JP2011039187A - Photoelectric conversion module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a photoelectric conversion module which is adaptable to multiple channels, and arranges a transmission side circuit board and a reception side circuit board at a predetermined interval. <P>SOLUTION: The photoelectric conversion module 1 includes: a transmission side photoelectric conversion unit 2 for converting an electric signal into an optical signal; a transmission side circuit board 4 to which the transmission side photoelectric conversion unit 2 is attached and in which a positioning hole 16a is formed; a reception side photoelectric conversion unit 3 for converting an optical signal into an electric signal; a reception side circuit board 5 to which the reception side photoelectric conversion unit 3 is attached and in which a positioning hole 16b is formed; a support base 71 having one surface brought into contact with the transmission side circuit board 4 and the other surface brought into contact with the reception side circuit board 5; and a spacer 10 having a first positioning pin 15 protruded from one surface of the support base 71 and inserted into the positioning hole 16a of the transmission side circuit board 4 and a second positioning pin 15 protruded from the other surface of the support base 71 and inserted into the positioning hole 16b of the reception side circuit board 5. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to an opto-electric conversion module, and more particularly to an opto-electric conversion module that supports multi-channeling.

  In recent years, I / O interfaces (I / O architecture) for high-speed transmission such as InfiniBand (InfiniBand) and PCI Express have been put into practical use as the communication speed increases. In these I / O interfaces (I / O architecture), a high-speed band is realized by bundling and using a plurality of channels.

  As a photoelectric conversion module used for such an I / O interface, a configuration in which an optical transmission assembly (transmission side photoelectric conversion unit) and an optical reception assembly (reception side photoelectric conversion unit) are mounted on one circuit board is generally used. (For example, see Patent Document 1).

  In this photoelectric conversion module, a connection terminal that is electrically connected to an information system device of a connection partner is formed at one end of a circuit board, and a card edge connector that fits into a card edge socket provided in the information system device is provided. Forming.

JP 2008-90232 A

  However, in the conventional photoelectric conversion module, the transmission-side photoelectric conversion unit and the reception-side photoelectric conversion unit are mounted on one circuit board, so that the connection terminals for transmission and reception are connected to one end of one circuit board. Must be formed. When the number of channels is increased, the number of connection terminals is increased accordingly. Therefore, there is a problem that the width of the card edge connector is increased and the size of the photoelectric conversion module is increased.

  For example, a photoelectric conversion module that supports 12-channel bidirectional transmission (12 transmission channels and 12 reception channels) uses differential electrical signals for transmission, and therefore requires two connection terminals for each channel. In addition, 48 connection terminals are required for transmission and reception. In this case, in the conventional photoelectric conversion module, even when the connection terminals are formed on the front and back surfaces of the circuit board, the card edge connector requires a minimum width of 24 connection terminals. Becomes larger and the photoelectric conversion module becomes larger.

  As a configuration for reducing the width of the card edge connector, a configuration in which two circuit boards of a transmission side circuit board and a reception side circuit board are used, and a connection terminal is formed on each circuit board to form a two-stage card edge connector. There is.

  In the I / O interface standard, the two-stage card edge connectors on the transmission side and the reception side are required to have a predetermined interval in accordance with the dimensions of the edge connector socket to be connected. The vertical and horizontal widths of the entire photoelectric conversion module are also required to have predetermined dimensions.

  In such a configuration, a configuration in which the transmission side circuit board and the reception side circuit board can be set at a predetermined interval is required.

  SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned problems, and to provide an optoelectric conversion module that can cope with the increase in the number of channels and can set the transmission side circuit board and the reception side circuit board at a predetermined interval.

  The present invention was devised to achieve the above object, and includes a transmission side photoelectric conversion unit that converts an electrical signal into an optical signal, and a transmission in which the transmission side photoelectric conversion unit is attached and a positioning hole is formed. Side circuit board, a reception side photoelectric conversion part for converting an optical signal into an electrical signal, a reception side circuit board to which the reception side photoelectric conversion part is attached and a positioning hole is formed, and one surface is the transmission side A support base in contact with the circuit board and having the other surface in contact with the reception side circuit board; a first positioning pin protruding from one surface of the support base and passing through a positioning hole in the transmission side circuit board; and the support And a spacer provided with a second positioning pin that protrudes from the other surface of the base and passes through the positioning hole of the receiving circuit board.

  A housing comprising an upper housing in which a positioning fitting hole is formed and a lower housing in which a positioning fitting hole is formed, wherein the first positioning pin of the spacer is based on the thickness of the transmitting circuit board; The second positioning pin of the spacer is formed to be longer than the thickness of the receiving circuit board, and the positioning fitting hole of the housing, the first positioning pin of the spacer, and the second positioning pin A pin may be fitted.

  The spacer may include a plate-like plate portion disposed between the transmission side circuit board and the reception side circuit board.

  The transmission-side photoelectric conversion unit is attached to one end of the transmission-side circuit board so as to be disposed on the front surface side of the transmission-side circuit board, and a connection terminal is formed at the other end of the transmission-side circuit board. The circuit board is provided with a wiring pattern for wiring the connection terminal and the transmission side photoelectric conversion unit on a surface thereof, and the reception side photoelectric conversion unit is disposed on a surface side of the reception side circuit board. A connection terminal is formed at one end, and a connection terminal is formed at the other end of the reception-side circuit board. The reception-side circuit board includes a wiring pattern for wiring the connection terminal and the reception-side photoelectric conversion unit on the surface, and the transmission-side circuit The substrate and the receiving circuit board may be arranged with the surface of the transmitting circuit board and the surface of the receiving circuit board facing each other with a spacer interposed therebetween.

  The spacer may be formed with a wiring notch for passing a wiring member that electrically connects the transmitting circuit board and the receiving circuit board.

  ADVANTAGE OF THE INVENTION According to this invention, the small photoelectric conversion module which can respond | correspond to multi-channel and can make a transmission side circuit board and a receiving side circuit board into a predetermined space | interval can be provided.

