CN109817589A - The encapsulating structure and method of electromagnetic shielding are realized to chip - Google Patents
The encapsulating structure and method of electromagnetic shielding are realized to chip Download PDFInfo
- Publication number
- CN109817589A CN109817589A CN201811645493.9A CN201811645493A CN109817589A CN 109817589 A CN109817589 A CN 109817589A CN 201811645493 A CN201811645493 A CN 201811645493A CN 109817589 A CN109817589 A CN 109817589A
- Authority
- CN
- China
- Prior art keywords
- chip
- shielded
- layer
- conducting bridge
- electromagnetic shielding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/04105—Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/12105—Bump connectors formed on an encapsulation of the semiconductor or solid-state body, e.g. bumps on chip-scale packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The invention discloses encapsulating structures and method that electromagnetic shielding is realized to chip, wherein the structure includes: chip to be shielded；Molding layer, coats the side wall of chip to be shielded, and exposes the pad of chip to be shielded；At least one conducting bridge, conducting bridge include at least one conductive metal structure；Conducting bridge penetrates through molding layer, and the both ends of conductive metal structure are exposed in the both side surface of molding layer respectively in conducting bridge；Multiple conducting bridges are located at around chip to be shielded；Conductive layer, is set to the side of molding layer, and conductive layer is electrically connected with conductive metal structure.The encapsulating structure of the present invention program preparation can realize electromagnetic shielding completely to chip, and small volume, embedded shield loop are not easy affected by environment and lose electro-magnetic screen function, will not fall off, and reliability is higher.It is above-mentioned that the packaging method of electromagnetic shielding can also realize individually electromagnetic shielding to each chip in multiple integrated chips to be realized to chip, it avoids interfering with each other between the intracorporal chip of encapsulation.
Description
Technical field
The present invention relates to integrated circuit Advanced Packaging fields, and in particular to a kind of pair of chip realizes the envelope of electromagnetic shielding
Assembling structure and method.
Background technique
In field of electronic devices, there is IC chip (English: Integrated much more sensitive to electromagnetic interference
Circuit, referred to as: IC chip is referred to as chip in the application by IC), such as radio frequency chip, especially high-frequency radio frequency
Chip.These chips must carry out electromagnetic shielding before work to it.
The prior art, which is electromagnetically shielded chip, often disposes metal shell, Huo Zhetong in the packaging body periphery of chip
The method of vacuum sputtering is crossed outside the packaging body of chip into metal film.
However, it is found by the inventors that the mode for installing metal shell increases the volume of chip-packaging structure, while to smaller
The encapsulating structure of volume, the method for disposing metal shell become relatively difficult, and will increase the volume of packaging body.And splash-proofing sputtering metal
Outside of the film method since packaging body is arranged in, is easier to the influence by external environment, and thickness is too thin, and metal film is easy to aoxidize
And electro-magnetic screen function is lost, reliability is poor；Even if metal film, which thickens, can guarantee electro-magnetic screen function, but manufacturing cost
It is significantly raised；On the other hand, the adhesion of the metal thick film and encapsulating structure that so prepare is poor, is easy during use
Layering occurs to fall off, reliability is poor.
Summary of the invention
In view of this, the embodiment of the invention provides the encapsulating structures and method of realizing electromagnetic shielding to chip, to solve
The packaging body that electromagnetic armouring structure reliability in the prior art is poor, preparation cost is high, difficulty is big, is arranged after electromagnetic shielding
The larger problem of volume.
According in a first aspect, the embodiment of the invention provides the encapsulating structures that a kind of pair of chip realizes electromagnetic shielding, comprising:
Chip to be shielded；Molding layer, coats the side wall of the chip to be shielded, and exposes the pad of the chip to be shielded；At least one
A conducting bridge, the conducting bridge include at least one conductive metal structure；The conducting bridge penetrates through the molding layer, and described leads
The both ends of conductive metal structure are exposed in the both side surface of the molding layer respectively in electric bridge；The multiple conducting bridge is located at described
Around chip to be shielded；Conductive layer is set to the side of the molding layer, the conductive layer and conductive metal structure electricity
Connection.
Optionally, the conductive metal structure includes conductive metal wire and/or conductive metal sheet.
Optionally, the conducting bridge makes obtain by the following method: making a reservation on the substrate of inorganic as needed
Position punching, and conductive metal is filled in the hole, cut the substrate as needed to obtain the conducting bridge.
Optionally, the encapsulating structure further include: reroute layer and/or soldered ball, be set to the molding layer backwards to described
The surface of conductive layer.
According to second aspect, the embodiment of the invention provides the packaging methods that a kind of pair of chip realizes electromagnetic shielding, comprising:
Chip to be shielded is attached in the first surface of support plate；It is pasted in the first surface of the support plate, and around the chip to be shielded
At least one attached conducting bridge；The conducting bridge includes at least one conductive metal structure；It is formed in the first surface of the support plate
Molding layer, the molding layer coat the side wall of the chip to be shielded and the conducting bridge, and expose the chip to be shielded
The both ends of conductive metal structure in pad and the conducting bridge；It is arranged in the molding layer toward or away from the side of the support plate
Conductive layer, the conductive layer are electrically connected with the conductive metal structure.
