JP2011222363A - Terminal and electronic circuit component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a terminal which can improve mounting reliability with small mounting area.SOLUTION: A terminal 1a includes a plurality of lead pins 3a arranged on the right and left sides in parallel and a box-shaped resin member 2 in which to hold all the lead pins fixed with resin. The lead pins penetrate through the resin member from the rear side to the back to the front. A front-end part 3f and a back-end part 3r protrude from the front-end face and the back-end face of the resin member respectively. A middle part 3m which is fixed inside the resin member is curved vertically and connected to the front-end and back-end parts in a way that it is not exposed on the outside of the resin member.

Description

  The present invention relates to a terminal having lead pins arranged in parallel in a row, and an electronic circuit component on which the terminal is mounted.

  As a package structure such as an IC, there is a SIP (Single In-line Package) in which terminals are arranged in one line on one side of the package. FIG. 6 is a diagram showing an example of an electronic circuit component (hereinafter, SIP type module) 10c having terminals 1c in which lead pins 3c are arranged in a line on the end face of the substrate 11. As shown in FIG. This SIP type module 10c becomes SIP if it is housed in a package with the terminal 1c led out to the outside. Of course, it may be mounted on another substrate as it is without being housed in the package.

  The illustrated SIP type module 10c has a structure in which a plurality of lead pins 3c to be electronic components 12 and terminals 1c are mounted on a substrate 11, and one end 3r of the lead pin 3c is formed in the substrate 11 of the module 10c. In the state inserted in the through hole 13, it is soldered by, for example, a flow method. The other end 3f of the lead pin 3c is mounted on a substrate constituting an external electronic circuit by soldering or the like. Thereby, the electronic circuit of the module 10c and the external electronic circuit are connected.

  In addition, as a terminal for the SIP type module, there is a terminal called “pin header” having a structure in which a lead pin is implanted in a box-shaped resin member. FIG. 7 shows a SIP type module 10d provided with the pin header 1d. FIG. 7A is a perspective view of the SIP type module 10d as viewed from above and front. (B) is a sectional side view of the SIP type module 10d, and shows a section taken along the line cc in (A). Moreover, (C) is a front view of the pin header 1d when viewed from the front. As shown in FIG. 7, the lead pin 3 protrudes in the front-rear direction at the lower end of the box-shaped resin member 2. The lower surface 3dd of the lead pin 3 is exposed at the lower surface 2d of the resin member 2. FIG. 8 shows a side sectional view of a SIP type module 10e provided with a pin header 1e having a different shape of the lead pin 3e. In the pin header 1e, the lead pin 3e passes through substantially the center in the vertical direction of the resin member 2, and the rear end portion 3r extends rearward from the end surface of the resin member 2 and then bends downward in an L shape. Further, it is bent back in an L shape so as to be parallel to the surface of the substrate 11. This is the so-called “Z bending”. And the front-end | tip of the rear-end part 3r is soldered to the board | substrate 11 of the module 10e. Non-Patent Document 1 below describes the shape and specifications of various pin headers.

Iriso Electronics Co., Ltd., “Product Introduction Pin Header”, [online], [March 26, 2010 Search], Internet <URL: http://www.iriso.co.jp/catalog/8/>

  By the way, it has been found that the conventional terminals have various problems particularly when they are mounted on a substrate for a SIP type module. For example, since the terminal 1c in the SIP type module shown in FIG. 6 has the lead pin 3c mounted on the substrate 11 using the through hole 13, an area for mounting the lead pin 3c on both sides of the substrate 11 is required. Become. Therefore, the area for mounting other electronic components 12 is reduced on both surfaces of the substrate 11, and it is difficult to improve the mounting density of the SIP type module.

  In the conventional example shown in FIG. 7, since the lead pins 3d can be surface-mounted on the substrate 11 by a reflow method or the like, the mounting area of the other electronic component 12 is not occupied on one surface of the substrate 11. However, since the lead pin 3d is exposed to the front and back while being exposed below the resin member 2, the solder 14 for mounting the lead pin 3d flows along the lead pin 3d, and the resin member 2 and the module substrate 11 are connected to each other. If the solder 14 enters the space and the solder 14 is solidified, the resin member 2 bonded onto the substrate 11 may be peeled off or lifted up. If the resin member 2 is lifted, the lead pin 3d is also lifted, and contact failure may occur in the mounting portion.

