CN104870198B - 图案化的结构化转印带 - Google Patents

图案化的结构化转印带 Download PDF

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Publication number
CN104870198B
CN104870198B CN201380066654.8A CN201380066654A CN104870198B CN 104870198 B CN104870198 B CN 104870198B CN 201380066654 A CN201380066654 A CN 201380066654A CN 104870198 B CN104870198 B CN 104870198B
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layer
backfill
backfill layer
template
structured
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CN104870198A (zh
Inventor
马丁·B·沃克
迈克尔·本顿·弗里
玛格丽特·M·沃格尔-马丁
埃文·L·施瓦茨
米奇斯瓦夫·H·马祖雷克
特里·O·科利尔
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3M Innovative Properties Co
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3M Innovative Properties Co
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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
    • C03C17/28—Surface treatment of glass, not in the form of fibres or filaments, by coating with organic material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • B32B3/263—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by a layer having non-uniform thickness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
    • C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/161—Coating processes; Apparatus therefor using a previously coated surface, e.g. by stamping or by transfer lamination
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/34—Imagewise removal by selective transfer, e.g. peeling away
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H10K59/38—Devices specially adapted for multicolour light emission comprising colour filters or colour changing media [CCM]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/40—Organosilicon compounds, e.g. TIPS pentacene
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0174—Manufacture or treatment of microstructural devices or systems in or on a substrate for making multi-layered devices, film deposition or growing
    • B81C2201/0191—Transfer of a layer from a carrier wafer to a device wafer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/331—Nanoparticles used in non-emissive layers, e.g. in packaging layer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/10—Organic polymers or oligomers
    • H10K85/141—Organic polymers or oligomers comprising aliphatic or olefinic chains, e.g. poly N-vinylcarbazol, PVC or PTFE
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7434—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used in a transfer process involving at least two transfer steps, i.e. including an intermediate handle substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
    • Y10T428/24521—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness with component conforming to contour of nonplanar surface

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Organic Chemistry (AREA)
  • Nanotechnology (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Microelectronics & Electronic Packaging (AREA)
CN201380066654.8A 2012-12-21 2013-12-12 图案化的结构化转印带 Active CN104870198B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/723,716 2012-12-21
US13/723,716 US9711744B2 (en) 2012-12-21 2012-12-21 Patterned structured transfer tape
PCT/US2013/074523 WO2014099562A1 (en) 2012-12-21 2013-12-12 Patterned structured transfer tape

Publications (2)

Publication Number Publication Date
CN104870198A CN104870198A (zh) 2015-08-26
CN104870198B true CN104870198B (zh) 2017-12-05

Family

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CN201380066654.8A Active CN104870198B (zh) 2012-12-21 2013-12-12 图案化的结构化转印带

Country Status (6)

