JP2004227794A

JP2004227794A - Connection structure of tab to conductive material

Info

Publication number: JP2004227794A
Application number: JP2003010686A
Authority: JP
Inventors: Yuji Saka; 雄次阪
Original assignee: Sumitomo Wiring Systems Ltd
Current assignee: Sumitomo Wiring Systems Ltd
Priority date: 2003-01-20
Filing date: 2003-01-20
Publication date: 2004-08-12

Abstract

<P>PROBLEM TO BE SOLVED: To connect and fix a tab to a conductive material of a printed circuit board or a bus bar. <P>SOLUTION: A press contact part having both left and right widthwise side parts formed into a rhombic shape by bending them outward is formed on the lower root side of the tab formed of an elongated vertical flat plate; the press contact part is pressed into a tab press-contact hole bored in the conductive material of a printed circuit board or a bus bar to electrically connect the tab to the conductive material; the tab is erected vertically from the conductive material; in this form, a lower side part of the tab excluding an external terminal contact part on the upper side, and the conductive material are molded with a molten resin adhesive (hot-melt adhesive), or the lower side part of the tab is stuck to the upper end surface of the conductive material with the molten resin adhesive (hot-melt adhesive) to form an integrated member of the tab and the conductive material. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

【０００１】
【発明の属する技術分野】
本発明は、プリント基板やバスバー等の導電材とタブとの接続構造に関し、特に、自動車のワイヤハーネスに接続される分岐接続箱内に収容されるプリント基板の導電路と外部接続端子となるタブとの接続を半田なしで行うものである。
【０００２】
【従来の技術】
従来、図８に示すように、アッパーケース１とロアケース２とからなる分岐接続箱のケース内にプリント基板３を収容し、該プリント基板３の導電路４と他回路とを接続する場合、回路密度向上や外形肥大化を抑制するため、プリント基板３に穿設した貫通穴３ａに端子金具からなるタブ５の根元を貫通させて垂直方向に組みつけ、プリント基板３の裏面側で半田６で固定すると共に導電路４と電気接続している。これらタブ５はアッパーケース１内に突出させ、該アッパーケース１内にワイヤハーネスの端末に接続したコネクタ等のケースを嵌合し、該ケース内の雌端子あるいは圧接端子と上記タブとを嵌合して電気接続している。また、分岐接続箱のケース内部にバスバーを収容し、該バスバーに対して別個に形成したタブを垂直方向に接続している場合もあり、この場合もバスバーに穿設した貫通穴のタブの根元を通して半田接続している場合もある。
【０００３】
このように、プリント基板の導電路あるいはバスバーに対して垂直方向にタブを固定接続する場合は半田づけで行われているが、環境上の問題より鉛の使用低減化が要請されており、半田の鉛フリー化の開発が進められている。しかしながら、半田の鉛フリー化をしても、半田接続する場合には、プリント基板あるいはバスバーを半田槽に搬送して半田付けをしなければならず、工程数が増加してコストアップとなり、かつ、プリント基板やバスバーの端子穴に挿入したタブが不安定であると、信頼性の点で問題がある。
【０００４】
上記した問題に対して、半田付けを使用せずに機械的に接続する接続構造が特開平１０−２４１７５９号公報（特許文献１）で提案されている。