Optionally, the conducting bridge makes obtain by the following method: making a reservation on the substrate of inorganic as needed
Position punching, and conductive metal is filled in the hole；The substrate is cut as needed, obtains the conducting bridge.
Optionally, described to include: the step of conductive layer is arranged toward or away from the side of the support plate in the molding layer
Before the step of first surface in support plate attaches chip to be shielded, conductive layer is set in the first surface of support plate.
Optionally, before the step of first surface in support plate attaches chip to be shielded and described in the load
The first surface of plate, and before the step of attaching multiple conducting bridges around the chip to be shielded, further includes: in the conduction
Layer surface coats conductive metal glue.
Optionally, described to include: the step of conductive layer is arranged toward or away from the side of the support plate in the molding layer
Remove the support plate；On the surface for originally attaching the support plate, conductive layer is set.
Optionally, the encapsulating structure further include: formed and rerouted backwards to the surface of the conductive layer in the molding layer
Layer and/or setting soldered ball, wherein at least one of described conducting wire for rerouting layer and/or the soldered ball and the conducting bridge
The conductive metal structure electrical connection that end is exposed.
The above-mentioned encapsulating structure that electromagnetic shielding is realized to chip realizes chip surface by the conductive layer of molding layer side
Electromagnetic shielding, and the conductive metal structure by being embedded in molding layer, around chip realizes the electricity of chip sidewall sections
Magnetic screen, conductive layer and conductive metal structure are respectively positioned on the inside of packaging body, it is not easy to be affected by the external environment and lose electromagnetism
Function of shielding, and will not fall off, reliability is higher；Compared with prior art, which can realize electromagnetic screen to chip
It covers, and encapsulation volume is smaller, preparation cost is lower.It is above-mentioned that the encapsulating structure of electromagnetic shielding can also be to multiple cores to be realized to chip
Each chip during piece is integrated realizes individually electromagnetic shielding, avoids interfering with each other between the intracorporal chip of encapsulation.
Detailed description of the invention
It, below will be to specific in order to illustrate more clearly of the specific embodiment of the invention or technical solution in the prior art
Embodiment or attached drawing needed to be used in the description of the prior art be briefly described, it should be apparent that, it is described below
Attached drawing is some embodiments of the present invention, for those of ordinary skill in the art, before not making the creative labor
It puts, is also possible to obtain other drawings based on these drawings.
Fig. 1 shows the flow chart that a kind of pair of chip according to an embodiment of the present invention realizes the packaging method of electromagnetic shielding；
Fig. 2 shows the processes of another packaging method that electromagnetic shielding is realized to chip according to an embodiment of the present invention
Figure；
Fig. 3 shows the process of another packaging method being electromagnetically shielded to chip realization according to an embodiment of the present invention
Figure；
Fig. 4 shows the process of another packaging method being electromagnetically shielded to chip realization according to an embodiment of the present invention
Figure；
A kind of pair of chip that Fig. 5 A, Fig. 5 B, Fig. 5 D to Fig. 5 G show the embodiment of the present invention realizes the encapsulation of electromagnetic shielding
The obtained structural schematic diagram of part steps in method；
Fig. 5 C shows the top view after another conducting bridge according to an embodiment of the present invention attaches；
Fig. 6 A to Fig. 6 F is shown in the middle part of another packaging method being electromagnetically shielded to chip realization of the embodiment of the present invention
Obtained structural schematic diagram step by step；
Fig. 7 A to Fig. 7 F is shown in the middle part of another packaging method being electromagnetically shielded to chip realization of the embodiment of the present invention
Obtained structural schematic diagram step by step；
Appended drawing reference:
10 --- support plate；20 --- interim bonded layer；30 --- conductive layer；
40 --- layers of two-sided；50 --- chip to be shielded；60 --- conducting bridge；
61 --- conductive metal structure；62 --- inorganic；70 --- molding layer；
80 --- reroute layer；90 --- soldered ball.
Specific embodiment
In order to make the object, technical scheme and advantages of the embodiment of the invention clearer, below in conjunction with the embodiment of the present invention
In attached drawing, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described embodiment is
A part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, those skilled in the art are not having
Every other embodiment obtained under the premise of creative work is made, shall fall within the protection scope of the present invention.
Embodiment one
The embodiment of the invention provides the encapsulating structures that a kind of pair of chip realizes electromagnetic shielding, and as depicted in fig. 5g, this is to core
Piece realizes that the encapsulating structure of electromagnetic shielding includes chip 50, molding layer 70, at least one conducting bridge 60 and conductive layer to be shielded
30。
Molding layer 70 coats the side wall of chip 50 to be shielded, and exposes the pad of chip 50 to be shielded.
