CN105118823A - Stacked type chip packaging structure and packaging method - Google Patents
Stacked type chip packaging structure and packaging method Download PDFInfo
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- CN105118823A CN105118823A CN201510618758.6A CN201510618758A CN105118823A CN 105118823 A CN105118823 A CN 105118823A CN 201510618758 A CN201510618758 A CN 201510618758A CN 105118823 A CN105118823 A CN 105118823A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/96—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/568—Temporary substrate used as encapsulation process aid
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/04105—Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/12105—Bump connectors formed on an encapsulation of the semiconductor or solid-state body, e.g. bumps on chip-scale packages
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
Abstract
The invention provides a stacked type chip packaging structure and packaging method. The packaging method includes the following steps: S1: forming a carrier and a bonding layer; S2: bonding a first semiconductor chip and an interconnection structure on the surface of the bonding layer; S3: forming a first plastic packaging layer; S4: removing the carrier and the bonding layer; S5: forming a first dielectric layer on the upper surface of the first plastic packaging layer and a second dielectric layer on the lower surface of the first plastic packaging layer, and forming a first redistribution wiring layer based on the first dielectric layer; S6: making a second semiconductor chip face downwards to be bonded to the first redistribution wiring layer; S7: forming a second plastic packaging layer enclosing the second semiconductor chip; and S8: forming a second redistribution wiring layer of the first semiconductor chip and the interconnection structure based on the second dielectric layer. The interconnection structure is additionally arranged during the stacked packing process, so that the connecting points are increased, the interconnection of the chips is easy to realize and the stability of the stacked packaging structure is improved.
Description
Technical field
The invention belongs to field of semiconductor manufacture, relate to a kind of stack chip packaging structure and method for packing.
Background technology
Semi-conductor industry experienced by grows up fast, and due to the improvement of electronic component integration density, people tend to pursue less and have more creationary semiconductor die package technology.In fan-out-type structure, the input of chip and o pads are distributed in region exterior residing for chip, and therefore, the quantity of semiconductor device input, o pads can increase.
Stack type package (PackageonPackage, PoP) the multiple chip of vertical stack in single package body can be made, the logic be longitudinally separated and storage ball grid array are combined, signal transmission is carried out by standard interface between stacked each packaging body, thus realize the multiplication of component density, make single package body realize more function, be widely used in the fields such as mobile phone, personal digital assistant (PDA), digital camera.
In Advanced Packaging, silicon through hole technology (Through-siliconvia, TSV) has significant impact, and it is the vertical electric connection technology penetrating substrate (particularly silicon chip).TSV almost can replace the place of the wire bonding (Wire-Bonding) in all encapsulation, improve the electric property of all kinds chip package, comprise raising integrated level, reduce chip size, particularly at system collection encapsulation (System-in-Packaging, SiP), among wafer level packaging (Wafer-LevelPackaging – WLP) and three-dimensional perpendicular stacked package (3DPackaging) these Advanced Packagings.The manufacture of TSV includes the manufacture of through hole, the deposition of insulating barrier, the filling of through hole and follow-up CMP (CMP) and the techniques such as (RDL) that connects up again.
Traditional stack type package is relevant to TSV technique, needs the manufacturing process of series of complex, causes higher production cost and lower yield.Existing a solution is, is formed at by connecting through hole in plastic packaging layer, and in connecting through hole filled conductive metal, realize the interconnection of chip chamber.This scheme is easy to realize, but the quantity of connecting through hole limits to some extent in plastic packaging layer, and due to thermal coefficient of expansion (CoefficientofThermalExpansion, CTE) mismatch, the conductive plug be formed in plastic packaging layer will cause the instability of join domain.
Therefore, how to provide a kind of novel stack chip packaging structure and method for packing, to reduce process complexity, to improve packaging efficiency, become the important technological problems that those skilled in the art are urgently to be resolved hurrily.
Summary of the invention
The shortcoming of prior art in view of the above, the object of the present invention is to provide a kind of stack chip packaging structure and method for packing, for solving stack type package complex process in prior art, cost is higher, yield is lower problem.
For achieving the above object and other relevant objects, the invention provides a kind of stacked chip packaging method, comprise the following steps:
S1: provide a carrier, forms adhesive layer at described carrier surface;
S2: the first semiconductor chip face down is adhered to described adhesive layer surface, and adhere at least one interconnection structure around described first semiconductor chip; Described interconnection structure comprises supporter and runs through some conductive poles of described supporter up and down;
S3: form the first plastic packaging layer on described adhesive layer surface, wherein, described first semiconductor chip and described interconnection structure to be embedded in described first plastic packaging layer and to expose upper surface;
S4: remove described carrier and adhesive layer;
S5: form first medium layer at described first plastic packaging layer upper surface, lower surface forms second dielectric layer, and based on described first medium layer, first is formed to described first semiconductor chip and described interconnection structure and to distribute again trace layer;
S6: distribute the second semiconductor chip face down and described first trace layer bonding again;
S7: form the second plastic packaging layer surrounding described second semiconductor chip;
S8: based on described second dielectric layer, second is formed to described first semiconductor chip and described interconnection structure and to distribute again trace layer.
Alternatively, also comprise step S9: distributing described second, trace layer is surperficial forms ubm layer again, and forms solder bumps on described ubm layer surface.
Alternatively, in described step S6, described second semiconductor chip front is manufactured with some projection cube structures, before bonding, first formed and cover the described first the 3rd dielectric layer distributing trace layer again, and in described 3rd dielectric layer, form some parts described first that exposes to distribute again the first through hole of trace layer, then by described projection cube structure and described first through-hole alignment, described second semiconductor chip to be distributed trace layer bonding by described projection cube structure and described first again.