  In the conventional example shown in FIG. 8, since the lead pin 3e penetrates the center of the resin member 2, the resin member 2 is lifted by the flow of the solder 14, and the possibility of contact failure due to the lift is reduced. However, it is necessary to bend the rear end portion 3r of the lead pin 3e led out from the center of the resin member 2 so as to contact the surface of the module substrate 11, and a length L required for the bending is required. Therefore, the mounting area of the other electronic components 12 is reduced on the mounting surface of the pin header 1e on the substrate 11.

  The present invention was created in order to solve various problems in terminals such as the above-mentioned SIP module terminals that are mainly assumed to be surface-mounted on a substrate. Therefore, it is an object of the present invention to provide a terminal that can improve the mounting reliability.

  To achieve the above object, the present invention comprises a plurality of lead pins arranged in parallel on the left and right sides, and a box-shaped resin member that collectively holds the plurality of lead pins in a state of being fixed by a resin. Passes through the resin member in the front-rear direction, the front end portion and the rear end portion protrude from the front end surface and the rear end surface of the resin member, respectively, and the intermediate portion fixed in the resin member The terminal is bent in the vertical direction so as not to be exposed to the outside of the resin member and is continuous with the front end portion and the rear end portion.

  The front end portion and the rear end portion of the lead pin protrude at a lower edge portion of the resin member, and the intermediate portion extends in a straight line from the front end portion and the rear end portion. A terminal that is bent inside the member may be used.

  Under the left and right side surfaces of the resin member, a concave portion for applying an adhesive that extends across the left and right side surfaces and the lower surface may be formed. Furthermore, the front end surface of the resin member may be formed in a groove shape by an edge that protrudes forward while extending in the vertical direction at both left and right ends.

  The present invention also extends to an electronic circuit component on which any one of the above terminals is mounted. In the electronic circuit component, the terminal is aligned with the upper front edge of the substrate and the lower front edge of the resin member. In this state, the rear end of the lead pin is surface-mounted on the upper surface of the substrate.

  According to the terminal of the present invention, the mounting area is small, the mounting density of the electronic circuit component on which the terminal is mounted can be increased, and the electronic circuit component is reduced in size. In addition, the mounting reliability can be improved.

It is an external view of the SIP type module which mounted the terminal concerning one embodiment of the present invention. It is a figure which shows the structure of the terminal in 1st Example of this invention. It is a figure for demonstrating the manufacturing method of the said SIP type module. It is a figure which shows the structure of the terminal in the 2nd Example of this invention. It is a figure for demonstrating the function of the groove | channel which can be formed in the terminal of each said Example. It is an external view of the SIP type module which mounted the terminal used as the prior art example of this invention. It is a figure which shows the structure of the SIP type module which mounted the conventional pin header. FIG. 6 is a structural diagram of a SIP type module on which a pin header having a partially different structure from the conventional pin header is mounted.

=== SIP module ===
As described above, the present invention is mainly directed to terminals in an electronic circuit component (SIP type module) having a structure in which lead pins are arranged in a line on the end face of a substrate and the SIP type module. More specifically, a pin header type terminal (hereinafter referred to as a pin header) and a SIP module on which the pin header is mounted are mainly targeted.

  FIG. 1 shows a SIP type module (hereinafter referred to as a module) 10a on which a pin header 1 according to an embodiment of the present invention is mounted. The pin header 1 is mounted on one surface of the substrate 11, and the electronic components 12 constituting the electronic circuit of the module 10 a are mounted on both surfaces of the substrate 11.

  The pin header 1 has a structure in which lead pins 3 are implanted in a row on a box-shaped resin member (hereinafter referred to as a header base) 2. Here, if the mounting surface of the pin header 1 on the substrate 11 is the top surface and the extending direction of the lead pins 3 is the front-rear direction, as shown in the figure, the rear end 3r of the lead pin 3 is It is surface-mounted on the upper surface of the substrate 11 by a reflow method. The front end portion 3f of the lead pin 3 is a portion that is inserted into a through hole or the like when the module 10a is mounted on another substrate. Hereinafter, some embodiments in which the structure of the pin header 10 is different will be specifically shown. Hereinafter, the description and illustration of the mounting component 12 on the lower surface of the substrate 11 will be omitted for the sake of convenience.

