CN104995741B - 半导体纳米线的凹槽式接触 - Google Patents
半导体纳米线的凹槽式接触 Download PDFInfo
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- CN104995741B CN104995741B CN201380073253.5A CN201380073253A CN104995741B CN 104995741 B CN104995741 B CN 104995741B CN 201380073253 A CN201380073253 A CN 201380073253A CN 104995741 B CN104995741 B CN 104995741B
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- nanowire
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- H—ELECTRICITY
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- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions
- H10D64/205—Nanosized electrodes, e.g. nanowire electrodes
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- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/117—Shapes of semiconductor bodies
- H10D62/118—Nanostructure semiconductor bodies
- H10D62/119—Nanowire, nanosheet or nanotube semiconductor bodies
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- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/117—Shapes of semiconductor bodies
- H10D62/118—Nanostructure semiconductor bodies
- H10D62/119—Nanowire, nanosheet or nanotube semiconductor bodies
- H10D62/122—Nanowire, nanosheet or nanotube semiconductor bodies oriented at angles to substrates, e.g. perpendicular to substrates
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- H10F10/00—Individual photovoltaic cells, e.g. solar cells
- H10F10/10—Individual photovoltaic cells, e.g. solar cells having potential barriers
- H10F10/16—Photovoltaic cells having only PN heterojunction potential barriers
- H10F10/163—Photovoltaic cells having only PN heterojunction potential barriers comprising only Group III-V materials, e.g. GaAs/AlGaAs or InP/GaInAs photovoltaic cells
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- H10F71/00—Manufacture or treatment of devices covered by this subclass
- H10F71/127—The active layers comprising only Group III-V materials, e.g. GaAs or InP
- H10F71/1276—The active layers comprising only Group III-V materials, e.g. GaAs or InP comprising growth substrates not made of Group III-V materials
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- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/10—Semiconductor bodies
- H10F77/14—Shape of semiconductor bodies; Shapes, relative sizes or dispositions of semiconductor regions within semiconductor bodies
- H10F77/143—Shape of semiconductor bodies; Shapes, relative sizes or dispositions of semiconductor regions within semiconductor bodies comprising quantum structures
- H10F77/1437—Quantum wires or nanorods
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- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/20—Electrodes
- H10F77/244—Electrodes made of transparent conductive layers, e.g. transparent conductive oxide [TCO] layers
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- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
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- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/817—Bodies characterised by the crystal structures or orientations, e.g. polycrystalline, amorphous or porous
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- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/83—Electrodes
- H10H20/831—Electrodes characterised by their shape
- H10H20/8314—Electrodes characterised by their shape extending at least partially onto an outer side surface of the bodies
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- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/83—Electrodes
- H10H20/832—Electrodes characterised by their material
- H10H20/833—Transparent materials
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- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/34—Deposited materials, e.g. layers
- H10P14/3451—Structure
- H10P14/3452—Microstructure
- H10P14/3462—Nanowires
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- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
- H10P14/6326—Deposition processes
- H10P14/6328—Deposition from the gas or vapour phase
- H10P14/6334—Deposition from the gas or vapour phase using decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
- H10P14/6339—Deposition from the gas or vapour phase using decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition deposition by cyclic CVD, e.g. ALD, ALE or pulsed CVD
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- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/66—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials
- H10P14/668—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials the materials being characterised by the deposition precursor materials
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- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/66—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials
- H10P14/668—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials the materials being characterised by the deposition precursor materials
- H10P14/6681—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials the materials being characterised by the deposition precursor materials the precursor containing a compound comprising Si
- H10P14/6684—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials the materials being characterised by the deposition precursor materials the precursor containing a compound comprising Si the compound comprising silicon and oxygen
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- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/69—Inorganic materials
- H10P14/692—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses
- H10P14/6921—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon
- H10P14/69215—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon the material being a silicon oxide, e.g. SiO2
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- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P50/00—Etching of wafers, substrates or parts of devices
- H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
- H10P50/28—Dry etching; Plasma etching; Reactive-ion etching of insulating materials
- H10P50/282—Dry etching; Plasma etching; Reactive-ion etching of insulating materials of inorganic materials
- H10P50/283—Dry etching; Plasma etching; Reactive-ion etching of insulating materials of inorganic materials by chemical means
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
- H10D62/85—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group III-V materials, e.g. GaAs
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
- H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P50/00—Etching of wafers, substrates or parts of devices
- H10P50/60—Wet etching
- H10P50/66—Wet etching of conductive or resistive materials
- H10P50/663—Wet etching of conductive or resistive materials by chemical means only
- H10P50/667—Wet etching of conductive or resistive materials by chemical means only by liquid etching only
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/544—Solar cells from Group III-V materials
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/547—Monocrystalline silicon PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S977/00—Nanotechnology
- Y10S977/902—Specified use of nanostructure
- Y10S977/932—Specified use of nanostructure for electronic or optoelectronic application
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Materials Engineering (AREA)
- Photovoltaic Devices (AREA)
- Led Devices (AREA)
- Electrodes Of Semiconductors (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Energy (AREA)
- Thin Film Transistor (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/723,413 US9012883B2 (en) | 2012-12-21 | 2012-12-21 | Recessed contact to semiconductor nanowires |
| US13/723413 | 2012-12-21 | ||
| PCT/IB2013/003176 WO2014096962A2 (en) | 2012-12-21 | 2013-12-06 | Recessed contact to semiconductor nanowires |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104995741A CN104995741A (zh) | 2015-10-21 |
| CN104995741B true CN104995741B (zh) | 2017-08-25 |
Family
ID=50973605
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201380073253.5A Expired - Fee Related CN104995741B (zh) | 2012-12-21 | 2013-12-06 | 半导体纳米线的凹槽式接触 |
Country Status (5)
| Country | Link |
|---|---|
| US (3) | US9012883B2 (https=) |
| EP (1) | EP2936568B1 (https=) |
| JP (1) | JP6254608B2 (https=) |
| CN (1) | CN104995741B (https=) |
| WO (1) | WO2014096962A2 (https=) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9012883B2 (en) | 2012-12-21 | 2015-04-21 | Sol Voltaics Ab | Recessed contact to semiconductor nanowires |
| US20170352542A1 (en) * | 2014-10-30 | 2017-12-07 | President And Fellows Of Harvard College | Nanoscale wires with tip-localized junctions |
| WO2016071762A1 (en) * | 2014-11-07 | 2016-05-12 | Sol Voltaics Ab | Shell-enabled vertical alignment and precision-assembly of a close-packed colloidal crystal film |
| DE102015205230B4 (de) * | 2015-03-23 | 2023-01-19 | Universität Duisburg-Essen | Verfahren zur Herstellung von Bauelementen aufweisend eine Schottky-Diode mittels Drucktechnik und Bauelement |
| KR101787435B1 (ko) * | 2016-02-29 | 2017-10-19 | 피에스아이 주식회사 | 나노 로드 제조방법 |
| EP3260414A1 (en) | 2016-06-21 | 2017-12-27 | Sol Voltaics AB | Method for transferring nanowires from a fluid to a substrate surface |
| FR3064109B1 (fr) * | 2017-03-20 | 2025-03-14 | Commissariat Energie Atomique | Structure a nanofils et procede de realisation d'une telle structure |
| KR101919487B1 (ko) * | 2017-09-14 | 2018-11-19 | 한국과학기술연구원 | 반도체 기판을 텍스쳐링하는 방법과, 이 방법에 의해 제조된 반도체 기판, 그리고, 이러한 반도체 기판을 포함하는 태양 전지 |
| JP7371366B2 (ja) * | 2019-06-27 | 2023-10-31 | 富士通株式会社 | 半導体デバイス、及びこれを用いた無線受信器 |