Alternatively, in described step S5, form described first to distribute again the second through hole that trace layer comprises the steps: first to be formed in described first medium layer corresponding to some and described conductive pole, then in described second through hole, fill metal, and form metallic circuit on described first medium layer surface.
Alternatively, described step S5 is also included in described second dielectric layer and forms some and described first semiconductor chip and electrically draw and the step of third through-hole corresponding to described conductive pole.
Alternatively, the cross section of described conductive pole comprises at least one in polygon, circle and ellipse; The cross section of described supporter comprises at least one in polygon, circle and ellipse.
Alternatively, in described interconnection structure, each conductive pole is lattice arrangement.
Alternatively, the formation method of described interconnection structure comprises the following steps:
(1) described supporting construction is formed;
(2) in described supporting construction, some fourth holes are formed;
(3) in described fourth hole, fill metal, obtain described conductive pole.
Alternatively, the formation method of described interconnection structure comprises the following steps:
(1) substrate is provided, forms some conductive poles vertically set up at described substrate surface;
(2) moulding material of coated described conductive pole is formed;
(3) remove the unnecessary moulding material of described conductive pole upper surface and remove described substrate to expose described conductive pole lower surface, remaining moulding material forms described strutting piece.
Alternatively, in described step (1), form described conductive pole by galvanoplastic or fiber elongation method at described substrate surface.
The present invention also provides a kind of stack chip packaging structure, comprising:
First plastic packaging layer;
Be embedded in the first semiconductor chip in described first plastic packaging layer and at least one interconnection structure; Described interconnection structure comprises supporter and runs through some conductive poles of described supporter up and down;
Be positioned at described first side, the semiconductor chip back side and be electrically connected with described interconnection structure first distribute again trace layer;
Be positioned at described first side, the semiconductor chip back side and the second plastic packaging layer be connected with described first plastic packaging layer;
To be embedded in described second plastic packaging layer and to distribute again the second semiconductor chip that trace layer is electrically connected with described first;
Be positioned at described first side, semiconductor chip front and be electrically connected with described first semiconductor chip and described interconnection structure second distribute again trace layer.
Alternatively, described second semiconductor chip front is manufactured with some projection cube structures; Described second semiconductor chip is connected by described projection cube structure and described first trace layer that distributes again.
Alternatively, be formed with first medium layer group between described first semiconductor chip and described second semiconductor chip, described first trace layer that distributes again is embedded in described first medium layer group.
Alternatively, the described second trace layer surface that distributes again is connected with ubm layer, and described ubm layer surface is connected with solder bumps.
Alternatively, described first side, semiconductor chip front is formed with second dielectric layer group, and the described second distribute again trace layer and described ubm layer is embedded in described second dielectric layer group.
As mentioned above, stack chip packaging structure of the present invention and method for packing, have following beneficial effect: the present invention, by adding interconnection structure in stack type package process, makes tie point increasing number, thus the interconnection of chip chamber is more easily realized.The more important thing is, in stack type package structure of the present invention, each layer semiconductor chip and interconnection structure all embed in plastic packaging layer, can improve the stability of stack type package structure in severe external environment condition.
Accompanying drawing explanation
Fig. 1 is shown as the process chart of stacked chip packaging method of the present invention.
Fig. 2 is shown as stacked chip packaging method of the present invention forms adhesive layer schematic diagram at carrier surface.
Fig. 3 is shown as the schematic diagram of stacked chip packaging method of the present invention at described adhesive layer surface adhesion first semiconductor chip and at least one interconnection structure.
Fig. 4 is shown as a kind of layout structure figure of described first semiconductor chip and described interconnection structure.
Fig. 5 ~ Fig. 8 is shown as several cross sectional representation of described interconnection structure.
Fig. 9 ~ Figure 11 is shown as a kind of schematic diagram forming method of described interconnection structure.
Figure 12 ~ Figure 13 is shown as a kind of schematic diagram forming method of described interconnection structure.
Figure 14 is shown as stacked chip packaging method of the present invention forms the first plastic packaging layer schematic diagram on described adhesive layer surface.
Figure 15 is shown as the schematic diagram that stacked chip packaging method of the present invention removes described carrier and adhesive layer.
Figure 16 is shown as stacked chip packaging method of the present invention at the schematic diagram that described first plastic packaging layer upper surface forms first medium layer, lower surface forms second dielectric layer.
Figure 17 is shown as stacked chip packaging method of the present invention and forms the first schematic diagram distributing trace layer again based on described first medium layer to described first semiconductor chip and described interconnection structure.
Figure 18 is shown as stacked chip packaging method of the present invention and is formed and cover the described first schematic diagram of the 3rd dielectric layer distributing trace layer again.
Figure 19 is shown as stacked chip packaging method of the present invention by the schematic diagram of the projection cube structure in the second semiconductor chip front and described first through-hole alignment.
Figure 20 is shown as stacked chip packaging method of the present invention and second semiconductor chip face down and described first is distributed the schematic diagram of trace layer bonding again.
Figure 21 is shown as the schematic diagram that stacked chip packaging method of the present invention forms the second plastic packaging layer surrounding described second semiconductor chip.
Figure 22 is shown as stacked chip packaging method of the present invention and forms the second schematic diagram distributing trace layer again based on described second dielectric layer to described first semiconductor chip and described interconnection structure.