It is a disassembled perspective view of the photoelectric conversion module which concerns on one embodiment of this invention. It is the disassembled perspective view seen from the other direction of the photoelectric conversion module of FIG. It is a disassembled side view of the photoelectric conversion module of FIG. (A), (b) is a perspective view which shows the external appearance of the photoelectric conversion module of FIG. (A) is a side view of the photoelectric conversion module of FIG. 1, (b) is the sectional side view. It is a figure which shows the transmission side circuit board used for the photoelectric conversion module of FIG. 1, (a) is the perspective view seen from upper direction, (b) is the perspective view seen from the downward direction. It is a figure which shows the transmission side circuit board and transmission side photoelectric conversion part which are used for the photoelectric conversion module of FIG. 1, (a) is a side view, (b) is a principal part expanded side view. It is a side view when a transmission side optical fiber is connected to the transmission side photoelectric conversion part of FIG. It is a figure which shows the receiving side circuit board used for the photoelectric conversion module of FIG. 1, (a) is the perspective view seen from upper direction, (b) is the perspective view seen from the downward direction. It is a figure which shows the receiving side circuit board and receiving side photoelectric conversion part which are used for the photoelectric conversion module of FIG. 1, (a) is a side view, (b) is a principal part expanded side view. It is a side view when a receiving side optical fiber is connected to the receiving side photoelectric conversion part of FIG. (A) is a perspective view when a connector is provided on the transmission side circuit board of FIG. 6, and (b) is a perspective view of the connector. It is a perspective view of the spacer used for the photoelectric conversion module of FIG. In the photoelectric conversion module of FIG. 1, it is a perspective view when a spacer is arrange | positioned between both circuit boards. In the photoelectric conversion module of FIG. 1, it is a perspective view when a spacer is arrange | positioned between the transmission side circuit board and the reception side circuit board, and these are mounted in a lower housing | casing. It is a figure which shows the photoelectric conversion module which concerns on one embodiment of this invention, (a) arrange | positions a spacer between a transmission side circuit board and a reception side circuit board, and when these are mounted in a lower housing | casing (B) is a principal part enlarged side view of a transmission side circuit board and a transmission side photoelectric conversion part, (c) is a principal part enlarged side view of a reception side circuit board and a reception side photoelectric conversion part. is there. It is a disassembled perspective view of the photoelectric conversion module which concerns on one embodiment of this invention. It is the disassembled perspective view seen from the other direction of the photoelectric conversion module of FIG. It is a decomposition | disassembly side view of the photoelectric conversion module of FIG. It is a sectional side view of the photoelectric conversion module of FIG. It is a perspective view of the transmission side circuit board used for the photoelectric conversion module of FIG. It is a side view of the transmission side circuit board of FIG. It is a perspective view of the receiving side circuit board used for the photoelectric conversion module of FIG. It is a side view of the receiving side circuit board of FIG. FIG. 18 is a perspective view of the photoelectric conversion module of FIG. 17 in which spacers are arranged between the transmission side circuit board and the reception side circuit board and these are mounted on the lower housing.

  Preferred embodiments of the present invention will be described below with reference to the accompanying drawings.

  In this embodiment, an 8-channel bidirectional (transmission 8 channel, reception 8 channel) photoelectric conversion module will be described as an example. Note that the number of channels is not limited to this, and may be, for example, 12-channel bidirectional (transmission 12 channels, reception 12 channels) or 4-channel bidirectional (transmission 4 channels, reception 4 channels).

[Photoelectric conversion module]
1 and 2 are exploded perspective views of the photoelectric conversion module according to the present embodiment, FIG. 3 is an exploded side view thereof, and FIGS. 4A and 4B are perspective views showing the external appearance of the photoelectric conversion module. FIG. 5 (a) is a side view thereof, and FIG. 5 (b) is a side sectional view thereof.

  As shown in FIGS. 1 to 5, the photoelectric conversion module 1 includes a transmission side circuit board 4 in which a connection terminal 8 a is formed at one end and a base member 6 on which the transmission side photoelectric conversion unit 2 is mounted is fixed at the other end. The connection terminal 8b is formed at one end, and the base member 7 having the reception side photoelectric conversion unit 3 mounted at the other end is fixed between the reception side circuit board 5 and the transmission side circuit board 4 and the reception side circuit board 5. A spacer 10 disposed at a predetermined interval between the transmission side circuit board 4 and the reception side circuit board 5, a connector 13 for electrically connecting the transmission side circuit board 4 and the reception side circuit board 5, and a transmission side circuit board 4, and a housing 17 including an upper housing 18 and a lower housing 19 that house the receiving circuit board 5, the spacer 10, and the connector 13.

  The transmission side circuit board 4 and the reception side circuit board 5 face each other on the surface on which the transmission side photoelectric conversion unit 2 of the transmission side circuit board 4 is mounted and the surface on which the reception side photoelectric conversion unit 3 of the reception side circuit board 5 is mounted. It is arranged up and down in the state.

  The optical fiber cable 22 is fixed to the housing 17. At the tip of the optical fiber cable 22 (the right side in FIGS. 1 and 2), the optical fiber cable 22 branches into a transmission side optical fiber 51 and a reception side optical fiber 53. An MT ferrule 52 a is provided at the tip of the transmission side optical fiber 51. The MT ferrule 52a is optically connected to the transmission side photoelectric conversion unit 2. An MT ferrule 52 b is provided at the tip of the reception side optical fiber 53. The MT ferrule 52b is optically connected to the receiving side photoelectric conversion unit 3.

  As shown in FIGS. 4 and 5, the transmission-side circuit board 4 and the reception-side circuit board 5 are stacked one above the other with a predetermined interval. The photoelectric conversion module 1 is formed at one end (on the right side in FIGS. 4 and 5) at one end of the transmission side card edge connector 9 a composed of the connection terminal 8 a formed at one end of the transmission side circuit board 4 and at one end of the reception side circuit board 5. The receiving-side card edge connector 9b including the connected terminal 8b is arranged at a predetermined interval. As described above, the photoelectric conversion module 1 includes the two-stage card edge connectors 9a and 9b at one end. The photoelectric conversion module 1 is electrically connected by inserting the card edge connectors 9a and 9b at one end into the edge connector socket of the device to be connected. In the present embodiment, the case where the transmission side circuit board 4 is arranged below and the reception side circuit board 5 is arranged above is explained, but it may be arranged upside down.

  An optical fiber cable 22 is fixed to the other end of the photoelectric conversion module 1. The optical fiber cable 22 may be provided with the photoelectric conversion module 1 at both ends thereof.

  The photoelectric conversion module 1 is used when, for example, devices such as servers are electrically connected. By using the optical fiber cable 22 provided with the photoelectric conversion module 1 at both ends, the photoelectric conversion module 1 at one end is connected to one device, and the photoelectric conversion module 1 at the other end is connected to another device, Connect between devices.

  In the photoelectric conversion module 1, an electrical signal is input to the transmission side circuit board 4 from the connection partner device via the connection terminal 8 a, and the transmission side photoelectric conversion unit 2 converts the electrical signal into an optical signal and transmits the optical signal. Send to the side optical fiber 51. Further, the optical signal transmitted from the reception side optical fiber 53 is converted into an electric signal by the reception side photoelectric conversion unit 3, and the electric signal is transmitted to the connected device via the wiring pattern of the reception side circuit board 5 and the connection terminal 8 b. Is output.