Conducting bridge 60 includes at least one conductive metal structure, and conducting bridge 60 penetrates through molding layer 70, and leads in conducting bridge 70
Expose respectively in the both side surface of molding layer 70 at the both ends of electric metal structure.Conducting bridge 60 can for individual conductive metal wire or
(situation is not shown in the figure in the attached of the present patent application to conductive metal sheet；Limitation based on manufacture craft, individual conductive metal wire
Usually relatively thick, individual conductive metal sheet is usually thicker), conducting bridge 60 or conductive metal structure are coated on other materials
Among namely conducting bridge 60 be the internal block at least one conductive metal structure 61, such as inorganic coated with conductive
Metal structure forms conducting bridge 60 or organic material coated with conductive metal structure forms conducting bridge 60.
Conducting bridge 60 can be multiple as shown in Figure 6B, or one.When conducting bridge 60 is one, conducting bridge 60
In conductive metal structure be face type (such as conductive metal sheet realizes electromagnetic shielding to the side of chip to be shielded) or three-dimensional tie
Structure (such as cartridge type) could preferably realize chip to be shielded and be electromagnetically shielded.
Conductive layer 30 is set to the side of molding layer 70, and conductive layer 30 is electrically connected with conductive metal structure 61.
The above-mentioned encapsulating structure that electromagnetic shielding is realized to chip realizes chip surface by the conductive layer of molding layer side
Electromagnetic shielding, and the conductive metal structure by being embedded in molding layer, around chip realizes the electricity of chip sidewall sections
Magnetic screen, conductive layer and conductive metal structure are respectively positioned on the inside of packaging body, it is not easy to be affected by the external environment and lose electromagnetism
Function of shielding, and will not fall off, reliability is higher；Compared with prior art, which can realize electromagnetic screen to chip
It covers, and encapsulation volume is smaller, preparation cost is lower.It is above-mentioned that the encapsulating structure of electromagnetic shielding can also be to multiple cores to be realized to chip
Each chip during piece is integrated realizes individually electromagnetic shielding, avoids interfering with each other between the intracorporal chip of encapsulation.
Optionally, when conducting bridge 60 is that conductive metal structure (such as conductive metal wire or conductive metal sheet) is coated on other
When among material, can be by the following method production obtain: as needed inorganic (for example, silicon, silica, glass,
Ceramics) substrate on predetermined position punching, and conductive metal is filled in hole, cutting substrate as needed is to obtain conducting bridge
60 namely conducting bridge 60 can also consist of two parts: the inorganic material of conductive metal structure 61 and coated with conductive metal structure 61
Matter 62.The top view of the conducting bridge 60 is shown in Fig. 5 B.
It optionally, can be by the following method when conducting bridge 60 is that conductive metal " piece " is coated among other materials
Production obtains: sheet metal being suppressed covering or thermal bonding on the thin plate of one piece of inorganic, then on sheet metal again
Compacting covering or one piece of homogeneity of thermal bonding or heterogeneous inorganic sheet；The block of lower predetermined length and width is cut as needed,
It include filling conductive metal sheet in the block.Fig. 5 C is shown with the top view of the conducting bridge 60.
As a kind of optional embodiment of the present embodiment, the conductive metal structure in conducting bridge 60 can be used to implement envelope
Fill the electrical connection in body between each layer.
As a kind of optional embodiment of the present embodiment, above-mentioned encapsulating structure further include: reroute layer 80 and/or soldered ball
90, it is set to surface of the molding layer 70 backwards to conductive layer 30, as depicted in fig. 5g.Soldered ball 90 can be set on rerouting layer 80；
It can also setting soldered ball 90.In molding layer 70, backwards to the surface of conductive layer 30, setting reroutes layer, can pass through the rewiring
Layer realizes the electromagnetic shielding on another surface of chip, thus, it is just realized by conducting bridge, conductive layer, rewiring layer complete to chip
The electromagnetic shielding in orientation.Optionally, conducting bridge, conductive layer, rewiring layer are electrical connections, and pass through soldered ball and connect rewiring
Layer, user can be by making chip obtain comprehensive electromagnetic shielding solder ball ground when using the chip packing-body.In addition,
Can also be arranged in Fig. 5 G be electrically connected with the pad of chip to be shielded but not with reroute the soldered ball that is electrically connected of layer, so as to will be to
The pad of shielding chip is drawn out to outside packaging body.
Embodiment two
Fig. 1 shows the flow chart that a kind of pair of chip according to an embodiment of the present invention realizes the packaging method of electromagnetic shielding,
The packaging method can be used for making encapsulating structure described in embodiment one or its any one optional embodiment.Such as Fig. 1
Shown, this method comprises the following steps:
S101: chip to be shielded is attached in the first surface of support plate.
S102: in the first surface of support plate, and position corresponding with each side wall of chip to be shielded attaches at least one and leads
Electric bridge；Conducting bridge includes at least one conductive metal structure.
