CN111258009A - Optical module - Google Patents

Optical module Download PDF

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Publication number
CN111258009A
CN111258009A CN202010084569.6A CN202010084569A CN111258009A CN 111258009 A CN111258009 A CN 111258009A CN 202010084569 A CN202010084569 A CN 202010084569A CN 111258009 A CN111258009 A CN 111258009A
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CN
China
Prior art keywords
plate
optical
optical module
metal
module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202010084569.6A
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Chinese (zh)
Inventor
陈露露
周升强
王晨阳
曾江华
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hisense&jonhon Optical Electrical Technologies Co ltd
Original Assignee
Hisense&jonhon Optical Electrical Technologies Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hisense&jonhon Optical Electrical Technologies Co ltd filed Critical Hisense&jonhon Optical Electrical Technologies Co ltd
Priority to CN202010084569.6A priority Critical patent/CN111258009A/en
Publication of CN111258009A publication Critical patent/CN111258009A/en
Pending legal-status Critical Current

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    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4274Electrical aspects
    • G02B6/428Electrical aspects containing printed circuit boards [PCB]
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4256Details of housings
    • G02B6/4257Details of housings having a supporting carrier or a mounting substrate or a mounting plate
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4266Thermal aspects, temperature control or temperature monitoring
    • G02B6/4268Cooling
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4274Electrical aspects
    • G02B6/428Electrical aspects containing printed circuit boards [PCB]
    • G02B6/4281Electrical aspects containing printed circuit boards [PCB] the printed circuit boards being flexible

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)

Abstract

The invention discloses an optical module, which is characterized in that a second flexible plate and a rigid plate are overlapped, so that the effective board distribution area of a PCB is expanded, the structure in a shell is compact, the space utilization rate is improved, the miniaturized packaging of a product is realized, and the problem of large packaging volume is solved; because the light emitting component is arranged in the first accommodating groove and is in direct contact with the metal supporting plate, the heat generated by the light emitting component can be directly conducted to the metal supporting plate; the light receiving assembly is fixed on the metal reinforcing plate, heat generated by the light receiving assembly can be directly transmitted to the metal reinforcing plate and is transmitted to the metal supporting plate in time through the metal reinforcing plate, the metal supporting plate finally transmits the heat to the upper shell in time through the supporting table, and the heat is radiated out through the upper shell; the metal support plate is a structural support in the whole optical module and a good heat conduction channel in the optical module, the whole optical module is good in heat dissipation effect and high in heat dissipation efficiency, and the application range of the optical module is expanded.

Description

Optical module
Technical Field
The invention belongs to the technical field of communication, and particularly relates to an optical module.
Background
With the popularization and deep application of optical communication technology, the demand of optical modules is increasing day by day.
The heat dissipation problem of the optical module directly affects the application range and the service life of the product. The PSM4 optical module which is the mainstream in the market at present is mainly in a standard QSFP28 packaging form, is limited by the packaging scheme, has a working temperature zone which is only a commercial temperature zone (0 to +70 ℃), has poor heat dissipation effect and relatively large packaging volume (about 17600 mm), and cannot be applied to special occasions such as miniaturization, high temperature resistance and the like.
Disclosure of Invention
The invention provides an optical module, which solves the problems of large packaging volume and poor heat dissipation effect.