Element numbers explanation
S1 ~ S8 step
1 carrier
2 adhesive layers
3 first semiconductor chips
4 interconnection structures
5 supporters
6 conductive poles
7 fourth holes
8 substrates
9 moulding materials
10 first plastic packaging layers
11 first medium layers
12 second dielectric layer
13 second through holes
14 third through-holes
15 first distribute trace layer again
16 the 3rd dielectric layers
17 first through holes
18 second semiconductor chips
19 projection cube structures
20 second plastic packaging layers
21 second distribute trace layer again
22 ubm layers
23 solder bumps
24 the 4th dielectric layers
Embodiment
Below by way of specific instantiation, embodiments of the present invention are described, those skilled in the art the content disclosed by this specification can understand other advantages of the present invention and effect easily.The present invention can also be implemented or be applied by embodiments different in addition, and the every details in this specification also can based on different viewpoints and application, carries out various modification or change not deviating under spirit of the present invention.
Refer to Fig. 1 to Figure 22.It should be noted that, the diagram provided in the present embodiment only illustrates basic conception of the present invention in a schematic way, then only the assembly relevant with the present invention is shown in graphic but not component count, shape and size when implementing according to reality is drawn, it is actual when implementing, and the kenel of each assembly, quantity and ratio can be a kind of change arbitrarily, and its assembly layout kenel also may be more complicated.
Embodiment one
The invention provides a kind of stacked chip packaging method, refer to Fig. 1, be shown as the process chart of the method, comprise the following steps:
S1: provide a carrier, forms adhesive layer at described carrier surface;
S2: the first semiconductor chip face down is adhered to described adhesive layer surface, and adhere at least one interconnection structure around described first semiconductor chip; Described interconnection structure comprises supporter and runs through some conductive poles of described supporter up and down;
S3: form the first plastic packaging layer on described adhesive layer surface, wherein, described first semiconductor chip and described interconnection structure to be embedded in described first plastic packaging layer and to expose upper surface;
S4: remove described carrier and adhesive layer;
S5: form first medium layer at described first plastic packaging layer upper surface, lower surface forms second dielectric layer, and based on described first medium layer, first is formed to described first semiconductor chip and described interconnection structure and to distribute again trace layer;
S6: distribute the second semiconductor chip face down and described first trace layer bonding again;
S7: form the second plastic packaging layer surrounding described second semiconductor chip;
S8: based on described second dielectric layer, second is formed to described first semiconductor chip and described interconnection structure and to distribute again trace layer.
First refer to Fig. 2, perform step S1: provide a carrier 1, form adhesive layer 2 on described carrier 1 surface.
Concrete, described carrier 1 for follow-up making adhesive layer 2 and can paste structure or the matrix that the first semiconductor chip 3 and interconnection structure 4 provide rigidity, and its material can be selected from least one in metal, semiconductor (such as Si), polymer or glass.Exemplarily, described carrier 1 selects glass.
Described adhesive layer 2 in subsequent technique as the first semiconductor chip 3, separating layer between interconnection structure 4 and carrier 1, it preferably selects the jointing material with smooth finish surface to make, it must have certain adhesion with the first semiconductor chip 3 and interconnection structure 4, to ensure that the first semiconductor chip 3 and interconnection structure 4 can not produce the situations such as mobile in subsequent technique, in addition, itself and carrier 1 also have stronger adhesion, in general, the adhesion of itself and carrier 1 needs the adhesion that is greater than with the first semiconductor chip 3 and interconnection structure 4.Exemplarily, the material of described adhesive layer 2 adhesive glue etc. that is selected from the sticking adhesive tape of two-sided equal tool or made by spin coating proceeding.Described adhesive tape preferably adopts UV adhesive tape, and it is easy to be torn off after UV illumination is penetrated.
Then refer to Fig. 3, perform step S2: the first semiconductor chip 3 face down is adhered to described adhesive layer 2 surface, and adhere at least one interconnection structure 4 around described first semiconductor chip 3; Described interconnection structure comprises supporter and runs through some conductive poles of described supporter up and down.
Concrete, described first semiconductor chip 3 includes but not limited to the devices such as memory device, display device, input module, discrete component, power supply, pressurizer.The quantity of described first semiconductor chip 3 can be one or more, until the first semiconductor chip 3 quantity that a wafer can carry.Herein, the front of described first semiconductor chip 3 refers to the one side that described first semiconductor chip 3 is formed with device and electrode extraction.
Concrete, the quantity of the interconnection structure 4 around described first semiconductor chip 3 can be one or more, exemplarily, Fig. 4 shows a kind of layout structure figure of described first semiconductor chip 3 and described interconnection structure 4, as shown in the figure, be distributed with four described interconnection structures 4 around each described first semiconductor chip 3, these four described interconnection structures 4 lay respectively at the orientation, front, rear, left and right of described first semiconductor chip 3.Be only example herein, in other embodiments, the quantity of described interconnection structure 4 can increase and decrease as required, and its arrangement mode also can adjust, and should too not limit the scope of the invention herein.
Adding of described interconnection structure 4, the tie point increasing number in encapsulating structure can be made, thus the interconnection of chip chamber is more easily realized.
Concrete, the height of described interconnection structure 4 is preferably identical with described semiconductor chip or roughly the same.The cross section of described conductive pole comprises at least one in polygon, circle and ellipse; The cross section of described supporter comprises at least one in polygon, circle and ellipse.
Exemplarily, Fig. 5 ~ Fig. 8 shows several cross sectional representation of described interconnection structure, wherein, the cross section that Fig. 5 is shown as described supporter 5 and described conductive pole 6 is tetragonal schematic diagram, the cross section that Fig. 6 is shown as described supporter 5 is square, the cross section of described conductive pole 6 is circular schematic diagram, the cross section that Fig. 7 is shown as described supporter 5 is cross section that is circular, described conductive pole 6 is tetragonal schematic diagram, and the cross section that Fig. 8 is shown as described supporter 5 and described conductive pole 6 is circular schematic diagram.
