CN104869760A - Welding process of optical assembly - Google Patents
Welding process of optical assembly Download PDFInfo
- Publication number
- CN104869760A CN104869760A CN201510200965.XA CN201510200965A CN104869760A CN 104869760 A CN104869760 A CN 104869760A CN 201510200965 A CN201510200965 A CN 201510200965A CN 104869760 A CN104869760 A CN 104869760A
- Authority
- CN
- China
- Prior art keywords
- solder flux
- optical module
- pin
- circuit board
- welding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/044—Solder dip coating, i.e. coating printed conductors, e.g. pads by dipping in molten solder or by wave soldering
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
The invention discloses a welding process of an optical assembly. The welding process of the optical assembly comprises the following steps: inserting the pin of the optical assembly in a circuit board; providing a peak welding fixture, wherein the peak welding fixture comprises a hollow portion and a solder guiding module, and the solder guiding module is arranged to be close to the hollow portion; stacking and fixing the circuit board on the peak welding fixture, wherein the pin and the solder guiding module are arranged at an interval; and injecting a liquid-state solder from the hollow portion, wherein a part of the liquid-state solder is guided to the surface of the solder guiding module from the surface of the pin. The welding process of the optical assembly, provided by the invention, avoids a solder connection phenomenon caused by solder aggregation on the surface of the pin of the optical assembly, and also decreases the labor cost for production while improving the product quality.
Description
Technical field
The present invention relates to welding technology field, relate to a kind of welding procedure of optical module particularly.
Background technology
Along with the development of optical transport technology, optical fiber is applied in the life of people more and more as signal transmission means.In optical module, optical transceiver module interface module may be used for the conversion of photosignal, is the fiber products that fiber optic communication field is conventional.
In DIP (Dual In-line Package) the wave soldering process of optical transceiver module interface module, the pin welding that often there will be optical transceiver module interface module connects tin phenomenon.The solution of current routine has:
One, weld by optical module pin is cut short, reduce pin and connect tin fraction defective; It is too short that its weak point is that optical module pin goes out pin, and pin welding spot reliability can not be guaranteed, and easily causes optical module performance bad, and connect tin rate still up to about 50%.
Two, adopt active stronger scaling powder, reduce pin and connect tin fraction defective; Residual many after being wave soldering, the sticky hands of its weak point, need 100% cleaning, client and user will not accept, and connect tin rate still up to about 50%.
In addition, after product occurs connecting tin phenomenon, normally adopt artificial mode to be processed, this can increase again the human cost in production process.
Summary of the invention
In order to solve the problems of the technologies described above, the embodiment of the present invention discloses a kind of welding procedure of optical module.
The welding procedure of described optical module, comprises the steps: the pin of optical module to be inserted in circuit board; There is provided wave soldering tool, described wave soldering tool comprises hollow-out parts and solder flux guiding module, and described solder flux guiding module closes on described hollow-out parts and arranges; Folded for described circuit board establishing is fixed on described wave soldering tool, and described pin and described solder flux are guided module interval and are arranged; And inject liquid flux from described hollow-out parts, the described liquid flux of part is directed to described solder flux guiding module surface from described pin surface.In a preferred embodiment of the present invention, in welding process, described liquid flux adheres to described pin.
In a preferred embodiment of the present invention, the liquid flux adhering to described pin contacts described solder flux guiding module and is led to described solder flux guiding module surface.
In a preferred embodiment of the present invention, described welding guiding module is fixed between described wave soldering tool and described circuit board.
In a preferred embodiment of the present invention, described solder flux guiding module is the sheet material that metal or ceramic material process.
In a preferred embodiment of the present invention, described solder flux guiding module comprises the U-shaped gap structure being formed at described solder flux guiding module edge, coordinates the edge of described hollow-out parts to surround through hole the U-shaped gap structure of described solder flux guiding module.
In a preferred embodiment of the present invention, described pin is run through described circuit board and through hole, and extend to described hollow-out parts.
In a preferred embodiment of the present invention, described solder flux is scolding tin.
In a preferred embodiment of the present invention, folded for described circuit board establishing is fixed on described wave soldering tool and is obtained welding structure, liquid flux is being injected from described hollow-out parts, the described liquid flux of part is directed to the step on described solder flux guiding module surface from described pin surface, and described welding structure is along the direction rectilinear movement at setting angle of inclination.
In a preferred embodiment of the present invention, after described optical module is welded on described circuit board, increase the described welding structure step of cooling.