In order to solve the technical problems, the invention adopts the following technical scheme:
a light module, comprising:
the shell comprises an upper shell and a lower shell, and the upper shell and the lower shell enclose an accommodating space;
the PCB is positioned in the accommodating space and comprises a rigid plate, a first flexible plate and a second flexible plate, and the rigid plate is respectively connected with the first flexible plate and the second flexible plate; the second flexible plate is folded upwards and is arranged in a stacked mode with the rigid plate; a metal reinforcing plate is fixed on the back surface of the second flexible plate;
the metal supporting plate is positioned in the accommodating space and is provided with a first accommodating groove and a second accommodating groove; the second accommodating groove is positioned between the metal reinforcing plate and the rigid plate and used for installing the metal reinforcing plate; a supporting table protruding upwards is formed at the peripheral edge of the metal supporting plate, and the supporting table is abutted to the upper shell;
the light emitting component is arranged in the first accommodating groove; and is connected with the first flexible board;
a light receiving member fixed to the metal reinforcing plate; and is connected with the second flexible board;
the optical fiber ribbon assembly comprises a first optical device, a second optical device, an optical fiber ribbon and an optical fiber connector, wherein the first optical device is communicated with the optical transmitting assembly, the second optical device is communicated with the optical receiving assembly, one end of the optical fiber ribbon is connected with the first optical device and the second optical device, and the other end of the optical fiber ribbon is connected with the optical fiber connector.
Furthermore, one side edge of the rigid plate is connected with the first flexible plate, and the side edge of the rigid plate adjacent to the side edge is connected with the second flexible plate.
Still further, the optical transmission assembly comprises a plurality of TOSA assemblies, the TOSA assemblies are matched, the metal support plate is provided with a plurality of first accommodating grooves, and the optical fiber ribbon assembly comprises a plurality of first optical devices; the TOSA subassembly corresponds places in the first holding tank of a plurality of, corresponds the communication with the first optical device of a plurality of.
Furthermore, the first accommodating groove is a semicircular groove with an upward opening.
Still further, the first accommodating grooves are arranged in parallel at equal intervals.
Further, the first flexible plate is arranged perpendicular to the rigid plate, and a welding hole is formed in the first flexible plate at a position corresponding to each TOSA assembly, and the TOSA assemblies are welded with the corresponding welding holes.
Still further, the TOSA assembly abuts the upper housing.
Furthermore, the light receiving component comprises a receiving chip and a driving chip, and the driving chip drives the receiving chip to operate; an avoiding area is formed on the second flexible board, and the receiving chip and the driving chip are respectively adhered and fixed on the metal reinforcing board at positions corresponding to the avoiding area.
Still further, the optical module further comprises a sealing cover and a fixing piece, wherein the sealing cover is provided with a clamping jaw, and the fixing piece is provided with a clamping groove; the fixing piece is welded on the metal reinforcing plate and corresponds to the avoidance area, the sealing cover is arranged on the receiving chip and the driving chip, and the clamping jaws are clamped with the clamping grooves.
Furthermore, one side of the metal supporting plate close to the optical fiber ribbon is formed with a supporting groove, one end of the optical fiber ribbon is placed in the supporting groove, a clamping hole is formed in the groove wall of the supporting groove, and a clamping piece is clamped with the clamping hole and fixes one end of the optical fiber ribbon in the supporting groove.
Compared with the prior art, the invention has the advantages and positive effects that: according to the optical module, the second flexible board and the rigid board are overlapped, so that the effective board distribution area of the PCB is expanded, the structure in the shell is compact, the space utilization rate is improved, the miniaturized package of a product is realized, and the problem of large package volume is solved; because the light emitting component is arranged in the first accommodating groove and is in direct contact with the metal supporting plate, the heat generated by the light emitting component can be directly conducted to the metal supporting plate; the light receiving assembly is fixed on the metal reinforcing plate, heat generated by the light receiving assembly can be directly transmitted to the metal reinforcing plate and is transmitted to the metal supporting plate in time through the metal reinforcing plate, the metal supporting plate finally transmits the heat to the upper shell in time through the supporting table, and the heat is radiated out through the upper shell; the metal support plate is a structural support in the whole optical module and a good heat conduction channel in the optical module, the whole optical module is good in heat dissipation effect and high in heat dissipation efficiency, and the application range of the optical module is expanded.
Other features and advantages of the present invention will become more apparent from the detailed description of the embodiments of the present invention when taken in conjunction with the accompanying drawings.
