EP2934896A4 - Patterned structured transfer tape - Google Patents

Patterned structured transfer tape

Info

Publication number
EP2934896A4
EP2934896A4 EP13866077.4A EP13866077A EP2934896A4 EP 2934896 A4 EP2934896 A4 EP 2934896A4 EP 13866077 A EP13866077 A EP 13866077A EP 2934896 A4 EP2934896 A4 EP 2934896A4
Authority
EP
European Patent Office
Prior art keywords
transfer tape
structured transfer
patterned structured
patterned
tape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP13866077.4A
Other languages
German (de)
French (fr)
Other versions
EP2934896B1 (en
EP2934896A1 (en
Inventor
Martin B Wolk
Michael Benton Free
Margaret M Vogel-Martin
Evan L Schwartz
Mieczyslaw H Mazurek
Terry O Collier
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of EP2934896A1 publication Critical patent/EP2934896A1/en
Publication of EP2934896A4 publication Critical patent/EP2934896A4/en
Application granted granted Critical
Publication of EP2934896B1 publication Critical patent/EP2934896B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form
    • B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • B32B3/263—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by a layer having non-uniform thickness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
    • C03C17/28—Surface treatment of glass, not in the form of fibres or filaments, by coating with organic material
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
    • C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/161—Coating processes; Apparatus therefor using a previously coated surface, e.g. by stamping or by transfer lamination
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/34—Imagewise removal by selective transfer, e.g. peeling away
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H10K59/38—Devices specially adapted for multicolour light emission comprising colour filters or colour changing media [CCM]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/40—Organosilicon compounds, e.g. TIPS pentacene
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0174—Manufacture or treatment of microstructural devices or systems in or on a substrate for making multi-layered devices, film deposition or growing
    • B81C2201/0191—Transfer of a layer from a carrier wafer to a device wafer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68368—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used in a transfer process involving at least two transfer steps, i.e. including an intermediate handle substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/331—Nanoparticles used in non-emissive layers, e.g. in packaging layer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/10—Organic polymers or oligomers
    • H10K85/141—Organic polymers or oligomers comprising aliphatic or olefinic chains, e.g. poly N-vinylcarbazol, PVC or PTFE
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
    • Y10T428/24521—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness with component conforming to contour of nonplanar surface

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Organic Chemistry (AREA)
  • Nanotechnology (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
EP13866077.4A 2012-12-21 2013-12-12 Patterned structured transfer tape Active EP2934896B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/723,716 US9711744B2 (en) 2012-12-21 2012-12-21 Patterned structured transfer tape
PCT/US2013/074523 WO2014099562A1 (en) 2012-12-21 2013-12-12 Patterned structured transfer tape

Publications (3)

Publication Number Publication Date
EP2934896A1 EP2934896A1 (en) 2015-10-28
EP2934896A4 true EP2934896A4 (en) 2016-07-20
EP2934896B1 EP2934896B1 (en) 2021-04-14

Family

ID=50974961

Family Applications (1)

Application Number Title Priority Date Filing Date
EP13866077.4A Active EP2934896B1 (en) 2012-12-21 2013-12-12 Patterned structured transfer tape

Country Status (6)

