CN204711363U - Wave soldering tool and welding structure - Google Patents
Wave soldering tool and welding structure Download PDFInfo
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- CN204711363U CN204711363U CN201520256105.3U CN201520256105U CN204711363U CN 204711363 U CN204711363 U CN 204711363U CN 201520256105 U CN201520256105 U CN 201520256105U CN 204711363 U CN204711363 U CN 204711363U
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- solder flux
- out parts
- wave soldering
- hollow
- soldering tool
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Abstract
The utility model provides a kind of wave soldering tool.Described wave soldering tool comprises body, multiple hollow-out parts and solder flux and guides module, described multiple openwork part is distributed in described body, described solder flux guides module to close on described hollow-out parts and arranges, and solder flux described in the edge mate of described hollow-out parts guides module to surround receiving space.The scolding tin bad connection rate of described pin is reduced to 0% by the wave soldering tool that the utility model provides, and avoids scolding tin to assemble, also reduces the human cost of production while improving the quality of products.The utility model also provides a kind of Welding Structure using the wave-soldering of described wave soldering tool simultaneously.
Description
Technical field
The utility model relates to welding equipment technical field of automatic control, particularly, relates to a kind of wave soldering tool and uses the welding structure of described wave soldering tool.
Background technology
Along with the development of optical transport technology, optical fiber is applied in the life of people more and more as signal transmission means.Optical transceiver module interface module may be used for the conversion of photosignal, is the fiber products that fiber optic communication field is conventional.
In DIP (Dual In-line Package) the wave soldering process of optical transceiver module interface module, the pin welding that often there will be optical transceiver module interface module connects tin phenomenon.The solution of current routine has:
One, weld by optical transceiver module interface module pin is cut short, reduce pin and connect tin fraction defective; It is too short that its weak point is that optical transceiver module interface module pin goes out pin, and pin welding spot reliability can not be guaranteed, and easily causes optical transceiver module interface module performance bad, and connect tin rate still up to about 50%.
Two, solid scaling powder in adopting activity stronger, reduces pin and connects tin fraction defective; Residual many after being wave soldering, the sticky hands of its weak point, need 100% cleaning, client and user will not accept, and connect tin rate still up to about 50%.
In addition, after product occurs connecting tin phenomenon, normally adopt artificial mode to be processed, this can increase again the human cost in production process.
Utility model content
In order to solve the problems of the technologies described above, the utility model embodiment discloses a kind of wave soldering tool and welding structure.
A kind of wave soldering tool, comprise body, multiple hollow-out parts and solder flux guiding module, described multiple openwork part is distributed in described body, and described solder flux guides module to close on described hollow-out parts and arranges, and solder flux described in the edge mate of described hollow-out parts guides module to surround receiving space.
In the utility model one preferred embodiment, described solder flux guiding module is the sheet material that metal or ceramic material process.
In the utility model one preferred embodiment, described solder flux guiding module is U-shaped structure, and described U-shaped structural edge coordinates the edge of described hollow-out parts to surround receiving space.
In the utility model one preferred embodiment, described body comprises the supporting surface being formed at described body one side surface, and described hollow-out parts runs through described supporting surface, and described solder flux guiding module is fixed on described supporting surface.
In the utility model one preferred embodiment, described hollow-out parts comprises multiple through hole, and described multiple through hole array distribution is in described body.
In the utility model one preferred embodiment, the quantity of described solder flux guiding module is multiple, and it is corresponding described multiple through hole setting respectively.
A kind of welding structure, comprise optical transceiver module interface module, circuit board and wave soldering tool, described circuit board surface is located at by described optical transceiver module interface module, described wave soldering tool comprises: body, described body comprises the supporting surface being formed at described body one side surface, and described circuit board is stacked at the supporting surface of described body; And hollow-out parts, described openwork part is distributed in described body, and described wave soldering tool also comprises solder flux guiding module, and described solder flux guiding module closes on described hollow-out parts and arranges, and coordinates described hollow-out parts to form receiving space.
In the utility model one preferred embodiment, described solder flux guiding module is fixed on the supporting surface of described body, and between described body and described circuit board.
In the utility model one preferred embodiment, described circuit board surface arranges multiple welding hole, and described optical transceiver module interface module is inserted in described welding hole.
In the utility model one preferred embodiment, described hollow-out parts comprises multiple through hole, and the quantity of described solder flux guiding module is multiple, and with the through hole of described hollow-out parts and welding hole is corresponding arranges.
In the welding structure that the utility model provides, described wave soldering tool comprises hollow-out parts and closes on the solder flux guiding module of described hollow-out parts setting, described solder flux guiding module coordinates with hollow-out parts and surrounds the receiving terminal that receiving space surrounds optical transceiver module interface module, thus in wave soldering process, liquid solder unnecessary for described optical transceiver module interface module pin surface is guided to described solder flux guiding module surface and the scolding tin bad connection rate of described pin is reduced to 0%, avoid scolding tin to assemble, while improving the quality of products, also reduce the human cost of production.