上記特許文献１の接続構造は、図９に示すように、プリント基板３’の導電路４’に切欠４ａ’を設け、タブ５’に面方向に働く圧縮バネ部５ａ’を設け、切欠４ａ’に側方からタブ５’を挿入すると、圧縮バネ部５ａ’が切欠４ａ’の内面の導電路４’に圧接する構成とし、タブに設けた圧縮バネ部５ａ’でプリント基板３’との固定と導電路４’との電気接続を図っている。
【０００５】
【特許文献１】
特開平１０−２４１７５９号公報
【０００６】
【発明が解決しようとする課題】
上記特許文献１の構造では、タブ５’をバネ接触だけでプリント基板に圧接保持しているだけであるため、取付強度に信頼性が低い問題もあり、特に、タブに相手方端子を嵌合接触した際に、タブが受ける外力が圧縮接バネ部に直接に伝わり、圧縮バネ部が切欠４ａ’より抜け出る恐れもある。
【０００７】
本発明は、上記した問題を解消し、半田なしでプリント基板にタブを垂直方向に強固に固定できると共に、該プリント基板の導電路とをタブとの電気接触も確実に行えるようにすることを課題としている。
【０００８】
【課題を解決するための手段】
上記課題を解決するため、本発明は、細長い垂直方向の平板からなるタブの下部根元側に、幅方向の左右両側部を外方へと拡幅させて菱形状とした圧接部を設け、該圧接部をプリント基板あるいはバスバーからなる導電材に穿設したタブ圧接穴に圧入して該タブと上記導電材とを電気接続すると共に、上記タブを導電材より垂直方向に立設し、この状態で該タブの上部側の外部端子接触部を除く下側部と上記導電材とを溶融樹脂接着剤（ホットメルト）でモールドし、或いは上記タブの下側部と上記導電材の上端面とを溶融樹接着剤（ホットメルト）で接着して、タブと導電材との一体化部材を設けていることを特徴とする導電材とタブとの接続構造を提供している。
【０００９】
上記のように、タブはプリント基板やバスバーからなる導電材と圧接した状態でホットメルトで接着して予め一体化部材とし、この状態でケース内部に収容している。このように、タブは導電材のタブ圧接穴に圧入して圧接接続させた状態でホットメルトにより強固に接着しているため、タブを相手方端子と嵌合した時に、この嵌合外力がホットメルトの硬化部およびプリント基板の絶縁基板部に負荷され、タブ圧接穴に圧入した圧接部には伝わらない。よって、タブと導電材との電気接続信頼性を高めることができる。
上記タブの左右両側に拡幅して菱形形状に設けた圧接部は、タブの幅方向の中央部を叩たき出しより設けて他の部位よりも剛性を低下させ、所要の可撓性を持たせている。なお、幅方向の中央部に切れ目を設けて左右を分離させ、この分離させた部分を“く”の字状に拡幅さてもよい。
上記タブは容易に縮径すると共に拡幅できるため、導電材のタブ圧接穴に圧入して、圧接部を導電材と電気接触させることができる。
かつ、導電材に穿設したタブ圧接穴に上方よりタブを圧入固定できるため、導電材の中間部の任意の位置にタブを垂直に接続でき、回路密度を高くした場合に十分に対応でき外形の肥大化を抑制できる。
【００１０】
上記タブは下部根元側の圧接部と上部側の外部端子接触部との間に、太幅とした後に段状に細幅としたホットメルト接着部を設けていると共に、該ホットメルト接着部の上部に下向きに拡径するテーパ部を備え、
上記一体化部材をアッパーケースとロアケース内に収容すると共に、該アッパーケースは上記一体化部材の上部にタブガイド用仕切壁を設け、該タブガイド用仕切壁に下向きに拡径するテーパ状のタブ貫通穴を設け、該タブ貫通穴に上記タブのテーパ部を位置させている。
【００１１】
上記のように、タブのホットメルト接着部に太幅とした後に細幅とした部分を設けているため、タブの圧接部の上部の細幅部の外周に接着剤が充填され、タブに負荷される外力を細幅部の外周に充填したホットメルト硬化部で受け止めることができ、圧接部に外力が確実に伝わらないよういできる。
さらに、タブをアッパーケースのタブガイド用仕切壁に設けたタブ貫通穴に貫通させ、かつ、タブ貫通穴を下向きに広がる形状とすると共にタブにテーパ部を設けているため、タブと相手方端子との嵌合時に、アッパーケースのタブガイド用仕切壁でも外力を受け止めることができると共に、タブを変形させずに真っすぐな垂直方向に立設されるようにガイドすることができる。その結果、相手方端子との嵌合時にタブに変形を発生させることなくスムーズな嵌合を行うことができる。
【００１２】
上記プリント基板では上記タブ圧接穴の内周面全面から上記プリント基板の絶縁基板の裏面あるいは／および表面側の導電材と接合する位置にかけてメッキを施して導電部を設け、該導電部を介して上記タブとプリント基板の導電材とを電気接続している。
上記メッキとしては銅メッキの表面に錫メッキあるいは半田メッキを施したものが好ましい。
上記構成とすると、プリント基板の絶縁基板の表面あるいは裏面のいずれか一方あるいは両方に導電材からなる回路を設けた場合に、タブと電気接続できる。
【００１３】
タブと電気接続するプリント基板は１層に限らず複数のプリント基板を積層して、これら複数のプリント基板とタブとをホットメルトで接着してもよい。この場合、積層したプリント基板の垂直方向に連続した位置にタブ圧接穴を設けておき、これらタブ圧接穴の上記メッキよりなる導電部を形成し、各プリント基板の導電材と電気接続させておくとと共に各層の導電部を接合しておくことにより、最上層のプリント基板のタブ圧接穴にタブの導電材接触部を圧入して接触させるだけで、複数枚のプリント基板の導電材を１つのタブに電気接続させることができ、立体的な電気接続の自由度を高めることができる。
