JP2010538464A - ポリマ埋め込み型半導体ロッドアレイ - Google Patents
ポリマ埋め込み型半導体ロッドアレイ Download PDFInfo
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- JP2010538464A JP2010538464A JP2010522999A JP2010522999A JP2010538464A JP 2010538464 A JP2010538464 A JP 2010538464A JP 2010522999 A JP2010522999 A JP 2010522999A JP 2010522999 A JP2010522999 A JP 2010522999A JP 2010538464 A JP2010538464 A JP 2010538464A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 126
- 229920000642 polymer Polymers 0.000 title claims description 26
- 239000000463 material Substances 0.000 claims abstract description 131
- 239000000758 substrate Substances 0.000 claims abstract description 99
- 238000000034 method Methods 0.000 claims abstract description 67
- 239000004205 dimethyl polysiloxane Substances 0.000 claims description 21
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims description 21
- 238000004519 manufacturing process Methods 0.000 claims description 19
- 238000003491 array Methods 0.000 claims description 16
- 230000003287 optical effect Effects 0.000 claims description 13
- 230000008569 process Effects 0.000 claims description 13
- 238000000151 deposition Methods 0.000 claims description 8
- 229920001940 conductive polymer Polymers 0.000 claims description 7
- -1 polydimethylsiloxane Polymers 0.000 claims description 5
- 229910021421 monocrystalline silicon Inorganic materials 0.000 claims description 4
- 239000002861 polymer material Substances 0.000 claims description 4
- 239000007787 solid Substances 0.000 claims description 4
- 239000002654 heat shrinkable material Substances 0.000 claims description 3
- 238000004528 spin coating Methods 0.000 claims description 3
- 230000001788 irregular Effects 0.000 claims 2
- 238000005266 casting Methods 0.000 abstract description 5
- 239000010408 film Substances 0.000 description 43
- 238000001878 scanning electron micrograph Methods 0.000 description 20
- 235000012431 wafers Nutrition 0.000 description 20
- 239000003054 catalyst Substances 0.000 description 16
- 239000002073 nanorod Substances 0.000 description 13
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 12
- UHYPYGJEEGLRJD-UHFFFAOYSA-N cadmium(2+);selenium(2-) Chemical compound [Se-2].[Cd+2] UHYPYGJEEGLRJD-UHFFFAOYSA-N 0.000 description 10
- 239000010931 gold Substances 0.000 description 10
- 230000000737 periodic effect Effects 0.000 description 10
- 238000005530 etching Methods 0.000 description 9
- 239000013078 crystal Substances 0.000 description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- 239000000203 mixture Substances 0.000 description 7
- 229920002120 photoresistant polymer Polymers 0.000 description 7
- 239000002585 base Substances 0.000 description 6
- 239000002131 composite material Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- 239000002245 particle Substances 0.000 description 6
- 229920006254 polymer film Polymers 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 4
- 229910021419 crystalline silicon Inorganic materials 0.000 description 4
- 238000004070 electrodeposition Methods 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 238000012546 transfer Methods 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 229920000144 PEDOT:PSS Polymers 0.000 description 3
- RWRDLPDLKQPQOW-UHFFFAOYSA-N Pyrrolidine Chemical compound C1CCNC1 RWRDLPDLKQPQOW-UHFFFAOYSA-N 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 3
- 239000011368 organic material Substances 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- WNZQDUSMALZDQF-UHFFFAOYSA-N 2-benzofuran-1(3H)-one Chemical compound C1=CC=C2C(=O)OCC2=C1 WNZQDUSMALZDQF-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 2