Country Link
US (5) US9711744B2 (en)
EP (1) EP2934896B1 (en)
JP (1) JP6367226B2 (en)
KR (1) KR102208719B1 (en)
CN (1) CN104870198B (en)
WO (1) WO2014099562A1 (en)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150100765A (en) 2012-12-21 2015-09-02 쓰리엠 이노베이티브 프로퍼티즈 컴파니 Curable silsesquioxane polymers, compositions, articles, and methods
US9711744B2 (en) 2012-12-21 2017-07-18 3M Innovative Properties Company Patterned structured transfer tape
US20140178698A1 (en) 2012-12-21 2014-06-26 3M Innovative Properties Company Curable silsesquioxane polymers, compositions, articles, and methods
US20140175707A1 (en) 2012-12-21 2014-06-26 3M Innovative Properties Company Methods of using nanostructured transfer tape and articles made therefrom
US9878954B2 (en) 2013-09-13 2018-01-30 3M Innovative Properties Company Vacuum glazing pillars for insulated glass units
US9246134B2 (en) 2014-01-20 2016-01-26 3M Innovative Properties Company Lamination transfer films for forming articles with engineered voids
EP3096945B1 (en) * 2014-01-20 2019-08-14 3M Innovative Properties Company Lamination transfer films for forming reentrant structures
US20150202834A1 (en) * 2014-01-20 2015-07-23 3M Innovative Properties Company Lamination transfer films for forming antireflective structures
KR102456918B1 (en) 2014-01-22 2022-10-19 쓰리엠 이노베이티브 프로퍼티즈 컴파니 Microoptics for glazing
TW201539736A (en) 2014-03-19 2015-10-16 3M Innovative Properties Co Nanostructures for color-by-white OLED devices
US9643381B2 (en) 2014-05-19 2017-05-09 Vindicoat, Llc Composite binding materials
WO2015191339A1 (en) 2014-06-13 2015-12-17 3M Innovative Properties Company Optical stacks for sparkle reduction
US9472788B2 (en) 2014-08-27 2016-10-18 3M Innovative Properties Company Thermally-assisted self-assembly method of nanoparticles and nanowires within engineered periodic structures
CN107075898B (en) * 2014-10-20 2020-02-18 3M创新有限公司 Insulating glazing unit and microoptical layer including microstructured diffuser and method
US10518512B2 (en) 2015-03-31 2019-12-31 3M Innovative Properties Company Method of forming dual-cure nanostructure transfer film
US10106643B2 (en) * 2015-03-31 2018-10-23 3M Innovative Properties Company Dual-cure nanostructure transfer film
EP3311430B1 (en) 2015-06-19 2019-12-18 3M Innovative Properties Company Segmented transfer tape and method of making the same
US11086056B2 (en) * 2015-06-19 2021-08-10 3M Innovative Properties Company Micro-optical assemblies including transparent substrates having graphic layer and method of making thereof
US10435590B2 (en) * 2015-06-19 2019-10-08 3M Innovative Properties Company Segmented transfer tape and method of making and use thereof
JP2018521357A (en) 2015-06-30 2018-08-02 スリーエム イノベイティブ プロパティズ カンパニー Thermal insulating glass unit, micro-optical layer and method including microstructured anisotropic diffuser
KR102288354B1 (en) * 2015-08-10 2021-08-11 삼성디스플레이 주식회사 Method for manufacturing flexible display apparatus
US10882793B2 (en) * 2015-11-11 2021-01-05 Amotech Co., Ltd. Ferrite sheet production method and ferrite sheet using same
WO2018052045A1 (en) 2016-09-16 2018-03-22 東京応化工業株式会社 Substrate bonding method and laminated body production method
JP2019532840A (en) 2016-09-20 2019-11-14 シャークレット テクノロジーズ インコーポレイテッド IMPRINT TAPE, ITS MANUFACTURING METHOD, AND ARTICLE INCLUDING THE SAME
US10367169B2 (en) * 2016-10-17 2019-07-30 Corning Incorporated Processes for making light extraction substrates for an organic light emitting diode using photo-thermal treatment
CN107021644B (en) * 2017-04-13 2019-09-13 宁波大学 A kind of preparation method of photovoltaic glass
JP7219606B2 (en) * 2018-12-21 2023-02-08 東京応化工業株式会社 Semiconductor substrate manufacturing method
US11825568B2 (en) * 2021-04-01 2023-11-21 Whirlpool Corporation Segmented thermoresistive heating system
CN114179536A (en) * 2021-12-15 2022-03-15 上海豪承信息技术有限公司 Pattern processing method
US11878935B1 (en) * 2022-12-27 2024-01-23 Canon Kabushiki Kaisha Method of coating a superstrate

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6521324B1 (en) * 1999-11-30 2003-02-18 3M Innovative Properties Company Thermal transfer of microstructured layers
US20070298176A1 (en) * 2006-06-26 2007-12-27 Dipietro Richard Anthony Aromatic vinyl ether based reverse-tone step and flash imprint lithography
US20090256287A1 (en) * 2008-04-09 2009-10-15 Peng-Fei Fu UV Curable Silsesquioxane Resins For Nanoprint Lithography
US20100104807A1 (en) * 2008-10-23 2010-04-29 Compal Electronics, Inc. Transfer film, method of manufacturing the same, transfer method and object surface structure
US20100150513A1 (en) * 2008-12-17 2010-06-17 3M Innovative Properties Company Light extraction film with nanoparticle coatings
US20100308497A1 (en) * 2007-09-06 2010-12-09 David Moses M Tool for making microstructured articles