Drawings
Fig. 1 is a schematic front structural diagram of an optical module according to the present invention;
fig. 2 is a schematic diagram of a back structure of an optical module according to the present invention;
FIG. 3 is an exploded view of FIG. 1;
FIG. 4 is a cross-sectional view of FIG. 1;
FIG. 5 is a schematic structural view of the PCB board of FIG. 3;
FIG. 6 is a schematic view of the light emitting assembly and the light receiving assembly of FIG. 3 mounted on a PCB board;
FIG. 7 is a schematic view of the connection of the fiber optic ribbon assembly of FIG. 3 to the light emitting assembly and the light receiving assembly;
FIG. 8 is a schematic view of the mounting of the light receiving module and the PCB board in FIG. 3;
FIG. 9 is a schematic view of the mounting of the metal support plate and the PCB board of FIG. 3;
FIG. 10 is a schematic view of the installation of the light receiving assembly and the fiber optic ribbon assembly of FIG. 3;
FIG. 11 is a schematic view of the installation of the optical transmission assembly and the fiber optic ribbon assembly of FIG. 3;
FIG. 12 is a schematic view of the mounting of the upper and lower shells of FIG. 3;
fig. 13 is a schematic view of the mounting of the electrical connector and the lower housing of fig. 3.
Reference numerals:
100. a rigid plate; 110. a first flexible board; 111. welding the hole; 120. a second flexible board; 121. an avoidance zone; 130. a metal reinforcing plate;
200. a driving chip; 210. a receiving chip; 220. a sealing cover; 230. a fixing member;
300. a metal support plate; 310. a first accommodating groove; 320. a second accommodating groove; 330. a support groove; 340. a support table;
400. an optical fiber ribbon; 410. a second optical device; 420. a first optical device; 430. a clamping piece; 440. an optical fiber connector;
500. a TOSA assembly; 510. a TOSA assembly; 520. a TOSA assembly; 530. a TOSA assembly;
600. a lower case; 610. an upper shell;
700. a screw; 710. a screw; 720. a screw; 730. a screw;
800. a positioning pin; 810. a positioning pin; 820. an electrical connector.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in further detail with reference to the accompanying drawings and examples.
It should be noted that in the description of the present invention, the terms of direction or positional relationship indicated by the terms "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, which are merely for convenience of description, and do not indicate or imply that the device or element must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
Furthermore, it should be noted that, in the description of the present invention, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
The optical module of the present embodiment mainly includes a housing, a PCB, a metal supporting board 300, a light emitting module, a light receiving module, a fiber ribbon module, an electrical connector 820, and the like, as shown in fig. 1 to 13. The case includes an upper case 610 and a lower case 600, and the upper case 610 and the lower case 600 enclose a receiving space.
The PCB is positioned in the accommodating space and comprises a rigid plate 100, a first flexible plate 110 and a second flexible plate 120, and the rigid plate 100 is respectively connected with the first flexible plate 110 and the second flexible plate 120; the second flexible plate 120 is folded upwards and arranged in a stacking way with the rigid plate 100; the PCB is designed into the structure, so that the effective board distribution area of the PCB can be expanded, the occupied space can be reduced, the structure is compact, and the miniaturization and packaging of products are realized. The metal reinforcing plate 130 is fixed to the back surface of the second flexible board 120, and the metal reinforcing plate 130 is used for supporting the second flexible board 120 to improve the strength of the second flexible board 120 and is also used for fixing the light receiving module, thereby facilitating the heat dissipation of the light receiving module. In this embodiment, the metal reinforcing plate 130 is made of copper alloy material, and has high strength and good thermal conductivity. The metal reinforcing plate 130 is adhered and fixed to the back surface of the second flexible board 120.
The metal support plate 300 is located in the accommodating space, and the metal support plate 300 has a first accommodating groove 310 and a second accommodating groove 320; the second receiving groove 320 is located between the metal reinforcing plate 130 and the rigid plate 100, and is used for mounting the metal reinforcing plate 130, that is, the second flexible plate 120, the metal reinforcing plate 130, the metal support plate 300, and the rigid plate 100 are stacked; the metal reinforcing plate 130 is fixed in the second receiving groove 320; the supporting base 340 protruding upward is formed on the periphery of the metal supporting plate 300, the supporting base 340 abuts against the upper case 610, and the supporting base 340 plays a role in supporting and transferring heat.