さらに、積層したプリント基板のうち、タブと電気接続しないプリント基板があれば、タブ圧接穴の内面に設けた導電部と該プリント基板の導電材とを接続させなければ良いだけである。
【００１４】
【発明の実施の形態】
以下、本発明の実施形態を図面を参照して説明する。
図１乃至図４は第１実施形態を示し、分岐接続箱１０は図１に示すようにアッパーケース１１に複数のコネクタ収容部１９を並列に設けた構成で、アッパーケース１１とロアケース１２の内部に、プリント基板１３および該プリント基板１３に穿設したタブ圧接穴１７に根元部を圧入して垂直方向に立設したタブ１５とをホットメルト（溶融樹脂接着剤）でモールドした一体化部材２０を収容している。
【００１５】
タブ１５は、導電性金属板からなる細長い平板状で、細幅とした先端側の外部端子接触部１５ａと、該外部端子接触部１５ａの下端に段状と突出させた太幅部１５ｂ−１と細幅部１５ｂ−２を連続させたホットメルト接着部１５ｂと、該ホットメルト接着部１５ｂの下部に連続させた下部根元側の導電材接触部１５ｃとから構成している。即ち、プリント基板１３に垂直に立設固定した状態で、上部側に外部端子接触部１５ａ、中間部にホットメルト接着部１５ｂ、下部側に導電材接触部１５ｃを設けている。
【００１６】
上記外部端子接触部１５ａの下部は下向きに拡径したテーパ部１５ｄを設け、該テーパ部１５ｄの下端に段状に突出させた上記ホットメルト接着部１５ｂを連続させている。また、ホットメルト接着部１５ｂの下部の細幅部１５ｂ−２に連続する導電材接触部１５ｃは幅方向中央部を叩き出して左右両側部を外方へ“く”の字状に突出させ、全体として菱形形状の圧接部１５ｅを設けている。この圧接部１５ｅの下部に先端をテーパ状に縮径させた挿入端部１５ｆを設けている。
【００１７】
上記タブ１５の下部根元側を垂直方向に立設するプリント基板１３は、絶縁基板１３ａの表裏両面に導電路材を貼着あるいは接着して導電路１６を設け、かつ、導電路１６を貫通するタブ圧接穴１７を図１に示すように所定ピッチをあけて穿設している。これらタブ圧接穴１７の内周面には、図４に示すように、銅メッキの表面に錫メッキあるいは半田メッキを施して導電部１８を設け、該導電部１８の上下両端より絶縁基板１３ａ上の導電路１６と接合している。
【００１８】
上記プリント基板１３のタブ圧接穴１７にタブ１５の導電材接触部１５ｃを圧入し、圧接部１５ｅの突出端を導電材１８と圧接させて導電路１６と電気接続させ、かつ、プリント基板１３よりタブ１５を垂直に立設させている。
【００１９】
上記のように組みつけたタブ１５とプリント基板１３とは、ホットメルト２１でモールドして、大略直方体形状の一体化部材２０を予め設けている。タブ１５は太幅部１５ｂ−１の上端までモールドし、ホットメルト接着部１５ｂの太幅部１５ｂ−１と圧接部１５ｅの間の細幅部１５ｂ−２の外周にホットメルトからなる外力受け部２１ａを設けている。
【００２０】
プリント基板１３も上下面および側面を含む全体をホットメルト２１でモールドし、タブ圧接穴１７より突出するタブ１５の挿入端部１５ｆもモールドしている。このように予め一体化部材２０を設け、タブ１５とプリント基板１３の導電路１６との電気接続状態を固定していると共に、タブ１５をプリント基板１３から立設した状態で固定している。
【００２１】
このように、プリント基板１３とタブ１５とをホットメルト２０でモールドした一体化部材２０は、アッパーケース１１の内部に収容した状態でロアケース１２を被せてケース内部に収容している。
詳しくは、アッパーケース１１には、ロアケース１２に内嵌する側壁１１ａを備えると共に、コネクタ収容部１９の底壁を兼ねるタブガイド用仕切用壁１１ｂを備えている。該タブガイド用仕切壁１１ｂの下部に一体化部材２０の収容部とすると共に、タブガイド用仕切壁１１ｂに下向きに拡径するタブ貫通穴１１ｃを穿設している。このタブ貫通穴１１ｃに一体化部材２０より突出したタブ１５を下方から貫通させ、タブ１５のテーパ部１５ｄをタブ貫通穴１１ｃ内に位置させている。
【００２２】
上記構成からなる分岐接続箱１０では、アッパーケース１１のタブガイド用仕切壁１１ｂの上部のコネクタ収容部１９に、ワイヤハーネス端末に接続されたコネクタ（図示せず）が嵌合され、該コネクタ内の雌端子がタブ１５の外部端子接触部１５ａに嵌合され、プリント基板１３の導電路１６はタブ１５を介してワイヤハーネスに接続される。
【００２３】
上記コネクタの嵌合時に負荷される外力は、ホットメルト接着部１５ｂと圧接部１５ｅの間の細幅部１５ｂ−２の外周に充填された外力受け部２１ａおよびプリント基板１３の絶縁基板１３ａの表面で受け止められ、プリント基板１３と圧接する導電材接触部１５ｃには伝わらない。よって、タブ１５とプリント基板１３の導電路１６との電気接続信頼性を高めることができる。
【００２４】
また、プリント基板１３の任意の中間位置にタブ圧接穴１７を設け、タブ１５を上方より圧入固定できるため、回路密度を高めることができると共に、分岐接続箱１０の肥大化を抑制できる。かつ、タブ１５をプリント基板１３の導電路１６と半田なしで簡単に圧入固定することができ、工数削減によりコスト低下を図ることができる。
【００２５】
さらに、プリント基板１３とタブ１５とをホットメルト２１でモールドしているが、このモールド時の成形温度および圧力は低いため、プリント基板１３のタブ圧接穴１７内でのタブ１５の圧接部１５ｅとの圧接に影響を与えない。
