CN105027297A - 光发电装置 - Google Patents

光发电装置 Download PDF

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CN105027297A
CN105027297A CN201380056524.6A CN201380056524A CN105027297A CN 105027297 A CN105027297 A CN 105027297A CN 201380056524 A CN201380056524 A CN 201380056524A CN 105027297 A CN105027297 A CN 105027297A
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light generating
finger electrode
generating device
plain conductor
generating element
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桥本公一
大内正纯
阪本行
村松和郎
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VIEETECH JAPAN CO Ltd
Namics Corp
Choshu Industry Co Ltd
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Namics Corp
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Abstract

本发明提供一种光发电装置(10),该光发电装置(10)具有:多个光发电元件(11),在其正反面形成有透明导电氧化物层(18、19),利用光照射来产生电力;和设在各该光发电元件(11)的正反面的集电构件,其中,正面侧的所述集电构件包括:在正面侧的所述透明导电氧化物层(18)上通过凹版胶印平行地形成的厚度为5μm以下的指状电极(27);和与该指状电极(27)正交接合的多根金属导线(28),该金属导线(28)在一个方向上进一步延伸并与串联相邻的所述光发电元件(11)的反面侧所设置的所述集电构件接合。

Description

光发电装置
技术领域
本发明涉及一种光发电装置。
背景技术
现在,作为不产生CO2等气体的清洁能源,光发电装置受到关注。其中,发电效率高的异质结的光发电装置被广泛应用。再者,该光发电装置具有多个光发电元件11,如图4所示,光发电元件11在n型单晶硅基板(c-Si)12的一面(上表面),隔着本征非晶硅层(i层)13而具备p型非晶硅系薄膜层14;在n型单晶硅基板(c-Si)12的另一面(下表面),隔着本征非晶硅层(i层)15而具备n型非晶硅系薄膜层16,p型非晶硅系薄膜层14的上面及n型非晶硅系薄膜层16的下面分别具有透明导电氧化物(TransparentConductive Oxide)层18、19。
如图5的(A)、(B)所示,在透明导电氧化物层18、19的表面,设有由用来收集产生的电力的指状电极21和连接在该指状电极21上的母线电极22构成的集电构件(参见专利文献1、2)。该指状电极21(通常的宽度为50~100μm,高度为50μm以下)和母线电极22(通常的宽度为0.5~2mm,高度与指状电极21相同)通过丝网印刷同时形成。再者,多个光发电元件11借助内部连线25串联连接,从而提高了光发电装置整体的发电电压。
现有技术文献
专利文献
专利文献1:日本特开2005-317886号公报
专利文献2:日本特开2012-54442号公报
发明内容
发明要解决的课题
指状电极21和母线电极22由作为各自导电性粘合剂的银浆而构成。银浆在同一截面积上比起通常的金属导体(例如,铜)等的电阻大。另一方面,因为银浆是非透光性的,所以如果增加指状电极21或母线电极22的宽度的话,遮光率就将增加且发电效率降低。
因此,虽然通过多次反复进行丝网印刷确保了截面积,但为了要形成高度较高的集电构件,则需要大量的银浆,因而存在原料成本高的问题。
而且,丝网印刷存在印刷精度差,进行重叠印刷的话,宽度将逐渐地扩大,指状电极21形成超出需要的宽度,遮光率增加这样的问题。
