CN109633832A - Optical module and its welding method - Google Patents
Optical module and its welding method Download PDFInfo
- Publication number
- CN109633832A CN109633832A CN201811541754.2A CN201811541754A CN109633832A CN 109633832 A CN109633832 A CN 109633832A CN 201811541754 A CN201811541754 A CN 201811541754A CN 109633832 A CN109633832 A CN 109633832A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- flexible circuit
- mating surface
- ground pad
- pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/428—Electrical aspects containing printed circuit boards [PCB]
- G02B6/4281—Electrical aspects containing printed circuit boards [PCB] the printed circuit boards being flexible
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4202—Packages, e.g. shape, construction, internal or external details for coupling an active element with fibres without intermediate optical elements, e.g. fibres with plane ends, fibres with shaped ends, bundles
Abstract
The invention discloses a kind of optical module and its welding method, which includes pcb board, opto-electronic device and the flexible circuit board connecting with pcb board and opto-electronic device；Wherein, opto-electronic device includes transmitting optical assembly, and transmitting optical assembly includes the mating surface being cooperatively connected with flexible circuit board, and mating surface is equipped with electrical connection section；Flexible circuit board includes the welding disking area for adapting to mating surface, welding disking area is equipped with to the ground pad that connect with electrical connection section and the conductive part being electrically connected with the ground pad, and the conducting position is in the flexible circuit board side opposite with the mating surface and electrical property is fixed on the mating surface.The present invention with emit on the flexible circuit board that connect of optical assembly in opto-electronic device equipped with conductive part, so that the mating surface of flexible circuit board and transmitting optical assembly realizes comprehensive welding, improve the return flow path of high speed signal with this, the impedance continuity for optimizing high-speed line, improves the originator eye figure performance of optical module.
Description
Technical field
The present invention relates to optical module technical field more particularly to a kind of optical module and its welding methods.
Background technique
Communications Market demand is pushing always the promotion of optic communication underlying transport rate, and photoelectric conversion module basis passes
Defeated rate is promoted, and is heavily dependent on the performance of optical device itself and the driving capability of driving electrical chip；Among these, with
The promotion of signal transmission rate, electrical signal integrity be raised to new height, as one-channel signal transmission rate is elevated
To 25G, optical module design is increasingly harsh for the cabling requirement of PCB (Printed Circuit Board, printed circuit board),
If the design impedance matching for HW High Way is imperfect, by the effect of strong influence light, electric eye figure, eye is caused to be schemed
Some column problems such as multi-thread, overshoot, shake be big, and these unfavorable factors can cause chain, amplification effect system-level, it is unfavorable because
Element is every to pass through level-one light, electric treatment, and signal will deteriorate step by step.
Summary of the invention
In view of this, the present invention proposes a kind of optical module and its welding method that can meet and improve high speed signal return flow path
To solve the above technical problems.
In order to achieve the above object, the technical scheme adopted by the invention is as follows:
According to a first aspect of the embodiments of the present invention, provide a kind of optical module, comprising: pcb board, opto-electronic device and
The flexible circuit board being connect with the pcb board and the opto-electronic device；
Wherein, the opto-electronic device includes transmitting optical assembly, and the transmitting optical assembly includes and the flexible circuit board
The mating surface of mating connection, the mating surface are equipped with electrical connection section；
The flexible circuit board includes the welding disking area for adapting to the mating surface, the welding disking area be equipped with to institute
The conductive part stating the ground pad of electrical connection section connection and being electrically connected with the ground pad, the conducting position is in described
The flexible circuit board side opposite with the mating surface and electrically it is fixed on the mating surface.
According to a second aspect of the embodiments of the present invention, a kind of weldering applied to optical module described in any one of above-mentioned is provided
Method is connect, the welding method includes:
Upper solder processing is carried out in the mating surface of transmitting optical assembly；
Part electrical connection section is pre-fixed with pad corresponding on flexible circuit board；
By heating the solder so that solder fusion is between conductive part and the mating surface；
Complete the remaining electrical connection section of welding and pad corresponding on flexible circuit board.