Country Link
US (6) US9711744B2 (enExample)
EP (1) EP2934896B1 (enExample)
JP (1) JP6367226B2 (enExample)
KR (1) KR102208719B1 (enExample)
CN (1) CN104870198B (enExample)
WO (1) WO2014099562A1 (enExample)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140175707A1 (en) 2012-12-21 2014-06-26 3M Innovative Properties Company Methods of using nanostructured transfer tape and articles made therefrom
US20140178698A1 (en) 2012-12-21 2014-06-26 3M Innovative Properties Company Curable silsesquioxane polymers, compositions, articles, and methods
JP2016507613A (ja) 2012-12-21 2016-03-10 スリーエム イノベイティブ プロパティズ カンパニー 硬化性シルセスキオキサンポリマー、組成物、物品、及び方法
US9711744B2 (en) 2012-12-21 2017-07-18 3M Innovative Properties Company Patterned structured transfer tape
US9878954B2 (en) 2013-09-13 2018-01-30 3M Innovative Properties Company Vacuum glazing pillars for insulated glass units
US20150202834A1 (en) 2014-01-20 2015-07-23 3M Innovative Properties Company Lamination transfer films for forming antireflective structures
US10220600B2 (en) * 2014-01-20 2019-03-05 3M Innovative Properties Company Lamination transfer films for forming reentrant structures
US9246134B2 (en) * 2014-01-20 2016-01-26 3M Innovative Properties Company Lamination transfer films for forming articles with engineered voids
WO2015112711A1 (en) 2014-01-22 2015-07-30 3M Innovative Properties Company Microoptics for glazing
TW201539736A (zh) 2014-03-19 2015-10-16 ３Ｍ新設資產公司 用於藉白光成色之 oled 裝置的奈米結構
US9643381B2 (en) 2014-05-19 2017-05-09 Vindicoat, Llc Composite binding materials
US9995944B2 (en) 2014-06-13 2018-06-12 3M Innovative Properties Company Optical stacks for sparkle reduction
US9472788B2 (en) 2014-08-27 2016-10-18 3M Innovative Properties Company Thermally-assisted self-assembly method of nanoparticles and nanowires within engineered periodic structures
EP3209841B1 (en) 2014-10-20 2021-04-07 3M Innovative Properties Company Insulated glazing units and microoptical layer comprising microstructured diffuser and methods
US10518512B2 (en) 2015-03-31 2019-12-31 3M Innovative Properties Company Method of forming dual-cure nanostructure transfer film
US10106643B2 (en) * 2015-03-31 2018-10-23 3M Innovative Properties Company Dual-cure nanostructure transfer film
EP3311430B1 (en) 2015-06-19 2019-12-18 3M Innovative Properties Company Segmented transfer tape and method of making the same
WO2016205189A1 (en) * 2015-06-19 2016-12-22 3M Innovative Properties Company Micro-optical assemblies including transparent substrates having graphic layer and method of making thereof
CN107820461B (zh) * 2015-06-19 2019-12-17 3M创新有限公司 分段式转印带及其制备和使用方法
JP2018521357A (ja) 2015-06-30 2018-08-02 スリーエム イノベイティブ プロパティズ カンパニー 微細構造化異方性拡散体を含む断熱ガラスユニット及び微小光学層並びに方法
KR102288354B1 (ko) * 2015-08-10 2021-08-11 삼성디스플레이 주식회사 플렉서블 디스플레이 장치의 제조 방법
WO2017082662A1 (ko) * 2015-11-11 2017-05-18 주식회사 아모텍 페라이트 시트의 제조방법 및 이를 이용한 페라이트 시트
EP3513955B1 (en) * 2016-09-16 2021-01-13 Tokyo Ohka Kogyo Co., Ltd. Substrate bonding method and laminated body production method
CN109996672A (zh) * 2016-09-20 2019-07-09 善洁科技有限公司 压印带、其制作方法和包括其的制品
US10367169B2 (en) * 2016-10-17 2019-07-30 Corning Incorporated Processes for making light extraction substrates for an organic light emitting diode using photo-thermal treatment
CN107021644B (zh) * 2017-04-13 2019-09-13 宁波大学 一种光伏玻璃的制备方法
JP7219606B2 (ja) * 2018-12-21 2023-02-08 東京応化工業株式会社 半導体基板の製造方法
US11825568B2 (en) * 2021-04-01 2023-11-21 Whirlpool Corporation Segmented thermoresistive heating system
CN114179536A (zh) * 2021-12-15 2022-03-15 上海豪承信息技术有限公司 一种图案的处理方法
US11878935B1 (en) * 2022-12-27 2024-01-23 Canon Kabushiki Kaisha Method of coating a superstrate
CN115974422B (zh) * 2022-12-29 2025-04-11 蓝思科技（长沙）有限公司 玻璃表面纹理的制备方法、具有纹理的玻璃和应用

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5491015A (en) * 1991-08-28 1996-02-13 Minnesota Mining And Manufacturing Company Slip control sheeting and articles covered with same
TW399692U (en) * 1991-09-12 2000-07-21 Minnesota Mining & Mfg Adhesive transfer tape
CN1433358A (zh) * 1999-11-30 2003-07-30 3M创新有限公司 微结构层的热转印
CN101160219A (zh) * 2005-04-13 2008-04-09 Ovd基尼格拉姆股份公司 包括一带有凸纹结构的层的转印膜