The light emitting element is installed in the first receiving groove 310, and is connected to the first flexible board 110 for signal transmission.
The light receiving element is fixed on the metal reinforcing plate 130, connected to the second flexible board 120, and performs signal transmission with the second flexible board.
The fiber optic ribbon assembly includes a first optical device 420, a second optical device 410, a fiber optic ribbon 400, and a fiber optic connector 440, the first optical device 420 being in communication with the optical transmit assembly, the second optical device 410 being in communication with the optical receive assembly, one end of the fiber optic ribbon 400 connecting the first optical device 420 and the second optical device 410, the other end of the fiber optic ribbon 400 connecting the fiber optic connector 440.
The electrical connector 820 is mounted in a mounting hole of the lower case 600 as an external electrical interface of the optical module, and the electrical connector 820 communicates with the rigid board 100. In order to ensure good connection between the contact pins of the electrical connector 820 and the rigid board 100, two positioning holes are formed on the electrical connector 820, and two positioning pins 800 and 810 are fixed on the rigid board 100 and are matched with the two positioning holes; the electrical connector 820 is mounted in the mounting hole, and the positioning pin passes through the corresponding positioning hole, so as to ensure that the electrical connector 820 is well connected with the rigid plate 100.
Signal receiving process of the optical module: the optical fiber connector 440 receives an external optical signal and transmits the external optical signal to the optical fiber ribbon 400, the optical fiber ribbon 400 transmits the optical signal to the second optical device 410, the second optical device 410 is coupled with the optical receiving component and transmits the optical signal to the optical receiving component, the optical receiving component converts the optical signal into an electrical signal and transmits the electrical signal to the second flexible board 120, the second flexible board 120 transmits the received electrical signal to the rigid board 100, and the rigid board 100 transmits the received electrical signal to the electrical connector 820.
The signal transmitting process of the optical module comprises the following steps: the electrical connector 820 receives an external electrical signal and transmits the received electrical signal to the rigid board 100, the rigid board 100 transmits the received electrical signal to the first flexible board 110, the first flexible board transmits the received electrical signal to the optical transmission assembly, the optical transmission assembly converts the electrical signal into an optical signal and transmits the optical signal to the first optical device 420, the first optical device 420 transmits the received optical signal to the optical fiber ribbon 400, the optical fiber ribbon 400 transmits the optical signal to the optical fiber connector 440, and the optical fiber connector 440 transmits the optical signal to the outside.
In the optical module of the embodiment, the second flexible board 120 and the rigid board 100 are stacked, so that the effective board distribution area of the PCB is expanded, the structure in the housing is compact, the space utilization rate is improved, and the miniaturized packaging of the product is realized; since the light emitting module is mounted in the first receiving groove 310 and directly contacts the metal support plate 300, heat generated from the light emitting module can be directly transferred to the metal support plate 300; the light receiving component is fixed on the metal reinforcing plate 130, the heat generated by the light receiving component can be directly conducted to the metal reinforcing plate 130, and is timely conducted to the metal supporting plate 300 through the metal reinforcing plate 130, the metal supporting plate 300 finally conducts the heat to the upper shell 610 through the supporting platform 340, and as shown in fig. 4, the heat is radiated through the upper shell 610; the metal support plate 300 is a structural support in the whole optical module, and is also a good heat conduction channel in the optical module, so that the whole optical module has a good heat dissipation effect and high heat dissipation efficiency, and the application range of the optical module is expanded.
The optical module of this embodiment, in less accommodation space, through make full use of space, adopt the form of second flexbile plate 120 and just board 100 stack and set up the metal support plate, with on light-emitting component and light-receiving component's heat direct transfer to metal support plate and casing, effectively solve the heat dissipation problem.