The embodiment of the present invention provide technical solution can include the following benefits: the present invention with opto-electronic device
The flexible circuit board of middle transmitting optical assembly connection is equipped with conductive part, so that the mating surface of flexible circuit board and transmitting optical assembly is real
Now comprehensive welding, is improved the return flow path of high speed signal with this, optimizes the impedance continuity of high-speed line, improve optical module
Originator eye figure performance.
It should be understood that above general description and following detailed description be only it is exemplary and explanatory, not
It can the limitation present invention.
Detailed description of the invention
Fig. 1 is a kind of decomposition diagram of smooth film block shown in an exemplary embodiment of the invention；
Fig. 2 is a kind of partial structure diagram of optical module shown in an exemplary embodiment of the invention；
Fig. 3 is the dress for emitting optical assembly and flexible circuit board in a kind of optical module shown in an of the invention exemplary embodiment
With schematic diagram；
Fig. 4 is the structural schematic diagram of flexible circuit board in a kind of optical module shown in an of the invention exemplary embodiment；
Fig. 5 is the knot of the first circuit layer of flexible circuit board in a kind of optical module shown in an of the invention exemplary embodiment
Structure schematic diagram；
Fig. 6 is a kind of flow chart of the welding method of optical module shown in an exemplary embodiment of the invention.
Specific embodiment
Below with reference to specific embodiment shown in the drawings, the present invention will be described in detail.But these embodiments are simultaneously
The present invention is not limited, structure that those skilled in the art are made according to these embodiments, method or functionally
Transformation is included within the scope of protection of the present invention.
It is only to be not intended to limit the invention merely for for the purpose of describing particular embodiments in terminology used in the present invention.
It is also intended in the present invention and the "an" of singular used in the attached claims, " described " and "the" including majority
Form, unless the context clearly indicates other meaning.It is also understood that term "and/or" used herein refers to and wraps
It may be combined containing one or more associated any or all of project listed.
With reference to the accompanying drawing, it elaborates to some embodiments of the present invention, it is in the absence of conflict, following
Feature in embodiment and embodiment can be combined with each other.
As shown in Figures 1 to 5, the optical module 100 of the embodiment of the present invention include: pcb board 1, opto-electronic device 2 and with
The flexible circuit board 3 that pcb board 1 and opto-electronic device 2 connect.Opto-electronic device 2 is realized with pcb board 1 by flexible circuit board 3
It is in communication with each other.The optical module 100 further includes shell 10, and pcb board 1, opto-electronic device 2 and flexible circuit board 3 are arranged in shell
In 10.
Wherein, which includes transmitting optical assembly 21, and transmitting optical assembly 21 includes cooperating with flexible circuit board 3
The mating surface 211 of connection, mating surface 211 are equipped with the electrical connection section 212 to connect with flexible circuit board 3.The photoelectron device
Part 2 further includes receiving optical assembly 22, receives optical assembly 22 and flexible circuit board 3 is electrically connected.The optical module 100 passes through transmitting light
The conversion of photosignal is realized in component 21 and the cooperation for receiving optical assembly 22.
The flexible circuit board 3 includes adapting to the welding disking area 33 of mating surface 211, welding disking area 33 be equipped with to be electrically connected
The ground pad 331 that socket part 212 connects and the conductive part (not shown) being electrically connected with ground pad 331.Wherein, ground connection weldering
Disk 331 is connected to the ground path of flexible circuit board 3, conducting position in the side opposite with mating surface 211 of flexible circuit board 3 and
It electrically is fixed on mating surface 211, by the setting of the conductive part, the contact surface of ground pad 331 Yu mating surface 211 can be increased
Product improves the optical signal quality of optical module 100, promotes the performance indicator of optical module 100.Wherein, which is large area
GND leak copper pad.