=== First Embodiment ===
FIG. 2 shows the structure of the pin header 1a according to the first embodiment of the present invention. 2A and 2B are perspective views when the pin header 1a in the first embodiment is viewed from the upper front and the lower front, respectively. (C) is a sectional side view of the pin header, showing a cross section taken along the line aa in (A). The pin header 1a is composed of a plurality of lead pins 3a extending in the front-rear direction and arranged in parallel on the left and right sides, and a box-like header base 2. The lead pins 3a are integrally formed in the header base 2 by molding or the like. It is fixed.

  In the pin header 1a in the first embodiment, the rear end portion 3r of the lead pin 3a extends rearward from the lower end of the header base 2, and the front end portion 3f extends forward from a substantially vertical center position of the header base 2. . The lead pin 3a is bent in the vertical direction at an intermediate portion 3m that connects the front end portion 3f and the rear end portion 3r in the header base 2. In the first embodiment, after bending upward from the rear end 3r side, it is bent forward. In this example, it is in a “Z-bending” state in which it is bent twice at an obtuse angle. Accordingly, the intermediate portion 3m of the lead pin 3a is fixed at a substantially vertical center position in the header base 2. Therefore, in the intermediate part 3m, a sufficient amount of resin is arranged vertically, and the lead pins 3a are firmly fixed in the header base 2.

  Further, since the lead pin 3a is bent in the header base 2, the length of the bent portion at the rear end 3r can be shortened as in the conventional pin header 1e shown in FIG. The mounting area of the other electronic component 12 can be increased. Therefore, the module 10a can be easily downsized. Alternatively, more electronic components 12 can be mounted, and higher functionality of the module 10a can be expected. Further, since the lead pin 3a is not exposed on the lower surface 2d of the header base 2 as in the conventional pin header 1d shown in FIG. 7, the rear end portion 3r of the lead pin 3a is soldered on the substrate 11 by a reflow method or the like. In this case, the solder does not flow along the lead pins 3a and enter the lower surface 2d of the header base 2. Therefore, the mounting reliability is improved. A rear end portion 3r extending rearward from below on the rear end surface of the header base 2 and a front end portion 3f extending forward from the front end surface of the header base 2 are continuously bent in the header base 2 while being bent vertically. If the intermediate portion 3m is not exposed on the lower surface of the header base 2, the bent shape of the lead pin 3a is not limited to the illustrated “Z bend”.

=== Second Embodiment ===
In the pin header 1a according to the first embodiment, the lead pin 3 is "Z-bent" in the header base 2 so that the lower surface of the intermediate portion 3m of the lead pin 3a is not exposed from the lower surface 2d of the header base 2. It was. As a result, the reliability of mounting the module 10a on the substrate 11 can be improved, and the mounting density of other components 12 in the module 10a can be improved. In addition to the features of the pin header 1a in the first embodiment, the pin header according to the second embodiment improves the shape stability of the front end portion 3f of the lead pin 3, and the module 10a itself is mounted on another substrate. Features for improving reliability when mounted. In particular, the pin header according to the second embodiment has a configuration in which the lead pin 3b is not bent when the module 10a on which the pin header is mounted is manufactured.

  FIG. 3 shows an example of a method for manufacturing the module 10a. As shown in FIG. 3A, each module 10a is surface-mounted with electronic components 12 and pin headers 1 corresponding to a plurality of modules 10a on a single substrate (master substrate) 20, and thereafter And the master substrate 20 is cut (at the dashed line portion in the figure). FIG. 3B is an enlarged view of the inside of the circle 30 in FIG. 3A, and the manufacturing method of the module 10a will be described more specifically based on FIG. 3B. The openings 21 indicated by hatching in FIG. 2 are arranged in a lattice pattern, and the portions that become the substrates 11 of the modules 10 a are partitioned by the openings 21. Each section is connected by a bridging portion 22 that separates adjacent openings 21. And it cut | disconnects into each module 10a by cut | disconnecting this bridge | crosslinking part 22. FIG.

  In the manufacturing method described above, in the pin header 1a in the first embodiment, the front end portion 3f of the lead pin 3a is in a state of floating from the upper surface of the substrate 11 through the manufacturing process of the module 10a, and the front end portion 3f is When stress is applied, it is easily bent up and down. Since the front end portion 3f of the lead pin 3a is inserted into a through hole or the like when the module 10a is mounted on another substrate, if the front end portion 3f is bent, it is necessary to correct the bend in advance. It causes cost increase. If it is disposed of as a defective product, the yield of the module 10a is reduced, resulting in a large cost increase.