Exemplarily, in described interconnection structure, each conductive pole 6 is in lattice arrangement.It is pointed out that lattice arrangement described herein refers in the cross section of described interconnection structure, the arrangement of each conductive pole has periodically.Fig. 5 ~ Fig. 8 is only example; in other embodiments; described supporter 5 and described conductive pole 6 also can possess other shape and arrangement mode, as long as meet described conductive pole about 6 to run through described supporter 5, should too not limit the scope of the invention herein.
Exemplarily, the formation method of described interconnection structure comprises the following steps:
As shown in Figure 9, step (1) is performed: form described supporting construction 5.
The material of described supporting construction 5 includes but not limited to glass, polymer, silica, silicon nitride etc., preferably adopts low K (dielectric constant K≤3.9) or ultralow K (dielectric constant K<3 or K<2.5) dielectric material.According to the difference of material, the methods such as Shooting Technique, spin coating, chemical vapour deposition (CVD), plasma gas-phase deposit can be adopted to form described supporting construction.
Described supporting construction 5 also can adopt the light-sensitive materials such as light-sensitive polyimide, photosensitive benzocyclobutene, photosensitive polybenzoxazole, it has the feature of low K equally, it can be used as photoresist layer again while as dielectric material, directly can obtain through hole wherein by steps such as exposure, developments.
As shown in Figure 10, perform step (2), in described supporting construction 5, form some second through holes 7.The method forming described second through hole 7 includes but not limited to laser drill, machine drilling, deep reaction ion etching, exposure imaging etc.
As shown in figure 11, in described second through hole 7, fill metal, obtain described conductive pole 6.The material of described conductive pole 6 is selected from least one in Al, Cu, Sn, Ni, Au and Ag.The method of filling metal in described second through hole 7 includes but not limited to plating, chemical plating, physical vapour deposition (PVD), chemical vapour deposition technique etc.
In another embodiment, described interconnection structure also can adopt following steps to be formed:
As shown in figure 12, perform step (1): provide a substrate 8, form some conductive poles 6 vertically set up on described substrate 8 surface.
Concrete, form described conductive pole 6 by galvanoplastic or fiber elongation method at described substrate surface.
As shown in figure 13, step (2) is performed: the moulding material 9 forming coated described conductive pole 6.Described moulding material adopts thermosets, includes but not limited to epoxy resin, polyimides, silica gel etc.Can adopt compression molding, note pressing formation realize this process.
Then step (3) is performed, remove the unnecessary moulding material of described conductive pole 6 upper surface and remove described substrate 8 to expose described conductive pole 6 lower surface, remaining moulding material forms described strutting piece 5, thus obtains interconnection structure as shown in figure 11.
It is pointed out that above two kinds of methods all can form multiple described interconnection structure simultaneously, obtain single described interconnection structure finally by cutting.
Refer to Figure 14 again, perform step S3: form the first plastic packaging layer 10 on described adhesive layer 2 surface, wherein, described first semiconductor chip 3 and described interconnection structure 4 to be embedded in described first plastic packaging layer 10 and to expose upper surface.
It is to be noted, multiple first semiconductor chips 3 of described adhesive layer 2 surface adhesion can be inconsistent with the height of interconnection structure 4, when forming described plastic packaging layer 10, in order to expose the upper surface of all described first semiconductor chips 3 and described interconnection structure 4, the techniques such as grinding, local laser opening can be adopted to described plastic packaging layer.Wherein, the height of each first semiconductor chip 3 and interconnection structure 4 can carry out reasonable adjusting according to actual needs.
Concrete, described first plastic packaging layer 10 selects thermosets, conventional capsulation material such as such as silica gel, epoxy resin etc.The method forming described plastic packaging layer 10 can be selected from but be not limited to compression molding (compressivemolding), printing (pasteprinting), transfer molding (transfermolding), hydraulic seal are shaped in the method such as (liquidencapsulantmolding), vacuum pressing-combining (vacuumlamination), spin coating (spincoating) any one.
Such as, transfer molding (transfermolding) is one of manufacturing process of plastics, it is by the metal pattern heating after closed, the method be shaped of hardening is made it from tubule cast gate press-in molten resin, high compared with the forming accuracy of compression molding, and the formed products of very complicated shape can be generated.And to load resin at a place and carry out once-through operation and simultaneously can obtain several formed products in the metal pattern be communicated with.This manufacturing process is mainly used in the shaping of the thermosetting resins such as phenolic resins, urea resin, melamine, epoxy resin and polyester, so be also referred to as the note pressing formation of thermosetting resin.
Then refer to Figure 15, perform step S4: remove described carrier 1 and adhesive layer 2.
Concrete, the method removing described carrier 1 and adhesive layer 2 is selected from but is not limited at least one in chemical corrosion, mechanical stripping, mechanical lapping, heat baking, UV-irradiation, laser ablation, chemico-mechanical polishing and wet method stripping.Such as, if described adhesive layer 2 adopts UV adhesive tape, then can first adopt UV-irradiation that described UV adhesive tape viscosity is reduced, then the mode by tearing off makes described carrier 1 and described adhesive layer 2 depart from described first plastic packaging layer 10, chip 3 and interconnection structure 4, relative to reduction process, as grinding, corrosion etc., this separation method is more simple, be easy to operation, greatly can reduce process costs.