Further, which further includes the solder layer for being set to mating surface 211, the weldering of flexible circuit board 3
Disk area 33 is welded in mating surface 211 by solder layer, and conductive part is connected with solder layer.Specifically, in mating surface 211 in advance
Upper solder processing by hand is carried out, then by heating the welding so that flexible circuit board 3 and transmitting optical assembly 21.This implementation
In example, the solder of the solder layer is tin.Certainly, which is not limited to tin, and the metal material of welding can also be met for other.
The ground pad 331 includes ground pad hole, and electrical connection section 212 includes the grounding connection with the cooperation of ground pad hole
Portion 2121.The electrical connection section 212 is multiple PIN foot, and ground connection PIN foot therein is by being interspersed in ground pad hole and passing through solder
It welds and is fixedly connected with flexible circuit board 3 with transmitting optical assembly 21.Certainly, electrical connection section 212 of the invention is not limited to PIN
Foot, the electrical connection section 212 can also be the connection structure of other forms in other embodiments, herein and be not specifically limited.
In the present embodiment, which is greater than the size of grounding points 2121, which is can be saturating
The big via hole of solder, the solder being designed such that in mating surface 211 can be partially covered on flexibility by ground pad hole
The surface of circuit board 3, so as to enhance flexible circuit board 3 and emit the connection reliability of optical assembly 21.
In another embodiment, which further includes the through-hole (not shown) for being set to welding disking area 33, this is logical
The solder of hole and solder layer cooperates so that welding disking area 33 is welded in mating surface 211.I.e. by the solder in mating surface 211 into
Row heating, so that the solder of melting infiltrates through through-hole and is partially covered on the surface of flexible circuit board 3, so as to enhance flexibility
The connection reliability of circuit board 3 and transmitting optical assembly 21.
Further, which further includes signal connecting element 2122, welding disking area 33 be additionally provided with to signal
The signal pad 332 that interconnecting piece 2122 connects, signal pad 332 are connected to the signal line on flexible circuit board 3.Wherein, should
Signal connecting element 2122 is signal PIN foot, and the signal line on flexible circuit board 3 includes at least laser control signal and feedback letter
Number.
In the present embodiment, flexible circuit board 3 is made of double-layer structure.The flexible circuit board 3 includes being equipped with signal line
First circuit layer 31 and the second circuit layer (not shown) equipped with ground path.Wherein, first circuit layer 31 is located at second circuit
The top of layer, signal pad 332 are set to first layer circuit, and ground pad 331 and conductive part are all set in the second circuit layer.Into
One step, in one end that the flexible circuit board 3 is connect with pcb board 1, first circuit layer 31 is equipped with the signal gold connecting with pcb board 1
Finger, the second circuit layer are equipped with the grounded metal finger connecting with pcb board 1.
One end that the flexible circuit board 3 is connected with pcb board 1 is equipped with pilot hole 34, and flexible circuit board 3 passes through solder or connection
Part is matched with pilot hole 34 and is fixed on pcb board 1.In the present embodiment, pilot hole 34 is two, and two pilot holes 34 are arranged with
It the two sides of pcb board 1 and is welded by solder.
In addition, the fixed form of the reception optical assembly 22 and flexible circuit board 3 can be with transmitting optical assembly 21 and flexible electrical
The welding manner of road plate 3 is identical, i.e., with receive optical assembly 22 flexible circuit board 3 on have additional conductive part so that flexible electrical
Road plate 3 and the mating surface 211 for receiving optical assembly 22 realize comprehensive welding, improve the return flow path of high speed signal with this.When
So, the fixed form of the reception optical assembly 22 and flexible circuit board 3 only can also be carried out directly by way of PIN foot and pad
It is welded and fixed.
The present invention emits with opto-electronic device equipped with conductive part on the flexible circuit board that optical assembly is connect, so that flexible
The mating surface of circuit board and transmitting optical assembly realizes comprehensive welding, improves the return flow path of high speed signal with this, and optimization is high
The impedance continuity of fast line improves the originator eye figure performance of optical module.