In this embodiment, one side of the rigid plate 100 is connected to the first flexible plate 110, and the side of the rigid plate 100 adjacent to the one side (the side connected to the first flexible plate 110) is connected to the second flexible plate 120. That is, the first flexible board 110 and the second flexible board 120 are located at two adjacent sides of the rigid board, so that the accommodating space is utilized more reasonably, the space utilization rate is improved, and the space occupation is further reduced.
The optical transmission assembly comprises a plurality of TOSA assemblies, and is matched, the metal support plate 300 is provided with a plurality of first accommodating grooves 310, and the optical fiber ribbon assembly comprises a plurality of first optical devices 420; a plurality of TOSA subassemblies are correspondingly placed in the first accommodation grooves 310, and the plurality of TOSA subassemblies are correspondingly communicated with the first optical devices 420. Design into a plurality of TOSA subassembly with the light emission subassembly, can further improve space utilization according to the nimble overall arrangement of accommodation space of casing, reduce accommodation space's volume. The TOSA component can meet the industrial temperature range (-40 ℃ -85 ℃), and can be applied to high temperature resistant occasions. The first optical device 420 is an LC ferrule, and the LC ferrule is inserted in the TOSA module and bonded together to realize transmission of optical signals between the LC ferrule and the TOSA module.
First holding tank 310 is opening semicircular groove up, and the TOSA subassembly assembly of both being convenient for has been guaranteed again to TOSA subassembly and first holding tank 310 and has sufficient area of contact in first holding tank 310, does benefit to the heat dissipation.
The first holding tanks 310 of a plurality of are arranged in parallel and at equal intervals, so that the layout in the shell is more reasonable, and the space utilization rate is further improved.
In the present embodiment, the light emitting module includes four TOSA modules: TOSA assembly 500, TOSA assembly 510, TOSA assembly 520, TOSA assembly 530; the metal support plate 300 has four first receiving grooves 310 and the ribbon assembly includes four first optical devices 420. Four TOSA assemblies are correspondingly disposed in the four first receiving grooves 310, and the four TOSA assemblies are correspondingly communicated with the four first optical devices 420.
First flexible board 110 and just board 100 are laid perpendicularly, and are formed with welding hole 111 in the position that corresponds each TOSA subassembly on first flexible board 110, and the TOSA subassembly is in the same place with the welding of corresponding welding hole 111, both realizes the transmission of the signal of telecommunication between TOSA subassembly and the first flexible board 110, makes first flexible board 110 and just board 100 keep vertical state again, improves overall arrangement rationality and space utilization.
In this embodiment, each TOSA assembly abuts against the upper shell 610, a part of heat of the TOSA assembly can be directly conducted to the upper shell 610, and the other part of heat is conducted to the upper shell 610 through the metal support plate 300, so as to further improve the heat dissipation efficiency and effect.
The light receiving component comprises a receiving chip 210 and a driving chip 200, the driving chip 200 drives the receiving chip 210 to operate, and the receiving chip 210 and the driving chip 200 are respectively connected and communicated with the second flexible board 120; since the second flexible board 120 covers the metal reinforcing plate 130, in order to facilitate the mounting of the receiving chip 210 and the driving chip 200, a relief area 121 is formed on the second flexible board 120 to expose a portion of the metal reinforcing plate 130, and the receiving chip 210 and the driving chip 200 are respectively adhered and fixed on the metal reinforcing plate 130 at a position corresponding to the relief area 121, that is, at an exposed position on the metal reinforcing plate 130. The receiving chip 210 and the driving chip 200 are bare chips, and heat can be directly conducted to the metal reinforcing plate 130, so that the heat dissipation effect is good. The receiving chip 210 is coupled to the second optical device 410 to realize transmission of optical signals, and the second optical device 410 is an FA optical device.
Each heating device on the PCB may also conduct heat to the metal support plate 300 through heat conducting interface materials such as a heat conducting rubber pad.