另外,为了要连接相邻的光发电元件11,就有必要设置沿母线电极22而不同于母线电极22的内部连线25。
本发明正是鉴于这样的情形而做出的,其目的在于,提供能够比较廉价地制造的光发电装置。
用于解决课题的手段
按照上述目的的第1发明所涉及的光发电装置具有:多个光发电元件,在其正反面形成有透明导电氧化物层,利用光照射来产生电力;和设在各该光发电元件的正反面的集电构件,在该光发电装置中,正面侧的所述集电构件包括:在正面侧的所述透明导电氧化物层上通过凹版胶印平行地形成的厚度为5μm以下的指状电极;和与该指状电极正交接合的多根金属导线,该金属导线在一个方向上进一步延伸并与串联相邻的所述光发电元件的反面侧所设置的所述集电构件接合。
由于将凹版胶印用于形成指状电极,所以能够通过丝网印刷进行复杂的薄膜的印刷。
再者,指状电极的厚度优选为1μm以上,指状电极的厚度若小于1μm的话,则实施起来变得困难,而且电阻将增大。另外,指状电极的厚度一旦增加的话,金属浆料(例如,银浆)的使用量就将增加,材料费将会增加。再者,指状电极的宽度w为例如40~200μm(更优选地为100~200μm)。
另外,金属导线虽然优选采用铜(包含合金),但也可以是其他金属线(铝线、银线、镍线等)。
第2发明所涉及的光发电装置是在第1发明所涉及的光发电装置中,所述金属导线直径d为80~400μm,并以15d以上且15mm以下的间距来配置。这里,金属导线的直径d小于80μm时电阻将变大,金属导线的直径d超过400μm虽然也是可以的,但就正常需要而言电阻小,遮光率也大。再者,金属导线(例如,铜线)的表面也可以电镀不同种类的金属。
第3发明所涉及的光发电装置是在第1、第2发明所涉及的光发电装置中,对于所述金属导线与所述指状电极的接合使用低熔点金属(例如,焊锡)。这种情形的低熔点金属是在金属导线上通过涂覆处理来形成,厚度可以是金属导线的直径的0.05~0.2倍。
在第1~第3发明所涉及的光发电装置中,通过将多数的金属导线用作以往的母线电极,可以谋求电阻的减小,能够提供更高效的光发电装置。
发明的效果
在本发明所涉及的光发电装置中,由于采用凹版胶印而形成有指状电极,所以指状电极的宽度实质上为一定且能够将厚度准确地做薄,而且,因为将母线电极去掉设为金属导线,所以导电性粘合材料(例如,银浆)的使用量将会减少,能够更为廉价地制造光发电装置。
另外,因为金属导线朝一个方向进一步延伸并与旁边的光发电元件的反面侧的集电构件相接合,所以不需要像以往那样的内部连线,光发电装置的组装及制造就变得更加容易。
附图说明
图1是本发明的一实施方式所涉及的光发电装置的俯视图。
图2是本发明的一实施方式所涉及的光发电装置的侧视图。
图3是图1中的A-A’截面图。
图4是采用现有技术例子所涉及的光发电装置的光发电元件的示意图。
图5的(A)、(B)是该光发电装置的俯视图、侧视图。
具体实施方式
接着,一边参见附上的附图,一边对将本发明具体化了的实施方式进行说明。再者,对于与现有技术例子所涉及的光发电装置的结构要素相同的结构要素,附上相同的编号。
如图1、图2、图3所示,本发明的一实施方式所涉及的光发电装置10具有串联连接的多个光发电元件11。该光发电元件11与图4所示的结构相同(异质结太阳电池),在中央具有n型单晶硅基板(c-Si)12,在其上下具有本征非晶硅层13、15,进一步在其外侧分别具有p型非晶硅系薄膜层14和n型非晶硅系薄膜层16,在上下表面分别具有透明导电氧化物层18、19。
该光发电元件11的表面接触到光(例如,太阳光)的时候,在正反面的透明导电氧化物层18、19之间将会产生电位差从而产生电力。一个光发电元件11的电动势大约为0.7V较小。因此,将多个光发电元件11串联连接,能够得到规定的电压。关于这些结构,因为是众所周知的,所以详细的说明予以省略。
在光发电元件11的正反面形成有透明导电氧化物层18、19,如图1、图2所示,在透明导电氧化物层18、19的表面具有分别平行地等间隔配置的多个指状电极27和盖在其上面的多根金属导线28。在该实施方式中,通过将由细线组成的多个指状电极27和与该指状电极27正交配置的多个金属导线28,来形成正面侧及反面侧的集电构件。正面侧的集电构件与形成在光发电元件11的正面侧的透明导电氧化物层18电接合。反面侧的集电构件与形成在光发电元件11的反面侧的透明导电氧化物层19电接合。再者,反面侧的集电构件也可以与正面侧不同。