  In the photoelectric conversion module 1, for example, a signal of 10 Gb / s is transmitted per channel. In the present embodiment, because of 8-channel bidirectional transmission, signals of transmission 80 Gb / s and reception 80 Gb / s are transmitted.

[Transmission side circuit board, Transmission side photoelectric conversion unit]
FIGS. 6A and 6B are perspective views of the transmission side circuit board 4 and the transmission side photoelectric conversion unit 2. 7A and 7B are side views of the transmission side circuit board 4 and the transmission side photoelectric conversion unit 2.

  The transmission side circuit board 4 is made of, for example, a laminated board. Eight connection terminals 8a are formed at one end of the surface of the transmission side circuit board 4 (FIG. 6A). Two connection terminals serving as power supply terminals or ground terminals are formed on both sides of the eight connection terminals 8a. Similarly, eight connection terminals 8a are formed at one end of the back surface (FIG. 6B) of the transmission side circuit board 4. Two connection terminals serving as power supply terminals or ground terminals are formed on both sides of the eight connection terminals 8a. The connection terminal 8a corresponds to one channel of differential signals in two sets. A total of 16 connection terminals 8a on the front and back surfaces correspond to 8 channels.

  One end of the transmission-side circuit board 4 is formed with a connection terminal 8a, which is a card edge connector 9a that fits into an edge connector socket of a device to be connected.

  The transmission side circuit board 4 is formed with positioning holes 16a through which the positioning pins 15 of the spacer 10 pass. One positioning hole 16a is provided on each of one end side and the other end side of one side of the transmission side circuit board 4 (the upper left side in FIG. 6A), and the other side of the transmission side circuit board 4. A total of four are formed on each of the one end side and the other end side of the (lower right side in FIG. 6A).

  The transmission side circuit board 4 has a through hole 14a for fitting the conductor pin 12 of the connector 13 in the vicinity of the center of one side of the transmission side circuit board 4 (the upper left side in FIG. 6A). 7 are formed.

  On the surface of the transmission side circuit board 4, a wiring pattern 38 a for wiring from the connection terminal 8 a to the transmission side photoelectric conversion unit 2 is formed. A wiring pattern 39 a is formed on the back surface of the transmission side circuit board 4. As shown in FIGS. 6B and 7A, the wiring pattern 39a formed on the back surface of the transmission side circuit board 4 is electrically connected to the wiring pattern 38a on the front surface through the through hole 40a.

  As shown in FIGS. 7A and 7B, the transmission side photoelectric conversion unit 2 includes a light emitting element array (for example, VCSEL array) 30, a driver IC 31 that drives the light emitting element array 30, and the light emitting element array 30. A lens block 32a disposed above. The light emitting element array 30 includes eight light emitting elements. The light emitting element array 30 is mounted on the base member 6 via the submount 30b.

  The lens block 32a includes a substantially triangular prism-shaped right-angle optical path lens 33a having a reflective surface 37a, a lens 34a (see FIG. 6) formed on the front surface (left surface in FIG. 7) of the right-angle optical path lens 33a, and a right-angle optical path lens. The fitting pin 35a is formed so as to protrude from the front surface of 33a, and the lens 36a is formed on the lower surface of the right-angle optical path lens 33a and arranged so as to coincide with the optical axis of the light emitting element array 30. The lens block 32a is fixed to the base member 6 by a member (not shown).

  As shown in FIG. 7B, the light emitting element array 30 and the driver IC 31 are electrically connected by a wire 41a. The driver IC 31 and the wiring pattern 38a formed on the surface side of the transmission side circuit board 4 are electrically connected by a wire 42a.

  Although not shown, a microcomputer (microcomputer) is mounted on the back surface of the transmission side circuit board 4. The microcomputer is electrically connected to the driver IC 31 and the amplification IC 44 (see FIG. 10) of the reception side circuit board 5 and controls them. The microcomputer and the amplification IC 44 are electrically connected via a connector 13 that electrically connects the transmission side circuit board 4 and the reception side circuit board 5. The microcomputer is desirably mounted on the transmission side circuit board 4 in order to mainly control the driver IC 31 (setting of the driver IC 31 and the like).

  In the present embodiment, a base member 6 is provided at the other end of the transmission side circuit board 4, and the transmission side photoelectric conversion unit 2 is mounted on the base member 6.

  The base member 6 includes a plate-like base portion 6a and an extension portion 6b that is formed integrally with the base portion 6a and has a smaller thickness than the base portion 6a that extends from the lower portion of the base portion 6a (the portion on the back side of the base portion 6a). It is formed in a substantially L shape in a side view. The base member 6 has a flat surface on the back surface side (lower side in FIG. 7), and has a step on the front surface side (upper side in FIG. 7) between the base portion 6a and the extension portion 6b.

  The base member 6 is made of a conductive member, for example, a metal such as copper tungsten (Cu-W) or Kovar.

  On the surface of the base portion 6a of the base member 6, the submount 30b on which the light emitting element array 30 is placed and the driver IC 31 are bonded and fixed with a conductive adhesive. The lens block 32a is fixed to the surface of the base portion 6a of the base member 6 by a member (not shown).

  The back surface on the other end side of the transmission side circuit board 4 is bonded and fixed to the surface of the extension portion 6 b of the base member 6. The base member 6 is electrically connected to a ground pattern (not shown) formed in the inner layer of the transmission side circuit board 4.

  In the present embodiment, the transmission-side photoelectric conversion unit 2 is connected to the other side of the transmission-side circuit board 4 in the width direction (from the upper left to the lower right in FIG. 6A) (lower right in FIG. 6A). It is mounted biased to the side. That is, the base member is arranged such that the entire transmission side photoelectric conversion unit 2 is disposed on the other side (the lower right side in FIG. 6A) side from the center in the width direction of the transmission side circuit board 4. 6 is installed. The transmission side photoelectric conversion unit 2 has one side (the upper left side in FIG. 6A) side in the width direction of the transmission side circuit board 4 (the direction from the upper left to the lower right in FIG. 6A). It may be biased to be mounted.

[Receiving side circuit board, receiving side photoelectric conversion unit]
FIGS. 9A and 9B are perspective views of the reception side circuit board 5 and the reception side photoelectric conversion unit 3. FIGS. 10A and 10B are side views of the reception side circuit board 5 and the reception side photoelectric conversion unit 3.