In the welding procedure of optical module provided by the invention, the wave soldering tool of described welding structure comprises hollow-out parts and closes on the solder flux guiding module of described hollow-out parts setting, and the pin relative spacing of described solder flux guiding module and described optical module is arranged.In wave soldering process, liquid flux unnecessary for described pin surface be directed to described solder flux guiding module surface and avoid described pin surface solder flux to assemble and occur that solder flux connects phenomenon, also reduces the human cost of production while improving the quality of products.
Accompanying drawing explanation
In order to be illustrated more clearly in the technical scheme in the embodiment of the present invention, below the accompanying drawing used required in describing embodiment is briefly described, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings, wherein:
Fig. 1 is the cross-sectional side view of welding structure one preferred embodiment needed for welding procedure realizing optical module provided by the invention;
Fig. 2 is the floor map of the medium wave peak of welding structure shown in Fig. 1 welding fixture;
Fig. 3 is the schematic flow sheet of the welding procedure of optical module provided by the invention.
Embodiment
Be clearly and completely described to the technical scheme in the embodiment of the present invention below, obviously, described embodiment is only a part of embodiment of the present invention, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making other embodiments all obtained under creative work prerequisite, belong to the scope of protection of the invention.
Please refer to Fig. 1 and Fig. 2, wherein Fig. 1 is the cross-sectional side view of welding structure one preferred embodiment needed for welding procedure realizing optical module provided by the invention, and Fig. 2 is the floor map of the medium wave peak of welding structure shown in Fig. 1 welding fixture.The welding structure 100 of described wave-soldering comprises wave soldering tool 1, circuit board 3 and optical module 5.Described wave soldering tool 1 supports fixing described circuit board 3.Described circuit board 3 realizes effective welding with described optical module 5 by described wave soldering tool 1, obtains the circuit board 3 of fixing described optical module 5.
Described wave soldering tool 1 comprises body 11, hollow-out parts 13 and solder flux guiding module 15.Described hollow-out parts 13 is formed at described body 11, and described solder flux guiding module 15 closes on described hollow-out parts 13 and arranges, and coordinates the through hole 17 that described hollow-out parts 13 surrounds.
Described body 11 entirety structure in the form of sheets, the structure outline of its shape and product circuit plate 3 to be welded reaches unanimity.Described body 11 comprises the supporting surface 111 being formed at described body 11 1 side surface.Described supporting surface 111 supports described circuit board 3, is aided with fastening assembly (not shown) simultaneously and described circuit board 3 is fixed on described body 1, be convenient to the carrying out of welding procedure, and avoid the temperature distortion of described circuit board 3.
Described hollow-out parts 13 point is laid in described body 1 according to the designing requirement of described circuit board 3.Described hollow-out parts 13 comprises multiple through hole 131, and described multiple through hole 131 array distribution is in described body 11.
Described solder flux guiding module 15 is the sheet material that metal or ceramic material process.Described solder flux guiding module 15 comprises the U-shaped gap structure (sign) being formed at described solder flux guiding module 15 edge, and described U-shaped gap structure coordinates the edge of described hollow-out parts 13 to surround through hole 17.Alternately, described solder flux guiding module can also comprise the gap structure of other suitable shapes.The quantity of described solder flux guiding module 15 can be multiple, and is fixed on the supporting surface 111 of described body 11, that is, in described welding structure 100, described solder flux guiding module 15 is located between described body 11 and described circuit board 3.
In the present embodiment, described solder flux guiding module 15 is fixed on described supporting surface 111, the two independent component for being separated from each other.As the further improvement of above-mentioned execution mode, described solder flux guiding module 15 can also be structure as a whole with described body 11.In the present embodiment, the thickness of described solder flux guiding module 15 is 0.6mm.
Described circuit board 3 is the circuit board for fixing described optical module 5, and its surface arranges multiple welding hole 31.Described multiple welding hole 31 runs through described circuit board 3, and described multiple welding hole 31 and corresponding described through hole 17 and described through hole 131 is corresponding arranges.
Described optical module 5 comprises pin 51, and described optical module 5 is inserted in the welding hole 31 of described circuit board 3 by described pin 51.And described pin 51 runs through described circuit board 3 and described through hole 17, and extend to described hollow-out parts 13, wherein said pin 51 and described solder flux are guided interval between module 15 and are arranged.Described optical module 5 can be any one in light emission component, optical fiber receive module and optical transceiver module interface module.