Family Cites Families (59)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT610737A (en) 1955-11-18 1900-01-01
US4567073A (en) 1982-07-02 1986-01-28 Minnesota Mining And Manufacturing Company Composite low surface energy liner of perfluoropolyether
US4472480A (en) 1982-07-02 1984-09-18 Minnesota Mining And Manufacturing Company Low surface energy liner of perfluoropolyether
US4614667A (en) 1984-05-21 1986-09-30 Minnesota Mining And Manufacturing Company Composite low surface energy liner of perfluoropolyether
GB8911806D0 (en) 1989-05-23 1989-07-12 Rolls Royce Plc Gas turbine engine fuel control system with enhanced relight capability
US5234740A (en) * 1991-08-28 1993-08-10 Minnesota Mining And Manufacturing Company Slip control sheeting and articles covered with same
JP3522750B2 (en) * 1991-09-12 2004-04-26 ミネソタ マイニング アンド マニュファクチャリング カンパニー Embossed pressure-sensitive adhesive transfer tape
US5591958A (en) 1993-06-14 1997-01-07 Nikon Corporation Scanning exposure method and apparatus
US5691846A (en) 1993-10-20 1997-11-25 Minnesota Mining And Manufacturing Company Ultra-flexible retroreflective cube corner composite sheetings and methods of manufacture
JP3444053B2 (en) 1995-10-13 2003-09-08 ソニー株式会社 Thin film semiconductor device
EP0945254B1 (en) * 1998-03-17 2004-12-22 Chi Mei Optoelectronics Corporation Material comprising an anti-reflective coating on a flexible glass substrate
US6329058B1 (en) * 1998-07-30 2001-12-11 3M Innovative Properties Company Nanosize metal oxide particles for producing transparent metal oxide colloids and ceramers
US6838142B2 (en) 2001-05-18 2005-01-04 3M Innovative Properties Company Specular laminates
US6858253B2 (en) 2001-05-31 2005-02-22 3M Innovative Properties Company Method of making dimensionally stable composite article
JP4436030B2 (en) 2002-05-10 2010-03-24 スリーエム イノベイティブ プロパティズ カンパニー Acrylic release agent precursor, release agent article and method for producing release agent article
US6849558B2 (en) 2002-05-22 2005-02-01 The Board Of Trustees Of The Leland Stanford Junior University Replication and transfer of microstructures and nanostructures
US6805809B2 (en) * 2002-08-28 2004-10-19 Board Of Trustees Of University Of Illinois Decal transfer microfabrication
EP1537445B1 (en) * 2002-09-05 2012-08-01 Nanosys, Inc. Nanocomposites
KR100638091B1 (en) 2003-07-02 2006-10-25 재단법인서울대학교산학협력재단 Process for nanoparticle patterning and preparation of sintered body using same
US20050147838A1 (en) 2003-12-30 2005-07-07 3M Innovative Properties Company Polymerizable compositions for optical articles
JP2005193473A (en) 2004-01-06 2005-07-21 Three M Innovative Properties Co Transfer mold, its manufacturing method and fine structure manufacturing method
US7419912B2 (en) 2004-04-01 2008-09-02 Cree, Inc. Laser patterning of light emitting devices
US7645478B2 (en) * 2005-03-31 2010-01-12 3M Innovative Properties Company Methods of making displays
DE102005017170B4 (en) 2005-04-13 2010-07-01 Ovd Kinegram Ag Transfer film, process for their preparation and multilayer body and its use
US20060270806A1 (en) * 2005-05-26 2006-11-30 Hale Wesley R Miscible high Tg polyester/polymer blend compositions and films formed therefrom
MX2007016039A (en) 2005-06-17 2008-10-27 Univ North Carolina Nanoparticle fabrication methods, systems, and materials.
US20070020451A1 (en) 2005-07-20 2007-01-25 3M Innovative Properties Company Moisture barrier coatings
US7569254B2 (en) 2005-08-22 2009-08-04 Eastman Kodak Company Nanocomposite materials comprising high loadings of filler materials and an in-situ method of making such materials
US20070077349A1 (en) * 2005-09-30 2007-04-05 Eastman Kodak Company Patterning OLED device electrodes and optical material
US20090128916A1 (en) * 2006-01-16 2009-05-21 Masaki Noro Curable composition and cured product, laminate film and antireflective film using the same and polarizing plate and image display device using the antireflective film
JP2007335253A (en) 2006-06-15 2007-12-27 Toshiba Matsushita Display Technology Co Ltd Organic el display device
JP5084194B2 (en) * 2006-07-18 2012-11-28 エヌ・ティ・ティ・アドバンステクノロジ株式会社 Surface-modifying composition and laminate
US7604916B2 (en) 2006-11-06 2009-10-20 3M Innovative Properties Company Donor films with pattern-directing layers
US20080233404A1 (en) 2007-03-22 2008-09-25 3M Innovative Properties Company Microreplication tools and patterns using laser induced thermal embossing
US7604381B2 (en) 2007-04-16 2009-10-20 3M Innovative Properties Company Optical article and method of making
US20090015142A1 (en) * 2007-07-13 2009-01-15 3M Innovative Properties Company Light extraction film for organic light emitting diode display devices
US8236668B2 (en) * 2007-10-10 2012-08-07 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing SOI substrate
US20090263668A1 (en) 2008-04-21 2009-10-22 3M Innovative Properties Company Durable coating of an oligomer and methods of applying
CL2009001579A1 (en) 2008-07-15 2011-07-22 Basf Corp Device for supplying a composition of chlorine dioxide free of oxychlorine anion to a fabric comprising a source layer of chlorine dioxide and a barrier layer interposed between the source layer and the fabric, the barrier layer prohibits the passage of anions oxychlorine and let the chlorine dioxide composition pass through.
US8222352B2 (en) 2008-12-24 2012-07-17 Nitto Denko Corporation Silicone resin composition
JP5052534B2 (en) * 2009-01-08 2012-10-17 株式会社ブリヂストン Photocurable transfer sheet and method for forming uneven pattern using the same
US20100188751A1 (en) 2009-01-29 2010-07-29 3M Innovative Properties Company Optical films with internally conformable layers and method of making the films
US20110091694A1 (en) * 2009-10-20 2011-04-21 E. I. Du Pont De Nemours And Company Method for forming fine electrode patterns
KR20110054841A (en) * 2009-11-18 2011-05-25 삼성모바일디스플레이주식회사 Organic light emitting diode display and method of manufacturing the same
JP2011105894A (en) 2009-11-20 2011-06-02 Konica Minolta Holdings Inc Method for producing attachable tape
WO2011088161A1 (en) 2010-01-13 2011-07-21 3M Innovative Properties Company Optical films with microstructured low refractive index nanovoided layers and methods therefor
JP2011221470A (en) * 2010-04-14 2011-11-04 Sony Corp Optical element, method for manufacturing the same, display unit, and solar cell
JPWO2011155582A1 (en) * 2010-06-11 2013-08-15 株式会社日立ハイテクノロジーズ Stamper for fine structure transfer and fine structure transfer device
US8469551B2 (en) 2010-10-20 2013-06-25 3M Innovative Properties Company Light extraction films for increasing pixelated OLED output with reduced blur
CN103249562B (en) 2010-12-09 2015-07-08 旭化成电子材料株式会社 Fine-structure laminate, method for preparing fine-tructure laminate, and production method for fine-structure laminate
EP2651651B1 (en) 2010-12-17 2019-01-23 3M Innovative Properties Company Transfer article having multi-sized particles and methods
US8692446B2 (en) 2011-03-17 2014-04-08 3M Innovative Properties Company OLED light extraction films having nanoparticles and periodic structures
KR20140033173A (en) 2011-05-31 2014-03-17 쓰리엠 이노베이티브 프로퍼티즈 캄파니 Methods for making differentially pattern cured microstructured articles
US9415539B2 (en) 2011-05-31 2016-08-16 3M Innovative Properties Company Method for making microstructured tools having discontinuous topographies, and articles produced therefrom
US9780335B2 (en) 2012-07-20 2017-10-03 3M Innovative Properties Company Structured lamination transfer films and methods
US20140175707A1 (en) * 2012-12-21 2014-06-26 3M Innovative Properties Company Methods of using nanostructured transfer tape and articles made therefrom
US9711744B2 (en) 2012-12-21 2017-07-18 3M Innovative Properties Company Patterned structured transfer tape
EP3069384A4 (en) * 2013-11-11 2017-07-12 3M Innovative Properties Company Nanostructures for oled devices
US9246134B2 (en) 2014-01-20 2016-01-26 3M Innovative Properties Company Lamination transfer films for forming articles with engineered voids