  FIGS. 4A and 4B are a perspective view and a side sectional view from the lower front of the pin header 1b in the second embodiment. The intermediate portion 3m of the lead pin 3b is bent in the vertical direction so as to make a U-turn in the header base 2 so that the front end portion 3f and the rear end portion 3r of the lead pin 3b are on the same straight line. In the second embodiment, the lower surface 3fd of the front end portion 3f, the lower surface 3rd of the rear end portion 3r, and the lower surface 2d of the header base 2 are bent so as to be the same surface. In the example shown in FIG. 4, the lead pin 3 b has a side cross-sectional shape in which an edged dish is turned down. FIGS. 4C and 4D show a state at the time of manufacturing the module 10a on which the pin header 1b is mounted. (C) corresponds to the cross section taken along the line bb in FIG. (D) is an enlarged view in a circle 31 in (C). As shown in FIG. 4, when the pin header 1b according to the second embodiment is mounted on the section to be the substrate 11 of each module 10a, the tip 3t of the front end 3f of the lead pin is connected to the front module 10a. It can be supported on the upper surface of the substrate 11 or the master substrate 20. That is, it is possible to maintain the tip 3t of the lead pin 3b in close contact with the surface of the substrate (11, 20) until the individual modules 10a are separated. Accordingly, for example, there is a very high possibility that the front end 3f of the lead pin 3b is bent upward by bending the tip 3t or that the downward stress is applied to the front end 3f and the front end 3f is bent downward. Lower. Therefore, the yield of the module 10a can be improved and cost reduction can be expected.

  The bent shape of the lead pin 3b is such that the lower surface 3fd of the front end portion 3f of the lead pin 3b, the lower surface 3rd of the rear end portion 3r, and the lower surface 2d of the header base 2 are bent in the vertical direction. The shape is not limited to the above-described dish shape, and may be an appropriate shape such as a “h (reverse V)” shape, a “reverse U shape” shape, or a “U” shape opening downward.

=== Other features ===
As a characteristic of the pin header (1, 1a, 1b) according to each embodiment, the bending structure of the lead pin (3, 3a, 3b) in the header base 2 has been mainly described. Below, the other characteristic in the pin header (1, 1a, 1b) in the Example of this invention is demonstrated.

<Recessed header base>
As shown in FIGS. 1, 2, and 4, the header base 2 of the pin header (1, 1a, 1b) is formed with a recess 4 that straddles the left and right end surfaces 2s and the lower surface 2d. The recess 4 is a portion to which an adhesive is applied when the header base 2 is bonded onto the surface of the substrate 11. For example, as shown in FIG. 1, even if there is a surplus in the applied adhesive 15, the surplus will escape outward from the left and right ends 2 s of the header base 2. Therefore, the adhesive is prevented from flowing to the lower surface 2d of the header base 2 and floating the header base 2.

  Further, in the conventional pin headers (1d, 1e) shown in FIGS. 7 and 8, since the header base 2 is bonded on the plane of the lower surface 2d, a small amount of adhesive is taken into consideration in consideration of the floating of the header base 2. It could only be applied. And since it adhere | attached the board | substrate 11 and planes, it was difficult to obtain big adhesive strength. If the adhesive strength is weak, when the pin header (1d, 1e) is mounted on the substrate 11 of the module (10d, 10e) by reflow soldering, the lead pins (3d, 3e) flow on the solder 14 in the molten state. There was a possibility that it could not be prevented reliably and the mounting position was shifted.

  On the other hand, in the pin header (1, 1a, 1b) provided with the recess 4 in the header base 2, since the adhesive is applied to the three-dimensional inner wall surface of the recess 4, the entire wall surface becomes an adhesive surface and the bonding area is expanded. can do. In addition, a sufficient amount of adhesive can be filled in the space in the recess 4. That is, the header base 2 and the substrate 11 can be bonded with greater strength.