The optical module further includes a sealing cover 220 and a fixing member 230, the sealing cover 220 having a claw, the fixing member 230 having a card slot; the fixing member 230 is welded on the metal reinforcing plate 130 at a position corresponding to the avoiding region 111, that is, at a position exposed on the metal reinforcing plate 130, the sealing cover 220 covers the receiving chip 210 and the driving chip 200 for protecting the receiving chip 210 and the driving chip 200, and the clamping jaws are clamped with the clamping grooves to fix the sealing cover 220 and the fixing member 230.
One side of the metal supporting plate 300 close to the optical fiber ribbon 400 is formed with a supporting groove 330, one end of the optical fiber ribbon 400 is placed in the supporting groove 330, a clamping hole is formed on the groove wall of the supporting groove 330, a clamping member 430 is clamped with the clamping hole to fix one end of the optical fiber ribbon 400 in the supporting groove 330, the supporting groove 330 and the clamping member 430 play a role in supporting and fixing one end of the optical fiber ribbon 400, and the optical fiber ribbon 400 is prevented from being stressed and shaken.
The rigid plate 100 is integrally formed or welded with the first and second flexible plates 110 and 120.
The optical module of the embodiment provides a miniaturized high-temperature-resistant nonstandard packaging scheme, which is characterized in that the packaging volume is small (about 5686mm, which is less than one third of the standard packaging volume), the working temperature can reach an industrial temperature range (-40 ℃ to +85 ℃), and the working temperature range of the PSM4 optical module is increased to the industrial temperature range under the condition of a small packaging volume. The electrical connector adopts an LGA elastic sheet type electrical connector, the whole optical module is fixed on other equipment by adopting a screw, and the packaging form is more stable and reliable than a standard packaging plug-pull form and has excellent vibration resistance.
The optical module of the embodiment realizes small packaging volume through design selection and reasonable layout of the light emitting assembly and the light receiving assembly; through reasonable material selection and heat dissipation channel design, the packaging thermal resistance is reduced as much as possible, the heat dissipation effect is improved, the heat dissipation problem of the PSM4 protocol optical module under a small packaging volume is effectively solved, and the working temperature zone of the PSM4 protocol optical module is improved from a standard packaged commercial temperature zone to an industrial temperature zone under the packaging form.
The optical module of the embodiment can break through the application environment limitation of the traditional optical module of the type, so that the optical module can be applied to various severe environments such as high temperature, high humidity, high vibration and the like; the miniaturized package also greatly improves the layout density when the miniaturized package is applied, so that the communication bandwidth of the communication equipment can be improved while the size of the communication equipment is reduced, and the miniaturized package has great significance for improving the optical communication level.
The specific assembly steps are as follows:
(1) the receiving chip 210 and the driving chip 200 are attached to the metal stiffener 130, and then gold wire bonding is performed to electrically connect the second flexible board 120, as shown in fig. 8.
(2) The metal supporting plate 300 and the metal reinforcing plate 130 are bonded together by a heat conductive adhesive, and the metal reinforcing plate 130 is fixed to the second receiving groove 320, as shown in fig. 9.
(3) After the second optical device 410 (FA optical device) is coupled to the receiving chip 210, the fixing member 230 is soldered on the metal reinforcing plate 130, and the sealing cover 220 is covered to protect the bare chip, as shown in fig. 10.
(4) The TOSA assembly and the first flexible plate 110 are welded together, and then the four LC ferrules and the four TOSA assemblies are bonded together and fiber-coiled, completing the connection of the transmitting end optical path, as shown in fig. 11.
(5) The above completed assembly is loaded into the lower case 600, and then the upper case 610 is covered, and finally the upper and lower cases are fixed with four screws 700, 710, 720, 730, as shown in fig. 12. Four screw holes are formed at four corners of the upper case 610, four screw holes are also formed at corresponding positions of the lower case 600, and four screws pass through the corresponding screw holes to fix the upper case 600 and the lower case 610 together.
(6) The electrical connector 820 is fixed in the fitting hole of the lower case 600, as shown in fig. 13.