【００２６】
図５は第２実施形態を示す。
第２実施形態では、プリント基板１３を３枚積層している。これら積層するプリント基板１３Ａ、１３Ｂ、１３Ｃに垂直位置にタブ圧接穴１７Ａ、１７Ｂ、１７Ｃを貫通させて穿設し、かつ、これらタブ圧接穴の内周面からプリント基板の表面に導電路１６に連続する導電部１８’を銅メッキにより設けている。この導電部１８’により３層のプリント基板の導電路１６を電気接続している。
【００２７】
タブ１５は第１実施形態と同様な形状であり、最上層のプリント基板１３Ａのタブ圧接穴１７Ａに圧入して導電部１８’と圧接により電気接続している。
上記のように３層積層したプリント基板にタブ１５を立設した状態でホットメルトでモールドして一体化部材２０’を設けている。
【００２８】
上記構成とすると、１つのタブ１５に積層した３層のプリント基板の導電路を電気接続することができる。
なお、プリント基板は３層に限らないことは言うまでもない。
また、例えば、３層積層したプリント基板のうち、中間層のプリント基板１３Ｂの導電路１６をタブ１５と接続しない場合は、該プリント基板１３Ｂのタブ圧接穴１７Ｂの導電部１８’にプリント基板１３Ｂの導電路を接合させていない。
【００２９】
図６は第３実施形態を示す。
該第３実施形態の分岐接続箱１０’では、プリント基板１３とタブ１５とをホットメルト２１でモールドせず、タブ１５のホットメルト接着部１５ｂの外周面とプリント基板１３の上面とをホットメルト２１で接着して、一体化部材２０”を設けている。
タブ１５の形状、プリント基板１３の構成等の他の構成と同様であり、かつ、作用効果も第１実施形態と同様であるため説明を省略する。
【００３０】
図７は第４実施形態を示す。
第４実施形態はタブ１５と接続する導電材を、プリント基板に変えてバスバー３０としている点で第１、２実施形態と相違させている。バスバー３０に穿設したタブ圧接穴３０ａにタブ１５の圧接部１５ｅを圧入して電気接続した状態で、タブ１５とバスバー３０とをホットメルト２１でモールドして、一体化部材２０’を設けている。
タブ１５の形状およびアッパーケース、ロアケースの形状は第１実施形態と同様であり、かつ作用効果も同様であるため、説明を省略する。
【００３１】
【発明の効果】
以上の説明より明らかなように、本発明では、プリント基板やバスバーからなる導電材のタブ圧接穴にタブの圧接部を上方より圧入するだけで圧接接続でき、かつ、この状態で導電材とタブとをホットメルトでモールド或いは部分的に接着し、予め一体化部材として強固に固定しているため、導電材と接続した状態で強固に垂直保持することができる。よって、従来必要とされていたタブと導電材との半田づけを無くすことができ、環境上の要請に応えることができると共に、半田工程の削減でコスト低下も図ることができる。
【００３２】
さらに、タブはホットメルトでプリント基板あるいはバスバーに固着しているため、該タブに外部回路の端子を嵌合接続した際に負荷される嵌合外力はホットメルトの硬化部および導電材の全体に負荷され、導電材とタブとの圧接部には外力は伝わらないため、導電材とタブとの電気接続信頼性を高めることができる。
なお、ホットメルトは成形温度および圧力は低いため、ホットメルトでモールドしてもタブと導電材との接触部に影響を与えない。
【００３３】
さらにまた、導電材の中間部の任意の位置にタブ圧接穴を穿設してタブを圧接接続させることができるため、回路密度の向上および外形の肥大化抑制も図ることができる等の種々の利点を有するものである。
【図面の簡単な説明】
【図１】本発明の第１実施形態の斜視図である。
【図２】図１のＩ−Ｉ線断面図である。
【図３】タブの拡大図である。
【図４】（Ａ）はプリント基板のタブ圧接穴を示す拡大断面図、（Ｂ）はタブ圧接穴にタブが圧入された状態を示す拡大断面図である。
【図５】第２実施形態の断面図である。
【図６】第３実施形態を示す断面図である。
【図７】第４実施形態を示す断面図である。
【図８】従来例を示し、（Ａ）は平面図、（Ｂ）は断面図である。
【図９】他の従来例を示す斜視図である。
【符号の説明】
１０分岐接続箱
１１アッパーケース
１１ｂタブガイド用仕切壁
１１ｃタブ貫通穴
１２ロアケース
１３プリント基板
１５タブ
１５ａ外部端子接触部
１５ｂホットメルト接着部
１５ｃ導電材接触部
１５ｄテーパ部
１５ｅ圧接部
１６導電路
１７タブ圧接穴
１８導電材
１９コネクタ収容部
２０一体化部材
２１ホットメルト
３０バスバー[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a connection structure between a conductive material such as a printed circuit board or a bus bar and a tab, and in particular, a conductive path of a printed circuit board housed in a branch connection box connected to a wire harness of an automobile and a tab serving as an external connection terminal. Is connected without soldering.