- GLUUGHFHXGJENI-UHFFFAOYSA-N Piperazine Chemical compound C1CNCCN1 GLUUGHFHXGJENI-UHFFFAOYSA-N 0.000 description 2
- NQRYJNQNLNOLGT-UHFFFAOYSA-N Piperidine Chemical compound C1CCNCC1 NQRYJNQNLNOLGT-UHFFFAOYSA-N 0.000 description 2
- 229920002732 Polyanhydride Polymers 0.000 description 2
- KAESVJOAVNADME-UHFFFAOYSA-N Pyrrole Chemical compound C=1C=CNC=1 KAESVJOAVNADME-UHFFFAOYSA-N 0.000 description 2
- KTSFMFGEAAANTF-UHFFFAOYSA-N [Cu].[Se].[Se].[In] Chemical compound [Cu].[Se].[Se].[In] KTSFMFGEAAANTF-UHFFFAOYSA-N 0.000 description 2
- 239000006096 absorbing agent Substances 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- IOJUPLGTWVMSFF-UHFFFAOYSA-N benzothiazole Chemical compound C1=CC=C2SC=NC2=C1 IOJUPLGTWVMSFF-UHFFFAOYSA-N 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- TXCDCPKCNAJMEE-UHFFFAOYSA-N dibenzofuran Chemical compound C1=CC=C2C3=CC=CC=C3OC2=C1 TXCDCPKCNAJMEE-UHFFFAOYSA-N 0.000 description 2
- 238000011049 filling Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910021480 group 4 element Inorganic materials 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 238000001020 plasma etching Methods 0.000 description 2
- XSCHRSMBECNVNS-UHFFFAOYSA-N quinoxaline Chemical compound N1=CC=NC2=CC=CC=C21 XSCHRSMBECNVNS-UHFFFAOYSA-N 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- KHFMBSMOWZLHOZ-UHFFFAOYSA-N 2-cyclononyloxonane Chemical compound C1CCCCCCCC1C1OCCCCCCC1 KHFMBSMOWZLHOZ-UHFFFAOYSA-N 0.000 description 1
- MARUHZGHZWCEQU-UHFFFAOYSA-N 5-phenyl-2h-tetrazole Chemical compound C1=CC=CC=C1C1=NNN=N1 MARUHZGHZWCEQU-UHFFFAOYSA-N 0.000 description 1
- 229910015365 Au—Si Inorganic materials 0.000 description 1
- 229910000878 H alloy Inorganic materials 0.000 description 1
- GPXJNWSHGFTCBW-UHFFFAOYSA-N Indium phosphide Chemical compound [In]#P GPXJNWSHGFTCBW-UHFFFAOYSA-N 0.000 description 1
- 229910017855 NH 4 F Inorganic materials 0.000 description 1
- PCKPVGOLPKLUHR-UHFFFAOYSA-N OH-Indolxyl Natural products C1=CC=C2C(O)=CNC2=C1 PCKPVGOLPKLUHR-UHFFFAOYSA-N 0.000 description 1
- 229920001609 Poly(3,4-ethylenedioxythiophene) Polymers 0.000 description 1
- WTKZEGDFNFYCGP-UHFFFAOYSA-N Pyrazole Chemical compound C=1C=NNC=1 WTKZEGDFNFYCGP-UHFFFAOYSA-N 0.000 description 1
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 1
- 229910003902 SiCl 4 Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229920004890 Triton X-100 Polymers 0.000 description 1
- 239000013504 Triton X-100 Substances 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical compound C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 1
- 238000002441 X-ray diffraction Methods 0.000 description 1
- 238000002679 ablation Methods 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- DHKHKXVYLBGOIT-UHFFFAOYSA-N acetaldehyde Diethyl Acetal Natural products CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 description 1
- 125000002777 acetyl group Chemical class [H]C([H])([H])C(*)=O 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 150000001448 anilines Chemical class 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004202 carbamide Substances 0.000 description 1
- 150000001720 carbohydrates Chemical class 0.000 description 1
- 235000014633 carbohydrates Nutrition 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000002041 carbon nanotube Substances 0.000 description 1
- 229910021393 carbon nanotube Inorganic materials 0.000 description 1
- 239000003575 carbonaceous material Substances 0.000 description 1
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000012512 characterization method Methods 0.000 description 1
