CN111009510A - Electromagnetic shielding structure and packaging method thereof - Google Patents
Electromagnetic shielding structure and packaging method thereof Download PDFInfo
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- CN111009510A CN111009510A CN201911381456.6A CN201911381456A CN111009510A CN 111009510 A CN111009510 A CN 111009510A CN 201911381456 A CN201911381456 A CN 201911381456A CN 111009510 A CN111009510 A CN 111009510A
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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- H—ELECTRICITY
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/04105—Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
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- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
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- H01L2224/732—Location after the connecting process
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- H01L2224/92—Specific sequence of method steps
- H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
- H01L2224/9222—Sequential connecting processes
- H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
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- H01L2224/96—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting
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Abstract
The invention belongs to the technical field of shielding material preparation, and particularly relates to an electromagnetic shielding structure and a packaging method. The electromagnetic shielding structure includes a carrier; a shield disposed on the carrier; the chip is arranged on the carrier, at least one chip is arranged between adjacent shields, and the height of the chip is not more than that of the shields; and the plastic packaging layer is arranged at the same side of the carrier with the chip and the shielding body and covers the shielding body and the chip. The structure arranges the shielding body on the carrier, then arranges the chip on the carrier, can effectively shield the chip, has small packaging volume and high process integration level, reduces the complexity of the packaging process, and can meet the requirements of light, thin, short and small electronic products.
Description
Technical Field
The invention belongs to the technical field of shielding material preparation, and particularly relates to an electromagnetic shielding structure and a packaging method thereof.
Background
Electromagnetic shielding is a measure for preventing high-frequency electromagnetic field from propagating in space by using a shielding body, when the electromagnetic wave passes through metal or a barrier layer with an attenuation effect on the electromagnetic wave, the electromagnetic wave is attenuated to a certain degree, and the barrier layer material has a shielding effect and is the shielding body. The shield may be made of metal such as copper, aluminum, steel, etc. in general, but ferrite, etc. may be used as the shield for constant and very low frequency magnetic fields. The shielding body can avoid the problem that the performance of the system is deteriorated due to electromagnetic noise or interference generated in the same system or different systems.
The shield body may be classified into an electrostatic shield body, a magnetic shield body, and an electromagnetic shield body according to the purpose of shielding. The electrostatic shield is made of a diamagnetic material (e.g., copper, aluminum) and is connected to ground to terminate the electric field at the metallic surface of the shield and transfer the charge to ground. The magnetic shield body is made of strong magnetic material (such as steel) with high magnetic conductivity, and can limit magnetic lines of force in the shield body. The electromagnetic shield is mainly used for suppressing the influence of a high-frequency electromagnetic field, so that an interference field forms a vortex in the shield and generates reflection on an interface between the shield and a protected space, thereby greatly weakening the field intensity value of the interference field in the protected space and achieving the shielding effect. Sometimes, to enhance the shielding effect, a multilayer shield may be used, the outer layer of which is typically made of a material with high electrical conductivity to increase the reflection, and the inner layer of which is made of a material with high magnetic permeability to increase the eddy current effect.
Chinese patent document CN110010480A discloses a wafer-level rf chip electromagnetic shielding packaging process, which uses wafer-level TSV to form a cavity structure, fills metal in the TSV through hole to form a metal electromagnetic shielding structure, and then bonds to a wafer with a chip through wafer-level bonding to form an electromagnetic shielding cavity structure; the process has high technical cost and very complex process. In addition, the shielding structure in the prior art generally consists of a frame with a partition wall and a cover, and the shielding structure generally occupies a large area, is assembled individually, has low efficiency and complex assembly process, and is easy to cause damage to internal chips.
Disclosure of Invention
Therefore, the technical problem to be solved by the present invention is to overcome the defects of large size, low efficiency, high production cost, etc. of the electromagnetic shielding device in the prior art, so as to provide an electromagnetic shielding structure and a packaging method thereof.
Therefore, the invention provides the following technical scheme.
The present invention provides an electromagnetic shielding structure, comprising,
a carrier;
a shield disposed on the carrier;
the chip is arranged on the carrier, at least one chip is arranged between adjacent shields, and the height of the chip is not more than that of the shields;
and the plastic packaging layer is arranged at the same side of the carrier with the chip and the shielding body and covers the shielding body and the chip.