As shown in Figure 5 D, 10 be support plate, and 50 be chip to be shielded.In step S101, the side of chip 50 to be shielded is attached
Method can be as shown in Fig. 5 A and Fig. 5 D: (in one embodiment, the conductive layer 30 in structure shown in Fig. 5 A and Fig. 5 D
Can not be arranged at this moment, correspondingly, layers of two-sided 40 can also not have) interim bonded layer first is set on the surface of support plate 10
20, then chip 50 to be shielded is attached on interim bonded layer 20；It can also be straight by chip 50 to be shielded by other means
It connects and is bonded on support plate 10.The application does not limit specific attaching method herein.
Fig. 5 D is shown with the longitudinal sectional view attached after chip and conducting bridge to be shielded, and Fig. 5 B, which is shown, attaches core to be shielded
Top view after piece and conducting bridge.Wherein 50 be chip to be shielded, and 60 be conducting bridge.
About the specific descriptions of conducting bridge, embodiment one is referred to.
It should be added that the sequence of above-mentioned steps S101 and S102 can exchange, namely conducting bridge is first attached, then
Attach chip to be shielded；Alternatively, the sequence of above-mentioned steps S101 and S102 also may be performed simultaneously, i.e., attach simultaneously conducting bridge and
Chip to be shielded.
S103: forming molding layer in the first surface of support plate, and molding layer coats the side wall of chip and conducting bridge to be shielded, and
Expose the both ends of conductive metal structure in the pad and conducting bridge of chip to be shielded.
As shown in Figure 5 D, 70 be molding layer.The pad of chip 50 to be shielded can be towards support plate 10, can also be towards remote
Direction from support plate 10, the present embodiment is it is not limited here.
It should be pointed out that step S103 is after the first surface of support plate 10 forms molding layer 70, the molding layer 50 is not
The both ends of conductive metal structure 61 in the pad and conducting bridge 60 of chip 50 to be shielded must be exposed, it at this time can be by other hands
Section make its exposing, such as first pass through grind be thinned (as shown in fig. 5e) mode remove most of molding material, then by swash
The mode of light (as described in the arrow in Fig. 5 E) drilling is removed at 50 pad of chip to be shielded and conductive metal in conducting bridge 60
The molding layer material that 61 end of structure is covered.The application is to making " conductive gold in 50 pad of chip and conducting bridge 60 to be shielded
The method that category 61 end of structure " is exposed is without limitation.
S104: conductive layer is set toward or away from the side of support plate in molding layer, conductive layer is electrically connected with conductive metal structure
It connects.
For example, the molding layer 50 shown in Fig. 5 F upper surface be arranged conductive layer 30, before support plate 10 is removed or
It is settable after dismounting；Conductive layer 30 is arranged in the lower surface of the molding layer 50 shown in Fig. 5 F, must carry at this time
Plate 10 is arranged after removing, or is arranged before attaching chip and conducting bridge to be shielded on support plate.
The method of conductive layer is set, can be the mode for covering conductive metal sheet, it can also be (such as true using sputtering technology
Empty sputtering technology) plating conductive metal layer mode.The application to setting conductive layer specific method without limitation.
The above-mentioned packaging method that electromagnetic shielding is realized to chip realizes chip surface by the conductive layer of molding layer side
Electromagnetic shielding, and the conductive metal structure by being embedded in molding layer, around chip realizes the electricity of chip sidewall sections
Magnetic screen, conductive layer and conductive metal structure are respectively positioned on the inside of packaging body, it is not easy to be affected by the external environment and lose electromagnetism
Function of shielding will not fall off, and reliability is higher；Compared with prior art, the obtained encapsulating structure of the packaging method can be right
Chip realizes electromagnetic shielding completely, and encapsulation volume is smaller, and preparation cost is lower.The above-mentioned encapsulation that electromagnetic shielding is realized to chip
Method can also realize individually electromagnetic shielding to each chip in multiple integrated chips, avoid the intracorporal chip of encapsulation
Between interfere with each other.
Optionally, after step s 103, further includes: molding layer backwards to support plate surface setting reroute layer and/or
Soldered ball.As depicted in fig. 5g, 80 attach most importance to wiring layer, and 90 be soldered ball.Rerouting layer can realize in conjunction with conducting bridge, conductive layer to chip
Comprehensive electromagnetic shielding specifically refers to embodiment one.
Embodiment three
Fig. 2 shows the processes of another packaging method that electromagnetic shielding is realized to chip according to an embodiment of the present invention
Figure, the packaging method can be used for making encapsulating structure described in embodiment one or its any one optional embodiment.Such as
Shown in Fig. 2, this method comprises the following steps:
S201: conductive layer is set in the first surface of support plate.
As shown in Figure 5A, 10 be support plate, and 30 be conductive layer.Specifically refer to the step S104 of embodiment three.
S202: chip to be shielded is attached in conductive layer surface, wherein the pad of chip to be shielded is directed away from the side of support plate
To.
S203: on the surface of conductive layer, and position corresponding with each side wall of chip to be shielded attaches at least one conduction
Bridge；Conducting bridge includes at least one conductive metal structure.