[0002]
[Prior art]
Conventionally, as shown in FIG. 8, when a printed circuit board 3 is accommodated in a case of a branch connection box composed of an upper case 1 and a lower case 2 and a conductive path 4 of the printed circuit board 3 is connected to another circuit, In order to increase the density and suppress the enlargement of the outer shape, the base of the tab 5 made of a terminal fitting is penetrated into the through hole 3 a formed in the printed circuit board 3, and is vertically assembled. It is fixed and electrically connected to the conductive path 4. These tabs 5 protrude into the upper case 1, a case such as a connector connected to a terminal of a wire harness is fitted into the upper case 1, and the female terminal or the press contact terminal in the case is fitted to the tab. And make an electrical connection. In some cases, a bus bar is housed inside the case of the branch connection box, and a separately formed tab is connected to the bus bar in the vertical direction. In this case as well, the base of the tab of the through hole formed in the bus bar is also provided. In some cases, the solder connection is made.
[0003]
As described above, when the tab is fixedly connected to the conductive path or the bus bar of the printed circuit board in the vertical direction, soldering is performed. However, due to environmental problems, the use of lead is required to be reduced. The development of lead-free is being promoted. However, even if the solder is made lead-free, in the case of solder connection, the printed circuit board or bus bar must be transported to the solder tank and soldered, which increases the number of steps and increases the cost, and If a tab inserted into a terminal hole of a printed circuit board or a bus bar is unstable, there is a problem in reliability.
[0004]
To solve the above problem, a connection structure for mechanically connecting without using soldering has been proposed in Japanese Patent Laid-Open No. Hei 10-241759 (Patent Document 1).
In the connection structure of Patent Document 1, as shown in FIG. 9, a notch 4a 'is provided in a conductive path 4' of a printed circuit board 3 ', and a compression spring portion 5a' acting in the surface direction is provided in a tab 5 '. When the tab 5 'is inserted into the notch 4' from the side, the compression spring portion 5a 'comes into pressure contact with the conductive path 4' on the inner surface of the notch 4a ', and the compression spring portion 5a' provided on the tab makes contact with the printed circuit board 3 '. The electrical connection between the fixing and the conductive path 4 'is achieved.
[0005]
[Patent Document 1]
JP-A-10-241759
[Problems to be solved by the invention]
In the structure of Patent Document 1, since the tab 5 'is merely pressed and held on the printed circuit board only by the spring contact, there is a problem that the mounting strength is low in reliability. In this case, the external force received by the tab is directly transmitted to the compression contact spring portion, and the compression spring portion may fall out of the notch 4a '.
[0007]
The present invention has been made to solve the above-described problems, and it is possible to firmly fix a tab to a printed circuit board in a vertical direction without soldering, and to make sure that a conductive path of the printed circuit board can be electrically contacted with the tab. It is an issue.
[0008]
[Means for Solving the Problems]
In order to solve the above-mentioned problem, the present invention provides a pressure contact portion having a rhombic shape by widening both left and right sides in the width direction outward on the lower root side of a tab formed of an elongated vertical flat plate, The part is press-fitted into a tab press-contact hole formed in a conductive material made of a printed circuit board or a bus bar to electrically connect the tab and the conductive material, and the tab is erected vertically from the conductive material. The lower portion of the tab except the external terminal contact portion and the conductive material are molded with a molten resin adhesive (hot melt), or the lower portion of the tab and the upper end surface of the conductive material are melted. There is provided a connection structure between a conductive material and a tab, wherein an integrated member of the tab and the conductive material is provided by bonding with a tree adhesive (hot melt).
[0009]
As described above, the tab is bonded to a conductive material such as a printed circuit board or a bus bar with a hot melt in a state where the tab is pressed against the conductive material to form an integrated member in advance, and is housed inside the case in this state. As described above, since the tab is firmly bonded by hot melt in a state where the tab is press-fitted into the tab press-contact hole of the conductive material and pressed and connected, when the tab is fitted to the mating terminal, the external force of the hot melt is applied. And is not transmitted to the press-contact portion press-fitted into the tab press-contact hole. Therefore, the electrical connection reliability between the tab and the conductive material can be improved.
The press-contact portions, which are widened on the right and left sides of the tab and provided in a rhombic shape, are provided by tapping out the center portion in the width direction of the tab to reduce rigidity more than other portions and to have required flexibility. ing. Note that a cut may be provided at the center in the width direction to separate the left and right, and the separated portion may be widened in the shape of a “ku”.
Since the tab can be easily reduced in diameter and widened, the tab can be press-fitted into the tab press-contact hole of the conductive material to make the press-contact portion electrically contact the conductive material.
In addition, since the tab can be press-fitted from above into the tab press-contact hole formed in the conductive material, the tab can be connected vertically to any position in the middle part of the conductive material, and it can sufficiently cope with high circuit density. Enlargement can be suppressed.