- 239000000571 coke Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000002447 crystallographic data Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- JJRDHFIVAPVZJN-UHFFFAOYSA-N cyclotrisiloxane Chemical class O1[SiH2]O[SiH2]O[SiH2]1 JJRDHFIVAPVZJN-UHFFFAOYSA-N 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- RAABOESOVLLHRU-UHFFFAOYSA-N diazene Chemical compound N=N RAABOESOVLLHRU-UHFFFAOYSA-N 0.000 description 1
- 229910000071 diazene Inorganic materials 0.000 description 1
- 150000001993 dienes Chemical class 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- ZOMNIUBKTOKEHS-UHFFFAOYSA-L dimercury dichloride Chemical class Cl[Hg][Hg]Cl ZOMNIUBKTOKEHS-UHFFFAOYSA-L 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- COTGJZIJWUCYCL-UHFFFAOYSA-N ethenyl nitrite Chemical class C=CON=O COTGJZIJWUCYCL-UHFFFAOYSA-N 0.000 description 1
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 description 1
- 239000000374 eutectic mixture Substances 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910021478 group 5 element Inorganic materials 0.000 description 1
- 229910021476 group 6 element Inorganic materials 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- HTDJPCNNEPUOOQ-UHFFFAOYSA-N hexamethylcyclotrisiloxane Chemical compound C[Si]1(C)O[Si](C)(C)O[Si](C)(C)O1 HTDJPCNNEPUOOQ-UHFFFAOYSA-N 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- JYGFTBXVXVMTGB-UHFFFAOYSA-N indolin-2-one Chemical compound C1=CC=C2NC(=O)CC2=C1 JYGFTBXVXVMTGB-UHFFFAOYSA-N 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910021423 nanocrystalline silicon Inorganic materials 0.000 description 1
- 239000002105 nanoparticle Substances 0.000 description 1
- 239000002070 nanowire Substances 0.000 description 1
- KERTUBUCQCSNJU-UHFFFAOYSA-L nickel(2+);disulfamate Chemical compound [Ni+2].NS([O-])(=O)=O.NS([O-])(=O)=O KERTUBUCQCSNJU-UHFFFAOYSA-L 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- WCPAKWJPBJAGKN-UHFFFAOYSA-N oxadiazole Chemical compound C1=CON=N1 WCPAKWJPBJAGKN-UHFFFAOYSA-N 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- UCUUFSAXZMGPGH-UHFFFAOYSA-N penta-1,4-dien-3-one Chemical compound C=CC(=O)C=C UCUUFSAXZMGPGH-UHFFFAOYSA-N 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- XKJCHHZQLQNZHY-UHFFFAOYSA-N phthalimide Chemical compound C1=CC=C2C(=O)NC(=O)C2=C1 XKJCHHZQLQNZHY-UHFFFAOYSA-N 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920002627 poly(phosphazenes) Polymers 0.000 description 1
- 229920000548 poly(silane) polymer Polymers 0.000 description 1
- 229920001467 poly(styrenesulfonates) Polymers 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920002480 polybenzimidazole Polymers 0.000 description 1
- 229920002577 polybenzoxazole Polymers 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000307 polymer substrate Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920001021 polysulfide Polymers 0.000 description 1
- 229920000123 polythiophene Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- CVSGFMWKZVZOJD-UHFFFAOYSA-N pyrazino[2,3-f]quinoxaline Chemical compound C1=CN=C2C3=NC=CN=C3C=CC2=N1 CVSGFMWKZVZOJD-UHFFFAOYSA-N 0.000 description 1
- PBMFSQRYOILNGV-UHFFFAOYSA-N pyridazine Chemical compound C1=CC=NN=C1 PBMFSQRYOILNGV-UHFFFAOYSA-N 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229940124530 sulfonamide Drugs 0.000 description 1
- 150000003456 sulfonamides Chemical class 0.000 description 1
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 1
- 150000007970 thio esters Chemical class 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 150000003852 triazoles Chemical class 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- UIYCHXAGWOYNNA-UHFFFAOYSA-N vinyl sulfide Chemical compound C=CSC=C UIYCHXAGWOYNNA-UHFFFAOYSA-N 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