Refer to Figure 16 ~ Figure 17 again, perform step S5: form first medium layer 11 at described first plastic packaging layer 10 upper surface, lower surface forms second dielectric layer 12, and based on described first medium layer 11, first is formed to described first semiconductor chip 3 and described interconnection structure 4 and to distribute again trace layer 15.
Concrete, described first medium layer 11 can adopt identical or different material with second dielectric layer 12, the low K of preferred employing or ultra low-K material, include but not limited to silica, phosphorosilicate glass, silicon oxycarbide compound, polyimides, benzocyclobutene, polybenzoxazoles etc.According to the difference of material, the methods such as spin coating, thermal chemical vapor deposition, plasma reinforced chemical vapour deposition can be selected to form described first medium layer 11 and second dielectric layer 12.
Concrete, form at least one that the described first method distributing trace layer 15 again includes but not limited in physical vaporous deposition, chemical vapour deposition technique, plating and chemical plating; Described first distributes trace layer 15 again can for single or multiple lift, and its material is selected from but is not limited at least one in Al, Cu, Sn, Ni, Au and Ag.
Exemplarily, form described first trace layer 15 that distributes again and comprise the steps: as shown in figure 16, in described first medium layer 11, first form the second through hole 13 corresponding to some and described conductive pole; As shown in figure 17, in described second through hole 13, then fill metal form conductive plug, and form metallic circuit on described first medium layer 11 surface, described conductive plug and described metallic circuit form described first and to distribute trace layer 15 again.
Described conductive plug and described metallic circuit can be formed respectively, also can be formed together.Exemplarily, first in described second through hole 13, fill metallic conductor by techniques such as deposition, plating, form described conductive plug; Then photoetching technique is utilized on described first medium layer by sputtering and electroplate the metallic circuit pattern needed for formation.
Concrete, as shown in figure 16, when forming described second through hole 13 in described first medium layer 11, some and described first semiconductor chip 3 can also be formed electrically draw and third through-hole 14 corresponding to described conductive pole in described second dielectric layer 12.
The method forming described second through hole 13 and third through-hole 14 includes but not limited to laser drill, machine drilling, deep reaction ion etching.If described first medium layer 11 adopts light-sensitive material with second dielectric layer 12, also directly described second through hole 13 and third through-hole 14 can be obtained by exposure, development, thus Simplified flowsheet step.
Then refer to Figure 18 ~ Figure 20, perform step S6: distribute the second semiconductor chip 18 face down and described first trace layer 15 bonding again.
Concrete, described second semiconductor chip 18 front is manufactured with some projection cube structures 19 (as shown in figure 19), before bonding, first formed and cover the described first the 3rd dielectric layer 16 (as shown in figure 18) distributing trace layer 15 again, and in described 3rd dielectric layer 16, form some parts described first that exposes to distribute again the first through hole 17 (as shown in figure 18) of trace layer 15, then described projection cube structure 19 is aimed at (as shown in figure 19) with described first through hole 17, described second semiconductor chip 18 to be distributed trace layer 15 bonding (as shown in figure 20) by described projection cube structure 19 and described first again.
Refer to Figure 21 again, perform step S7: form the second plastic packaging layer 20 surrounding described second semiconductor chip 18.
The method forming described second plastic packaging layer 20 is roughly the same with the method forming described first plastic packaging layer 10, repeats no more herein.It is to be noted; in this step; the back side of described second semiconductor chip 18 can be coated in described second plastic packaging layer 20 (as shown in figure 21), also can be exposed to the second plastic packaging layer 20 outer (not giving diagram), should too not limit the scope of the invention herein.
In addition, described second plastic packaging layer 20 can coated described first plastic packaging layer 10 edge, and to strengthen encapsulating fastness, in this case, the edge of described second dielectric layer 12 is also coated in described second plastic packaging layer 20 (as shown in figure 21).
In the present invention, because each layer semiconductor chip and interconnection structure all embed in plastic packaging layer, the stability of stack type package structure in severe external environment condition can be improved.
Finally refer to Figure 22, perform step S8: based on described second dielectric layer 12, second is formed to described first semiconductor chip 3 and described interconnection structure 4 and to distribute again trace layer 21.Forming described second distribute the again method of trace layer 21 roughly the same with forming described first distribute the again method of trace layer 15, repeating no more herein.
Further, stacked chip packaging method of the present invention also comprises step S9: as shown in figure 22, and distributing described second, trace layer 21 is surperficial forms ubm layer 22 again, and forms solder bumps 23 on described ubm layer 22 surface.
Concrete, described step S9 comprises:
Step S9-1: the 4th dielectric layer 25 of the trace layer 21 that distributes again in described second dielectric layer 12 surface formation covering described second, and some through holes are formed in described 4th dielectric layer 25;
Step S9-2: form described ubm layer 22 and described solder bumps 23 based on described 4th dielectric layer 24 and described through hole.
Described ubm layer 22 can stop the diffusion between solder bumps 23 and integrated circuit, and realizes lower contact resistance.Usually, described ubm layer 22 can be single or multiple lift metal.Exemplarily, described ubm layer 22 is Ti/Cu composite bed.The material of described solder bumps 23 includes but not limited to the conducting metals such as Ag, Cu.
For the situation that many group stacked chips encapsulate simultaneously, be finally separated each group of stacked chip by cutting technique.
Stacked chip packaging method of the present invention, by adding interconnection structure in stack type package process, makes tie point increasing number, thus the interconnection of chip chamber is more easily realized.Stacked chip packaging method of the present invention simplifies processing step, is conducive to improving packaging efficiency, reduces production cost.