  The receiving side circuit board 5 is made of, for example, a laminated board. Eight connection terminals 8b are formed at one end of the surface of the reception-side circuit board 5 (FIG. 9A). Two connection terminals serving as a power supply terminal or a ground terminal are formed on both sides of the eight connection terminals 8b. Similarly, eight connection terminals 8b are formed at one end of the back surface (FIG. 9B) of the reception-side circuit board 5. Two connection terminals serving as a power supply terminal or a ground terminal are formed on both sides of the eight connection terminals 8b. The connection terminal 8b corresponds to one channel of differential signals in two sets. A total of 16 connection terminals 8b on the front and back surfaces correspond to 8 channels.

  One end of the reception-side circuit board 5 is formed with a connection terminal 8b, which is a card edge connector 9b that fits into an edge connector socket of a device to be connected.

  The receiving side circuit board 5 is formed with positioning holes 16b through which the positioning pins 15 of the spacer 10 pass. One positioning hole 16b is provided on one side and the other side of one side of the reception side circuit board 5 (the upper left side in FIG. 9A), and the other side of the reception side circuit board 5. A total of four are formed on each of the one end side and the other end side of the (lower right side in FIG. 9A).

  The receiving side circuit board 5 has a through hole 14b for fitting the conductor pin 12 of the connector 13 at the center of the other side of the receiving side circuit board 5 (the lower right side in FIG. 9A). Seven are formed in the vicinity.

  On the surface of the reception side circuit board 5, a wiring pattern 38 b is formed for wiring from the connection terminal 8 b to the reception side photoelectric conversion unit 3. A wiring pattern 39 b is formed on the back surface of the receiving circuit board 5. As shown in FIGS. 9B and 10A, the wiring pattern 39b formed on the back surface of the receiving circuit board 5 is electrically connected to the wiring pattern 38b on the front surface through the through hole 40b.

  As shown in FIGS. 10A and 10B, the receiving-side photoelectric conversion unit 3 includes a light receiving element array (for example, PD array) 43, an amplification IC 44 that amplifies an electric signal from the light receiving element array 43, and A lens block 32b disposed above the light receiving element array 43. The light receiving element array 43 includes eight light receiving elements. The light receiving element array 43 is mounted on the base member 7 via the submount 43b.

  The lens block 32b includes a substantially triangular prism-shaped right-angle optical path lens 33b having a reflecting surface 37b, a lens 34b (see FIG. 9) formed on the front surface (left surface in FIG. 10) of the right-angle optical path lens 33b, and a right-angle optical path lens. The fitting pin 35b is formed so as to protrude from the front surface of 33b, and the lens 36b is formed on the lower surface of the right-angle optical path lens 33b and arranged so as to coincide with the optical axis of the light receiving element array 43. The lens block 32b is fixed to the base member 7 by a member (not shown).

  As shown in FIG. 10B, the light receiving element array 43 and the amplification IC 44 are electrically connected by a wire 41b. The amplification IC 44 and the wiring pattern 38b formed on the front surface side of the reception side circuit board 5 are electrically connected by a wire 42b.

  In the present embodiment, a base member 7 is provided at the other end of the reception side circuit board 5, and the reception side photoelectric conversion unit 3 is mounted on the base member 7.

  The base member 7 includes a plate-like base portion 7a and an extension portion 7b that is formed integrally with the base portion 7a and has a thickness smaller than the base portion 7a that extends from the lower portion of the base portion 7a (the portion on the back side of the base portion 7a). It is formed in a substantially L shape in a side view. The base member 7 has a flat surface on the back side (lower side in FIG. 10) and a step on the front side (upper side in FIG. 10) between the base portion 7a and the extension portion 7b.

  The base member 7 is made of a conductive member, for example, a metal such as copper tungsten (Cu-W) or Kovar.

  On the surface of the base portion 7a of the base member 7, the submount 43b on which the light receiving element array 43 is placed and the amplification IC 44 are bonded and fixed with a conductive adhesive. The lens block 32b is fixed to the surface of the base portion 7a of the base member 7 by a member (not shown).

  The back surface on the other end side of the reception side circuit board 5 is bonded and fixed to the surface of the extension 7 b of the base member 7. The base member 7 is electrically connected to a ground pattern (not shown) formed in the inner layer of the receiving circuit board 5.

  In the present embodiment, the reception-side photoelectric conversion unit 3 is arranged in the width direction of the reception-side circuit board 5 (from the upper left to the right in FIG. 9A), similarly to the arrangement of the transmission-side photoelectric conversion unit 2 of the transmission-side circuit board 4. Mounting is biased to the other side (lower right side in FIG. 9A) side. That is, the base member is arranged such that the entirety of the reception-side photoelectric conversion unit 3 is disposed on the other side (the lower right side in FIG. 9A) side from the center in the width direction of the reception-side circuit board 5. 7 is installed. The transmission side photoelectric conversion unit 2 is placed on one side (the upper left side in FIG. 6A) side of the transmission side circuit board 4 in the width direction (the direction from the upper left to the lower right in FIG. 6A). Similarly, when the mounting is performed in a biased manner, the receiving side photoelectric conversion unit 3 is arranged on one side of the width direction of the receiving side circuit board 5 (the direction from the upper left to the lower right in FIG. 9A) (FIG. 9). (A) The upper left side is mounted with a bias.

[connector]
FIG. 12B shows the connector 13. The connector 13 is for electrically connecting the transmission side circuit board 4 and the reception side circuit board 5. The connector 13 is provided with a plurality (seven in this case) of conductor pins 12 protruding above and below a rectangular parallelepiped connector body 60. Seven conductor pins 12 are arranged, and the connector body 60 is integrally formed by resin molding.

  A perspective view when the connector 13 is connected to the transmission side circuit board 4 is shown in FIG. The connector 13 is electrically connected to the transmission side circuit board 4 by soldering the conductor pins 12 through the through holes 14a. The same applies to the reception side circuit board 5.

  In the present embodiment, the transmission side circuit board 4 and the reception side circuit board 5 are electrically connected by the connector 13, but the present invention is not limited to this. For example, transmission is performed using a flexible printed circuit board or a cable array. The side circuit board 4 and the reception side circuit board 5 may be electrically connected.

[Spacer]
FIG. 13 shows the spacer 10. The spacer 10 is a member for keeping the transmission side circuit board 4 and the reception side circuit board 5 at a predetermined interval. The spacer 10 includes a plate-like plate portion 70 formed in a substantially rectangular shape in plan view, and a prismatic support base 71 formed so as to protrude up and down at a predetermined height from the four corners of the plate portion 70, It consists of columnar positioning pins 15 formed so as to protrude further from the upper and lower sides of each support base 71. In the spacer 10, the plate portion 70, the support base 71, and the positioning pins 15 are integrally formed.

  The spacer 10 passes the positioning pin 15 protruding downward through the positioning hole 16a of the transmission side circuit board 4 and passes the positioning pin 15 protruding upward through the positioning hole 16b of the reception side circuit board 5 to transmit. It is attached between the side circuit board 4 and the reception side circuit board 5.