It should be noted that the above description is not intended to limit the present invention, and the present invention is not limited to the above examples, and those skilled in the art should also make changes, modifications, additions or substitutions within the spirit and scope of the present invention.

Claims (10)

1. A light module, comprising:
the shell comprises an upper shell and a lower shell, and the upper shell and the lower shell enclose an accommodating space;
the PCB is positioned in the accommodating space and comprises a rigid plate, a first flexible plate and a second flexible plate, and the rigid plate is respectively connected with the first flexible plate and the second flexible plate; the second flexible plate is folded upwards and is arranged in a stacked mode with the rigid plate; a metal reinforcing plate is fixed on the back surface of the second flexible plate;
the metal supporting plate is positioned in the accommodating space and is provided with a first accommodating groove and a second accommodating groove; the second accommodating groove is positioned between the metal reinforcing plate and the rigid plate and used for installing the metal reinforcing plate; a supporting table protruding upwards is formed at the peripheral edge of the metal supporting plate, and the supporting table is abutted to the upper shell;
the light emitting component is arranged in the first accommodating groove; and is connected with the first flexible board;
a light receiving member fixed to the metal reinforcing plate; and is connected with the second flexible board;
the optical fiber ribbon assembly comprises a first optical device, a second optical device, an optical fiber ribbon and an optical fiber connector, wherein the first optical device is communicated with the optical transmitting assembly, the second optical device is communicated with the optical receiving assembly, one end of the optical fiber ribbon is connected with the first optical device and the second optical device, and the other end of the optical fiber ribbon is connected with the optical fiber connector.
2. The optical module of claim 1, wherein a side of the rigid plate is connected to a first flexible plate, and a side of the rigid plate adjacent to the side is connected to a second flexible plate.
3. The optical module of claim 1, wherein the optical transmit module includes a plurality of TOSA modules adapted, the metal support plate having a plurality of first receiving slots, the fiber ribbon module including a plurality of first optical devices; the TOSA subassembly corresponds places in the first holding tank of a plurality of, corresponds the communication with the first optical device of a plurality of.
4. The optical module of claim 3, wherein the first receiving groove is a semicircular groove with an upward opening.
5. The optical module as claimed in claim 3, wherein the plurality of first receiving grooves are arranged in parallel and at equal intervals.
6. The optical module as claimed in claim 3, wherein the first flexible board is arranged perpendicular to the rigid board, and a welding hole is formed on the first flexible board at a position corresponding to each TOSA module, and the TOSA module is welded with the corresponding welding hole.
7. The optical module of claim 3, wherein the TOSA assembly abuts the upper housing.
8. The optical module according to claim 1, wherein the light receiving component comprises a receiving chip and a driving chip, and the driving chip drives the receiving chip to operate; an avoiding area is formed on the second flexible board, and the receiving chip and the driving chip are respectively adhered and fixed on the metal reinforcing board at positions corresponding to the avoiding area.
9. The optical module of claim 8, further comprising a sealing cover having a claw and a fixture having a card slot; the fixing piece is welded on the metal reinforcing plate and corresponds to the avoidance area, the sealing cover is arranged on the receiving chip and the driving chip, and the clamping jaws are clamped with the clamping grooves.
10. The optical module according to any one of claims 1 to 9, wherein a support groove is formed on a side of the metal support plate close to the optical fiber ribbon, one end of the optical fiber ribbon is placed in the support groove, a clamping hole is formed on a groove wall of the support groove, and a clamping member is clamped with the clamping hole to fix one end of the optical fiber ribbon in the support groove.
CN202010084569.6A 2020-02-10 2020-02-10 Optical module Pending CN111258009A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114252965A (en) * 2021-12-21 2022-03-29 中航光电科技股份有限公司 Optical module
CN116840986A (en) * 2023-07-28 2023-10-03 Nano科技(北京)有限公司 Miniaturized packaging structure of multichannel light receiving module

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Application publication date: 20200609