Obtained structure after above-mentioned steps S201, S202 and S203, top view is as shown in Fig. 6 B or Fig. 6 C, in Fig. 5 D
It is shown with its longitudinal sectional view, wherein 50 be chip to be shielded, and 60 be conducting bridge.
Can interim bonded layer 20 first be arranged on 10 surface of support plate in above-mentioned steps S201, S202 and S203, then in ephemeral key
It closes and conductive layer is set on layer 20, then layers of two-sided 40 is set on conductive layer 30, attaching chip 50 and conducting bridge to be shielded
Before 60, the double-sided adhesive of the end corresponding position of the conductive metal structure of the pad of chip 50 to be shielded and conducting bridge 60 is gone
Except (as shown in Figure 5A) and conductive metal glue (such as elargol) is coated, finally chip 50 to be shielded and conducting bridge 60 are pasted onto and are led
The surface of electric layer 30.
Alternatively, step S202 attaches chip 50 and step S203 to be shielded in 30 table of conductive layer on 30 surface of conductive layer
The method of the attached conducting bridge 60 of face paste is also possible to that directly chip 50 to be shielded and conducting bridge 60 are bonded on conductive layer 30.
The application to specific attaching method without limitation.
S204: molding layer is formed on the surface of conductive layer, molding layer coats the side wall of chip and conducting bridge to be shielded, and reveals
Out in the pad and conducting bridge of chip to be shielded conductive metal structure both ends.
The step specifically refers to step S103.
S205: in molding layer, backwards to the surface of conductive layer, setting reroutes layer and/or soldered ball, wherein reroutes leading for layer
At least one of line and/or soldered ball are electrically connected with the conductive metal structure that conducting bridge end is exposed.
As illustrated in figure 5f, 80 attach most importance to wiring layer, and 90 be soldered ball.The (not shown) when rerouting the conducting wire comparatively dense of layer
The electromagnetic shielding comprehensive to chip can be realized in conjunction with conducting bridge, conductive layer, specifically refer to embodiment one.In addition, Fig. 5 F
In can also be arranged be electrically connected with the pad of chip to be shielded but not with reroute the soldered ball that is electrically connected of layer, so as to will be to be shielded
The pad of chip is drawn out to outside packaging body.
S206: support plate is removed.
As depicted in fig. 5g.Optionally, removing support plate can also execute before step S205.
It is emphasized that the difference of the embodiment of the present invention and example IV is, the opportunity that conductive layer 30 is arranged is different.
The above-mentioned packaging method that electromagnetic shielding is realized to chip, obtained encapsulating structure can realize electromagnetic screen to chip
It covers, and small volume, it is not easy to be lost electro-magnetic screen function by external environment influence, and will not fall off, reliability is higher.With
The prior art is compared, which can realize chip and be electromagnetically shielded, and encapsulation volume is smaller, and preparation cost is lower.On
It states and the packaging method of electromagnetic shielding can also be for realizing the individual electromagnetism of each chip in multiple integrated chips is realized to chip
Shielding avoids interfering with each other between the intracorporal chip of encapsulation.Specifically refer to embodiment three.
Example IV
Fig. 3 shows the process of another packaging method being electromagnetically shielded to chip realization according to an embodiment of the present invention
Figure, the packaging method can be used for making encapsulating structure described in embodiment one or its any one optional embodiment.Such as
Shown in Fig. 3, this method comprises the following steps:
S301: chip to be shielded is attached in the first surface of support plate, wherein the pad of chip to be shielded is directed away from support plate
Direction.
S302: in the first surface of support plate, and position corresponding with each side wall of chip to be shielded attaches at least one and leads
Electric bridge；Conducting bridge includes at least one conductive metal structure.
Obtained structure after above-mentioned steps S301 and S302, (wherein conducting bridge 60 can also as shown in Figure 6B for top view
Think structure shown in Fig. 5 C), its longitudinal sectional view is shown in Fig. 6 C, wherein 50 be chip to be shielded, and 60 be conducting bridge.
Interim bonded layer 20 can first be arranged on support plate 10, then pass through interim bonded layer by above-mentioned steps S301 and S302
Chip 50 to be shielded and conducting bridge 60 are attached to 10 surface of support plate by 20.
S303: forming molding layer in the first surface of support plate, and molding layer coats the side wall of chip and conducting bridge to be shielded, and
Expose the both ends of conductive metal structure in the pad and conducting bridge of chip to be shielded.
As shown in Fig. 7 C and Fig. 6 D.The step specifically refers to step S103.
S304: it is formed in molding layer backwards to the surface of conductive layer and reroutes layer and/or setting soldered ball, wherein reroute layer
At least one of conducting wire and/or soldered ball be electrically connected with the conductive metal structure that conducting bridge end is exposed.