[0010]
The tab is provided with a hot-melt adhesive portion having a large width and then a stepwise narrow width between the press-contact portion on the lower root side and the external terminal contact portion on the upper side, and the hot-melt adhesive portion of the hot-melt adhesive portion is provided. Equipped with a tapered section that expands downward at the top,
The integrated member is accommodated in an upper case and a lower case, and the upper case is provided with a partition wall for tab guide on the upper part of the integrated member, and a tapered tab that expands downward in the partition wall for tab guide. A through hole is provided, and the tapered portion of the tab is located in the tab through hole.
[0011]
As described above, since the hot melt adhesive portion of the tab is provided with a narrow portion after having a large width, the outer periphery of the narrow portion above the pressure contact portion of the tab is filled with an adhesive, and the tab is loaded. The external force to be applied can be received by the hot melt hardened portion filled in the outer circumference of the narrow width portion, and the external force can be reliably prevented from being transmitted to the press contact portion.
Furthermore, since the tab penetrates the tab through hole provided in the tab guide partition wall of the upper case, and the tab through hole has a shape that spreads downward and the tab has a tapered portion, the tab and the counterpart terminal At the time of fitting, the external force can be received even by the tab guide partition wall of the upper case, and the guide can be guided so as to be erected in a straight vertical direction without deforming the tab. As a result, smooth fitting can be performed without causing deformation of the tab when fitting with the counterpart terminal.
[0012]
It said conductive portions backside or / and toward position of bonding to the surface side of the conductive material by plating the inner from the peripheral surface entire surface of the printed circuit board insulating substrate of the tab pressing hole provided in the printed circuit board, through the conductive portion The tab is electrically connected to the conductive material of the printed circuit board.
The plating is preferably a copper plating having tin plating or solder plating on the surface.
With the above configuration, when a circuit made of a conductive material is provided on one or both of the front surface and the back surface of the insulating substrate of the printed circuit board, the circuit can be electrically connected to the tab.
[0013]
The printed circuit board electrically connected to the tab is not limited to one layer, and a plurality of printed circuit boards may be laminated, and the plurality of printed circuit boards and the tab may be bonded by hot melt. In this case, tab press contact holes are provided at positions that are continuous in the vertical direction of the stacked printed circuit boards, and conductive portions made of the plating of the tab press contact holes are formed, and are electrically connected to the conductive material of each printed circuit board. By joining the conductive parts of each layer together with the conductive material contact part of the tab to the tab press-contact hole of the uppermost printed circuit board and making contact therewith, the conductive material of the plurality of printed circuit boards is The tab can be electrically connected, and the degree of freedom of three-dimensional electric connection can be increased.
Furthermore, if there is a printed circuit board that is not electrically connected to the tab among the stacked printed circuit boards, it is only necessary to connect the conductive portion provided on the inner surface of the tab press-contact hole to the conductive material of the printed circuit board.
[0014]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIGS. 1 to 4 show a first embodiment, in which a branch connection box 10 has a configuration in which a plurality of connector housings 19 are provided in parallel in an upper case 11 as shown in FIG. And an integrated member 20 formed by molding a printed board 13 and a tab 15 which is press-fitted at its root into a tab press-contact hole 17 formed in the printed board 13 and which is vertically erected with hot melt (fused resin adhesive). Is housed.
[0015]
The tab 15 is an elongated flat plate made of a conductive metal plate, and has a narrow external terminal contact portion 15a on the distal end side, and a large width portion 15b-1 projecting stepwise from the lower end of the external terminal contact portion 15a. And a narrow width portion 15b-2, and a hot melt adhesive portion 15b, and a conductive material contact portion 15c on the lower root side continuous below the hot melt adhesive portion 15b. That is, in a state of being vertically mounted and fixed to the printed circuit board 13, an external terminal contact portion 15a is provided on an upper portion, a hot melt adhesive portion 15b is provided on an intermediate portion, and a conductive material contact portion 15c is provided on a lower portion.
[0016]
The lower portion of the external terminal contact portion 15a is provided with a tapered portion 15d whose diameter is increased downward, and the hot melt adhesive portion 15b projecting stepwise from the lower end of the tapered portion 15d is connected. In addition, the conductive material contact portion 15c which is continuous with the narrow portion 15b-2 under the hot melt adhesive portion 15b strikes out the center in the width direction, and the left and right side portions are outwardly protruded in the shape of "", A pressure contact portion 15e having a diamond shape as a whole is provided. An insertion end 15f having a tapered distal end is provided below the press-contact portion 15e.
[0017]
The printed circuit board 13 having the lower root side of the tab 15 erected in the vertical direction is provided with a conductive path 16 by attaching or bonding a conductive path material to both front and back surfaces of the insulating substrate 13a, and penetrates the conductive path 16. The tab press-contact holes 17 are formed at a predetermined pitch as shown in FIG. As shown in FIG. 4, conductive portions 18 are provided on the inner peripheral surfaces of the tab press-contact holes 17 by applying tin plating or solder plating to the surface of copper plating. With the conductive path 16.