Accompanying drawing explanation
In order to be illustrated more clearly in the technical scheme in the utility model embodiment, below the accompanying drawing used required in describing embodiment is briefly described, apparently, accompanying drawing in the following describes is only embodiments more of the present utility model, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings, wherein:
Fig. 1 is the side schematic view of welding structure one preferred embodiment that the utility model provides;
Fig. 2 is the floor map of the medium wave peak of welding structure shown in Fig. 1 welding fixture.
Detailed description of the invention
Be clearly and completely described to the technical scheme in the utility model embodiment below, obviously, described embodiment is only a part of embodiment of the present utility model, instead of whole embodiments.Based on the embodiment in the utility model, those of ordinary skill in the art are not making other embodiments all obtained under creative work prerequisite, all belong to the scope of the utility model protection.
Please refer to Fig. 1 and Fig. 2, wherein Fig. 1 is the side schematic view of welding structure one preferred embodiment that the utility model provides, and Fig. 2 is the floor map of the medium wave peak of welding structure shown in Fig. 1 welding fixture.The welding structure 100 that the utility model provides is applied to and the pin of optical transceiver module interface module is fixedly welded on corresponding circuit board.The welding structure 100 of described wave-soldering comprises wave soldering tool 1, circuit board 3 and optical transceiver module interface module 5.Described circuit board 3 is folded establishes the surface being fixed on described wave soldering tool 1, and described circuit board 3 is the circuit board for fixed light transceiver module interface module 5, its surface arranges multiple welding hole (sign), the pin one_to_one corresponding of described welding hole and described optical transceiver module assembly 5.Described optical transceiver module interface module 5 is fixedly welded on described circuit board 3 by described wave soldering tool 1.
Described wave soldering tool 1 comprises body 11, hollow-out parts 13 and solder flux guiding module 15.Described hollow-out parts 13 is formed at described body 11, and described solder flux guiding module 15 closes on described hollow-out parts 13 and arranges, and coordinates the receiving space 17 that described hollow-out parts 13 surrounds.
Described body 11 entirety structure in the form of sheets, the structure of its shape and product to be welded reaches unanimity.Described body 11 comprises the supporting surface 111 being formed at described body one side surface.Described supporting surface 111 supports described circuit board 3, is aided with fastening assembly (sign) simultaneously and described circuit board 3 is fixed on described body 1, be convenient to the carrying out of welding procedure, and avoid the temperature distortion of described circuit board 3.
Described hollow-out parts 13 point is laid in described body 1 according to the designing requirement of described circuit board 3.Described hollow-out parts 13 comprises multiple through hole 131, and described multiple through hole 131 array distribution is in described body 11.And described through hole 131 is corresponding with the welding hole on described circuit board 3 surface arranges.
The sheet material that described solder flux guiding module 15 can process for metal or ceramic material.Preferably, described solder flux guiding module 15 is U-shaped structure, and described U-shaped structural edge coordinates the edge of described hollow-out parts 13 to surround receiving space 17.The quantity of described solder flux guiding module 15 can be multiple, with the through hole 131 of described hollow-out parts 13 and welding hole is corresponding arranges.Described solder flux guiding module 15 is fixed on the supporting surface 111 of described body 11, that is, in described welding structure 100, described solder flux guiding module 15 is located between described body 11 and described circuit board 3.
In the present embodiment, described solder flux guiding module 15 is fixed on described supporting surface 111.Alternately, described solder flux guiding module 15 can also be structure as a whole with described body 11.In the present embodiment, the thickness of described solder flux guiding module 15 is 0.6mm.
When adopting solder wave process that described optical transceiver module interface module 5 is welded in described circuit board 3, comprise the steps:
Step S1, provides wave soldering tool 1;
Particularly, described wave soldering tool 1 comprises body 11, hollow-out parts 13 and solder flux guiding module 15.Described hollow-out parts 13 is formed at described body 11, and described solder flux guiding module 15 closes on described hollow-out parts 13 and arranges, and coordinates described hollow-out parts 13 to surround receiving space 17, and described body 11 comprises the supporting surface 111 being formed at described body 11 1 side surface.
Step S2, provides circuit board 3, described circuit board 3 is fixed on the supporting surface 111 of described Wave soldering fixture 1;
Wherein, described circuit board 3 surface is provided with multiple welding hole, and described welding hole is mutually corresponding with described receiving space 17.Described circuit board 3 is guided module 15 with the solder flux on described wave soldering tool 1 surface and is contacted, and namely described solder flux guiding module 15 is between described circuit board 3 and described body 11.
Step S3, provides optical transceiver module interface module 5, and described optical transceiver module interface module 5 is inserted in described circuit board 3, obtains described welding structure 100.
Specifically, the pin of described optical transceiver module interface module 5 is inserted in the corresponding welding hole of described circuit board 3.Wherein, described optical transceiver module interface module 5 comprises receiving terminal (sign), and described receiving terminal is surrounded by described receiving space 17.After described optical transceiver module interface module 5 is inserted in described circuit board 3, just obtain the welding structure 100 comprising described optical transceiver module interface module 5, described circuit board 3 and described wave soldering tool 1.