Embodiment two
The present invention also provides a kind of stack chip packaging structure, and as shown in figure 22, this stack chip packaging structure comprises:
First plastic packaging layer 10;
Be embedded in the first semiconductor chip 3 in described first plastic packaging layer 10 and at least one interconnection structure 4; Described interconnection structure 4 comprises supporter and runs through some conductive poles of described supporter up and down;
Be positioned at described first side, semiconductor chip 3 back side and be electrically connected with described interconnection structure 4 first distribute again trace layer 15;
Be positioned at described first side, semiconductor chip 3 back side and the second plastic packaging layer 20 be connected with described first plastic packaging layer 10;
To be embedded in described second plastic packaging layer 20 and to distribute again the second semiconductor chip 18 that trace layer 10 is electrically connected with described first;
Be positioned at described first side, semiconductor chip 3 front and be electrically connected with described first semiconductor chip 3 and described interconnection structure 4 second distribute again trace layer 21.
Exemplarily, described second semiconductor chip 18 front is manufactured with some projection cube structures 19; Described second semiconductor chip 18 is connected by described projection cube structure 19 and described first trace layer 10 that distributes again.Described projection cube structure 19 obtains by techniques such as sputtering, plating.
Exemplarily, be formed with first medium layer group between described first semiconductor chip 3 and described second semiconductor chip 18, described first trace layer 15 that distributes again is embedded in described first medium layer group.Exemplarily, as shown in figure 22, described first medium layer group comprises first medium layer 11 and the 3rd dielectric layer 16, wherein, be formed in described first medium layer 11 and hold the described first through hole of conductive plug distributing trace layer 15 again, in described 3rd dielectric layer 16, be formed with the through hole holding described projection cube structure 19.
Further, described second trace layer 21 surface that distributes again is connected with ubm layer 22, and described ubm layer 22 surface is connected with solder bumps 23.Described first side, semiconductor chip 3 front is formed with second dielectric layer group, and the described second distribute again trace layer 21 and described ubm layer 22 is embedded in described second dielectric layer group.Exemplarily, as shown in figure 22, described second dielectric layer group comprises second dielectric layer 12 and the 4th dielectric layer 24, wherein, be formed in described second dielectric layer 12 and hold the described second through hole of conductive plug distributing trace layer 21 again, described 4th dielectric layer 24 covers described second and to distribute trace layer 21 again, and is formed with the through hole holding described ubm layer 22.
Concrete, the height of described interconnection structure 4 is preferably identical or roughly the same with the height of described first semiconductor chip 3, certainly, the height of described interconnection structure 4 also can carry out reasonable adjusting according to actual needs, accordingly, the local openings corresponding with described conductive pole can be formed with in described first plastic packaging layer 10, in this local openings, be filled with conducting metal.
Concrete, the cross section of described conductive pole comprises at least one in polygon, circle and ellipse; The cross section of described supporter comprises at least one in polygon, circle and ellipse.Exemplarily, Fig. 5 ~ Fig. 8 shows several cross sectional representation of described interconnection structure, wherein, the cross section that Fig. 5 is shown as described supporter 5 and described conductive pole 6 is tetragonal schematic diagram, the cross section that Fig. 6 is shown as described supporter 5 is square, the cross section of described conductive pole 6 is circular schematic diagram, the cross section that Fig. 7 is shown as described supporter 5 is cross section that is circular, described conductive pole 6 is tetragonal schematic diagram, and the cross section that Fig. 8 is shown as described supporter 5 and described conductive pole 6 is circular schematic diagram.
Exemplarily, in described interconnection structure, each conductive pole 6 is in lattice arrangement.It is pointed out that lattice arrangement described herein refers in the cross section of described interconnection structure, the arrangement of each conductive pole has periodically.Fig. 5 ~ Fig. 8 is only example; in other embodiments; described supporter 5 and described conductive pole 6 also can possess other shape and arrangement mode, as long as meet described conductive pole about 6 to run through described supporter 5, should too not limit the scope of the invention herein.
In described interconnection structure, described supporter 5 preferably adopts low-K material (dielectric constant K≤3.9), includes but not limited to glass, polymer, silica, silicon nitride etc.The material of described conductive pole 6 is selected from least one in Al, Cu, Sn, Ni, Au and Ag.Described first medium layer 11, second dielectric layer 12, the 3rd dielectric layer 16 and the 4th dielectric layer 24 can adopt identical or different material, the low K of preferred employing or ultra low-K material, include but not limited in silica, phosphorosilicate glass, silicon oxycarbide compound, polyimides, benzocyclobutene, polybenzoxazoles any one.
In stack chip packaging structure of the present invention, each layer semiconductor chip and interconnection structure all embed in plastic packaging layer, in severe external environment condition, have higher stability.Stack chip packaging structure of the present invention is easy to realize, and is conducive to reducing process complexity, improves packaging efficiency, reduce production cost.
In sum, the present invention, by adding interconnection structure in stack type package process, makes tie point increasing number, thus the interconnection of chip chamber is more easily realized.The more important thing is, in stack type package structure of the present invention, each layer semiconductor chip and interconnection structure all embed in plastic packaging layer, can improve the stability of stack type package structure in severe external environment condition.So the present invention effectively overcomes various shortcoming of the prior art and tool high industrial utilization.
Above-described embodiment is illustrative principle of the present invention and effect thereof only, but not for limiting the present invention.Any person skilled in the art scholar all without prejudice under spirit of the present invention and category, can modify above-described embodiment or changes.Therefore, such as have in art usually know the knowledgeable do not depart from complete under disclosed spirit and technological thought all equivalence modify or change, must be contained by claim of the present invention.