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-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0657—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
- H01L29/0665—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body the shape of the body defining a nanostructure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02373—Group 14 semiconducting materials
- H01L21/02381—Silicon, silicon germanium, germanium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02551—Group 12/16 materials
- H01L21/0256—Selenides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02551—Group 12/16 materials
- H01L21/02562—Tellurides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02587—Structure
- H01L21/0259—Microstructure
- H01L21/02603—Nanowires
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/02636—Selective deposition, e.g. simultaneous growth of mono- and non-monocrystalline semiconductor materials
- H01L21/02639—Preparation of substrate for selective deposition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/02636—Selective deposition, e.g. simultaneous growth of mono- and non-monocrystalline semiconductor materials
- H01L21/02639—Preparation of substrate for selective deposition
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Abstract
【選択図】図3
Description
本出願は、以下の係属中の同一出願人による米国特許出願に関し、その利益を主張する:2007年8月28日に提出された米国特許出願第60/966,432号「Polymer−embedded semiconductor rod arrays」、および2008年5月13日に提出された米国特許出願第61/127,437号「Regrowth of Silicon Rod Arrays」;これらの出願双方の内容全体が参照により本書に組み込まれる。
米国政府は、DOEに付与された許可番号DE−FG02−03ER15483/T−103465による本発明の特定の権利を保有する。
である。
Claims (20)
- 結合材料層と;
規則正しく間隔を隔てられた半導体構造のアレイと、を具え、
前記半導体構造の各々は長さ寸法を有し、前記半導体構造は各半導体構造の前記長さ寸法の少なくとも一部に沿って前記結合材料層内に適合的に拘束されることを特徴とする構造体。 - 請求項1に記載の構造体において、前記半導体構造は前記結合材料層とは別に製造されて前記結合材料層内に移転され、前記結合材料層は前記半導体構造の最初の製造で得られる秩序と間隔を維持することを特徴とする構造体。
- 請求項2に記載の構造体において、前記半導体構造は高いアスペクト比を有する形状に製造され、前記高いアスペクト比は前記半導体構造間の向きを規定し、前記結合材料層は前記結合材料層内に前記半導体構造を移転する際に前記半導体構造の向きを維持することを特徴とする構造体。
- 請求項1乃至3の何れか1項に記載の構造体において、前記半導体構造は前記結合材料層とは別に、ある秩序と間隔で製造されて前記結合材料層内に移転され、前記結合材料層は前記結合材料層内で前記半導体構造の秩序および/または間隔を修正するよう操作されることを特徴とする構造体。
- 請求項4に記載の構造体において、前記半導体構造は前記半導体構造に第1の密度を提供する秩序と間隔で製造され、前記結合材料層は前記半導体構造に第2の密度を提供するよう操作されることを特徴とする構造体。
- 請求項5に記載の構造体において、前記第2の密度は前記構造体の所望の光学特性向けに選択されることを特徴とする構造体。
- 請求項1乃至6の何れか1項に記載の構造体において、電気的接点層をさらに具え、前記電気的接点層は前記半導体構造の端部または端部近傍で1以上の前記半導体構造に接触することを特徴とする構造体。
- 請求項1乃至7の何れか1項に記載の構造体において、前記結合材料層は柔軟性材料を含むことを特徴とする構造体。
- 請求項1乃至8の何れか1項に記載の構造体において、前記結合材料層は、導電性ポリマ材料および絶縁性ポリマ材料と;加熱収縮可能な材料と;半導体構造から共有結合で成長される材料と、の1以上の材料を含むことを特徴とする構造体。
- 請求項1乃至9の何れか1項に記載の構造体において、前記結合材料層内に埋め込まれる付加的な整っていない半導体構造と、前記付加的な整っていない半導体構造への電気的接点と、をさらに具えることを特徴とする構造体。
- 半導体構造の製造方法であって、
基板上に秩序立てて配向づけられた半導体構造を成長させるステップと;
前記基板の上面に結合材料を含むフィルム層を堆積させ、前記結合材料が前記基板およびその上に1以上の前記半導体構造を封入するステップと;
前記フィルム層が前記基板の上面で接触する位置またはその位置近傍で前記基板から前記フィルム層を分離するステップと、を含み、
これによって1以上の前記半導体構造の秩序と向きが前記フィルム層内に維持されることを特徴とする方法。 - 請求項11に記載の方法において、前記結合材料は、ポリジメチルシロキサンと;絶縁性ポリマ材料と;加熱収縮可能な材料と;半導体構造から共有結合で成長させる材料と、の1以上の材料を含むことを特徴とする方法。
- 請求項11または12に記載の方法において、前記半導体構造は、単結晶Si基板から気相−液相−固相プロセスで成長させた垂直配列のワイヤアレイを含むことを特徴とする方法。
- 請求項11乃至13の何れか1項に記載の方法において、前記半導体構造は頂部側と底部側を有し、前記底部側は前記基板の上面の近くに位置し、前記フィルム層の上面は1以上の半導体構造の頂部側より下に位置することを特徴とする方法。
- 請求項14に記載の方法において、導電性ポリマで前記半導体構造の前記頂部側の1以上に電気的接点を形成するステップをさらに含むことを特徴とする方法。
- 半導体構造の製造方法であって、
基板の少なくとも一部に1以上のロッドアレイを形成するステップであって、前記ロッドアレイの個々のロッドが前記基板の近くに配置される第1の端部と前記基板から離れて配置される第2の端部とをそれぞれ有するステップと;
前記基板の上面に結合材料を堆積させるステップであって、前記結合材料が前記個々のロッド間の隙間に適合して塞ぎ、前記結合材料が前記基板の上面に隣接する底面を有するフィルム層を形成するステップと;
前記ロッドアレイが前記フィルム層内に埋め込まれた状態で前記フィルム層を固体層に形成するステップと;