[0018]
The conductive material contact portion 15 c of the tab 15 is press-fitted into the tab press-contact hole 17 of the printed circuit board 13, the protruding end of the press-contact portion 15 e is pressed against the conductive material 18 to be electrically connected to the conductive path 16, and The tab 15 is erected vertically.
[0019]
The tab 15 and the printed circuit board 13 assembled as described above are molded with a hot melt 21 and an integrated member 20 having a substantially rectangular parallelepiped shape is provided in advance. The tab 15 is molded to the upper end of the wide portion 15b-1, and an external force receiving portion made of hot melt is formed on the outer periphery of the narrow portion 15b-2 between the wide portion 15b-1 and the press-contact portion 15e of the hot melt adhesive portion 15b. 21a is provided.
[0020]
The entire printed circuit board 13 including the upper and lower surfaces and side surfaces is molded with the hot melt 21, and the insertion end 15 f of the tab 15 projecting from the tab press-contact hole 17 is also molded. As described above, the integrated member 20 is provided in advance, and the electrical connection between the tab 15 and the conductive path 16 of the printed board 13 is fixed, and the tab 15 is fixed while standing upright from the printed board 13.
[0021]
As described above, the integrated member 20 in which the printed board 13 and the tab 15 are molded with the hot melt 20 is housed inside the upper case 11 with the lower case 12 covered.
More specifically, the upper case 11 includes a side wall 11 a that fits inside the lower case 12, and a tab guide partition wall 11 b that also serves as a bottom wall of the connector housing 19. A tab through hole 11c is formed in the lower part of the tab guide partition wall 11b to accommodate the integrated member 20 and to extend downward in the tab guide partition wall 11b. The tab 15 protruding from the integrated member 20 penetrates through the tab through hole 11c from below, and the tapered portion 15d of the tab 15 is located in the tab through hole 11c.
[0022]
In the branch connection box 10 having the above configuration, a connector (not shown) connected to the wire harness terminal is fitted into the connector accommodating portion 19 above the tab guide partition wall 11b of the upper case 11, and the inside of the connector is Are fitted into the external terminal contact portions 15a of the tabs 15, and the conductive paths 16 of the printed circuit board 13 are connected to the wire harness via the tabs 15.
[0023]
The external force applied at the time of mating of the connector is the external force receiving portion 21a filled in the outer periphery of the narrow portion 15b-2 between the hot melt adhesive portion 15b and the press contact portion 15e, and the surface of the insulating substrate 13a of the printed circuit board 13. , And is not transmitted to the conductive material contact portion 15 c which is in pressure contact with the printed circuit board 13. Therefore, the reliability of the electrical connection between the tab 15 and the conductive path 16 of the printed circuit board 13 can be improved.
[0024]
Further, since the tab press-contact hole 17 is provided at an arbitrary intermediate position of the printed circuit board 13 and the tab 15 can be press-fitted from above, the circuit density can be increased, and the enlargement of the branch connection box 10 can be suppressed. Further, the tab 15 can be easily press-fitted and fixed to the conductive path 16 of the printed circuit board 13 without soldering, and the cost can be reduced by reducing the number of steps.
[0025]
Further, although the printed board 13 and the tab 15 are molded with the hot melt 21, the molding temperature and pressure during this molding are low, so that the press-contact portion 15e of the tab 15 in the tab press-contact hole 17 of the printed board 13 is formed. Does not affect the pressure welding.
[0026]
FIG. 5 shows a second embodiment.
In the second embodiment, three printed circuit boards 13 are stacked. Tab press-contact holes 17A, 17B, and 17C are pierced and penetrated at vertical positions in the printed circuit boards 13A, 13B, and 13C to be laminated, and conductive paths 16 are formed from the inner peripheral surface of the tab press-contact holes to the surface of the printed circuit board. A continuous conductive portion 18 'is provided by copper plating. The conductive portions 18 'electrically connect the conductive paths 16 of the three-layer printed circuit board.
[0027]
The tab 15 has the same shape as that of the first embodiment, and is press-fitted into the tab press-contact hole 17A of the uppermost printed circuit board 13A to be electrically connected to the conductive portion 18 'by press-contact.
As described above, the integrated member 20 'is provided by molding with a hot melt in a state where the tabs 15 are erected on the printed circuit board in which three layers are stacked.
[0028]
With the above configuration, the conductive paths of the three-layer printed circuit board stacked on one tab 15 can be electrically connected.
Needless to say, the printed circuit board is not limited to three layers.
For example, when the conductive path 16 of the printed circuit board 13B of the intermediate layer is not connected to the tab 15 in the printed circuit board of three layers, the printed circuit board 13B is inserted into the conductive portion 18 'of the tab press-contact hole 17B of the printed circuit board 13B. Are not joined.
[0029]
FIG. 6 shows a third embodiment.
In the branch junction box 10 ′ of the third embodiment, the printed board 13 and the tab 15 are not molded with the hot melt 21, and the outer peripheral surface of the hot melt bonding portion 15 b of the tab 15 and the upper surface of the printed board 13 are hot melted. 21 to provide an integrated member 20 ″.