In above-mentioned wave soldering process, when described optical transceiver module interface module 5 is welded in described circuit board 3, high-temperature liquid state scolding tin adheres to the pin of described optical transceiver module interface module 5 and is fixed in described circuit board 3.Because described welding structure 100 edge in described wave soldering process has the direction rectilinear motion at certain angle of inclination, if described pin surface adheres to too much high-temperature liquid state scolding tin, unnecessary described high-temperature liquid state tin can be led to the surface of described solder flux guiding module 15 under its Action of Gravity Field.Thus make the scolding tin bad connection rate of optical transceiver module interface module 5 pin be reduced to 0%.
Compared to prior art, in the welding structure 100 that the utility model provides, described wave soldering tool 1 comprises hollow-out parts 13 and closes on the solder flux guiding module 15 of described hollow-out parts 13 setting, described solder flux guiding module 15 coordinates with hollow-out parts 13 and surrounds the receiving terminal that receiving space 17 surrounds optical transceiver module interface module 5, thus in wave soldering process, liquid solder unnecessary for described optical transceiver module interface module 5 pin surface is guided to described solder flux guiding module 15 surface and the scolding tin bad connection rate of described pin is reduced to 0%, scolding tin is avoided to assemble, also the human cost of production is reduced while improving the quality of products.
The foregoing is only embodiment of the present utility model; not thereby the scope of the claims of the present utility model is limited; every utilize the utility model description to do equivalent structure or equivalent flow process conversion; or be directly or indirectly used in other relevant technical field, be all in like manner included in scope of patent protection of the present utility model.
Claims (10)
1. a wave soldering tool, comprising:
Body; And
Multiple hollow-out parts, described multiple openwork part is distributed in described body; It is characterized in that, described wave soldering tool also comprises solder flux guiding module, and described solder flux guides module to close on described hollow-out parts and arranges, and solder flux described in the edge mate of described hollow-out parts guides module to surround receiving space.
2. wave soldering tool according to claim 1, is characterized in that, described solder flux guiding module is the sheet material that metal or ceramic material process.
3. wave soldering tool according to claim 1, is characterized in that, described solder flux guiding module is U-shaped structure, and described U-shaped structural edge coordinates the edge of described hollow-out parts to surround receiving space.
4. wave soldering tool according to claim 1, is characterized in that, described body comprises and is formed at surface support face, described body side, and described hollow-out parts runs through described supporting surface, and described solder flux guiding module is fixed on described supporting surface.
5. wave soldering tool according to claim 4, is characterized in that, described hollow-out parts comprises multiple through hole, and described multiple through hole array distribution is in described body.
6. wave soldering tool according to claim 5, is characterized in that, the quantity of described solder flux guiding module is multiple, and it is corresponding described multiple through hole setting respectively.
7. a welding structure, comprises optical transceiver module interface module, circuit board and wave soldering tool, and described circuit board surface is located at by described optical transceiver module interface module, and described wave soldering tool comprises:
Body, described body comprises the supporting surface being formed at described body one side surface, and described circuit board is stacked at the supporting surface of described body; And
Hollow-out parts, described openwork part is distributed in described body, it is characterized in that, described wave soldering tool also comprises solder flux guiding module, and described solder flux guiding module closes on described hollow-out parts and arranges, and coordinates described hollow-out parts to form receiving space.
8. welding structure according to claim 7, is characterized in that, described solder flux guiding module is fixed on the supporting surface of described body, and between described body and described circuit board.
9. welding structure according to claim 7, is characterized in that, described circuit board surface arranges multiple welding hole, and described optical transceiver module interface module is inserted in described welding hole.
10. welding structure according to claim 9, is characterized in that, described hollow-out parts comprises multiple through hole, and the quantity of described solder flux guiding module is multiple, and with the through hole of described hollow-out parts and welding hole is corresponding arranges.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520256105.3U CN204711363U (en) | 2015-04-24 | 2015-04-24 | Wave soldering tool and welding structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520256105.3U CN204711363U (en) | 2015-04-24 | 2015-04-24 | Wave soldering tool and welding structure |
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| Publication Number | Publication Date |
|---|---|
| CN204711363U true CN204711363U (en) | 2015-10-21 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201520256105.3U Expired - Fee Related CN204711363U (en) | 2015-04-24 | 2015-04-24 | Wave soldering tool and welding structure |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110072349A (en) * | 2019-05-29 | 2019-07-30 | 重庆华虹仪表有限公司 | A kind of device and its application method for electric energy meter module selectivity wave-soldering |
-
2015
- 2015-04-24 CN CN201520256105.3U patent/CN204711363U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110072349A (en) * | 2019-05-29 | 2019-07-30 | 重庆华虹仪表有限公司 | A kind of device and its application method for electric energy meter module selectivity wave-soldering |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20151021 Termination date: 20200424 |
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| CF01 | Termination of patent right due to non-payment of annual fee |