前記フィルム層の前記底面または底面近傍で前記基板から前記フィルム層と複数の前記個々のロッドを分離するステップと、を具えることを特徴とする方法。 - 請求項16に記載の方法において、前記結合材料はポリマを含むことを特徴とする方法。
- 請求項16または17に記載の方法において、前記基板の別の部分に半導体構造を形成するステップをさらに具え、前記結合材料を堆積するステップは前記半導体構造の周囲に適合して前記結合材料を堆積するステップを含み、前記フィルム層を分離するステップは前記フィルム層の前記底面または底面近傍で前記基板から前記半導体構造を分離するステップを含むことを特徴とする方法。
- 請求項17に記載の方法において、前記基板上に前記結合材料を堆積するステップは前記基板上へポリマをドロップキャスティングまたはスピンキャスティングするステップを含むことを特徴とする方法。
- 請求項16乃至19の何れか1項に記載の方法において、前記フィルム層の上面に導電性ポリマを堆積するステップをさらに含むことを特徴とする方法。
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015509657A (ja) * | 2012-02-07 | 2015-03-30 | コーニンクレッカ フィリップス エヌ ヴェ | 可撓性のナノワイヤをベースにした太陽電池 |
US9257601B2 (en) | 2011-05-17 | 2016-02-09 | Mcmaster University | Light emitting diodes and substrates |
Families Citing this family (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010533985A (ja) * | 2007-07-19 | 2010-10-28 | カリフォルニア インスティテュート オブ テクノロジー | 半導体の規則配列構造 |
KR100955109B1 (ko) * | 2007-07-25 | 2010-04-28 | 김경환 | 휴대용 숯불구이기 |
EP2183788A1 (en) | 2007-08-28 | 2010-05-12 | California Institute of Technology | Polymer-embedded semiconductor rod arrays |
US8242353B2 (en) | 2009-03-16 | 2012-08-14 | International Business Machines Corporation | Nanowire multijunction solar cell |
US20100244820A1 (en) * | 2009-03-26 | 2010-09-30 | Biomimetics Technologies Inc | Microchip for detection of poor sources of electrical and magnetic fields |
US10641843B2 (en) | 2009-03-26 | 2020-05-05 | Biomimetics Technologies, Inc. | Embedded crystal circuit for the detection of weak electrical and magnetic fields |
US8344597B2 (en) * | 2009-10-22 | 2013-01-01 | Lawrence Livermore National Security, Llc | Matrix-assisted energy conversion in nanostructured piezoelectric arrays |
US9530912B2 (en) * | 2009-11-30 | 2016-12-27 | The California Institute Of Technology | Three-dimensional patterning methods and related devices |
JP2011135058A (ja) * | 2009-11-30 | 2011-07-07 | Honda Motor Co Ltd | 太陽電池素子、カラーセンサ、ならびに発光素子及び受光素子の製造方法 |
US9263612B2 (en) | 2010-03-23 | 2016-02-16 | California Institute Of Technology | Heterojunction wire array solar cells |
EP2694705A4 (en) * | 2011-04-05 | 2015-04-29 | Us Gov Sec Navy | MICROFABRICATION OF TUNNELS |
EP2745360A4 (en) | 2011-08-01 | 2015-07-08 | Univ Columbia | CONJUGATES OF NANODIAMANT AND MAGNETIC OR METALLIC PARTICLES |
WO2013040446A1 (en) | 2011-09-16 | 2013-03-21 | The Trustees Of Columbia University In The City Of New York | High-precision ghz clock generation using spin states in diamond |
US9632045B2 (en) | 2011-10-19 | 2017-04-25 | The Trustees Of Columbia University In The City Of New York | Systems and methods for deterministic emitter switch microscopy |
TWI419202B (zh) * | 2011-12-06 | 2013-12-11 | Univ Nat Taiwan | 大面積薄型單晶矽之製作技術 |
US10026560B2 (en) | 2012-01-13 | 2018-07-17 | The California Institute Of Technology | Solar fuels generator |
US9476129B2 (en) | 2012-04-02 | 2016-10-25 | California Institute Of Technology | Solar fuels generator |
WO2013106793A1 (en) | 2012-01-13 | 2013-07-18 | California Institute Of Technology | Solar fuel generators |
WO2013126432A1 (en) | 2012-02-21 | 2013-08-29 | California Institute Of Technology | Axially-integrated epitaxially-grown tandem wire arrays |
WO2013152132A1 (en) | 2012-04-03 | 2013-10-10 | The California Institute Of Technology | Semiconductor structures for fuel generation |
US20150155167A1 (en) * | 2012-06-07 | 2015-06-04 | Qunano Ab | Method of manufacturing a structure adapted to be transferred to non-crystalline layer and a structure manufactured using said method |
US10170746B2 (en) * | 2012-10-17 | 2019-01-01 | Infineon Technologies Ag | Battery electrode, battery, and method for manufacturing a battery electrode |