As shown in fig. 6, another aspect according to an embodiment of the present invention, additionally provides a kind of welding method of optical module, it should
Welding method is applied to described in above-mentioned each embodiment in optical module, wherein the welding method includes:
S601, upper solder processing is carried out in the mating surface for emitting optical assembly.
In the step, by carrying out upper solder processing in the mating surface of transmitting optical assembly in advance, which is preferably tin,
Tin processing is carried out on a mating.Wherein, it should be noted that tin position corresponds to the conduction on flexible circuit board on this
Portion, and need to avoid the link position of the signal pad and signal connecting element on flexible circuit board.
S602, part electrical connection section is pre-fixed with pad corresponding on flexible circuit board.
In the present embodiment, flexible circuit board includes the welding disking area for adapting to mating surface, welding disking area be equipped with to electricity
The ground pad of interconnecting piece connection, ground pad includes ground pad hole.Electrical connection section includes connecing with what ground pad hole cooperated
Ground interconnecting piece and the signal connecting element being electrically connected with signal pad cooperation, the grounding points and signal connecting element are
The structure of PIN foot.
It wherein, can be by least one of electrical connection section in order to facilitate the assembly of flexible circuit board and transmitting optical assembly
Grounding points or signal connecting element are welded and fixed with corresponding pad, so as to realize flexible circuit board and transmitting light group
Part is pre-fixed.
S603, pass through heating solder so that solder fusion is between conductive part and mating surface.
After flexible circuit board and transmitting optical assembly realization pre-fix, by being heated to solder so that solder is molten
Melt, conductive part can be made comprehensively to be welded with mating surface by the solder of melting at this time, is realized after solder is cooling
Conductive part is bonded and is electrically connected with mating surface.
Further, by the way that ground pad hole to be set greater than to the size of grounding points, ground pad hole can be made
For can solder thoroughly big via hole, so as to so that solder in mating surface is partially covered on flexible electrical by ground pad hole
The surface of road plate, so to enhance flexible circuit board and emit the connection reliability of optical assembly.It is of course also possible in the flexible electrical
Through-hole is arranged in the welding disking area of road plate, which can make the solder of melting infiltrate through and be partially covered on the table of flexible circuit board
Face, so as to enhance flexible circuit board and emit the connection reliability of optical assembly.
S604, it completes to weld remaining electrical connection section and pad corresponding on flexible circuit board.
After transmitting optical assembly and flexible circuit board realize welding comprehensively, by remaining unwelded grounding points and signal
Interconnecting piece is welded with corresponding pad, to complete the electric connection of transmitting optical assembly and flexible circuit board.
Further, before being pre-fixed part electrical connection section with pad corresponding on flexible circuit board, welding
Method further include: prepare conductive part in the flexible circuit board side opposite with mating surface, conductive part and ground pad are electrically connected.
The conductive part that ground pad electric connection is added on flexible circuit board, so to increase contact of the ground pad with mating surface
Area improves the optical signal quality of optical module, promotes the performance indicator of optical module.Wherein, which is the GND of large area
Leak copper pad.
Optical module and its welding method of the invention, the GND by the way that large area is arranged in flexible circuit board leak copper pad,
So that the mating surface of flexible circuit board and transmitting optical assembly realizes comprehensive welding, improve the reflux road of high speed signal with this
Diameter optimizes the impedance continuity of high-speed line, improves the originator eye figure performance of optical module.
Those skilled in the art after considering the specification and implementing the invention disclosed here, will readily occur to of the invention its
Its embodiment.This application is intended to cover any variations, uses, or adaptations of the invention, these modifications, purposes or
Person's adaptive change follows general principle of the invention and including the undocumented common knowledge in the art of the present invention
Or conventional techniques.The description and examples are only to be considered as illustrative, and true scope and spirit of the invention are by the application
Claim point out.
It should be understood that the present invention is not limited to the precise structure already described above and shown in the accompanying drawings, and
And various modifications and changes may be made without departing from the scope thereof.The scope of the present invention is limited only by the attached claims.