<Header base groove structure>
Further, the pin header (1, 1a, 1b) of the present invention does not make the front end face of the header base 2 flat, but vertically on both left and right ends of the front end face as shown in FIGS. An extending edge 5 may be provided so as to protrude. FIG. 5 shows a diagram for explaining the function of the edge portion 5. The figure shows a state in which the module 10a is mounted on another substrate 40, and is a view when the module 10a is viewed from above. Due to the edge 5, the front end surface of the header base 2 has a groove shape that is wide on the left and right and short on the top and bottom in the planting region on the front end 3f side of the lead pins (3, 3a, 3b). Then, the module 10a is mounted on the other substrate 40, that is, the tip portion 3f of the lead pin (3, 3a, 3b) is inserted into the through hole formed in the other substrate 40, and the tip portion 3f. Is soldered to the other substrate 40, the front end of the edge portion 5 contacts the mounting surface 41 of the other substrate 40. At this time, the bottom 6b of the groove 6 of the pin header (1, 1a, 1b) is separated from the surface 41 of the other substrate 40. Then, it is possible to visually recognize the state in which the solder 50 climbs up to the lead pins (3, 3a, 3b) through the upper surface opening of the groove 6.

  In addition, since the gap between the bottom 6b of the groove 6 and the surface 41 of the other substrate 40 becomes a space where the solder 50 rises, the pin header (1, 1a, 1b) is urged backward by the solder 50 rising. Thus, the module 10a can be prevented from floating from the other substrate 40. Therefore, according to the pin header (1, 1a, 1b) provided with the edge 5, when the module 10a on which it is mounted is soldered to another substrate 40, the presence or absence of the soldering failure is confirmed. In addition, it is possible to improve the mounting reliability of the module 10a itself by securing a space for the solder to climb.

=== Mounting form of pin header ===
The pin header (1, 1a, 1b) in the embodiment of the present invention has a structure in which the lead pins (3, 3a, 3b) are bent in the header base 2 and are not exposed from the lower surface 2d of the header base 2. It has become. This structure is not limited to the case where the pin header (1, 1a, 1b) is surface-mounted, but the case where the pin header (1, 1a, 1b) is mounted perpendicularly to the substrate 11 by inserting the rear end 3r into a through hole or the like of the substrate 11. But it is effective. For example, even if the solder crawls up, the adjacent lead pins (3, 3a, 3b) are surely isolated from each other on the lower surface of the header base 2, so that a short circuit between the lead pins (3, 3a, 3b) can be prevented. . Further, since the lead pins (3, 3a, 3b) are bent in the header base 2 and the periphery thereof is firmly supported by the resin, the lead pins (3, 3a, 3b) are not easily removed. Therefore, the pin header (1, 1a, 1b) in the embodiment of the present invention is not limited to the surface mounting application.

  The present invention can be used for a SIP-type module such as a DC-DC converter or a collective resistor.

1, 1a, 1b SIP type module terminal (pin header) according to an embodiment of the present invention
1c-1e Conventional SIP module terminal 2 Resin member (header base)
3, 3a-3e Lead pin 3f One end of the lead pin (front end)
3r The other end (rear end) of the lead pin
3m Lead pin middle part 4 Recess 5 Adhesives 10a, 10c to 10e Electronic circuit parts (SIP type module)
11 Substrate 12 Electronic component 20 Master substrate 40 Other substrate

Claims (5)

  It is composed of a plurality of lead pins arranged in parallel on the left and right sides and a box-shaped resin member that holds the plurality of lead pins together in a state of being fixed by resin, and the lead pins penetrate the resin member in the front-rear direction. The front end portion and the rear end portion protrude from the front end surface and the rear end surface of the resin member, respectively, and the intermediate portion fixed in the resin member is vertically exposed so as not to be exposed to the outside of the resin member. The terminal is bent to be continuous with the front end portion and the rear end portion.   2. The lead pin according to claim 1, wherein the front end portion and the rear end portion of the lead pin protrude at a lower edge portion of the resin member, and the intermediate portion extends in a straight line from the front end portion and the rear end portion. Thus, the terminal is bent inside the resin member.   3. The terminal according to claim 1, wherein a concave portion for applying an adhesive is formed below each of the left and right side surfaces of the resin member and opens across the left and right side surfaces and the lower surface.   The terminal according to any one of claims 1 to 3, wherein the front end surface of the resin member is formed in a groove shape by an edge portion protruding forward while extending vertically at both left and right ends. An electronic circuit component in which the electronic component and the terminal according to any one of claims 1 to 4 are mounted on a substrate having a front-back, left-right direction as a surface,
The rear end of the lead pin is surface-mounted on the upper surface of the substrate in a state where the terminal is disposed so that the upper surface front edge of the substrate and the lower surface front edge of the resin member coincide with each other.
An electronic circuit component characterized by that.

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