US9012883B2 (en) | 2012-12-21 | 2015-04-21 | Sol Voltaics Ab | Recessed contact to semiconductor nanowires |
US9553223B2 (en) | 2013-01-24 | 2017-01-24 | California Institute Of Technology | Method for alignment of microwires |
EP2964455A4 (en) * | 2013-03-06 | 2016-11-16 | Univ Columbia | PROCESS FOR THE MANUFACTURE OF DIAMOND NANOSTRUCTURES |
KR101402989B1 (ko) * | 2013-06-12 | 2014-06-11 | 한국과학기술연구원 | 기판과의 결합력이 향상된 탄소나노튜브 기반 전계효과트랜지스터 소자의 제조방법 및 이에 의하여 제조된 탄소나노튜브 기반 전계효과트랜지스터 소자 |
US20140374268A1 (en) * | 2013-06-24 | 2014-12-25 | Agency For Science, Technology And Research | Method for forming a composite film |
KR20150048538A (ko) * | 2013-10-28 | 2015-05-07 | 희성금속 주식회사 | 반도체용 재활용 Au 타겟의 제조방법 |
KR102410666B1 (ko) | 2015-01-09 | 2022-06-20 | 삼성전자주식회사 | 반도체 소자의 계측 방법, 및 이를 이용한 반도체 소자의 제조방법 |
DE102015205230B4 (de) * | 2015-03-23 | 2023-01-19 | Universität Duisburg-Essen | Verfahren zur Herstellung von Bauelementen aufweisend eine Schottky-Diode mittels Drucktechnik und Bauelement |
CN106158582B (zh) * | 2015-04-01 | 2018-09-28 | 中国科学院上海高等研究院 | 近邻阴影效应辅助阵列法制备层转移薄晶硅工艺 |
DE102015117834B4 (de) | 2015-10-20 | 2019-05-02 | Technische Universität Dresden | Verfahren zur Herstellung einer flexiblen Rod-Array-Anordnung und Rod-Array-Anordnung |
DE102015015452A1 (de) | 2015-12-02 | 2017-06-08 | Forschungszentrum Jülich GmbH | Verfahren zum Planarisieren von Nanostrukturen |
WO2018085371A1 (en) | 2016-11-01 | 2018-05-11 | Massachusetts Institute Of Technology | Lift-off embedded micro and structures |
US11111598B2 (en) * | 2019-06-28 | 2021-09-07 | Kabushiki Kaisha Toshiba | Crystal growth method in a semiconductor device |
AU2021331483A1 (en) | 2020-08-27 | 2023-03-09 | H2U Technologies, Inc. | System for managing fuel generation |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06508678A (ja) * | 1991-06-24 | 1994-09-29 | ミネソタ マイニング アンド マニュファクチャリング カンパニー | 配向微細構造を含む複合材製品 |
JP2000269561A (ja) * | 1999-03-19 | 2000-09-29 | Asahi Chem Ind Co Ltd | 複合構造体 |
JP2001135516A (ja) * | 1999-11-05 | 2001-05-18 | Tdk Corp | 磁性複合組成物及び磁性成形物 |
JP2004152787A (ja) * | 2002-10-28 | 2004-05-27 | Sharp Corp | 半導体素子及びその製造方法 |
JP2005303301A (ja) * | 2004-04-07 | 2005-10-27 | Samsung Electronics Co Ltd | ナノワイヤー発光素子及びその製造方法 |
JP2005310821A (ja) * | 2004-04-16 | 2005-11-04 | Ebara Corp | 光電変換素子 |
Family Cites Families (52)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2658839B1 (fr) * | 1990-02-23 | 1997-06-20 | Thomson Csf | Procede de croissance controlee de cristaux aciculaires et application a la realisation de microcathodes a pointes. |
US5352651A (en) * | 1992-12-23 | 1994-10-04 | Minnesota Mining And Manufacturing Company | Nanostructured imaging transfer element |
RU2099808C1 (ru) * | 1996-04-01 | 1997-12-20 | Евгений Инвиевич Гиваргизов | Способ выращивания ориентированных систем нитевидных кристаллов и устройство для его осуществления (варианты) |
JP4032264B2 (ja) * | 1997-03-21 | 2008-01-16 | ソニー株式会社 | 量子細線を有する素子の製造方法 |
US5976957A (en) * | 1996-10-28 | 1999-11-02 | Sony Corporation | Method of making silicon quantum wires on a substrate |
JPH11214720A (ja) | 1998-01-28 | 1999-08-06 | Canon Inc | 薄膜結晶太陽電池の製造方法 |
US6649824B1 (en) * | 1999-09-22 | 2003-11-18 | Canon Kabushiki Kaisha | Photoelectric conversion device and method of production thereof |
KR100984585B1 (ko) * | 2000-08-22 | 2010-09-30 | 프레지던트 앤드 펠로우즈 오브 하버드 칼리지 | 반도체 성장 방법 및 디바이스 제조 방법 |
KR20040000418A (ko) * | 2001-03-30 | 2004-01-03 | 더 리전트 오브 더 유니버시티 오브 캘리포니아 | 나노구조체 및 나노와이어의 제조 방법 및 그로부터제조되는 디바이스 |
CA2447728A1 (en) | 2001-05-18 | 2003-01-16 | President And Fellows Of Harvard College | Nanoscale wires and related devices |
