CN104995741B - 半导体纳米线的凹槽式接触 - Google Patents
半导体纳米线的凹槽式接触 Download PDFInfo
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- CN104995741B CN104995741B CN201380073253.5A CN201380073253A CN104995741B CN 104995741 B CN104995741 B CN 104995741B CN 201380073253 A CN201380073253 A CN 201380073253A CN 104995741 B CN104995741 B CN 104995741B
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- nanowire
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- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
- H01L21/02164—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material being a silicon oxide, e.g. SiO2
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- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
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- H01L21/02214—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si the compound comprising silicon and oxygen
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- H01L21/02271—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
- H01L21/0228—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition deposition by cyclic CVD, e.g. ALD, ALE, pulsed CVD
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- H01L21/02365—Forming inorganic semiconducting materials on a substrate
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- H01L21/311—Etching the insulating layers by chemical or physical means
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- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
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- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
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- Materials Engineering (AREA)
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Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/723413 | 2012-12-21 | ||
| US13/723,413 US9012883B2 (en) | 2012-12-21 | 2012-12-21 | Recessed contact to semiconductor nanowires |
| PCT/IB2013/003176 WO2014096962A2 (en) | 2012-12-21 | 2013-12-06 | Recessed contact to semiconductor nanowires |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104995741A CN104995741A (zh) | 2015-10-21 |
| CN104995741B true CN104995741B (zh) | 2017-08-25 |
Family
ID=50973605
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201380073253.5A Expired - Fee Related CN104995741B (zh) | 2012-12-21 | 2013-12-06 | 半导体纳米线的凹槽式接触 |
Country Status (5)
| Country | Link |
|---|---|
| US (3) | US9012883B2 (enExample) |
| EP (1) | EP2936568B1 (enExample) |
| JP (1) | JP6254608B2 (enExample) |
| CN (1) | CN104995741B (enExample) |
| WO (1) | WO2014096962A2 (enExample) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9012883B2 (en) | 2012-12-21 | 2015-04-21 | Sol Voltaics Ab | Recessed contact to semiconductor nanowires |
| WO2016069831A1 (en) * | 2014-10-30 | 2016-05-06 | President And Fellows Of Harvard College | Nanoscale wires with tip-localized junctions |
| WO2016071762A1 (en) * | 2014-11-07 | 2016-05-12 | Sol Voltaics Ab | Shell-enabled vertical alignment and precision-assembly of a close-packed colloidal crystal film |
| DE102015205230B4 (de) * | 2015-03-23 | 2023-01-19 | Universität Duisburg-Essen | Verfahren zur Herstellung von Bauelementen aufweisend eine Schottky-Diode mittels Drucktechnik und Bauelement |
| KR101787435B1 (ko) * | 2016-02-29 | 2017-10-19 | 피에스아이 주식회사 | 나노 로드 제조방법 |
| EP3260414A1 (en) | 2016-06-21 | 2017-12-27 | Sol Voltaics AB | Method for transferring nanowires from a fluid to a substrate surface |
| FR3064109B1 (fr) * | 2017-03-20 | 2025-03-14 | Commissariat Energie Atomique | Structure a nanofils et procede de realisation d'une telle structure |
| KR101919487B1 (ko) * | 2017-09-14 | 2018-11-19 | 한국과학기술연구원 | 반도체 기판을 텍스쳐링하는 방법과, 이 방법에 의해 제조된 반도체 기판, 그리고, 이러한 반도체 기판을 포함하는 태양 전지 |
| JP7371366B2 (ja) * | 2019-06-27 | 2023-10-31 | 富士通株式会社 | 半導体デバイス、及びこれを用いた無線受信器 |
| US11101744B2 (en) * | 2019-12-27 | 2021-08-24 | Michael Junior Spruill | Capacitive engine featuring an extrinsic semiconductor |
| CN111180554B (zh) * | 2020-01-08 | 2023-01-03 | 燕山大学 | 一种混合结构太阳能电池的制备方法 |
| EP4138141A4 (en) * | 2020-04-15 | 2023-06-07 | Fujitsu Limited | SEMICONDUCTOR DEVICE, RESERVOIR COMPUTER SYSTEM AND METHOD OF MAKING A SEMICONDUCTOR DEVICE |
| US11094846B1 (en) * | 2020-08-31 | 2021-08-17 | 4233999 Canada Inc. | Monolithic nanocolumn structures |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080315430A1 (en) * | 2007-06-22 | 2008-12-25 | Qimonda Ag | Nanowire vias |
| CN101842909A (zh) * | 2007-07-19 | 2010-09-22 | 加利福尼亚技术学院 | 半导体的有序阵列结构 |