When adopting solder wave process that described optical module 5 is welded in described circuit board 3, the assembling process of described welding structure 100 comprises the steps:
Step S11, provides optical module 5;
Step S12, provides circuit board 3, and described optical module 5 is inserted in described circuit board 3;
Step S13, provides wave soldering tool 1, described circuit board 3 is fixed on the supporting surface 111 of described Wave soldering fixture 1, obtains described welding structure 100.
Referring to Fig. 3 again, is the schematic flow sheet of the welding procedure of optical module provided by the invention.The welding procedure 200 of described optical module comprises the steps:
Step S21, is inserted in circuit board 3 by the pin 51 of optical module 5;
Step S22, provides wave soldering tool 1, and described wave soldering tool 1 comprises hollow-out parts 13 and solder flux guiding module 15, and described solder flux guiding module 15 closes on described hollow-out parts 13 and arranges;
Step S23, folded the establishing of described circuit board 3 is fixed on described wave soldering tool 1, and described pin 51 and described solder flux are guided module 15 interval and are arranged; And
Step S24, injects liquid flux from described hollow-out parts 13, and the described liquid flux of part is directed to described solder flux guiding module 15 surface from described pin 51 surface.
Preferably, in the welding procedure 200 of described optical module, described solder flux is scolding tin.Be not limited to the present embodiment, in other alternate embodiments, described solder flux can also be designed to other suitable solder flux according to welding procedure.
It should be noted that, folded for described circuit board 3 establishing is fixed on described wave soldering tool 1 and is obtained described welding structure 100.In welding process, described liquid flux forms multiple solder flux crest in described crest welder, described welding structure 100 along setting angle of inclination direction straight ahead and skim over the top of described multiple solder flux crest.Described liquid flux enters described welding structure 100 from described hollow-out parts 13, and the pin 51 of described optical module 5 first contacts described liquid flux, and then described liquid flux can adhere to described pin 51 surface.Preferably, after described optical module 5 is fixedly welded on described circuit board 3, the step cooling described welding structure 100 can also be increased.
Owing to being provided with interval between described pin 51 and described solder flux arrangement for guiding 15, when the liquid flux adhering to described pin 51 does not contact described solder flux arrangement for guiding 15, described liquid flux would not be guided by described solder flux arrangement for guiding 15; When the liquid flux of described adhesion is too much, described too much liquid flux contacts described solder flux arrangement for guiding 15, and now described too much liquid flux is led to described solder flux guiding module 15 surface under its gravity and capillary effect.That is, interval between described pin 51 and described solder flux arrangement for guiding 15 ensures that the surface adhesion of described pin 51 has described liquid flux, but can not adhere to too much described liquid flux and cause the surperficial solder flux of described pin 51 assemble and occur the bad phenomenon that solder flux connects.
Compared to prior art, in the welding procedure 200 of optical module provided by the invention, the wave soldering tool 1 of described welding structure 100 comprises hollow-out parts 13 and closes on the solder flux guiding module 15 of described hollow-out parts 13 setting, and described solder flux guiding module 15 is arranged with pin 51 relative spacing of described optical module 5.In wave soldering process, the liquid flux of described pin 51 excess surface be directed to described solder flux guiding module 15 surface and avoid the surperficial solder flux of described pin 51 assemble and occur that solder flux connects phenomenon, also reduces the human cost of production while improving the quality of products.
The foregoing is only embodiments of the invention; not thereby the scope of the claims of the present invention is limited; every utilize description of the present invention to do equivalent structure or the conversion of equivalent flow process, or be directly or indirectly used in other relevant technical field, include in scope of patent protection of the present invention.
Claims (10)
1. a welding procedure for optical module, comprises the steps:
The pin of optical module is inserted in circuit board;
There is provided wave soldering tool, described wave soldering tool comprises hollow-out parts and solder flux guiding module, and described solder flux guiding module closes on described hollow-out parts and arranges;
Folded for described circuit board establishing is fixed on described wave soldering tool, and described pin and described solder flux are guided between module and are provided with interval; And
Inject liquid flux from described hollow-out parts, the described liquid flux of part is directed to described solder flux guiding module surface from described pin surface.
2. the welding procedure of optical module according to claim 1, is characterized in that, in welding process, described liquid flux adheres to described pin.
3. the welding procedure of optical module according to claim 2, is characterized in that, the liquid flux adhering to described pin contacts described solder flux guiding module and is led to described solder flux guiding module surface.