Family Cites Families (65)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USRE24906E (en) 1955-11-18 1960-12-13 Pressure-sensitive adhesive sheet material
US4567073A (en) 1982-07-02 1986-01-28 Minnesota Mining And Manufacturing Company Composite low surface energy liner of perfluoropolyether
US4472480A (en) 1982-07-02 1984-09-18 Minnesota Mining And Manufacturing Company Low surface energy liner of perfluoropolyether
US4614667A (en) 1984-05-21 1986-09-30 Minnesota Mining And Manufacturing Company Composite low surface energy liner of perfluoropolyether
GB8911806D0 (en) 1989-05-23 1989-07-12 Rolls Royce Plc Gas turbine engine fuel control system with enhanced relight capability
US5591958A (en) 1993-06-14 1997-01-07 Nikon Corporation Scanning exposure method and apparatus
US5691846A (en) 1993-10-20 1997-11-25 Minnesota Mining And Manufacturing Company Ultra-flexible retroreflective cube corner composite sheetings and methods of manufacture
JP3444053B2 (ja) 1995-10-13 2003-09-08 ソニー株式会社 薄膜半導体装置
EP0945254B1 (en) * 1998-03-17 2004-12-22 Chi Mei Optoelectronics Corporation Material comprising an anti-reflective coating on a flexible glass substrate
US6329058B1 (en) * 1998-07-30 2001-12-11 3M Innovative Properties Company Nanosize metal oxide particles for producing transparent metal oxide colloids and ceramers
US6838142B2 (en) 2001-05-18 2005-01-04 3M Innovative Properties Company Specular laminates
US6858253B2 (en) 2001-05-31 2005-02-22 3M Innovative Properties Company Method of making dimensionally stable composite article
JP4436030B2 (ja) 2002-05-10 2010-03-24 スリーエム イノベイティブ プロパティズ カンパニー アクリル系剥離剤前駆体、剥離剤物品及び剥離剤物品の製造方法
US6849558B2 (en) 2002-05-22 2005-02-01 The Board Of Trustees Of The Leland Stanford Junior University Replication and transfer of microstructures and nanostructures
US6805809B2 (en) * 2002-08-28 2004-10-19 Board Of Trustees Of University Of Illinois Decal transfer microfabrication
CN100584921C (zh) * 2002-09-05 2010-01-27 奈米系统股份有限公司 促进电荷转移至纳米结构或自纳米结构转移出电荷的有机物
KR100638091B1 (ko) 2003-07-02 2006-10-25 재단법인서울대학교산학협력재단 나노입자 패터닝 방법 및 이를 이용한 소결체의 제조 방법
US20050147838A1 (en) 2003-12-30 2005-07-07 3M Innovative Properties Company Polymerizable compositions for optical articles
JP2005193473A (ja) 2004-01-06 2005-07-21 Three M Innovative Properties Co 転写用成形型及びその製造方法ならびに微細構造体の製造方法
US7419912B2 (en) 2004-04-01 2008-09-02 Cree, Inc. Laser patterning of light emitting devices
US7490547B2 (en) * 2004-12-30 2009-02-17 Asml Netherlands B.V. Imprint lithography
US7645478B2 (en) * 2005-03-31 2010-01-12 3M Innovative Properties Company Methods of making displays
US20060270806A1 (en) * 2005-05-26 2006-11-30 Hale Wesley R Miscible high Tg polyester/polymer blend compositions and films formed therefrom
CA2611985C (en) 2005-06-17 2016-08-16 The University Of North Carolina At Chapel Hill Nanoparticle fabrication methods, systems, and materials
US20070020451A1 (en) 2005-07-20 2007-01-25 3M Innovative Properties Company Moisture barrier coatings
US7569254B2 (en) 2005-08-22 2009-08-04 Eastman Kodak Company Nanocomposite materials comprising high loadings of filler materials and an in-situ method of making such materials
US20070077349A1 (en) * 2005-09-30 2007-04-05 Eastman Kodak Company Patterning OLED device electrodes and optical material
US7677877B2 (en) * 2005-11-04 2010-03-16 Asml Netherlands B.V. Imprint lithography
US20090128916A1 (en) * 2006-01-16 2009-05-21 Masaki Noro Curable composition and cured product, laminate film and antireflective film using the same and polarizing plate and image display device using the antireflective film
JP2007335253A (ja) 2006-06-15 2007-12-27 Toshiba Matsushita Display Technology Co Ltd 有機ｅｌ表示装置
US20070298176A1 (en) 2006-06-26 2007-12-27 Dipietro Richard Anthony Aromatic vinyl ether based reverse-tone step and flash imprint lithography
JP5084194B2 (ja) * 2006-07-18 2012-11-28 エヌ・ティ・ティ・アドバンステクノロジ株式会社 表面改質組成物および積層体
US7604916B2 (en) 2006-11-06 2009-10-20 3M Innovative Properties Company Donor films with pattern-directing layers
US20080233404A1 (en) 2007-03-22 2008-09-25 3M Innovative Properties Company Microreplication tools and patterns using laser induced thermal embossing
US7604381B2 (en) 2007-04-16 2009-10-20 3M Innovative Properties Company Optical article and method of making