  FIG. 14 shows a perspective view when the spacer 10 is arranged between the transmission side circuit board 4 and the reception side circuit board 5.

  The length between the upper surface and the lower surface of the support base 71 is formed to be the same length as a predetermined interval to be maintained between the transmission side circuit board 4 and the reception side circuit board 5 defined in the I / O interface standard. The The positioning pins 15 of the spacer 10 are passed through the positioning holes 16 a and 16 b of the transmission side circuit board 4 and the reception side circuit board 5, respectively, and the spacer 10 is attached between the transmission side circuit board 4 and the reception side circuit board 5. At this time, the lower surface of the support base 71 is in contact with the surface of the transmission side circuit board 4, and the upper surface of the support base 71 is in contact with the surface of the reception side circuit board 5. Due to the length between the upper surface and the lower surface of the support base 71, the transmission side circuit board 4 and the reception side circuit board 5 are kept at a predetermined interval.

  Further, by adjusting the height of the support base 71 (the height from the upper surface to the lower surface), the vertical distance between the transmission side circuit board 4 and the reception side circuit board 5 can be adjusted as appropriate.

  The plate portion 70 is formed with a wiring cutout portion 11 through which the connector 13 passes. The wiring cutout 11 is formed in a substantially rectangular shape in plan view.

  The positioning pin 15 is formed so that its length (height from the upper surface or the lower surface of the support base 71) is longer than the thickness of the transmission side circuit board 4 and the reception side circuit board 5. When the positioning pin 15 is passed through the positioning holes 16a and 16b and the spacer 10 is attached between the transmission side circuit board 4 and the reception side circuit board 5, the tip of the positioning pin 15 is located below the transmission side. It protrudes from the back surface of the circuit board 4 and protrudes from the back surface of the receiving circuit board 5 in the upper part.

  The tip of the positioning pin 15 protruding from the back surface of the transmitting circuit board 4 is fitted into the positioning fitting hole 20 of the lower housing 19. The tip of the positioning pin 15 protruding from the back surface of the receiving circuit board 5 is fitted into the positioning fitting hole 20 of the upper housing 18. By engaging the positioning pin 15 of the spacer 10 with the positioning fitting hole 20 of the upper casing 18 and the lower casing 19, the transmitting circuit board 4 and the receiving circuit board 5 are connected to the upper casing 18 and the lower casing 18. Positioned with respect to the side housing 19.

  The spacer 10 is made of a conductive member such as metal. For example, the spacer 10 is made of zinc and is manufactured by die casting.

[Optical fiber cable]
The optical fiber cable 22 has eight transmission-side optical fibers 51 and eight reception-side optical fibers 53, and these 16 optical fibers 51 and 53 are bundled into a cable.

  As shown in FIGS. 1 to 3, a protective cover 23 made of a resin for protecting the end of the optical fiber cable 22 is provided at the end of the optical fiber cable 22. The protective cover 23 is, for example, a rubber boot. When the optical fiber cable 22 is bent 90 ° and pulled, the protective cover 23 made of rubber boots is arranged so that the optical fibers 51 and 53 do not bend at an allowable bending radius or more at the base of the protective cover 23. Protect. A flange-like engagement portion 24 is integrally formed at the end of the protective cover 23 so as to protrude from the end of the protective cover 23.

  The optical fiber cable 22 branches into eight transmission-side optical fibers 51 and eight reception-side optical fibers 53 at the end. An 8-core MT ferrule 52 a is provided at the end of the eight transmission-side optical fibers 51. Similarly, an eight-core MT ferrule 52 b is provided at the end of the eight reception-side optical fibers 53.

  As shown in FIG. 8, by fitting a fitting hole (not shown) formed in the MT ferrule 52a and a fitting pin 35a of the lens block 32a, the MT ferrule 52a and the lens block at the end of the transmission side optical fiber 51 are fitted. 32a is connected. Thereby, the transmission side optical fiber 51 and the light emitting element array 30 are optically connected via the MT ferrule 52a and the lens block 32a.

  Similarly, as shown in FIG. 11, by fitting a fitting hole (not shown) formed in the MT ferrule 52b and a fitting pin 35b of the lens block 32b, the MT ferrule 52b at the end of the reception-side optical fiber 53 is fitted. And the lens block 32b are connected. Thereby, the receiving side optical fiber 53 and the light receiving element array 43 are optically connected via the MT ferrule 52b and the lens block 32b.

[Case, Upper Case, Lower Case]
The photoelectric conversion module 1 includes a housing 17 that houses the transmission side circuit board 4, the transmission side photoelectric conversion unit 2, the reception side circuit board 5, and the reception side photoelectric conversion unit 3.

  As shown in FIGS. 1 to 3, the housing 17 is divided into upper and lower parts, and includes an upper housing 18 and a lower housing 19. The upper housing 18 and the lower housing 19 are made of metal.

  Positioning fitting holes 20 for fitting the positioning pins 15 of the spacer 10 are formed in the upper housing 18 and the lower housing 19, respectively. The positioning pins 15 of the spacer 10 are fitted into the positioning fitting holes 20 through the positioning holes 16a and 16b of the transmission side circuit board 4 and the reception side circuit board 5, so that the transmission side circuit board 4 and the reception side are received. The side circuit board 5 is positioned with respect to the housing 17.

  A notch groove 25 for engaging with the engaging portion 24 at the end of the optical fiber cable 22 is formed on the rear surface of the upper housing 18 and the lower housing 19 (the surface on the left front side in FIG. 1). .

  The upper housing 18 and the lower housing 19 are fixed by fixing screws 26.

[Assembly of photoelectric conversion module]
Next, the assembly procedure of the photoelectric conversion module of this embodiment will be described.

  The MT ferrule 52 a of the transmission side optical fiber 51 of the optical fiber cable 22 is connected to the lens block 32 a of the transmission side photoelectric conversion unit 2 of the transmission side circuit board 4. Similarly, the MT ferrule 52 b of the reception side optical fiber 53 is connected to the lens block 32 b of the reception side photoelectric conversion unit 3 of the reception side circuit board 5.

  The conductor pin 12 of the connector 13 is inserted into the through hole 14a of the transmission side circuit board 4 and attached (FIG. 12).

  The spacer 10 is disposed between the transmission-side circuit board 4 and the reception-side circuit board 5, and positioning pins 15 that protrude above and below the spacer 10 are positioned between the positioning holes 16 a of the transmission-side circuit board 4 and the reception-side circuit board 5. Each is attached through the positioning hole 16b. The transmission side circuit board 4 and the reception side circuit board 5 face the surface of the transmission side circuit board 4 on which the transmission side photoelectric conversion unit 2 is mounted and the surface of the reception side circuit board 5 on which the reception side photoelectric conversion unit 3 is mounted. It is attached as a combined state (FIG. 14). At the same time, the conductor pin 12 of the connector 13 is inserted into the through hole 14 b of the receiving circuit board 5.