Claims (15)
1. a stacked chip packaging method, is characterized in that, comprises the following steps:
S1: provide a carrier, forms adhesive layer at described carrier surface;
S2: the first semiconductor chip face down is adhered to described adhesive layer surface, and adhere at least one interconnection structure around described first semiconductor chip; Described interconnection structure comprises supporter and runs through some conductive poles of described supporter up and down;
S3: form the first plastic packaging layer on described adhesive layer surface, wherein, described first semiconductor chip and described interconnection structure to be embedded in described first plastic packaging layer and to expose upper surface;
S4: remove described carrier and adhesive layer;
S5: form first medium layer at described first plastic packaging layer upper surface, lower surface forms second dielectric layer, and based on described first medium layer, first is formed to described first semiconductor chip and described interconnection structure and to distribute again trace layer;
S6: distribute the second semiconductor chip face down and described first trace layer bonding again;
S7: form the second plastic packaging layer surrounding described second semiconductor chip;
S8: based on described second dielectric layer, second is formed to described first semiconductor chip and described interconnection structure and to distribute again trace layer.
2. stacked chip packaging method according to claim 1, is characterized in that: also comprise step S9: distributing described second, trace layer is surperficial forms ubm layer again, and forms solder bumps on described ubm layer surface.
3. stacked chip packaging method according to claim 1, it is characterized in that: in described step S6, described second semiconductor chip front is manufactured with some projection cube structures, before bonding, first formed and cover the described first the 3rd dielectric layer distributing trace layer again, and in described 3rd dielectric layer, form some parts described first that exposes to distribute again the first through hole of trace layer, then by described projection cube structure and described first through-hole alignment, described second semiconductor chip to be distributed trace layer bonding by described projection cube structure and described first again.
4. stacked chip packaging method according to claim 1, it is characterized in that: in described step S5, form described first to distribute again the second through hole that trace layer comprises the steps: first to be formed in described first medium layer corresponding to some and described conductive pole, then in described second through hole, fill metal, and form metallic circuit on described first medium layer surface.
5. stacked chip packaging method according to claim 1, is characterized in that: described step S5 is also included in described second dielectric layer and forms some and described first semiconductor chip and electrically draw and the step of third through-hole corresponding to described conductive pole.
6. stacked chip packaging method according to claim 1, is characterized in that: the cross section of described conductive pole comprises at least one in polygon, circle and ellipse; The cross section of described supporter comprises at least one in polygon, circle and ellipse.
7. stacked chip packaging method according to claim 1, it is characterized in that: in described interconnection structure, each conductive pole is lattice arrangement.
8. stacked chip packaging method according to claim 1, is characterized in that: the formation method of described interconnection structure comprises the following steps:
(1) described supporting construction is formed;
(2) in described supporting construction, some fourth holes are formed;
(3) in described fourth hole, fill metal, obtain described conductive pole.
9. stacked chip packaging method according to claim 1, is characterized in that: the formation method of described interconnection structure comprises the following steps:
(1) substrate is provided, forms some conductive poles vertically set up at described substrate surface;
(2) moulding material of coated described conductive pole is formed;
(3) remove the unnecessary moulding material of described conductive pole upper surface and remove described substrate to expose described conductive pole lower surface, remaining moulding material forms described strutting piece.
10. stacked chip packaging method according to claim 9, is characterized in that: in described step (1), forms described conductive pole by galvanoplastic or fiber elongation method at described substrate surface.
11. 1 kinds of stack chip packaging structures, is characterized in that, comprising:
First plastic packaging layer;
Be embedded in the first semiconductor chip in described first plastic packaging layer and at least one interconnection structure; Described interconnection structure comprises supporter and runs through some conductive poles of described supporter up and down;
Be positioned at described first side, the semiconductor chip back side and be electrically connected with described interconnection structure first distribute again trace layer;
Be positioned at described first side, the semiconductor chip back side and the second plastic packaging layer be connected with described first plastic packaging layer;
To be embedded in described second plastic packaging layer and to distribute again the second semiconductor chip that trace layer is electrically connected with described first;
Be positioned at described first side, semiconductor chip front and be electrically connected with described first semiconductor chip and described interconnection structure second distribute again trace layer.
12. stack chip packaging structures according to claim 11, is characterized in that: described second semiconductor chip front is manufactured with some projection cube structures; Described second semiconductor chip is connected by described projection cube structure and described first trace layer that distributes again.
13. stack chip packaging structures according to claim 11, is characterized in that: be formed with first medium layer group between described first semiconductor chip and described second semiconductor chip, and described first trace layer that distributes again is embedded in described first medium layer group.
14. stack chip packaging structures according to claim 11, is characterized in that: the described second trace layer surface that distributes again is connected with ubm layer, and described ubm layer surface is connected with solder bumps.
15. stack chip packaging structures according to claim 14, it is characterized in that: described first side, semiconductor chip front is formed with second dielectric layer group, the described second distribute again trace layer and described ubm layer is embedded in described second dielectric layer group.