An adhesion layer is arranged on the carrier, and the plastic package layer, the chip and the shielding body are arranged on the adhesion layer.
The pads of the chip are disposed towards the carrier.
The welding points of the chip are arranged back to the carrier.
The electromagnetic shielding structure further comprises a rewiring layer which is arranged on one side of the plastic packaging layer, which is back to the carrier, and the rewiring wire is electrically connected with the chip.
The electromagnetic shielding structure further comprises a solder ball which is arranged on one side of the redistribution layer back to the plastic packaging layer, and the solder ball and the chip are electrically connected with the chip through the redistribution layer.
The shield is a metal and/or ceramic shield.
The invention also provides a packaging method of the electromagnetic shielding structure, which comprises the following steps,
forming a shield on the carrier;
mounting the chip on a carrier;
forming a plastic packaging layer on the carrier, wherein the plastic packaging layer, the chip and the shield are positioned on the same side of the carrier, and the plastic packaging layer coats the shield and the chip;
and cutting by taking the central axis of the shielding body as a cutting line to obtain the electromagnetic shielding structure.
Further, the step of forming a shield on the carrier includes,
the shielding body is bonded with the carrier, and the shielding body is formed on the carrier; or the like, or, alternatively,
and arranging an adhesion layer on the carrier, and bonding the shielding body with the adhesion layer to form the shielding body on the carrier.
Further, before the step of forming the shield on the carrier, forming a mark on the carrier is further included;
after the step of forming a shield on the carrier, mounting the chip according to the mark.
After the step of forming the plastic packaging layer on the carrier, the method further comprises the steps of,
and thinning the plastic packaging layer, and then forming a rewiring layer on the plastic packaging layer.
The packaging method further comprises the step of packaging the substrate,
and arranging a solder ball on one side of the rewiring layer, which is back to the plastic packaging layer, so that the solder ball is electrically connected with the chip through the rewiring layer.
The technical scheme of the invention has the following advantages:
1. the invention provides an electromagnetic shielding structure, which comprises a carrier; a shield disposed on the carrier; the chip is arranged on the carrier, at least one chip is arranged between adjacent shields, and the height of the chip is not more than that of the shields; and the plastic packaging layer is arranged at the same side of the carrier with the chip and the shielding body and covers the shielding body and the chip. The structure arranges the shielding body on the carrier, then arranges the chip on the carrier, can effectively shield the chip, has small packaging volume and high process integration level, reduces the complexity of the packaging process, and can meet the requirements of light, thin, short and small electronic products.
2. According to the electromagnetic shielding structure provided by the invention, the shielding body is attached to the carrier by utilizing the existing wafer level packaging process, so that the chip is shielded, electromagnetic shielding and chip mounting are realized simultaneously, all processes can be realized on the same wafer level production line, the process integration level is higher, the packaging volume is smaller, the production efficiency is higher, and the cost is further reduced.
3. The invention provides a packaging method of an electromagnetic shielding structure, which comprises the steps of forming a shielding body on a carrier; mounting the chip on a carrier; forming a plastic package layer on the same side of the chip and the shielding body to coat the shielding body and the chip; and cutting by taking the central axis of the shielding body as a cutting line to obtain the electromagnetic shielding structure. The electromagnetic shielding structure manufactured by the method comprises the shielding body instead of a single shielding case, so that the processing efficiency can be improved, and the volume of the electromagnetic shielding structure can be reduced; the invention realizes that the wafer-level packaging process is adopted to prepare the electromagnetic shielding structure, can realize all processes on the same wafer-level production line, does not need to add a production line specially used for preparing the electromagnetic shielding structure, has higher process integration level and higher production efficiency, further reduces the production cost, further reduces the packaging volume of the whole structure, and can meet the requirements of light weight, thinness, shortness and shortness of electronic products.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1 is a schematic view of an electromagnetic shielding structure in embodiment 1 of the present invention;
fig. 2 is a schematic view of an electromagnetic shielding structure in embodiment 2 of the present invention;
fig. 3A and 3B are schematic views of an electromagnetic shielding structure in embodiment 3 of the present invention;
fig. 4A to 4D are schematic flow charts of the method for packaging the electromagnetic shielding structure according to embodiment 4 of the present invention;
fig. 5A to 5G are schematic flow charts of the method for packaging the electromagnetic shielding structure according to embodiment 5 of the present invention;
fig. 6A to 6D are schematic flow charts of the method for packaging the electromagnetic shielding structure according to embodiment 6 of the present invention;
reference numerals:
1-a carrier; 2-an adhesion layer; 3-a shield; 4-a rewiring layer; 5-plastic packaging layer; 6-chip; 7-solder balls;
4-1-rewiring of wires;
6-1-welding spot.
