 (en) * | 2004-11-17 | 2004-12-15 | Eastham Derek A | Focussing masks |
| US7468506B2 (en) | 2005-01-26 | 2008-12-23 | Applied Materials, Israel, Ltd. | Spot grid array scanning system |
| US7468507B2 (en) | 2005-01-26 | 2008-12-23 | Applied Materials, Israel, Ltd. | Optical spot grid array scanning system |
| US8304749B2 (en) | 2005-02-11 | 2012-11-06 | Ims Nanofabrication Ag | Charged-particle exposure apparatus with electrostatic zone plate |
| JP2007019192A (ja) * | 2005-07-06 | 2007-01-25 | Canon Inc | 荷電ビームレンズ、及び荷電ビーム露光装置 |
| EP1753010B1 (en) * | 2005-08-09 | 2012-12-05 | Carl Zeiss SMS GmbH | Particle-optical system |
| EP2270833A3 (en) * | 2005-09-06 | 2011-01-26 | Carl Zeiss SMT AG | Particle-optical component |
| JP5159035B2 (ja) * | 2005-10-28 | 2013-03-06 | キヤノン株式会社 | レンズアレイ及び該レンズアレイを含む荷電粒子線露光装置 |
| EP2270835B1 (en) | 2005-11-28 | 2012-10-10 | Carl Zeiss SMT GmbH | Particle-optical component |
| TWI432908B (zh) * | 2006-03-10 | 2014-04-01 | Mapper Lithography Ip Bv | 微影系統及投射方法 |
| EP2005460A4 (en) * | 2006-03-27 | 2010-11-24 | Multibeam Systems Inc | OPTICAL FOR GENERATING CHARGED PARTICLE DATA BEAMS HAVING HIGH CURRENT DENSITY |
| JP2007287365A (ja) * | 2006-04-13 | 2007-11-01 | Jeol Ltd | 多極子レンズ及び多極子レンズの製造方法 |
| JP4878501B2 (ja) * | 2006-05-25 | 2012-02-15 | 株式会社日立ハイテクノロジーズ | 荷電粒子線応用装置 |
| JP2009545101A (ja) | 2006-07-20 | 2009-12-17 | アビザ テクノロジー リミティド | プラズマ源 |
| US8425741B2 (en) | 2006-07-20 | 2013-04-23 | Aviza Technology Limited | Ion deposition apparatus having rotatable carousel for supporting a plurality of targets |
| JP5675099B2 (ja) | 2006-07-20 | 2015-02-25 | エスピーティーエス テクノロジーズ イーティー リミティド | イオンソース |
| EP2050118A1 (en) * | 2006-07-25 | 2009-04-22 | Mapper Lithography IP B.V. | A multiple beam charged particle optical system |
| US8134135B2 (en) | 2006-07-25 | 2012-03-13 | Mapper Lithography Ip B.V. | Multiple beam charged particle optical system |
| JP2008066359A (ja) * | 2006-09-05 | 2008-03-21 | Canon Inc | 荷電ビームレンズアレイ、露光装置及びデバイス製造方法 |
| US7763851B2 (en) * | 2006-12-22 | 2010-07-27 | Ims Nanofabrication Ag | Particle-beam apparatus with improved wien-type filter |
| JP5227512B2 (ja) * | 2006-12-27 | 2013-07-03 | 株式会社日立ハイテクノロジーズ | 電子線応用装置 |
| US8421305B2 (en) * | 2007-04-17 | 2013-04-16 | The University Of Utah Research Foundation | MEMS devices and systems actuated by an energy field |
| EP2019415B1 (en) * | 2007-07-24 | 2016-05-11 | IMS Nanofabrication AG | Multi-beam source |
| US8642959B2 (en) | 2007-10-29 | 2014-02-04 | Micron Technology, Inc. | Method and system of performing three-dimensional imaging using an electron microscope |
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| KR100946270B1 (ko) * | 2008-08-12 | 2010-03-09 | 주식회사 메가젠임플란트 | 연조직 절단 치과용 공구 |
| JP5484808B2 (ja) * | 2008-09-19 | 2014-05-07 | 株式会社ニューフレアテクノロジー | 描画装置及び描画方法 |
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| DE102010026169B4 (de) * | 2010-07-06 | 2014-09-04 | Carl Zeiss Microscopy Gmbh | Partikelstrahlsystem |
| JP5869572B2 (ja) * | 2010-08-26 | 2016-02-24 | テトラ ラバル ホールデイングス エ フイナンス ソシエテ アノニム | 電子ビーム発生装置のための制御グリッドの構成 |
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| US8294095B2 (en) * | 2010-12-14 | 2012-10-23 | Hermes Microvision, Inc. | Apparatus of plural charged particle beams with multi-axis magnetic lens |
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| JP2012238770A (ja) * | 2011-05-12 | 2012-12-06 | Canon Inc | 静電レンズアレイ、描画装置、及びデバイスの製造方法 |
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| JP6053919B2 (ja) * | 2012-05-31 | 2016-12-27 | シーメンス アクチエンゲゼルシヤフトSiemens Aktiengesellschaft | 荷電粒子を偏向させる偏向板および偏向装置 |
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| DE102014008105B4 (de) | 2014-05-30 | 2021-11-11 | Carl Zeiss Multisem Gmbh | Mehrstrahl-Teilchenmikroskop |
| DE102014008383B9 (de) | 2014-06-06 | 2018-03-22 | Carl Zeiss Microscopy Gmbh | Teilchenstrahlsystem und Verfahren zum Betreiben einer Teilchenoptik |
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| DE102015202172B4 (de) | 2015-02-06 | 2017-01-19 | Carl Zeiss Microscopy Gmbh | Teilchenstrahlsystem und Verfahren zur teilchenoptischen Untersuchung eines Objekts |
| US9691588B2 (en) | 2015-03-10 | 2017-06-27 | Hermes Microvision, Inc. | Apparatus of plural charged-particle beams |
| US10236156B2 (en) | 2015-03-25 | 2019-03-19 | Hermes Microvision Inc. | Apparatus of plural charged-particle beams |
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