这里,如图2所示,指状电极27是将作为金属浆料的一例的银浆进行印刷而成的。指状电极27的厚度(高度)t为1μm以上5μm以下、宽度w为40~200μm(较为优选地为100~200μm、更为优选地为50~150μm),指状电极27的间距p为宽度w的10~20倍左右。指状电极27对光进行遮蔽,w/p×100(参见图1、图2)为遮光率(%)的函数,该遮光率优选为10%以下。
再者,如果缩小指状电极27的截面积的话,银浆的使用量就与厚度成比例地减少,可以提供银浆的使用量更少的廉价的光发电装置。但是,如果做成极端薄的话,因为填充因子(FF)下降,所以最好确定指状电极27的宽度w和厚度t,以使该填充因子不过度地下降。
在这种情况下,要减薄指状电极27的厚度t,就要使用凹版胶印(凹版胶印)技术。通过将指状电极27的厚度t做薄,就可以减少制造光发电装置10时的银浆的量。
如图3所示,在光发电元件11的正面侧(及反面侧)以小间距设置的多个指状电极27的上面,平行地配置有多根金属导线28。该金属导线28的直径d为80~400μm,以间距p1为15d以上15mm以下(例如,金属导线28的间距为4mm)进行配线。
这里,如果金属导线28的间距变大的话,则指状电极27的集电区域将变长,将受电阻损耗的影响。金属导线28的间距一旦变小,遮光率就将增加。因此,考虑两者的平衡,优选在遮光率5~10%之间进行设计。再者,金属导线28与指状电极27用低熔点金属(例如,焊锡)30进行接合。
再者,低熔点金属30如图3所示,预先在金属导线28的周围以规定的厚度进行涂覆,通过大约200℃的加热,使低熔点金属30熔融,而与指状电极27接合。
光发电元件11的正面侧的金属导线28在一个方向上进一步延伸并与相邻的光发电元件11的反面侧的金属导线28接合。再者,“接合”是指除了连接有各自的金属导线的情形之外,还包含利用一根金属导线形成光发电元件的正面侧及相邻的光发电元件的反面侧的金属导线的情形。
在该实施方式中,没有像以往那样地在集电构件(即母线电极)中采用导电性粘合剂,而是采用了金属导线。因此,能够进行折弯,另外,不需要内部连线等,可以更加简单地制造。
如前所述,仅考虑了指状电极27的遮光率为(w/p)×100(%)。另外,假设金属导线28的直径为d、金属导线28的间距为p1,则考虑了指状电极27及金属导线28的遮光率大致为{100(w/p)+100(d/p1)}%。这些合计的遮光率优选为10%以下。再者,虽然金属导线28的截面为圆形,但通过采用截面为矩形、尤其是截面纵长的长方形的金属导线,可以在维持电阻的状态下,降低遮光率。
为了确认本发明的作用、效果而进行的实施例显示于表1中。No.1~No.7表示指状电极的高度分别为0.1μm、0.3μm、0.5μm、1μm、3μm、5μm、10μm的情形。在指状电极的高度为不足1μm的情况下,效率(η)也将下降,即使采用凹版胶印,也难以做到不足1μm的一定厚度。
另一方面,如果指状电极的厚度做得更厚的话,则由于银的使用量增加,所以制造成本将增加。
[表1]
指状电极高度 Isc/A Voc/V FF Rs/Ω η/%
No.1 0.1μm 9.031 0.724 0.732 6.20E-03 19.67
No.2 0.3μm 9.032 0.723 0.743 5.51E-03 19.94
No.3 0.5μm 9.031 0.725 0.752 5.26E-03 20.23
No.4 1μm 9.035 0.726 0.761 4.92E-03 20.51
No.5 3μm 9.034 0.724 0.766 4.45E-03 20.59
No.6 5μm 9.045 0.725 0.772 4.41E-03 20.80
No.7 10μm 9.038 0.726 0.781 4.30E-03 21.06
本发明并不限定于上述实施方式,在不改变本发明的主旨的范围内也可以对其结构进行更改。例如,在上述实施方式中,虽然将铜线用作为金属导线,但可以使用铝线、镍线等。而且,在金属导线的表面还可以实施电镀。另外,虽然在指状电极的制造中使用银浆作为导电性粘合剂,但也可以使用其他导电性粘合剂。
符号说明
10:光发电装置,11:光发电元件,12:n型单晶硅基板,13:本征非晶硅层,14:p型非晶硅系薄膜层,15:本征非晶硅层,16:n型非晶硅系薄膜层,18、19:透明导电氧化物层,21:指状电极,22:母线电极,25:内部连线,27:指状电极,28:金属导线,30:低熔点金属。