| US11101744B2 (en) * | 2019-12-27 | 2021-08-24 | Michael Junior Spruill | Capacitive engine featuring an extrinsic semiconductor |
| CN111180554B (zh) * | 2020-01-08 | 2023-01-03 | 燕山大学 | 一种混合结构太阳能电池的制备方法 |
| CN115428166B (zh) | 2020-04-15 | 2026-04-14 | 富士通株式会社 | 半导体装置、储层计算系统以及半导体装置的制造方法 |
| US11094846B1 (en) * | 2020-08-31 | 2021-08-17 | 4233999 Canada Inc. | Monolithic nanocolumn structures |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080315430A1 (en) * | 2007-06-22 | 2008-12-25 | Qimonda Ag | Nanowire vias |
| CN101842909A (zh) * | 2007-07-19 | 2010-09-22 | 加利福尼亚技术学院 | 半导体的有序阵列结构 |
| WO2010120233A2 (en) * | 2009-04-15 | 2010-10-21 | Sol Voltaics Ab | Multi-junction photovoltaic cell with nanowires |
| WO2012035243A1 (fr) * | 2010-09-14 | 2012-03-22 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Dispositif optoelectronique a base de nanofils pour l'émission de lumière |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3870459B2 (ja) * | 1996-10-28 | 2007-01-17 | ソニー株式会社 | 量子細線の製造方法 |
| JP4235440B2 (ja) | 2002-12-13 | 2009-03-11 | キヤノン株式会社 | 半導体デバイスアレイ及びその製造方法 |
| US6933222B2 (en) * | 2003-01-02 | 2005-08-23 | Intel Corporation | Microcircuit fabrication and interconnection |
| US20060207647A1 (en) | 2005-03-16 | 2006-09-21 | General Electric Company | High efficiency inorganic nanorod-enhanced photovoltaic devices |
| US7230286B2 (en) * | 2005-05-23 | 2007-06-12 | International Business Machines Corporation | Vertical FET with nanowire channels and a silicided bottom contact |
| EP1804286A1 (en) | 2005-12-27 | 2007-07-04 | Interuniversitair Microelektronica Centrum | Elongate nanostructure semiconductor device |
| KR100721020B1 (ko) * | 2006-01-20 | 2007-05-23 | 삼성전자주식회사 | 콘택 구조체를 포함하는 반도체 소자 및 그 형성 방법 |
| DE102006013245A1 (de) * | 2006-03-22 | 2007-10-04 | Infineon Technologies Ag | Verfahren zur Ausbildung von Öffnungen in einer Matrizenschicht und zur Herstellung von Kondensatoren |
| KR101547711B1 (ko) * | 2007-06-19 | 2015-08-26 | 큐나노 에이비 | 나노와이어-기반 태양 전지 구조 |
| EP2019313B1 (en) * | 2007-07-25 | 2015-09-16 | Stichting IMEC Nederland | Sensor device comprising elongated nanostructures, its use and manufacturing method |
| KR20100072220A (ko) * | 2007-08-28 | 2010-06-30 | 캘리포니아 인스티튜트 오브 테크놀로지 | 중합체―임베드된 반도체 로드 어레이 |
| KR20090058952A (ko) * | 2007-12-05 | 2009-06-10 | 삼성전자주식회사 | 나노로드를 이용한 발광소자 및 그 제조 방법 |
| US8698254B2 (en) * | 2009-09-30 | 2014-04-15 | National University Corporation Hokkaido University | Tunnel field effect transistor and method for manufacturing same |
| CN102770367B (zh) | 2009-12-22 | 2015-08-19 | 昆南诺股份有限公司 | 用于制备纳米线结构的方法 |
| JP2011187901A (ja) * | 2010-03-11 | 2011-09-22 | Canon Inc | 半導体デバイスの製造方法 |
| US7906354B1 (en) * | 2010-03-30 | 2011-03-15 | Eastman Kodak Company | Light emitting nanowire device |
| CN107090593A (zh) | 2010-05-11 | 2017-08-25 | 昆南诺股份有限公司 | 线的气相合成 |
| GB201015411D0 (en) | 2010-09-15 | 2010-10-27 | Univ Leuven Kath | Anti-cancer activity of novel bicyclic heterocycles |
| US10090425B2 (en) * | 2012-02-21 | 2018-10-02 | California Institute Of Technology | Axially-integrated epitaxially-grown tandem wire arrays |
| US9012883B2 (en) | 2012-12-21 | 2015-04-21 | Sol Voltaics Ab | Recessed contact to semiconductor nanowires |
-
2012
- 2012-12-21 US US13/723,413 patent/US9012883B2/en not_active Expired - Fee Related
-
2013
- 2013-12-06 JP JP2015548787A patent/JP6254608B2/ja not_active Expired - Fee Related
- 2013-12-06 CN CN201380073253.5A patent/CN104995741B/zh not_active Expired - Fee Related
- 2013-12-06 EP EP13865741.6A patent/EP2936568B1/en not_active Not-in-force
- 2013-12-06 WO PCT/IB2013/003176 patent/WO2014096962A2/en not_active Ceased
-
2015
- 2015-03-27 US US14/671,666 patent/US9419086B2/en active Active
-
2016
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080315430A1 (en) * | 2007-06-22 | 2008-12-25 | Qimonda Ag | Nanowire vias |
| CN101842909A (zh) * | 2007-07-19 | 2010-09-22 | 加利福尼亚技术学院 | 半导体的有序阵列结构 |
| WO2010120233A2 (en) * | 2009-04-15 | 2010-10-21 | Sol Voltaics Ab | Multi-junction photovoltaic cell with nanowires |
| WO2012035243A1 (fr) * | 2010-09-14 | 2012-03-22 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Dispositif optoelectronique a base de nanofils pour l'émission de lumière |
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| US20150200262A1 (en) | 2015-07-16 |
| JP6254608B2 (ja) | 2017-12-27 |
| JP2016510943A (ja) | 2016-04-11 |
| WO2014096962A2 (en) | 2014-06-26 |
| US9012883B2 (en) | 2015-04-21 |
| US20140175372A1 (en) | 2014-06-26 |
| US20160336411A1 (en) | 2016-11-17 |
| EP2936568A4 (en) | 2016-07-20 |
| US9818830B2 (en) | 2017-11-14 |
| US9419086B2 (en) | 2016-08-16 |
| EP2936568A2 (en) | 2015-10-28 |
| EP2936568B1 (en) | 2017-09-06 |
| WO2014096962A3 (en) | 2014-08-21 |
| CN104995741A (zh) | 2015-10-21 |
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