The configuration is the same as that of the other configuration such as the shape of the tab 15 and the configuration of the printed circuit board 13, and the operation and effect are the same as those of the first embodiment, and thus description thereof will be omitted.
[0030]
FIG. 7 shows a fourth embodiment.
The fourth embodiment is different from the first and second embodiments in that the conductive material connected to the tab 15 is changed to a printed circuit board and the bus bar 30 is used. The tab 15 and the bus bar 30 are molded with the hot melt 21 in a state where the press contact portion 15e of the tab 15 is press-fitted into the tab press contact hole 30a formed in the bus bar 30, and the integrated member 20 'is provided. I have.
The shape of the tab 15 and the shapes of the upper case and the lower case are the same as those of the first embodiment, and the operation and effect are also the same.
[0031]
【The invention's effect】
As is apparent from the above description, in the present invention, it is possible to press-connect only by pressing the press-contact portion of the tab into the tab press-contact hole of the conductive material formed of the printed board or the bus bar, and in this state, the conductive material and the tab are connected. Are molded or partially adhered by hot melt and firmly fixed as an integrated member in advance, so that they can be firmly held vertically while connected to a conductive material. Therefore, soldering between the tab and the conductive material, which has been required conventionally, can be eliminated, so that it is possible to meet environmental requirements and to reduce costs by reducing the number of soldering steps.
[0032]
Further, since the tab is fixed to the printed circuit board or the bus bar by hot melt, an external force applied when the terminal of the external circuit is fitted and connected to the tab is applied to the hardened portion of the hot melt and the entire conductive material. Since an external force is not transmitted to the press-contact portion between the conductive material and the tab, the reliability of the electrical connection between the conductive material and the tab can be improved.
Since the hot melt has a low molding temperature and pressure, the hot melt does not affect the contact between the tab and the conductive material.
[0033]
Furthermore, since a tab press-contact hole can be formed at an arbitrary position in the middle portion of the conductive material and the tab can be connected by press-contact, it is possible to improve the circuit density and suppress the enlargement of the outer shape. It has advantages.
[Brief description of the drawings]
FIG. 1 is a perspective view of a first embodiment of the present invention.
FIG. 2 is a sectional view taken along line II of FIG.
FIG. 3 is an enlarged view of a tab.
FIG. 4A is an enlarged cross-sectional view showing a tab press-contact hole of a printed circuit board, and FIG. 4B is an enlarged cross-sectional view showing a state where a tab is press-fitted into the tab press-contact hole.
FIG. 5 is a cross-sectional view of the second embodiment.
FIG. 6 is a sectional view showing a third embodiment.
FIG. 7 is a sectional view showing a fourth embodiment.
8A and 8B show a conventional example, in which FIG. 8A is a plan view and FIG. 8B is a cross-sectional view.
FIG. 9 is a perspective view showing another conventional example.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 10 Branch connection box 11 Upper case 11b Partition wall 11c for tab guide Tab through hole 12 Lower case 13 Printed circuit board 15 Tab 15a External terminal contact part 15b Hot melt adhesion part 15c Conductive material contact part 15d Taper part 15e Pressure contact part 16 Conductive path 17 Tab Pressure contact hole 18 Conductive material 19 Connector housing 20 Integrated member 21 Hot melt 30 Bus bar

Claims

On the lower root side of a tab made of a long and thin vertical plate, a rhombus-shaped pressure contact portion is provided by widening the left and right sides in the width direction outward, and the pressure contact portion is formed on a conductive material made of a printed circuit board or a bus bar. The tab and the conductive material are electrically connected by press-fitting into the drilled tab press-contact hole, and the tab is erected vertically from the conductive material. In this state, the external terminal contact portion on the upper side of the tab is formed. The lower part except the above and the conductive material are molded with a molten resin adhesive (hot melt), or the lower part of the tab and the upper end surface of the conductive material are bonded with a molten resin adhesive (hot melt). A connection structure between the conductive material and the tab, wherein an integrated member of the tab and the conductive material is provided.

The tab is provided with a hot-melt adhesive portion having a large width and then a stepwise narrow width between the press-contact portion on the lower root side and the external terminal contact portion on the upper side, and the hot-melt adhesive portion of the hot-melt adhesive portion is provided. Equipped with a tapered section that expands downward at the top,
The integrated member is accommodated in an upper case and a lower case, and the upper case is provided with a partition wall for tab guide on the upper part of the integrated member, and a tapered tab that expands downward in the partition wall for tab guide. 2. The connection structure between a conductive material and a tab according to claim 1, wherein a through hole is provided, and the tapered portion of the tab is located in the tab through hole.

It said conductive portions backside or / and toward position of bonding to the surface side of the conductive material by plating the inner from the peripheral surface entire surface of the printed circuit board insulating substrate of the tab pressing hole provided in the printed circuit board, through the conductive portion 3. The connection structure according to claim 1, wherein the tab is electrically connected to the conductive material of the printed circuit board.