4. the welding procedure of optical module according to claim 1, is characterized in that, is fixed between described wave soldering tool and described circuit board by described solder flux guiding module.
5. the welding procedure of optical module according to claim 1, is characterized in that, described solder flux guiding module is the sheet material that metal or ceramic material process.
6. the welding procedure of optical module according to claim 5, it is characterized in that, described solder flux guiding module comprises the U-shaped gap structure being formed at described solder flux guiding module edge, coordinates the edge of described hollow-out parts to surround through hole the U-shaped gap structure of described solder flux guiding module.
7. the welding procedure of optical module according to claim 6, is characterized in that, described pin is run through described circuit board and through hole, and extends to described hollow-out parts.
8. the welding procedure of optical module according to claim 1, is characterized in that, described solder flux is scolding tin.
9. the welding procedure of optical module according to claim 1, it is characterized in that, folded for described circuit board establishing is fixed on described wave soldering tool and is obtained welding structure, liquid flux is being injected from described hollow-out parts, the described liquid flux of part is directed to the step on described solder flux guiding module surface from described pin surface, and described welding structure is along the direction rectilinear movement at setting angle of inclination.
10. the welding procedure of optical module according to claim 9, is characterized in that, after described optical module is welded on described circuit board, increases the described welding structure step of cooling.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510200965.XA CN104869760A (en) | 2015-04-24 | 2015-04-24 | Welding process of optical assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510200965.XA CN104869760A (en) | 2015-04-24 | 2015-04-24 | Welding process of optical assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104869760A true CN104869760A (en) | 2015-08-26 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510200965.XA Pending CN104869760A (en) | 2015-04-24 | 2015-04-24 | Welding process of optical assembly |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0888463A (en) * | 1994-09-19 | 1996-04-02 | Fujitsu Ltd | Soldering packaging method of electronic parts |
| CN2616333Y (en) * | 2003-05-06 | 2004-05-19 | 华硕电脑股份有限公司 | Tool frame with tin-sticky function |
| WO2009019771A1 (en) * | 2007-08-08 | 2009-02-12 | Bosch Corporation | Circuit board with high packaging density |
| CN101636045A (en) * | 2008-07-24 | 2010-01-27 | 英业达股份有限公司 | Bearing plate for wave-soldering device |
| CN103299723A (en) * | 2011-01-14 | 2013-09-11 | 贺利实公司 | Method of making an electronic device having a liquid crystal polymer solder mask laminated to an interconnect layer stack and related devices |
| CN104325207A (en) * | 2013-07-22 | 2015-02-04 | 珠海格力电器股份有限公司 | Tin carrier, welding machine and method for preventing connecting tin short circuit |
| CN104429170A (en) * | 2012-07-11 | 2015-03-18 | 罗伯特·博世有限公司 | Printed circuit board having a solder-guiding capillary |
-
2015
- 2015-04-24 CN CN201510200965.XA patent/CN104869760A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0888463A (en) * | 1994-09-19 | 1996-04-02 | Fujitsu Ltd | Soldering packaging method of electronic parts |
| CN2616333Y (en) * | 2003-05-06 | 2004-05-19 | 华硕电脑股份有限公司 | Tool frame with tin-sticky function |
| WO2009019771A1 (en) * | 2007-08-08 | 2009-02-12 | Bosch Corporation | Circuit board with high packaging density |
| CN101636045A (en) * | 2008-07-24 | 2010-01-27 | 英业达股份有限公司 | Bearing plate for wave-soldering device |
| CN103299723A (en) * | 2011-01-14 | 2013-09-11 | 贺利实公司 | Method of making an electronic device having a liquid crystal polymer solder mask laminated to an interconnect layer stack and related devices |
| CN104429170A (en) * | 2012-07-11 | 2015-03-18 | 罗伯特·博世有限公司 | Printed circuit board having a solder-guiding capillary |
| CN104325207A (en) * | 2013-07-22 | 2015-02-04 | 珠海格力电器股份有限公司 | Tin carrier, welding machine and method for preventing connecting tin short circuit |
Non-Patent Citations (2)
| Title |
|---|
| HINCH，S.W.: "《表面安装技术手册》", 30 June 1993, 北京：科学出版社 * |
| 梁湖辉等: "《电子工艺实训教程》", 30 June 2009, 北京：中国电力出版社 * |
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Application publication date: 20150826 |
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