Detailed Description
The following examples are provided to further understand the present invention, not to limit the scope of the present invention, but to provide the best mode, not to limit the content and the protection scope of the present invention, and any product similar or similar to the present invention, which is obtained by combining the present invention with other prior art features, falls within the protection scope of the present invention.
The examples do not show the specific experimental steps or conditions, and can be performed according to the conventional experimental steps described in the literature in the field. The reagents or instruments used are not indicated by manufacturers, and are all conventional reagent products which can be obtained commercially.
Example 1
The present embodiment provides an electromagnetic shielding structure, as shown in fig. 1, including,
the carrier 1 is a wafer carrier, and an adhesion layer 2 is arranged on the carrier;
the shielding body 3 is a copper shielding body and is arranged on the adhesion layer 2, and a chip is arranged between the adjacent shielding bodies;
the chip 6 is arranged on the adhesion layer, a welding spot 6-1 of the chip faces the carrier, and the height of the chip is lower than that of the shielding body;
and the plastic packaging layer 5, the chip and the shielding body are arranged on the same side of the carrier and wraps the two shielding bodies and the chip.
As an alternative embodiment, the carrier may also be one of a silicon substrate, glass and metal.
As another alternative, the shield may also be other metal shields, such as gold shields, tin shields, etc.; the shield may also be a ceramic shield having packageable properties.
As another alternative embodiment, the number of the shields is not limited to two, the number of the chips is not limited to one, the positional relationship between the shields and the chips is determined according to the requirement, and is not limited to disposing one chip between adjacent shields, and may also be in various forms, such as disposing a plurality of chips between adjacent shields, disposing a plurality of shields to enclose the chips inside the shields, or disposing the shields on the top of the chips.
Example 2
The present embodiment provides an electromagnetic shielding structure, as shown in fig. 2, including,
the carrier 1 is a silicon substrate carrier, and an adhesion layer 2 is arranged on the carrier;
the shielding body 3 is arranged on the adhesion layer 2, the shielding body is a ceramic shielding body with the characteristic of encapsulation, and a chip is arranged between the adjacent shielding bodies;
the chip 3 is arranged on the adhesion layer 2, a welding spot 6-1 of the chip is opposite to the carrier, and the height of the chip is the same as that of the shielding body;
and the plastic packaging layer 5, the chip and the shielding body are arranged on the same side of the carrier and wraps the two shielding bodies and the chip.
As a preferred embodiment, the electromagnetic shielding structure further comprises,
the rewiring layer 4 is arranged on one side of the plastic packaging layer, which is back to the carrier, and a lead 4-1 of the rewiring layer is electrically connected with the chip;
and the solder balls 7 are arranged on one side of the rewiring layer, which is opposite to the plastic packaging layer, and are electrically connected with the chip through the wires 4-1 in the rewiring layer.
As an alternative embodiment, the carrier may also be one of a wafer, glass and metal.
As another alternative, the material of the shield may be a metal shield, such as a copper shield, gold shield, tin shield, or the like.
As another alternative embodiment, the number of the shields is not limited to two, the number of the chips is not limited to one, the positional relationship between the shields and the chips is determined according to the requirement, and is not limited to disposing one chip between adjacent shields, and may also be in various forms, such as disposing a plurality of chips between adjacent shields, disposing a plurality of shields to enclose the chips inside the shields, or disposing the shields on the top of the chips.
Example 3
The present embodiment provides an electromagnetic shielding structure, as shown in fig. 3A, including,
a carrier 1, wherein the carrier is a wafer;
the shielding body 3 is a gold shielding body and is arranged on the carrier, and two chips are arranged between the adjacent shielding bodies;
the chip 6 is arranged on the carrier, a welding spot 6-1 of the chip is back to the carrier, and the height of the chip is the same as that of the shielding body;
and the plastic packaging layer 5, the chip and the shielding body are arranged on the same side of the carrier and wraps the two shielding bodies and the two chips.
As an alternative embodiment, the carrier may also be one of a wafer, glass and metal.
