CN104946182B - 一种人造板材用脲醛树脂粘合剂及其制作工艺 - Google Patents
一种人造板材用脲醛树脂粘合剂及其制作工艺 Download PDFInfo
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- CN104946182B CN104946182B CN201410115958.5A CN201410115958A CN104946182B CN 104946182 B CN104946182 B CN 104946182B CN 201410115958 A CN201410115958 A CN 201410115958A CN 104946182 B CN104946182 B CN 104946182B
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- urea
- resin adhesive
- formaldehyde resin
- reactant
- artificial board
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CN201410115958.5A CN104946182B (zh) | 2014-03-26 | 2014-03-26 | 一种人造板材用脲醛树脂粘合剂及其制作工艺 |
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CN201410115958.5A CN104946182B (zh) | 2014-03-26 | 2014-03-26 | 一种人造板材用脲醛树脂粘合剂及其制作工艺 |
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CN104946182A CN104946182A (zh) | 2015-09-30 |
CN104946182B true CN104946182B (zh) | 2017-08-29 |
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Families Citing this family (2)
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CN105348463B (zh) * | 2015-12-07 | 2017-08-29 | 广西南宁德源胶粘剂有限公司 | 一种e2级建筑模板胶的制备方法 |
CN108977143A (zh) * | 2018-06-29 | 2018-12-11 | 怀宁县科林木业有限公司 | 低甲醛释放量的脲醛树脂粘合剂及其制备方法 |
Family Cites Families (2)
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US6548625B2 (en) * | 2001-03-23 | 2003-04-15 | Cytec Technology Corp. | Stable liquid melamine urea formaldehyde resins, hardeners, adhesive compositions, and methods for making same |
CN101555396B (zh) * | 2009-05-12 | 2012-01-25 | 张文通 | 脲醛树脂胶的生产方法 |
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PB01 | Publication | ||
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TR01 | Transfer of patent right |
Effective date of registration: 20171222 Address after: 418000 Huaihua hi tech Zone Development Road, Huaihua, Hunan Province Patentee after: Hunan new Mstar Technology Ltd Address before: 418000 development road of Industrial Park, Huaihua, Hunan Province, No. 3 Patentee before: Hunan Province Huaihua City Hong Hua Electronic Science and Technology Co., Ltd. |
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TR01 | Transfer of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Urea formaldehyde resin adhesive for artificial boards and manufacturing technique thereof Effective date of registration: 20180103 Granted publication date: 20170829 Pledgee: Bank of Changsha, Limited by Share Ltd, Huaihua branch Pledgor: Hunan new Mstar Technology Ltd Registration number: 2017430000129 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right |