US7109517B2 (en) * | 2001-11-16 | 2006-09-19 | Zaidi Saleem H | Method of making an enhanced optical absorption and radiation tolerance in thin-film solar cells and photodetectors |
US7259324B2 (en) * | 2001-12-05 | 2007-08-21 | Konarka Technologies, Inc. | Photovoltaic solar cell |
US7309620B2 (en) * | 2002-01-11 | 2007-12-18 | The Penn State Research Foundation | Use of sacrificial layers in the manufacture of high performance systems on tailored substrates |
US7253017B1 (en) * | 2002-06-22 | 2007-08-07 | Nanosolar, Inc. | Molding technique for fabrication of optoelectronic devices |
US7335259B2 (en) * | 2003-07-08 | 2008-02-26 | Brian A. Korgel | Growth of single crystal nanowires |
US7238594B2 (en) * | 2003-12-11 | 2007-07-03 | The Penn State Research Foundation | Controlled nanowire growth in permanent, integrated nano-templates and methods of fabricating sensor and transducer structures |
JP2005194609A (ja) | 2004-01-09 | 2005-07-21 | Sony Corp | 水素ガス発生装置、電気分解装置、太陽電池モジュールおよびエネルギーシステム |
TWI299358B (en) * | 2004-03-12 | 2008-08-01 | Hon Hai Prec Ind Co Ltd | Thermal interface material and method for making same |
EP1738378A4 (en) * | 2004-03-18 | 2010-05-05 | Nanosys Inc | NANOFIBRE SURFACE BASED CAPACITORS |
CN100383213C (zh) * | 2004-04-02 | 2008-04-23 | 清华大学 | 一种热界面材料及其制造方法 |
JP2005310388A (ja) | 2004-04-16 | 2005-11-04 | Ebara Corp | 光電変換素子 |
KR100553317B1 (ko) * | 2004-04-23 | 2006-02-20 | 한국과학기술연구원 | 실리콘 나노선을 이용한 실리콘 광소자 및 이의 제조방법 |
US20050279274A1 (en) * | 2004-04-30 | 2005-12-22 | Chunming Niu | Systems and methods for nanowire growth and manufacturing |
CN102351169B (zh) * | 2004-04-30 | 2013-11-27 | 纳米系统公司 | 纳米线生长和获取的体系和方法 |
JP2006128233A (ja) * | 2004-10-27 | 2006-05-18 | Hitachi Ltd | 半導体材料および電界効果トランジスタとそれらの製造方法 |
US7560366B1 (en) * | 2004-12-02 | 2009-07-14 | Nanosys, Inc. | Nanowire horizontal growth and substrate removal |
CN1669920A (zh) | 2004-12-29 | 2005-09-21 | 浙江大学 | 阳极氧化铝模板中一维硅纳米结构的制备方法 |
CN100375235C (zh) | 2005-01-18 | 2008-03-12 | 中国科学院半导体研究所 | 大面积制备二氧化硅或者硅纳米线的控制生长方法 |
US20060207647A1 (en) * | 2005-03-16 | 2006-09-21 | General Electric Company | High efficiency inorganic nanorod-enhanced photovoltaic devices |
JP2008544529A (ja) * | 2005-06-17 | 2008-12-04 | イルミネックス コーポレーション | 光発電ワイヤ |
US20090050204A1 (en) * | 2007-08-03 | 2009-02-26 | Illuminex Corporation. | Photovoltaic device using nanostructured material |
KR100767184B1 (ko) | 2005-08-10 | 2007-10-15 | 재단법인서울대학교산학협력재단 | 전자부품 냉각장치 및 그 제조방법 |
JP2007091485A (ja) * | 2005-09-26 | 2007-04-12 | Sonac Kk | カーボンファイバの製造方法、基板カートリッジおよび熱cvd装置 |
JP5057010B2 (ja) * | 2005-11-01 | 2012-10-24 | ニッタ株式会社 | カーボンファイバの製造方法 |
US20070122313A1 (en) * | 2005-11-30 | 2007-05-31 | Zhiyong Li | Nanochannel apparatus and method of fabricating |
CN100463111C (zh) * | 2006-01-14 | 2009-02-18 | 清华大学 | 硅线的制备方法 |
WO2008063209A2 (en) * | 2006-02-27 | 2008-05-29 | Los Alamos National Security, Llc | Optoelectronic devices utilizing materials having enhanced electronic transitions |
US8337979B2 (en) * | 2006-05-19 | 2012-12-25 | Massachusetts Institute Of Technology | Nanostructure-reinforced composite articles and methods |
WO2008054541A2 (en) * | 2006-05-19 | 2008-05-08 | Massachusetts Institute Of Technology | Nanostructure-reinforced composite articles and methods |
US7998788B2 (en) * | 2006-07-27 | 2011-08-16 | International Business Machines Corporation | Techniques for use of nanotechnology in photovoltaics |
US7893348B2 (en) * | 2006-08-25 | 2011-02-22 | General Electric Company | Nanowires in thin-film silicon solar cells |