As another alternative, the height of the chip may also be lower than the height of the shield.
As another alternative, the material of the shield may be other metal shields, such as copper shields, tin shields, etc.; the number of the shielding bodies and the number of the chips are not limited to two, the shielding bodies and the chips can also be a plurality of shielding bodies and a plurality of chips, the shielding bodies can also be arranged at the tops of the chips, the position relation of the shielding bodies and the chips can be determined according to use requirements, the shielding bodies and the chips are not limited to two chips to be arranged between adjacent shielding bodies, and the shielding bodies can also be arranged between adjacent shielding bodies, a plurality of chips are arranged between the adjacent shielding bodies, and the chips are sealed in the shielding bodies or the shielding bodies are arranged at the tops of the chips.
As a preferred embodiment, as shown in fig. 3B, the electromagnetic shielding structure further includes,
the rewiring layer 4 is arranged on one side of the plastic packaging layer, which is back to the carrier, and a lead 4-1 of the rewiring layer is electrically connected with the chip;
and the solder balls 7 are arranged on one side of the rewiring layer, which is opposite to the plastic packaging layer, and are electrically connected with the chip through wires in the rewiring layer.
Example 4
The present embodiment provides a method for packaging an electromagnetic shielding structure, which is illustrated in fig. 4A-4D, and includes the following steps,
a temporary bonding material is coated on the carrier wafer 1 to form an adhesion layer 2, and then two positions on the carrier are marked to play a role in positioning, so that the mounting accuracy of the chip and the wafer is improved, as shown in fig. 4A.
The four shields are bonded to the adhesive layer, and four shields 3 are formed on the carrier, as shown in fig. 4B, in which the shields are H-shaped and the shields are copper shields.
According to the positions of the two marks, the two chips 6 and the two marks are aligned, and the chips are mounted at the designated positions (namely the marked positions) of the wafer, the method can improve the mounting accuracy of the chips, one chip is arranged between two adjacent shielding bodies, the welding points 6-1 of the chips face the carrier wafer, and the height of the chips is lower than that of the shielding bodies, as shown in fig. 4C.
And performing plastic packaging on the wafer to form a plastic packaging layer 5, wherein the plastic packaging layer, the shielding body and the chip are positioned on the same side of the carrier wafer, and the plastic packaging layer covers the chip and the shielding body, as shown in fig. 4D.
And cutting by taking the central axis of the shielding body as a cutting line to obtain the electromagnetic shielding structure, as shown in fig. 4D.
The packaging method can utilize the existing wafer level packaging process to attach the shielding body to the carrier, so that the chip is conveniently shielded; the electromagnetic shielding structure can realize electromagnetic shielding and chip mounting simultaneously, can realize all processes on the same wafer-level production line, has high integration level and small volume of the encapsulated electromagnetic shielding structure, simplifies the encapsulation process and improves the production efficiency.
Example 5
The present embodiment provides a method for packaging an electromagnetic shielding structure, which is illustrated in fig. 5A-5G, and includes the following steps,
temporary bonding materials are coated on the carrier silicon substrate 1 to form an adhesion layer 2, and then marking is carried out at three positions on the carrier silicon substrate to play a role in positioning and improve the mounting accuracy of the chip and the silicon, as shown in fig. 5A.
The four shields are attached to the adhesive layer, and four shields 3 are formed on the carrier, as shown in fig. 5B, in which the shields are H-shaped, the shields are ceramic shields, and the ceramic shields have a property of being capable of being packaged.
According to the marked position, the three chips 6 are aligned with the mark, the chips are mounted at the designated position (marked position) of the silicon substrate, the mounting accuracy of the chips can be improved, the chips and the shielding bodies are arranged at intervals, one chip is arranged between the adjacent shielding bodies, the welding points of the chips are back to the carrier silicon substrate, and the heights of the chips and the shielding bodies are the same as that of fig. 5C.
And (3) performing plastic packaging on the silicon substrate to form a plastic packaging layer 5, wherein the plastic packaging layer, the shielding body and the chip are positioned on the same side of the carrier silicon substrate to cover the chip and the shielding body, as shown in fig. 5D.
The plastic encapsulation layer is thinned to expose the solder joint 6-1 of the chip, as shown in fig. 5E.