As seen in figure 7e.When rerouting the conducting wire comparatively dense of layer, (not shown) can combine conducting bridge, conductive layer
It realizes the electromagnetic shielding comprehensive to chip, specifically refers to embodiment one.In addition, can also be arranged in Fig. 6 F and core to be shielded
The soldered ball that the pad of piece is electrically connected but is not electrically connected with rewiring layer, so that the pad of chip to be shielded is drawn out to packaging body
It is external.
S305: support plate is removed.
S306: conductive layer is set in the side surface for originally attaching support plate.
The structure obtained after step S305 and S306 is as shown in Figure 7 F.Step S306 specifically refers to the step of embodiment three
Rapid S104.
It is emphasized that the difference of the embodiment of the present invention and embodiment three is, the opportunity that conductive layer 30 is arranged is different.
The above-mentioned packaging method that electromagnetic shielding is realized to chip, obtained encapsulating structure can realize electricity completely to chip
Magnetic screen, structural volume are smaller, it is not easy to it is affected by environment and lose electro-magnetic screen function, embedded shield loop reliability compared with
It is high.Compared with prior art, which can realize electromagnetic shielding completely to chip, and encapsulation volume is smaller, is prepared into
This is lower.It is above-mentioned that the packaging method of electromagnetic shielding can also be independent to each of multiple integrated chips chip to be realized to chip
Implement electromagnetic shielding, avoids interfering with each other between the intracorporal chip of encapsulation.Specifically refer to embodiment three.
Embodiment five
Fig. 4 shows the process of another packaging method being electromagnetically shielded to chip realization according to an embodiment of the present invention
Figure, the packaging method can be used for making encapsulating structure described in embodiment one or its any one optional embodiment.Such as
Shown in Fig. 4, this method comprises the following steps:
S401: attaching chip to be shielded in the first surface of support plate, wherein the pad of chip to be shielded is towards the side of support plate
To.
S402: in the first surface of support plate, and position corresponding with each side wall of chip to be shielded attaches at least one and leads
Electric bridge；Conducting bridge includes at least one conductive metal structure.
The method that step S401 and S402 attach chip and conducting bridge to be shielded can be and first set in the first surface of support plate
Interim bonded layer is set, is then attached (as shown in Fig. 7 A and Fig. 7 C)；Or other methods can also be used, the present embodiment exists
This is without limitation.
Obtained structure after above-mentioned steps S401 and S402, (wherein conducting bridge 60 can also as shown in Figure 7 B for top view
Think structure shown in Fig. 5 C), its longitudinal sectional view is shown in Fig. 7 C, wherein 50 be chip to be shielded, and 60 be conducting bridge.
S403: forming molding layer in the first surface of support plate, and molding layer coats the side wall of chip and conducting bridge to be shielded, and
Expose the both ends of conductive metal structure in conducting bridge.
As seen in figure 7 c, 70 be molding layer.After the first surface of support plate 10 forms molding layer 50, the molding layer 50 is not
The both ends of conductive metal structure must be exposed, its exposing can be made by other means at this time, for example, the side thinned by grinding
Formula (as illustrated in fig. 7d) or laser (as described in the arrow in Fig. 7 D) drill by way of.The application is to making to lead in conducting bridge
The method that the both ends of electric metal structure are exposed is without limitation.
S404: conductive layer is set backwards to the surface of support plate in molding layer.
As seen in figure 7e, 30 be conductive layer, and conductive layer is electrically connected with one end of conductive metal structure in conducting bridge at this time
's.
S405: support plate is removed.
S406: layer and/or soldered ball are rerouted in the side surface setting for originally attaching support plate, wherein reroute leading for layer
At least one of line and/or soldered ball are electrically connected with the conductive metal structure that conducting bridge end is exposed.
As shown in Figure 7 F, 80 attach most importance to wiring layer, and 90 be soldered ball.The (not shown) when rerouting the conducting wire comparatively dense of layer
The electromagnetic shielding comprehensive to chip can be realized in conjunction with conducting bridge, conductive layer, specifically refer to embodiment one.In addition, Fig. 5 F
In can also be arranged be electrically connected with the pad of chip to be shielded but not with reroute the soldered ball that is electrically connected of layer, so as to will be to be shielded
The pad of chip is drawn out to outside packaging body.
The above-mentioned packaging method that electromagnetic shielding is realized to chip, obtained encapsulating structure can realize electricity completely to chip
Magnetic screen, structural volume are smaller, it is not easy to it is affected by environment and lose electro-magnetic screen function, embedded shield loop reliability compared with
It is high.Compared with prior art, which can realize electromagnetic shielding completely to chip, and encapsulation volume is smaller, preparation cost
It is lower.It is above-mentioned that the packaging method of electromagnetic shielding can also be individually real to each of multiple integrated chips chip to be realized to chip
Electromagnetic shielding is applied, avoids interfering with each other between the intracorporal chip of encapsulation.Specifically refer to embodiment three.
Although being described in detail about example embodiment and its advantage, those skilled in the art can not departed from
Various change, replacement are carried out to these embodiments in the case where spirit of the invention and protection scope defined in the appended claims
And modification, such modifications and variations are each fallen within be defined by the appended claims within the scope of.For other examples, ability
The those of ordinary skill in domain should be readily appreciated that the order of processing step can become while keeping in the scope of the present invention
Change.