| WO2010120233A2 (en) * | 2009-04-15 | 2010-10-21 | Sol Voltaics Ab | Multi-junction photovoltaic cell with nanowires |
| WO2012035243A1 (fr) * | 2010-09-14 | 2012-03-22 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Dispositif optoelectronique a base de nanofils pour l'émission de lumière |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3870459B2 (ja) * | 1996-10-28 | 2007-01-17 | ソニー株式会社 | 量子細線の製造方法 |
| JP4235440B2 (ja) | 2002-12-13 | 2009-03-11 | キヤノン株式会社 | 半導体デバイスアレイ及びその製造方法 |
| US6933222B2 (en) * | 2003-01-02 | 2005-08-23 | Intel Corporation | Microcircuit fabrication and interconnection |
| US20060207647A1 (en) | 2005-03-16 | 2006-09-21 | General Electric Company | High efficiency inorganic nanorod-enhanced photovoltaic devices |
| US7230286B2 (en) * | 2005-05-23 | 2007-06-12 | International Business Machines Corporation | Vertical FET with nanowire channels and a silicided bottom contact |
| EP1804286A1 (en) | 2005-12-27 | 2007-07-04 | Interuniversitair Microelektronica Centrum | Elongate nanostructure semiconductor device |
| KR100721020B1 (ko) * | 2006-01-20 | 2007-05-23 | 삼성전자주식회사 | 콘택 구조체를 포함하는 반도체 소자 및 그 형성 방법 |
| DE102006013245A1 (de) * | 2006-03-22 | 2007-10-04 | Infineon Technologies Ag | Verfahren zur Ausbildung von Öffnungen in einer Matrizenschicht und zur Herstellung von Kondensatoren |
| WO2008156421A2 (en) * | 2007-06-19 | 2008-12-24 | Qunano Ab | Nanowire-based solar cell structure |
| EP2019313B1 (en) * | 2007-07-25 | 2015-09-16 | Stichting IMEC Nederland | Sensor device comprising elongated nanostructures, its use and manufacturing method |
| JP2010538464A (ja) * | 2007-08-28 | 2010-12-09 | カリフォルニア インスティテュート オブ テクノロジー | ポリマ埋め込み型半導体ロッドアレイ |
| KR20090058952A (ko) * | 2007-12-05 | 2009-06-10 | 삼성전자주식회사 | 나노로드를 이용한 발광소자 및 그 제조 방법 |
| US8698254B2 (en) * | 2009-09-30 | 2014-04-15 | National University Corporation Hokkaido University | Tunnel field effect transistor and method for manufacturing same |
| US9305766B2 (en) | 2009-12-22 | 2016-04-05 | Qunano Ab | Method for manufacturing a nanowire structure |
| JP2011187901A (ja) * | 2010-03-11 | 2011-09-22 | Canon Inc | 半導体デバイスの製造方法 |
| US7906354B1 (en) * | 2010-03-30 | 2011-03-15 | Eastman Kodak Company | Light emitting nanowire device |
| WO2011142717A1 (en) | 2010-05-11 | 2011-11-17 | Qunano Ab | Gas-phase synthesis of wires |
| GB201015411D0 (en) | 2010-09-15 | 2010-10-27 | Univ Leuven Kath | Anti-cancer activity of novel bicyclic heterocycles |
| WO2013126432A1 (en) * | 2012-02-21 | 2013-08-29 | California Institute Of Technology | Axially-integrated epitaxially-grown tandem wire arrays |
| US9012883B2 (en) | 2012-12-21 | 2015-04-21 | Sol Voltaics Ab | Recessed contact to semiconductor nanowires |
-
2012
- 2012-12-21 US US13/723,413 patent/US9012883B2/en not_active Expired - Fee Related
-
2013
- 2013-12-06 EP EP13865741.6A patent/EP2936568B1/en not_active Not-in-force
- 2013-12-06 WO PCT/IB2013/003176 patent/WO2014096962A2/en not_active Ceased
- 2013-12-06 CN CN201380073253.5A patent/CN104995741B/zh not_active Expired - Fee Related
- 2013-12-06 JP JP2015548787A patent/JP6254608B2/ja not_active Expired - Fee Related
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2015
- 2015-03-27 US US14/671,666 patent/US9419086B2/en active Active
-
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- 2016-07-28 US US15/221,811 patent/US9818830B2/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080315430A1 (en) * | 2007-06-22 | 2008-12-25 | Qimonda Ag | Nanowire vias |
| CN101842909A (zh) * | 2007-07-19 | 2010-09-22 | 加利福尼亚技术学院 | 半导体的有序阵列结构 |
| WO2010120233A2 (en) * | 2009-04-15 | 2010-10-21 | Sol Voltaics Ab | Multi-junction photovoltaic cell with nanowires |
| WO2012035243A1 (fr) * | 2010-09-14 | 2012-03-22 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Dispositif optoelectronique a base de nanofils pour l'émission de lumière |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2014096962A2 (en) | 2014-06-26 |
| EP2936568B1 (en) | 2017-09-06 |
| EP2936568A4 (en) | 2016-07-20 |
| WO2014096962A3 (en) | 2014-08-21 |
| EP2936568A2 (en) | 2015-10-28 |
| CN104995741A (zh) | 2015-10-21 |
| JP2016510943A (ja) | 2016-04-11 |
| US20140175372A1 (en) | 2014-06-26 |
| US9419086B2 (en) | 2016-08-16 |
| US9012883B2 (en) | 2015-04-21 |
| US20160336411A1 (en) | 2016-11-17 |
| US9818830B2 (en) | 2017-11-14 |
| US20150200262A1 (en) | 2015-07-16 |
| JP6254608B2 (ja) | 2017-12-27 |
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