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6521324B1 (en) * 1999-11-30 2003-02-18 3M Innovative Properties Company Thermal transfer of microstructured layers
US20070298176A1 (en) * 2006-06-26 2007-12-27 Dipietro Richard Anthony Aromatic vinyl ether based reverse-tone step and flash imprint lithography
US20100308497A1 (en) * 2007-09-06 2010-12-09 David Moses M Tool for making microstructured articles
US20090256287A1 (en) * 2008-04-09 2009-10-15 Peng-Fei Fu UV Curable Silsesquioxane Resins For Nanoprint Lithography
US20100104807A1 (en) * 2008-10-23 2010-04-29 Compal Electronics, Inc. Transfer film, method of manufacturing the same, transfer method and object surface structure
US20100150513A1 (en) * 2008-12-17 2010-06-17 3M Innovative Properties Company Light extraction film with nanoparticle coatings

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2014099562A1 *

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US11565495B2 (en) 2023-01-31
US20230141149A1 (en) 2023-05-11
US11396156B2 (en) 2022-07-26
EP2934896B1 (en) 2021-04-14
KR20150099585A (en) 2015-08-31
US20140178646A1 (en) 2014-06-26
CN104870198A (en) 2015-08-26
KR102208719B1 (en) 2021-01-28
US20220324195A1 (en) 2022-10-13
JP6367226B2 (en) 2018-08-01
EP2934896A1 (en) 2015-10-28
US9711744B2 (en) 2017-07-18
WO2014099562A1 (en) 2014-06-26
US20180351119A1 (en) 2018-12-06

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