  The distal end portion of the positioning pin 15 protruding from the transmitting circuit board 4 is fitted into the positioning fitting hole 20 of the lower housing 19 so that the transmitting circuit board 4 and the receiving circuit board 5 are connected to the lower housing. 19 At this time, as shown in FIGS. 1 and 3, a heat radiating sheet 21 a as a heat radiating member is disposed on the back surface of the base member 6 of the transmission side circuit board 4. The base member 6 of the transmission side circuit board 4 is in contact with the lower housing 19 via the heat dissipation sheet 21a.

  Moreover, the edge of the notch groove 25 of the lower housing | casing 19 and the groove | channel of the flange-shaped engaging part 24 of the edge part of the protective cover 23 of the optical fiber cable 22 are fitted (FIG. 15).

  The upper casing 18 is mounted on the lower casing 19 so as to cover the receiving circuit board 5. At this time, the positioning fitting hole 20 of the upper housing 18 is fitted to the tip end portion of the positioning pin 15 protruding from the receiving circuit board 5. Further, the edge of the notch groove 25 of the upper housing 18 and the groove of the flange-like engagement portion 24 at the end of the protective cover 23 of the optical fiber cable 22 are fitted. As shown in FIGS. 1, 2, and 3, a heat radiating sheet 21 b as a heat radiating member is disposed on the back surface of the base member 7 of the receiving circuit board 5. The base member 7 of the reception side circuit board 5 is in contact with the upper housing 18 via the heat dissipation sheet 21b.

  The upper casing 18 and the lower casing 19 are fixed with fixing screws 26. Thereby, the photoelectric conversion module 1 is obtained (FIG. 4).

[Operation of this embodiment]
The operation of the present embodiment will be described.

  In the photoelectric conversion module 1 according to the present embodiment, the transmission-side photoelectric conversion unit 2 is arranged so as to be biased toward one side of the transmission-side circuit board 4, and the reception-side photoelectric conversion unit 3 is similarly arranged on the reception-side circuit. A surface that is biased toward one side of the substrate 5 and the transmission-side photoelectric conversion unit 2 of the transmission-side circuit substrate 4 is disposed; and a surface that the reception-side photoelectric conversion unit 3 of the reception-side circuit substrate 5 is disposed; It is the composition which has been arranged facing each other.

  Thereby, the transmission side photoelectric conversion unit 2 and the reception side photoelectric conversion unit 3 can be arranged in parallel in the width direction between the transmission side circuit board 4 and the reception side circuit board 5 without interfering with each other. The interval between the transmission-side circuit board 4 and the reception-side circuit board 5 is determined by the I / O interface standard or the like, and the interval between the transmission-side photoelectric conversion unit 2 and the reception-side photoelectric conversion unit 3 cannot be set up and down. This is an effective configuration in some cases.

  Further, the lens block 32 a of the transmission side photoelectric conversion unit 2 and the lens block 32 b of the reception side photoelectric conversion unit 3 are arranged in parallel in the width direction between the transmission side circuit board 4 and the reception side circuit board 5. Yes.

  As a result, the lens block 32a of the transmission side photoelectric conversion unit 2 and the lens block 32b of the reception side photoelectric conversion unit 3 are saved between the transmission side circuit board 4 and the reception side circuit board 5 without interfering with each other. Can be arranged.

  Further, a spacer 10 having a positioning hole 16 a formed in the transmission side circuit board 4 and a positioning hole 16 b formed in the reception side circuit board 5 and provided with a positioning base 15 protruding from the support base 71 and the support base 71 is used. The spacer 10 is arranged between the transmission side circuit board 4 and the reception side circuit board 5, and the positioning pins 15 of the spacer 10 are inserted into the positioning holes 16 a of the transmission side circuit board 4 and the positioning holes 16 b of the reception side circuit board 5. It is equipped with the structure attached through each.

  Thereby, the space | interval between the transmission side circuit board 4 and the reception side circuit board 5 can be made into the length between the upper surface of the support stand 71 of the spacer 10, and a lower surface. By adjusting the height of the support base 71 (the height from the upper surface to the lower surface), the vertical distance between the transmission-side circuit board 4 and the reception-side circuit board 5 can be adjusted as appropriate.

  The positioning pins 15 of the spacer 10 are formed longer than the thicknesses of the transmission side circuit board 4 and the reception side circuit board 5, and the positioning pins 15 protrude from the back surfaces of the transmission side circuit board 4 and the reception side circuit board 5, The housing 17 has a positioning fitting hole 20 formed in each of the upper housing 18 and the lower housing 19, and the positioning fitting hole 20 of the housing 17 and the positioning pin 15 of the spacer 10 are fitted. ing.

  Accordingly, the spacer 10 can be positioned with respect to the casing 17 of the transmission side circuit board 4 and the reception side circuit board 5.

  In addition, the spacer 10 includes a plate-like plate portion 70, and the plate portion 70 has a configuration arranged between the transmission side circuit board 4 and the reception side circuit board 5. The spacer 10 is made of metal.

  Accordingly, the plate portion 70 of the spacer 10 functions as an electromagnetic shield between the transmission side circuit board 4 and the reception side circuit board 5, and transmits the high frequency signal transmitted through the transmission side circuit board 4 and the reception side circuit board 5. Crosstalk between high-frequency signals can be reduced. In particular, in the configuration in which the transmission side circuit board 4 and the reception side circuit board 5 are disposed so that the surfaces on which the wiring patterns 38a and 38b between the connection terminals 8a and 8b and the photoelectric conversion units 2 and 3 are formed face each other. This is effective because the shield part 10 can be electromagnetically shielded between the wiring patterns 38a and 38b.

  Further, the spacer 10 is formed with a wiring cutout portion 11 through which a wiring member (connector 13) for electrically connecting the transmission side circuit board 4 and the reception side circuit board 5 is passed.

  Thereby, the transmission side circuit board 4 and the reception side circuit board 5 can be electrically connected by the wiring member (connector 13) through the wiring notch 11 of the spacer 10.

  Further, the transmission side photoelectric conversion unit 2 is mounted on the surface of the base member 6, and a part of the surface of the base member 6 is fixed to the back surface of the transmission side circuit board 4. 7, a part of the surface of the base member 7 is fixed to the back surface of the reception side circuit board 5, and the front surface of the transmission side circuit board 4 and the surface of the reception side circuit board 5 face each other. The structure accommodated in the body 17 is provided.