US20090015142A1 (en) * 2007-07-13 2009-01-15 3M Innovative Properties Company Light extraction film for organic light emitting diode display devices
WO2009032815A1 (en) * 2007-09-06 2009-03-12 3M Innovative Properties Company Tool for making microstructured articles
US8236668B2 (en) * 2007-10-10 2012-08-07 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing SOI substrate
US8293354B2 (en) * 2008-04-09 2012-10-23 The Regents Of The University Of Michigan UV curable silsesquioxane resins for nanoprint lithography
US20090263668A1 (en) 2008-04-21 2009-10-22 3M Innovative Properties Company Durable coating of an oligomer and methods of applying
US20100062042A1 (en) 2008-07-15 2010-03-11 Basf Catalysts Llc Methods, Systems and Devices for Administration of Chlorine Dioxide
TWI365812B (en) * 2008-10-23 2012-06-11 Compal Electronics Inc Transfer film, method of manufacturing the same, transfer method and object surface structure
US7957621B2 (en) 2008-12-17 2011-06-07 3M Innovative Properties Company Light extraction film with nanoparticle coatings
US8222352B2 (en) 2008-12-24 2012-07-17 Nitto Denko Corporation Silicone resin composition
JP5052534B2 (ja) * 2009-01-08 2012-10-17 株式会社ブリヂストン 光硬化性転写シート、及びこれを用いた凹凸パターンの形成方法
US20100188751A1 (en) 2009-01-29 2010-07-29 3M Innovative Properties Company Optical films with internally conformable layers and method of making the films
US8899148B2 (en) * 2009-07-02 2014-12-02 E I Du Pont De Nemours And Company Method for printing a material onto a substrate
JP2011066100A (ja) * 2009-09-16 2011-03-31 Bridgestone Corp 光硬化性転写シート、及びこれを用いた凹凸パターンの形成方法
US20110091694A1 (en) * 2009-10-20 2011-04-21 E. I. Du Pont De Nemours And Company Method for forming fine electrode patterns
KR20110054841A (ko) * 2009-11-18 2011-05-25 삼성모바일디스플레이주식회사 유기 발광 표시 장치 및 그 제조 방법
JP2011105894A (ja) 2009-11-20 2011-06-02 Konica Minolta Holdings Inc 付着テープの製造方法
US20130011608A1 (en) 2010-01-13 2013-01-10 Wolk Martin B Optical films with microstructured low refractive index nanovoided layers and methods therefor
JP2011221470A (ja) * 2010-04-14 2011-11-04 Sony Corp 光学素子、およびその製造方法、表示装置、ならびに太陽電池
WO2011155582A1 (ja) * 2010-06-11 2011-12-15 株式会社日立ハイテクノロジーズ 微細構造転写用スタンパ及び微細構造転写装置
US8469551B2 (en) 2010-10-20 2013-06-25 3M Innovative Properties Company Light extraction films for increasing pixelated OLED output with reduced blur
CN103249562B (zh) 2010-12-09 2015-07-08 旭化成电子材料株式会社 微细结构积层体、微细结构积层体的制作方法以及微细结构体的制造方法
JP6033233B2 (ja) 2010-12-17 2016-11-30 スリーエム イノベイティブ プロパティズ カンパニー マルチサイズ粒子を有する転写物品及び方法
US8692446B2 (en) 2011-03-17 2014-04-08 3M Innovative Properties Company OLED light extraction films having nanoparticles and periodic structures
SG195166A1 (en) 2011-05-31 2013-12-30 3M Innovative Properties Co Method for making microstructured tools having discontinuous topographies, articles produced therefrom
BR112013030706A2 (pt) 2011-05-31 2016-12-06 3M Innovative Properties Co métodos de fabricação de artigos microestruturados curados com padrão diferencialmente
US9780335B2 (en) 2012-07-20 2017-10-03 3M Innovative Properties Company Structured lamination transfer films and methods
US9711744B2 (en) 2012-12-21 2017-07-18 3M Innovative Properties Company Patterned structured transfer tape
US20140175707A1 (en) * 2012-12-21 2014-06-26 3M Innovative Properties Company Methods of using nanostructured transfer tape and articles made therefrom
US20160268553A1 (en) * 2013-11-11 2016-09-15 3M Innovative Properties Company Nanostructures for oled devices
US9246134B2 (en) 2014-01-20 2016-01-26 3M Innovative Properties Company Lamination transfer films for forming articles with engineered voids

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5491015A (en) * 1991-08-28 1996-02-13 Minnesota Mining And Manufacturing Company Slip control sheeting and articles covered with same
TW399692U (en) * 1991-09-12 2000-07-21 Minnesota Mining & Mfg Adhesive transfer tape
CN1433358A (zh) * 1999-11-30 2003-07-30 3M创新有限公司 微结构层的热转印
CN101160219A (zh) * 2005-04-13 2008-04-09 Ovd基尼格拉姆股份公司 包括一带有凸纹结构的层的转印膜
EP1871620B1 (de) * 2005-04-13 2011-08-03 OVD Kinegram AG Transferfolie mit reliefstrukturschicht

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