And rewiring is carried out on the side, opposite to the silicon, of the plastic packaging layer to form a rewiring layer 4, and a lead 4-1 in the rewiring layer is electrically connected with a welding point 6-1 of the chip, as shown in fig. 5F.
And arranging solder balls 7 on the side of the rewiring layer opposite to the plastic package layer, so that the solder balls and the chip are electrically connected through wires in the rewiring layer, as shown in fig. 5G.
And cutting by taking the central axis of the shield as a cutting line to obtain the electromagnetic shielding structure, as shown in fig. 5G.
Example 6
The present embodiment provides a method for packaging an electromagnetic shielding structure, which is illustrated in fig. 6A to 6D, and includes the following steps,
four marks are formed at the designated positions of the carrier wafer 1 to play a role in positioning, so that the mounting accuracy of the chip and the wafer is improved, as shown in fig. 6A.
The three shields 3 are bonded to the wafer to form three shields on the carrier, as shown in fig. 6B, wherein the shields are H-shaped and gold shields.
According to the position of the mark, the four chips 6 are aligned with the mark, the chips are mounted at the designated positions of the wafer, the mounting accuracy of the chips is improved, two chips are arranged between the adjacent shielding bodies, and the height of each chip is lower than that of each shielding body, as shown in fig. 6C.
And performing plastic packaging on the wafer to form a plastic packaging layer, wherein the plastic packaging layer, the shielding body and the chip are positioned on the same side of the carrier wafer, and the plastic packaging layer wraps the chip and the shielding body, as shown in fig. 6D.
And cutting by taking the central axis of the shielding body as a cutting line to obtain the electromagnetic shielding structure, as shown in fig. 6D.
It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications of the invention may be made without departing from the spirit or scope of the invention.
Claims (12)
1. An electromagnetic shielding structure, comprising,
a carrier;
a shield disposed on the carrier;
the chip is arranged on the carrier, at least one chip is arranged between adjacent shields, and the height of the chip is not more than that of the shields;
and the plastic packaging layer is arranged at the same side of the carrier with the chip and the shielding body and covers the shielding body and the chip.
2. The electromagnetic shielding structure of claim 1, wherein an adhesive layer is disposed on the carrier, and the molding layer, the chip and the shield are disposed on the adhesive layer.
3. Electromagnetic shielding structure according to claim 2, characterized in that the solder joints of the chip are arranged towards the carrier.
4. Electromagnetic shielding structure according to claim 1 or 2, characterized in that the solder joints of the chip are arranged facing away from the carrier.
5. The EMI structure as set forth in claim 4, further comprising a rewiring layer disposed on a side of said molding compound layer facing away from said carrier, wherein said rewiring wires are electrically connected to said chip.
6. The structure of claim 5, further comprising solder balls disposed on a side of the redistribution layer opposite to the molding layer, wherein the solder balls and the chip are electrically connected to the chip through the redistribution layer.
7. Electromagnetic shielding structure according to claim 3, 5 or 6, characterized in that the shield is a metal and/or ceramic shield.
8. A method of encapsulating an electromagnetic shielding structure according to any of claims 1 to 7, comprising the steps of,
forming a shield on the carrier;
mounting the chip on a carrier;
forming a plastic packaging layer on the carrier, wherein the plastic packaging layer, the chip and the shield are positioned on the same side of the carrier, and the plastic packaging layer coats the shield and the chip;
and cutting by taking the central axis of the shielding body as a cutting line to obtain the electromagnetic shielding structure.
9. The packaging method of claim 8, wherein the step of forming a shield over the carrier comprises,
the shielding body is bonded with the carrier, and the shielding body is formed on the carrier; or the like, or, alternatively,
and arranging an adhesion layer on the carrier, and bonding the shielding body with the adhesion layer to form the shielding body on the carrier.
10. The method of packaging of claim 8 or 9, further comprising, prior to the step of forming a shield on the carrier, forming a mark on the carrier;
after the step of forming a shield on the carrier, mounting the chip according to the mark.
11. The encapsulation method according to any one of claims 8 to 10, further comprising, after the step of forming the molding layer on the carrier,
and thinning the plastic packaging layer, and then forming a rewiring layer on the plastic packaging layer.
12. The packaging method of claim 11, further comprising,
and arranging a solder ball on one side of the rewiring layer, which is back to the plastic packaging layer, so that the solder ball is electrically connected with the chip through the rewiring layer.
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