  Thereby, the heat generated in the transmission side photoelectric conversion unit 2 can be radiated to the housing 17 via the base member 6. The heat generated in the receiving side photoelectric conversion unit 3 can be radiated to the housing 17 via the base member 7. Therefore, it is possible to efficiently dissipate heat generated in the transmission side photoelectric conversion unit 2 and the reception side photoelectric conversion unit 3.

  The base members 6 and 7 are composed of plate-like base portions 6a and 7a and base portions 6a and 7a formed integrally with the base portions 6a and 7a, and the extension portions 6b and 7b having a thickness smaller than that of the base portions 6a and 7a. Yes, the surface has a shape with a step between the base portions 6a, 7a and the extension portions 6b, 7b, and a photoelectric conversion portion (transmission side photoelectric conversion portion 2 or reception side) on the surface of the base portions 6a, 7a of the base members 6, 7 The photoelectric conversion unit 3) is mounted, and the back surface of the circuit board (the transmission side circuit board 4 or the reception side circuit board 5) is fixed to the surface of the extension parts 6b and 7b of the base members 6 and 7.

  Accordingly, the photoelectric conversion units 2 and 3 can be attached to one end of the circuit boards 4 and 5 so as to be located on the surface side of the circuit boards 4 and 5, and the photoelectric conversion units 2 and 3 and the circuit boards 4 and 4 are attached. The base members 6 and 7 that can serve as a heat dissipation path between the casings 17 located on the back side of the base plate 5 can be disposed.

  Further, the base members 6 and 7 can align the heights of the surface of the photoelectric conversion units 2 and 3 and the circuit boards 4 and 5. The length of the wire connecting the patterns can be shortened.

  Moreover, the structure which contacts the housing | casing 17 through the thermal radiation sheet | seats 21a and 21b is provided.

  Thereby, the base members 6 and 7 are thermally connected to the housing 17 via the heat radiation sheets 21a and 21b. Therefore, it is possible to efficiently radiate heat generated in the transmission side photoelectric conversion unit 2 and the reception side photoelectric conversion unit 3 to the housing 17 via the base members 6 and 7 and the heat radiation sheets 21a and 21b.

[Second Embodiment]
Next, a second embodiment of the present invention will be described.

  FIG. 16A shows a second embodiment of the present invention. In the photoelectric conversion module 80 according to the second embodiment, as in the photoelectric conversion module 1 described above, the transmission circuit board 4 and the reception circuit board 5 are arranged above and below via the spacers 10. Is mounted on the lower casing 19 and is fixed to the lower casing 19 by covering an upper casing (not shown).

  In the photoelectric conversion module 80 according to the second embodiment, the shape of the base member 81 fixed to the transmission side circuit board 4 and the base member 82 fixed to the reception side circuit board 5 is the same as that of the photoelectric conversion module 1. Different from the base members 6 and 7.

  As shown in FIG. 16C, the base member 81 has a plate-like base portion 81a and a base portion 81a that is formed integrally with the base portion 81a and extends from the lower portion of the base portion 81a (the portion on the back side of the base portion 81a). The extension portion 81b has a small thickness, and is formed in an approximately L shape in a side view. The base member 81 has a flat surface on the back surface side (lower side in FIG. 16C) and a shape in which the front surface side (upper side in FIG. 16C) has a step between the base portion 81a and the extension portion 81b. It has become.

  The base member 81 extends from the extended portion 81b toward one end of the transmission side circuit board 4 (upper right direction in FIG. 16A, right direction in FIG. 16C) to the position of the support base 71 of the spacer 10. A second extension portion 81c is provided. The second extension portion 81 c is formed to be shorter than the extension portion 81 b so as not to interfere with the positioning pins 15 protruding from the back surface side of the transmission side circuit board 4. The surfaces of the extension portion 81 b and the second extension portion 81 c are bonded and fixed to the back surface of the transmission side circuit board 4 by an adhesive 84.

  When the transmission side circuit board 4 is mounted on the lower housing 19, the heat dissipation sheet 21a is disposed on the back surface of the second extension portion 81c. When the photoelectric conversion module 80 is assembled with the upper housing 19 and the lower housing 19 fixed, the second extension portion 81c and the heat dissipation sheet 21a are positioned between the support base 71 and the lower housing 19 and are supported. A vertical compressing force is applied by the base 71 and the lower housing 19.

  Similarly, as shown in FIG. 16B, the base member 82 includes a plate-like base portion 82a and a base portion that is formed integrally with the base portion 82a and extends from the lower portion of the base portion 82a (the portion on the back side of the base portion 82a). It consists of the extension part 82b whose thickness is smaller than 82a, and is formed in a substantially L shape by side view. The base member 82 has a flat surface on the back side (upper side in FIG. 16B) and a shape in which the front side (lower side in FIG. 16B) has a step between the base portion 82a and the extension portion 82b. It has become.

  The base member 82 extends from the extended portion 82b toward one end of the receiving circuit board 5 (upper right direction in FIG. 16A, right direction in FIG. 16B) to the position of the support base 71 of the spacer 10. A second extension 82c is provided. The second extension portion 82 c is formed to be shorter than the extension portion 82 b so as not to interfere with the positioning pins 15 protruding from the back surface side of the reception side circuit board 5. The front surfaces of the extension portion 82 b and the second extension portion 82 c are bonded and fixed to the back surface of the reception-side circuit board 5 with an adhesive 83.

  When the upper casing is placed over the reception side circuit board 5, the heat radiation sheet 21b is disposed on the back surface of the second extension portion 82c. When the photoelectric conversion module 80 is assembled with the upper casing 19 and the lower casing 19 fixed, the second extension 82c and the heat dissipation sheet 21b are positioned between the support base 71 and the upper casing. And the force which compresses in the up-down direction is added by the upper housing.

[Operation of Second Embodiment]
In the photoelectric conversion module 80 according to the second embodiment, the base member 81 fixed to one end of the transmission side circuit board 4 extends to a position where the base member 81 is sandwiched between the support base 71 of the spacer 10 and the lower casing 19. The base member 82 fixed to one end of the receiving side circuit board 5 is provided with a second extension portion 82c extending to a position sandwiched between the support base 71 of the spacer 10 and the upper housing. ing.

  Thus, the second extension portions 81 c and 82 c of the base members 81 and 82 of the transmission side circuit board 4 and the reception side circuit board 5 are compressed in the vertical direction by the support base 71 of the spacer 10 and the casing 17. Power is added.