In addition, application range of the invention is not limited to the technique, mechanism, system of specific embodiment described in specification
It makes, material composition, means, method and step.From the disclosure, will be easy as those skilled in the art
Ground understands, for current technique that is existing or will developing later, mechanism, manufacture, material composition, means, method or
Step, wherein they execute the function that the corresponding embodiment described with the present invention is substantially the same or the knot that acquisition is substantially the same
Fruit can apply them according to the present invention.Therefore, appended claims of the present invention are intended to these techniques, mechanism, system
It makes, material composition, means, method or step are included in its protection scope.
Claims (10)
1. the encapsulating structure that a kind of pair of chip realizes electromagnetic shielding characterized by comprising
Chip to be shielded；
Molding layer, coats the side wall of the chip to be shielded, and exposes the pad of the chip to be shielded；
At least one conducting bridge, the conducting bridge include at least one conductive metal structure；The conducting bridge penetrates through the molding
Layer, and the both ends of conductive metal structure are exposed in the both side surface of the molding layer respectively in the conducting bridge；It is the multiple to lead
Electric bridge is located at around the chip to be shielded；
Conductive layer, is set to the side of the molding layer, and the conductive layer is electrically connected with the conductive metal structure.
2. the encapsulating structure according to claim 1 for realizing electromagnetic shielding to chip, which is characterized in that the conductive metal
Structure includes conductive metal wire and/or conductive metal sheet.
3. the encapsulating structure according to claim 1 for realizing electromagnetic shielding to chip, which is characterized in that the conducting bridge is logical
Cross following methods to make to obtain: predetermined position is punched on the substrate of inorganic as needed, and is filled and led in the hole
Electric metal cuts the substrate as needed to obtain the conducting bridge.
4. the encapsulating structure according to claim 1 for realizing electromagnetic shielding to chip, which is characterized in that further include:
Layer and/or soldered ball are rerouted, is set to the molding layer backwards to the surface of the conductive layer.
5. the packaging method that a kind of pair of chip realizes electromagnetic shielding characterized by comprising
Chip to be shielded is attached in the first surface of support plate；
At least one conducting bridge is attached in the first surface of the support plate, and around the chip to be shielded；The conducting bridge
Including at least one conductive metal structure；
Molding layer is formed in the first surface of the support plate, the molding layer coats the chip to be shielded and the conducting bridge
Side wall, and expose the both ends of conductive metal structure in the pad and the conducting bridge of the chip to be shielded；
Conductive layer, the conductive layer and the conductive metal knot are set toward or away from the side of the support plate in the molding layer
Structure electrical connection.
6. the packaging method according to claim 5 for realizing electromagnetic shielding to chip, which is characterized in that the conducting bridge is logical
Cross following methods to make to obtain: predetermined position is punched on the substrate of inorganic as needed, and is filled and led in the hole
Electric metal；The substrate is cut as needed, obtains the conducting bridge.
7. the packaging method according to claim 5 for realizing electromagnetic shielding to chip, which is characterized in that described in the mould
Sealing toward or away from the support plate side be arranged conductive layer the step of include:
Before the step of first surface in support plate attaches chip to be shielded, conductive layer is set in the first surface of support plate.
8. the packaging method according to claim 7 for realizing electromagnetic shielding to chip, which is characterized in that described in support plate
First surface attaches before the step of chip to be shielded and the first surface in the support plate, and described to be shielded
Before the step of attaching multiple conducting bridges around chip, further includes:
Conductive metal glue is coated in the conductive layer surface.
9. the packaging method according to claim 5 for realizing electromagnetic shielding to chip, which is characterized in that described in the mould
Sealing toward or away from the support plate side be arranged conductive layer the step of include:
Remove the support plate；
On the surface for originally attaching the support plate, conductive layer is set.