US7850941B2 (en) * | 2006-10-20 | 2010-12-14 | General Electric Company | Nanostructure arrays and methods for forming same |
WO2008057558A2 (en) * | 2006-11-07 | 2008-05-15 | Nanosys, Inc. | Systems and methods for nanowire growth |
US20080110486A1 (en) * | 2006-11-15 | 2008-05-15 | General Electric Company | Amorphous-crystalline tandem nanostructured solar cells |
JP4767828B2 (ja) * | 2006-12-01 | 2011-09-07 | インターナショナル・ビジネス・マシーンズ・コーポレーション | コンピュータ用アプリケーション・プログラムの作成システム、方法、及びプログラム |
US7977568B2 (en) * | 2007-01-11 | 2011-07-12 | General Electric Company | Multilayered film-nanowire composite, bifacial, and tandem solar cells |
US8330090B2 (en) | 2007-05-07 | 2012-12-11 | Nxp, B.V. | Photosensitive device and method of manufacturing a photosensitive device using nanowire diodes |
US20080315430A1 (en) * | 2007-06-22 | 2008-12-25 | Qimonda Ag | Nanowire vias |
EP2171745A4 (en) * | 2007-07-19 | 2014-10-15 | California Inst Of Techn | STRUCTURES AND METHOD FOR FORMING VERTICALLY ORIENTED SI-WIRE ARRAYS |
JP2010533985A (ja) * | 2007-07-19 | 2010-10-28 | カリフォルニア インスティテュート オブ テクノロジー | 半導体の規則配列構造 |
EP2183788A1 (en) * | 2007-08-28 | 2010-05-12 | California Institute of Technology | Polymer-embedded semiconductor rod arrays |
KR101345432B1 (ko) * | 2007-12-13 | 2013-12-27 | 성균관대학교산학협력단 | 무촉매 단결정 실리콘 나노와이어의 제조방법, 그에 의해형성된 나노와이어 및 이를 포함하는 나노소자 |
-
2008
- 2008-07-18 EP EP08796311A patent/EP2183788A1/en not_active Withdrawn
- 2008-07-18 KR KR1020107006756A patent/KR20100067088A/ko not_active Application Discontinuation
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- 2008-07-18 AU AU2008296764A patent/AU2008296764A1/en not_active Abandoned
- 2008-07-18 JP JP2010522999A patent/JP2010538464A/ja active Pending
- 2008-07-18 JP JP2010523000A patent/JP2010541194A/ja active Pending
- 2008-07-18 WO PCT/US2008/070518 patent/WO2009032412A1/en active Application Filing
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- 2011-03-21 US US13/053,090 patent/US8222123B2/en not_active Expired - Fee Related
-
2012
- 2012-07-16 US US13/550,395 patent/US8455333B2/en active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06508678A (ja) * | 1991-06-24 | 1994-09-29 | ミネソタ マイニング アンド マニュファクチャリング カンパニー | 配向微細構造を含む複合材製品 |
JP2000269561A (ja) * | 1999-03-19 | 2000-09-29 | Asahi Chem Ind Co Ltd | 複合構造体 |
JP2001135516A (ja) * | 1999-11-05 | 2001-05-18 | Tdk Corp | 磁性複合組成物及び磁性成形物 |
JP2004152787A (ja) * | 2002-10-28 | 2004-05-27 | Sharp Corp | 半導体素子及びその製造方法 |
JP2005303301A (ja) * | 2004-04-07 | 2005-10-27 | Samsung Electronics Co Ltd | ナノワイヤー発光素子及びその製造方法 |
JP2005310821A (ja) * | 2004-04-16 | 2005-11-04 | Ebara Corp | 光電変換素子 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9257601B2 (en) | 2011-05-17 | 2016-02-09 | Mcmaster University | Light emitting diodes and substrates |
JP2015509657A (ja) * | 2012-02-07 | 2015-03-30 | コーニンクレッカ フィリップス エヌ ヴェ | 可撓性のナノワイヤをベースにした太陽電池 |
Also Published As
Publication number | Publication date |
---|---|
WO2009032412A1 (en) | 2009-03-12 |
US20090061600A1 (en) | 2009-03-05 |
EP2183788A1 (en) | 2010-05-12 |
AU2008296763A1 (en) | 2009-03-12 |
WO2009032413A1 (en) | 2009-03-12 |
US7910461B2 (en) | 2011-03-22 |
CN101796648B (zh) | 2012-05-30 |
JP2010541194A (ja) | 2010-12-24 |
AU2008296764A1 (en) | 2009-03-12 |
US20090057839A1 (en) | 2009-03-05 |
US8110898B2 (en) | 2012-02-07 |
EP2183789A1 (en) | 2010-05-12 |
KR20100072220A (ko) | 2010-06-30 |
US8455333B2 (en) | 2013-06-04 |
KR20100067088A (ko) | 2010-06-18 |
US20120028420A1 (en) | 2012-02-02 |
US20120282761A1 (en) | 2012-11-08 |
CN102067324A (zh) | 2011-05-18 |
CN101796648A (zh) | 2010-08-04 |
US8222123B2 (en) | 2012-07-17 |
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