  Since the second extensions 81c and 82c of the base members 81 and 82 are sandwiched and fixed between the support base 71 of the spacer 10 and the housing 17 from above and below, the base members 81 and 82 and the circuit boards 4 and 5 are fixed. It is possible to prevent the adhesive fixing from being peeled off. Further, since the second extension portions 81c and 82c are in close contact with the housing 17 via the heat radiation sheets 21a and 21b, the heat dissipation from the base members 81 and 82 to the housing 17 can be improved.

[Third Embodiment]
Next, a third embodiment of the present invention will be described.

  17 to 25 show a third embodiment of the present invention. The photoelectric conversion module 130 according to the third embodiment has basically the same configuration as the above-described photoelectric conversion module 1, omits the base member 6, and directly transmits the transmission-side photoelectric conversion unit 2. It is mounted on the substrate 4, and similarly, the base member 7 is omitted, and the reception side photoelectric conversion unit 3 is directly mounted on the reception side circuit substrate 5.

  As shown in FIG. 21, the transmission side photoelectric conversion unit 2 is directly mounted on one end of the transmission side circuit board 4 (lower left side in FIG. 21). The transmission side photoelectric conversion unit 2 is arranged so as to be biased toward one side of the transmission side circuit board 4 (lower right side in FIG. 21).

  As shown in FIG. 22, the wiring pattern 38a formed on the front surface side of the transmission side circuit board 4 and the wiring pattern 39a formed on the back surface side of the transmission side circuit board 4 are electrically connected by a through hole 40a. Has been.

  As shown in FIG. 23, the reception-side photoelectric conversion unit 3 is directly mounted on one end of the reception-side circuit board 5 (lower left side in FIG. 23). The reception-side photoelectric conversion unit 3 is arranged so as to be biased toward one side (the lower right side in FIG. 23) of the reception-side circuit board 5.

  As shown in FIG. 24, the wiring pattern 38b formed on the front surface side of the reception side circuit board 5 and the wiring pattern 39b formed on the back surface side of the reception side circuit board 5 are electrically connected by a through hole 40b. Has been.

  In FIG. 25, the spacer 10 is arranged between the transmission side circuit board 4 and the reception side circuit board 5, and the positioning pins 15 protruding from the back surface of the transmission side circuit board 4 are inserted into the positioning fitting holes of the lower housing 19. A perspective view when fitted to 20 is shown.

  17 to 20, the heat dissipation sheet is omitted, but the transmission side circuit board 4 and the reception side circuit board 5 are thermally connected to the lower casing 19 or the upper casing 18 via the heat dissipation sheet, respectively. It is desirable that Thereby, the heat generated in the transmission side photoelectric conversion unit 2 is transmitted to the lower housing 19 side via the transmission side circuit board 4 and the heat dissipation sheet, and the heat generated in the reception side photoelectric conversion unit 3 is received from the reception side circuit board 5; It becomes possible to radiate heat to the upper housing 18 side through the heat dissipation sheet.

  In this case, as the transmission side circuit board 4 and the reception side circuit board 5, it is desirable to use those made of a material having high thermal conductivity. Even when the transmission-side circuit board 4 and the reception-side circuit board 5 are made of a material having low thermal conductivity (for example, glass epoxy), the transmission-side circuit board 4 at the position where the photoelectric conversion units 2 and 3 are mounted and By forming a through-hole in the reception-side circuit board 5, heat generated in the photoelectric conversion units 2 and 3 can be radiated to the lower casing 19 or the upper casing 18 through the through-hole and the heat dissipation sheet. Is possible.

  In the photoelectric conversion module 130, since the base members 6 and 7 are omitted, the structure becomes simpler and the cost can be reduced.

[Other variations]
In the above embodiment, the case has been described in which the engaging portion 24 of the protective cover 23 of the optical fiber cable 22 is engaged with and fixed to the notch groove 25 of the housing 17. An optical connector may be provided at the end of the optical fiber 22 and an optical receptacle may be formed on the rear surface of the housing 17 so that the optical fiber cable 22 can be attached to and detached from the housing 17.

  The present invention is not limited to the above-described embodiment, and it is needless to say that various modifications can be made without departing from the gist of the present invention.

DESCRIPTION OF SYMBOLS 1 Photoelectric conversion module 2 Transmission side photoelectric conversion part 3 Reception side photoelectric conversion part 4 Transmission side circuit board 5 Reception side circuit board 6, 7 Base member 8a, 8b Connection terminal 9a, 9b Card edge connector 10 Spacer

Claims (5)

A transmission side photoelectric conversion unit that converts an electrical signal into an optical signal;
The transmission side photoelectric conversion unit to which the transmission side photoelectric conversion unit is attached and a positioning hole is formed; a reception side photoelectric conversion unit that converts an optical signal into an electrical signal;
A receiving side circuit board on which the receiving side photoelectric conversion unit is mounted and a positioning hole is formed; a support base in which one side is in contact with the transmitting side circuit board and the other side is in contact with the receiving side circuit board; A first positioning pin protruding from one surface of the support base and passing through the positioning hole of the transmission side circuit board, and a first positioning pin protruding from the other surface of the support base and passing through the positioning hole of the reception side circuit board A photoelectric conversion module comprising a spacer including a second positioning pin. A housing comprising an upper housing in which a positioning fitting hole is formed and a lower housing in which a positioning fitting hole is formed,
The first positioning pin of the spacer is formed longer than the thickness of the transmission side circuit board, and the second positioning pin of the spacer is formed longer than the thickness of the reception side circuit board,
The photoelectric conversion module according to claim 1, wherein the positioning fitting hole of the housing is fitted with the first positioning pin and the second positioning pin of the spacer.   The photoelectric conversion module according to claim 1, wherein the spacer includes a plate-like plate portion disposed between the transmission side circuit board and the reception side circuit board. The transmission-side photoelectric conversion unit is attached to one end of the transmission-side circuit board so as to be disposed on the front surface side of the transmission-side circuit board, and a connection terminal is formed at the other end of the transmission-side circuit board. The circuit board comprises a wiring pattern for wiring the connection terminal and the transmission side photoelectric conversion unit on the surface,
The receiving-side photoelectric conversion unit is attached to one end of the receiving-side circuit board so as to be disposed on the surface side of the receiving-side circuit board, and a connection terminal is formed at the other end of the receiving-side circuit board, The circuit board is provided with a wiring pattern for wiring the connection terminal and the receiving side photoelectric conversion unit on the surface,
The said transmission side circuit board and the said reception side circuit board are arrange | positioned so that the surface of the said transmission side circuit board and the surface of the said reception side circuit board may face each other through the spacer between them. Photoelectric conversion module.   5. The photoelectric conversion according to claim 1, wherein the spacer is formed with a wiring cutout portion through which a wiring member that electrically connects the transmitting circuit board and the receiving circuit board is passed. module.

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