Claims (3)

1.一种光发电装置,具有:多个光发电元件,在其正反面形成有透明导电氧化物层,利用光照射来产生电力;和设在各该光发电元件的正反面的集电构件,所述光发电装置的特征在于,
正面侧的所述集电构件包括:在正面侧的所述透明导电氧化物层上通过凹版胶印平行地形成的厚度为5μm以下的指状电极;和与该指状电极正交接合的多根金属导线,该金属导线在一个方向上进一步延伸并与串联相邻的所述光发电元件的反面侧所设置的所述集电构件接合。
2.根据权利要求1所述的光发电装置,其特征在于,
所述金属导线,其直径d为80~400μm,并以15d以上且15mm以下的间距来配置。
3.根据权利要求1或2所述的光发电装置,其特征在于,
所述金属导线与所述指状电极的接合使用了低熔点金属。
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Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3410493B1 (en) * 2014-06-26 2020-06-24 Lg Electronics Inc. Solar cell module
JP2016027640A (ja) * 2014-06-30 2016-02-18 日東電工株式会社 太陽電池モジュールおよび太陽電池モジュール用封止フィルム
KR102273014B1 (ko) * 2014-08-04 2021-07-06 엘지전자 주식회사 태양 전지 모듈
CN104282788B (zh) * 2014-09-28 2017-03-22 苏州中来光伏新材股份有限公司 无主栅、高效率背接触太阳能电池模块、组件及制备工艺
US20160126388A1 (en) 2014-10-31 2016-05-05 Byd Company Limited Solar cell array, solar cell module and manufacturing method thereof
CN105576057B (zh) * 2014-10-31 2018-06-26 比亚迪股份有限公司 太阳能电池组件及其制备方法
KR101889842B1 (ko) * 2014-11-26 2018-08-20 엘지전자 주식회사 태양 전지 모듈
JP2018056145A (ja) * 2015-02-06 2018-04-05 長州産業株式会社 光発電モジュール
KR101739404B1 (ko) * 2015-08-07 2017-06-08 엘지전자 주식회사 태양 전지 패널
EP3171412B1 (en) * 2015-11-17 2019-06-12 LG Electronics Inc. Apparatus and method for attaching interconnector of solar cell panel
US10834815B2 (en) 2015-12-01 2020-11-10 Japan Aviation Electronics Industry, Limited Printed wiring line, electronic device, touch panel, gravure plate, printed wiring line formation method, touch panel production method, and electronic device production method
JP6692634B2 (ja) * 2015-12-01 2020-05-13 日本航空電子工業株式会社 タッチパネル
EP3573113B1 (en) * 2018-05-24 2020-04-15 Solyco Technology GmbH Photovoltaic module
KR102266951B1 (ko) * 2019-10-29 2021-06-18 엘지전자 주식회사 태양 전지 모듈
KR102149926B1 (ko) * 2019-10-29 2020-08-31 엘지전자 주식회사 태양 전지 모듈
CN116110980A (zh) * 2021-11-10 2023-05-12 浙江晶科能源有限公司 一种电池片以及光伏组件

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5151386A (en) * 1990-08-01 1992-09-29 Mobil Solar Energy Corporation Method of applying metallized contacts to a solar cell
DE10239845C1 (de) * 2002-08-29 2003-12-24 Day4 Energy Inc Elektrode für fotovoltaische Zellen, fotovoltaische Zelle und fotovoltaischer Modul
US7122398B1 (en) * 2004-03-25 2006-10-17 Nanosolar, Inc. Manufacturing of optoelectronic devices
JP4593980B2 (ja) 2004-03-29 2010-12-08 京セラ株式会社 光電変換装置とこれを用いた太陽電池素子、並びに太陽電池モジュール
JP4925598B2 (ja) * 2005-03-29 2012-04-25 京セラ株式会社 太陽電池素子及びこれを用いた太陽電池モジュール
WO2010030109A2 (ko) * 2008-09-12 2010-03-18 주식회사 엘지화학 전력 손실이 최소화된 태양전지용 전면 전극 및 이를 포함하는 태양전지
EP2469604B1 (en) * 2009-08-19 2019-10-09 Panasonic Intellectual Property Management Co., Ltd. Solar battery module
JP2011103356A (ja) * 2009-11-10 2011-05-26 Mitsubishi Electric Corp 太陽電池セル電極形成ペースト、並びに太陽電池セルおよびその製造方法
JP2011142127A (ja) * 2009-12-11 2011-07-21 Hitachi Chem Co Ltd 太陽電池構造体及びその製造方法
JP2012054442A (ja) 2010-09-02 2012-03-15 Shin Etsu Chem Co Ltd 太陽電池の製造方法及びこれに用いるスクリーン製版
JP2012079869A (ja) * 2010-09-30 2012-04-19 Fujifilm Corp 有機薄膜太陽電池
EP2791979B1 (en) * 2011-12-13 2020-04-29 IMEC vzw Photovoltaic cell and method of forming the same

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