10. realizing the packaging method of electromagnetic shielding to chip according to any one of claim 5,7 or 9, feature exists
In, further includes:
It is formed in the molding layer backwards to the surface of the conductive layer and reroutes layer and/or setting soldered ball, wherein the rewiring
At least one of conducting wire of layer and/or the soldered ball are electrically connected with the conductive metal structure that the conducting bridge end is exposed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811645493.9A CN109817589A (en) | 2018-12-29 | 2018-12-29 | The encapsulating structure and method of electromagnetic shielding are realized to chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811645493.9A CN109817589A (en) | 2018-12-29 | 2018-12-29 | The encapsulating structure and method of electromagnetic shielding are realized to chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109817589A true CN109817589A (en) | 2019-05-28 |
Family
ID=66603072
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811645493.9A Pending CN109817589A (en) | 2018-12-29 | 2018-12-29 | The encapsulating structure and method of electromagnetic shielding are realized to chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109817589A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111009510A (en) * | 2019-12-27 | 2020-04-14 | 上海先方半导体有限公司 | Electromagnetic shielding structure and packaging method thereof |
| CN112834796A (en) * | 2021-03-23 | 2021-05-25 | 南方电网科学研究院有限责任公司 | Electric energy meter capable of preventing strong magnetic interference |
| CN115642148A (en) * | 2022-12-22 | 2023-01-24 | 北京智芯微电子科技有限公司 | Magnetic shielding device, preparation method of magnetic shielding device and MRAM chip |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080150095A1 (en) * | 2004-09-20 | 2008-06-26 | Advanced Semiconductor Engineering, Inc. | Semiconductor device package |
| US20120112326A1 (en) * | 2010-06-02 | 2012-05-10 | Stats Chippac, Ltd. | Semiconductor Device and Method of Forming Prefabricated EMI Shielding Frame with Cavities Containing Penetrable Material Over Semiconductor Die |
| CN105118823A (en) * | 2015-09-24 | 2015-12-02 | 中芯长电半导体（江阴）有限公司 | Stacked type chip packaging structure and packaging method |
| CN106653703A (en) * | 2015-11-04 | 2017-05-10 | 美光科技公司 | Package-on-package structure |
| CN108417563A (en) * | 2017-02-10 | 2018-08-17 | 日月光半导体制造股份有限公司 | Semiconductor device packages and its manufacturing method |
-
2018
- 2018-12-29 CN CN201811645493.9A patent/CN109817589A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080150095A1 (en) * | 2004-09-20 | 2008-06-26 | Advanced Semiconductor Engineering, Inc. | Semiconductor device package |
| US20120112326A1 (en) * | 2010-06-02 | 2012-05-10 | Stats Chippac, Ltd. | Semiconductor Device and Method of Forming Prefabricated EMI Shielding Frame with Cavities Containing Penetrable Material Over Semiconductor Die |
| CN105118823A (en) * | 2015-09-24 | 2015-12-02 | 中芯长电半导体（江阴）有限公司 | Stacked type chip packaging structure and packaging method |
| CN106653703A (en) * | 2015-11-04 | 2017-05-10 | 美光科技公司 | Package-on-package structure |
| CN108417563A (en) * | 2017-02-10 | 2018-08-17 | 日月光半导体制造股份有限公司 | Semiconductor device packages and its manufacturing method |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111009510A (en) * | 2019-12-27 | 2020-04-14 | 上海先方半导体有限公司 | Electromagnetic shielding structure and packaging method thereof |
| CN112834796A (en) * | 2021-03-23 | 2021-05-25 | 南方电网科学研究院有限责任公司 | Electric energy meter capable of preventing strong magnetic interference |
| CN115642148A (en) * | 2022-12-22 | 2023-01-24 | 北京智芯微电子科技有限公司 | Magnetic shielding device, preparation method of magnetic shielding device and MRAM chip |
| CN115642148B (en) * | 2022-12-22 | 2024-04-12 | 北京智芯微电子科技有限公司 | Magnetic shielding device, preparation method of magnetic shielding device and MRAM chip |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8184448B2 (en) | Bare chip embedded PCB | |
| EP1143509A2 (en) | Method of manufacturing the circuit device and circuit device | |
| CN109817589A (en) | The encapsulating structure and method of electromagnetic shielding are realized to chip | |
| CN108604582A (en) | Carry ultra-thin substrate | |
| CN104103596A (en) | Integrated circuit package assemblies including a glass solder mask layer | |
| CN101998213B (en) | Packaging structure of MEMS (Micro Electro Mechanical Systems) microphone and wafer packaging method thereof | |
| JP2006523964A (en) | At least partially packaged circuit device and method of forming the same | |
| JP2014017485A (en) | Device package with rigid interconnect structure connecting die and substrate and method thereof | |
| EP3859877B1 (en) | Antenna packaging structure and manufacturing method thereof | |
| CN110024107A (en) | Integrated circuit packaging method and integration packaging circuit | |
| TW200400918A (en) | Method of manufacturing an electronic device | |
| CN109801883A (en) | A kind of fan-out-type stacking encapsulation method and structure | |
| CN108622847A (en) | The encapsulating method and structure of MEMS sensor | |
| CN107958882A (en) | Encapsulating structure of chip and preparation method thereof | |
| US20230245944A1 (en) | Fan-out type package preparation method of fan-out type package | |
| JPS6394645A (en) | Electronic device | |
| CN102376539B (en) | For manufacturing the method and circuit of circuit | |
| CN110233113A (en) | A kind of packaging method of chip | |
| TWI283916B (en) | Manufacturing method of chip package structure | |
| CN105810705B (en) | The encapsulating structure and preparation method thereof of high pixel image sensing chip | |
| CN107615893B (en) | Circuit board, electronic device and electronic module | |
| TWI566343B (en) | Chip package having protection piece compliantly attached on chip sensor surface | |
| CN206163474U (en) | Image sensor module | |
| CN108630626A (en) | Without substrate encapsulation structure | |
| CN209374429U (en) | Packaging body |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190528 |