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100133704A1 (en) * | 2008-12-01 | 2010-06-03 | Stats Chippac, Ltd. | Semiconductor Device and Method of Forming an Interposer Package with Through Silicon Vias |
| KR20120094182A (en) * | 2011-02-16 | 2012-08-24 | 앰코 테크놀로지 코리아 주식회사 | Wafer level stack package and method for manufacturing the same |
| CN103456715A (en) * | 2012-06-04 | 2013-12-18 | 欣兴电子股份有限公司 | Intermediary base material and manufacturing method thereof |
| KR20140020506A (en) * | 2012-08-09 | 2014-02-19 | 앰코 테크놀로지 코리아 주식회사 | Wafer level fan out package and method for manufacturing the same |
| CN103779235A (en) * | 2012-10-19 | 2014-05-07 | 台湾积体电路制造股份有限公司 | Fan-out wafer level package structure |
| US20140210099A1 (en) * | 2013-01-30 | 2014-07-31 | Taiwan Semiconductor Manufacturing Company, Ltd. | Packaged Semiconductor Devices and Packaging Methods |
| US20140252605A1 (en) * | 2013-03-07 | 2014-09-11 | Samsung Electronics Co., Ltd. | Semiconductor package and method of fabricating the same |
-
2015
- 2015-09-24 CN CN201510618758.6A patent/CN105118823A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100133704A1 (en) * | 2008-12-01 | 2010-06-03 | Stats Chippac, Ltd. | Semiconductor Device and Method of Forming an Interposer Package with Through Silicon Vias |
| KR20120094182A (en) * | 2011-02-16 | 2012-08-24 | 앰코 테크놀로지 코리아 주식회사 | Wafer level stack package and method for manufacturing the same |
| CN103456715A (en) * | 2012-06-04 | 2013-12-18 | 欣兴电子股份有限公司 | Intermediary base material and manufacturing method thereof |
| KR20140020506A (en) * | 2012-08-09 | 2014-02-19 | 앰코 테크놀로지 코리아 주식회사 | Wafer level fan out package and method for manufacturing the same |
| CN103779235A (en) * | 2012-10-19 | 2014-05-07 | 台湾积体电路制造股份有限公司 | Fan-out wafer level package structure |
| US20140210099A1 (en) * | 2013-01-30 | 2014-07-31 | Taiwan Semiconductor Manufacturing Company, Ltd. | Packaged Semiconductor Devices and Packaging Methods |
| US20140252605A1 (en) * | 2013-03-07 | 2014-09-11 | Samsung Electronics Co., Ltd. | Semiconductor package and method of fabricating the same |
Cited By (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017049928A1 (en) * | 2015-09-24 | 2017-03-30 | 中芯长电半导体（江阴）有限公司 | Chip packaging structure and packaging method therefor |
| CN105551988A (en) * | 2015-12-22 | 2016-05-04 | 华进半导体封装先导技术研发中心有限公司 | Multi-layered fanout type packaging structure and preparation method therefor |
| CN105609480A (en) * | 2015-12-24 | 2016-05-25 | 合肥祖安投资合伙企业(有限合伙) | Stacked chip package structure |
| CN107154388A (en) * | 2016-03-02 | 2017-09-12 | 三星电子株式会社 | Semiconductor package assembly and a manufacturing method thereof |
| CN107154388B (en) * | 2016-03-02 | 2022-11-04 | 三星电子株式会社 | Semiconductor package and method of manufacturing the same |
| CN107818922A (en) * | 2016-09-13 | 2018-03-20 | 三星电子株式会社 | The method for manufacturing semiconductor packages |
| CN107818922B (en) * | 2016-09-13 | 2020-11-17 | 三星电子株式会社 | Method of manufacturing semiconductor package |
| WO2018171099A1 (en) * | 2017-03-22 | 2018-09-27 | 中芯长电半导体（江阴）有限公司 | Encapsulation method for encapsulation structure with integrated power transmission chip |
| CN108807295A (en) * | 2017-04-28 | 2018-11-13 | 中芯长电半导体（江阴）有限公司 | A kind of encapsulating structure and packaging method |
| CN109411367A (en) * | 2017-08-17 | 2019-03-01 | 力成科技股份有限公司 | Semiconductor package and forming method thereof |
| WO2019042120A1 (en) * | 2017-08-29 | 2019-03-07 | 华为技术有限公司 | Chip packaging structure and manufacturing method therefor, and electronic device |
| CN108389823A (en) * | 2018-01-31 | 2018-08-10 | 浙江卓晶科技有限公司 | For multi-chip wafer scale fan-out-type 3 D stereo encapsulating structure and its packaging technology |
| WO2020132909A1 (en) * | 2018-12-26 | 2020-07-02 | 华为技术有限公司 | Chip packaging structure |
| CN113169153A (en) * | 2018-12-26 | 2021-07-23 | 华为技术有限公司 | Packaging structure of chip |
| CN113169153B (en) * | 2018-12-26 | 2023-09-29 | 华为技术有限公司 | Packaging structure of chip |
| CN109817589A (en) * | 2018-12-29 | 2019-05-28 | 华进半导体封装先导技术研发中心有限公司 | The encapsulating structure and method of electromagnetic shielding are realized to chip |
| CN109727848A (en) * | 2018-12-29 | 2019-05-07 | 长江存储科技有限责任公司 | A kind of manufacturing method of three-dimensional storage |
| WO2020237685A1 (en) * | 2019-05-31 | 2020-12-03 | 华为技术有限公司 | Chip and integrated chip |
| WO2021109527A1 (en) * | 2019-12-06 | 2021-06-10 | 上海先方半导体有限公司 | Plastic encapsulation structure used for three dimensional fan-out encapsulation |
| US11710717B2 (en) | 2020-01-07 | 2023-07-25 | Yangtze Memory Technologies Co., Ltd. | Methods for multi-wafer stacking and dicing |
| CN111900094A (en) * | 2020-07-15 | 2020-11-06 | 中国电子科技集团公司第五十八研究所 | High-transmission-rate wafer-level fan-out type packaging method and structure thereof |
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| CN112420529B (en) * | 2020-11-27 | 2022-04-01 | 上海易卜半导体有限公司 | Package and method of forming a package |
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