Claims (10)
1. a kind of optical module characterized by comprising pcb board, opto-electronic device and with the pcb board and the photoelectron
The flexible circuit board of device connection；
Wherein, the opto-electronic device includes transmitting optical assembly, and the transmitting optical assembly includes cooperating with the flexible circuit board
The mating surface of connection, the mating surface are equipped with electrical connection section；
The flexible circuit board includes the welding disking area for adapting to the mating surface, the welding disking area be equipped with to the electricity
The ground pad of interconnecting piece connection and the conductive part being electrically connected with the ground pad, the conducting position is in the flexibility
The circuit board side opposite with the mating surface and electrically it is fixed on the mating surface.
2. optical module according to claim 1, which is characterized in that the ground pad includes ground pad hole, the electricity
Interconnecting piece includes the grounding points with ground pad hole cooperation；Wherein, the ground pad hole connects greater than the ground connection
The size of socket part.
3. optical module according to claim 2, which is characterized in that the electrical connection section further includes signal connecting element, described
Welding disking area is additionally provided with the signal pad to connect with the signal connecting element, the signal pad and the flexible circuit board
On signal line connection.
4. optical module according to claim 3, which is characterized in that the flexible circuit board includes the equipped with signal line
One circuit layer and the second circuit layer equipped with ground path；Wherein, the signal pad is set to the first layer circuit, described
Ground pad and the conductive part are all set in the second circuit layer.
5. optical module according to claim 1, which is characterized in that the transmitting optical assembly further includes being set to the cooperation
The solder layer in face, the welding disking area are welded in the mating surface, the conductive part and the solder layer by the solder layer
Conducting.
6. optical module according to claim 5, which is characterized in that the flexible circuit board further includes being set to the pad
The solder of the through-hole in region, the through-hole and the solder layer cooperates so that the welding disking area is welded in the mating surface.
7. optical module according to claim 1, which is characterized in that the flexible circuit board be connected with the pcb board one
End is equipped with pilot hole, and the flexible circuit board is matched with the pilot hole by solder or connector and is fixed on the pcb board.
8. a kind of welding method applied to the optical module as described in any one of claims 1 to 7, which is characterized in that the weldering
The method of connecing includes:
Upper solder processing is carried out in the mating surface of transmitting optical assembly；
Part electrical connection section is pre-fixed with pad corresponding on flexible circuit board；
By heating the solder so that solder fusion is between conductive part and the mating surface；
Complete the remaining electrical connection section of welding and pad corresponding on flexible circuit board.
9. welding method according to claim 8, which is characterized in that the flexible circuit board includes adapting to the cooperation
The welding disking area in face, the welding disking area are equipped with the ground pad to connect with the electrical connection section, the ground pad packet
Ground pad hole is included, the electrical connection section includes the grounding points with ground pad hole cooperation；Wherein, the ground connection weldering
Disk hole is greater than the size of the grounding points, so that the part solder is penetrated into from the ground pad hole.
10. welding method according to claim 9, which is characterized in that will be on part electrical connection section and flexible circuit board
Before corresponding pad is pre-fixed, the welding method further include:
Conductive part, the conductive part and the ground pad are prepared in the flexible circuit board side opposite with the mating surface
It is electrically connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811541754.2A CN109633832A (en) | 2018-12-17 | 2018-12-17 | Optical module and its welding method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811541754.2A CN109633832A (en) | 2018-12-17 | 2018-12-17 | Optical module and its welding method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109633832A true CN109633832A (en) | 2019-04-16 |
Family
ID=66074512
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811541754.2A Pending CN109633832A (en) | 2018-12-17 | 2018-12-17 | Optical module and its welding method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109633832A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110730557A (en) * | 2019-09-05 | 2020-01-24 | 光为科技(广州)有限公司 | High-speed flexible circuit board, optical assembly and optical module |
| CN111258009A (en) * | 2020-02-10 | 2020-06-09 | 中航海信光电技术有限公司 | Optical module |
| CN113064238A (en) * | 2021-03-22 | 2021-07-02 | 长飞光纤光缆股份有限公司 | Soft board for realizing connection with optical device, connection method and optical module |
| WO2021212868A1 (en) * | 2020-04-22 | 2021-10-28 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN114545568A (en) * | 2020-11-26 | 2022-05-27 | 青岛海信宽带多媒体技术有限公司 | Optical module |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040190835A1 (en) * | 2003-03-31 | 2004-09-30 | Burdick Stephan C | Transmitter subassembly ground return path |
| CN1917204A (en) * | 2005-08-04 | 2007-02-21 | 恩益禧电子股份有限公司 | Optical module with flexible substrate |
| CN105403966A (en) * | 2015-12-09 | 2016-03-16 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN106772835A (en) * | 2016-12-23 | 2017-05-31 | 青岛海信宽带多媒体技术有限公司 | Optical module |
-
2018
- 2018-12-17 CN CN201811541754.2A patent/CN109633832A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040190835A1 (en) * | 2003-03-31 | 2004-09-30 | Burdick Stephan C | Transmitter subassembly ground return path |
| CN1917204A (en) * | 2005-08-04 | 2007-02-21 | 恩益禧电子股份有限公司 | Optical module with flexible substrate |
| CN105403966A (en) * | 2015-12-09 | 2016-03-16 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN106772835A (en) * | 2016-12-23 | 2017-05-31 | 青岛海信宽带多媒体技术有限公司 | Optical module |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110730557A (en) * | 2019-09-05 | 2020-01-24 | 光为科技(广州)有限公司 | High-speed flexible circuit board, optical assembly and optical module |
| CN111258009A (en) * | 2020-02-10 | 2020-06-09 | 中航海信光电技术有限公司 | Optical module |
| WO2021212868A1 (en) * | 2020-04-22 | 2021-10-28 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN114545568A (en) * | 2020-11-26 | 2022-05-27 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN114545568B (en) * | 2020-11-26 | 2023-03-03 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN113064238A (en) * | 2021-03-22 | 2021-07-02 | 长飞光纤光缆股份有限公司 | Soft board for realizing connection with optical device, connection method and optical module |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109633832A (en) | Optical module and its welding method | |
| US10866439B2 (en) | High-frequency transmission line and optical circuit | |
| US10018794B2 (en) | Optical module and manufacturing method thereof | |
| US11616333B2 (en) | Endoscope device and cable assembly thereof | |
| JP6570976B2 (en) | Optical module | |
| US10001610B2 (en) | Optical module | |
| CN102474988A (en) | Electronic component unit and reinforcement adhesive | |
| JP2007123183A (en) | Connector for flexible board, board connection structure, optical transmitter and receiver module, and optical transmitter/receiver | |
| WO2016111243A1 (en) | Flexible printed wiring board and mounting method for same | |
| CN104507271A (en) | Plug-in component technology and surface mount technology combination based PCBA (printed circuit board assembly) machining method and PCBA | |
| US20180284374A1 (en) | Substrate packaging structure and optical module | |
| JP3205631U (en) | VEHICLE LIGHT DEVICE AND LIGHT EMITTING MODULE THEREOF | |
| JP2019046922A (en) | Optical module and optical transmission device | |
| CN110794524A (en) | Optical subassembly and optical module | |
| CN201234406Y (en) | Flexible printed circuit board | |
| CN104882531A (en) | LED integrated light-emitting module group | |
| US8008761B2 (en) | Optical semiconductor apparatus | |
| US11089683B2 (en) | Optical module | |
| US20220302671A1 (en) | Optical module | |
| US11483929B2 (en) | Optical module | |
| TW201431225A (en) | Interconnect structure for coupling an electronic unit and an optical unit, and optoelectronic module | |
| CN210775926U (en) | Light emitter and optical module | |
| CN104022379B (en) | Electric connector | |
| CN108732690A (en) | Coaxial packaging structure and optical transmission module | |
| JP2012142226A (en) | Relay board for transmission connector |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190416 |
|
| RJ01 | Rejection of invention patent application after publication |