JP5233965B2 - Optical module - Google Patents

Optical module Download PDF

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Publication number
JP5233965B2
JP5233965B2 JP2009259083A JP2009259083A JP5233965B2 JP 5233965 B2 JP5233965 B2 JP 5233965B2 JP 2009259083 A JP2009259083 A JP 2009259083A JP 2009259083 A JP2009259083 A JP 2009259083A JP 5233965 B2 JP5233965 B2 JP 5233965B2
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transmission
circuit board
photoelectric conversion
circuit
conversion unit
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JP2011107201A (en
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真行 二階堂
良明 石神
亮吉 馬場
健一 田村
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日立電線株式会社
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Description

  The present invention relates to an optical module capable of reducing deterioration in signal quality of a high-speed electrical signal.
  In recent years, with the increase in communication speed, next-generation I / O interfaces (I / O architecture) such as InfiniBand and PCI Express have been put into practical use. In InfiniBand and PCI Express, a high-speed band is realized by bundling and using a plurality of channels. A conventional optical module used for such an I / O interface is shown in FIG.
  The optical module 81 shown in FIG. 8 uses two circuit boards 82 and 83 of a transmission side circuit board 82 and a reception side circuit board 83, and a connection terminal (not shown) is formed at one end of each of the circuit boards 82 and 83. Thus, two-stage card edge connectors 84, 84 are formed.
  The transmission-side circuit board 82 includes a transmission-side photoelectric conversion unit 85 having a light-emitting element and a driver IC that drives the light-emitting element. The reception-side circuit board 83 amplifies the light receiving element and the electrical signal from the light receiving element. A receiving-side photoelectric conversion unit 86 having an amplification IC is mounted. A transmission side optical fiber 88 is connected to the transmission side photoelectric conversion unit 85 via an MT ferrule 87, and a reception side optical fiber 90 is connected to the reception side photoelectric conversion unit 86 via an MT ferrule 89.
  Further, a control element (not shown) such as a microcomputer (microcomputer) for controlling the driver IC and the amplification IC is mounted on either one of the circuit boards 82 and 83, and between the circuit boards 82 and 83. The inter-substrate wiring 91 for communicating a control signal from the control element between the two circuit boards is formed. Hereinafter, a circuit for transmitting a control signal from the control element (including the inter-substrate wiring 91 and the wiring pattern formed on the two circuit boards 82 and 83) is referred to as a control circuit 92, and the two circuit boards 82, A region where 83 control circuits are arranged is referred to as a control circuit region.
  In the conventional optical module 81, both photoelectric conversion portions 85 and 86 are disposed at the other end portions of both circuit boards 82 and 83 (the end portion opposite to the end portion on which the card edge connector 84 is formed). In general, the control circuit 92 is disposed closer to the card edge connector 84 than 85 and 86.
  As prior art document information related to the invention of this application, there are Patent Documents 1 and 2.
JP 2008-90232 A US Pat. No. 6,213,651
  However, in the conventional optical module 81, high-speed electrical signals are transmitted through the wiring patterns (high-speed electrical signal transmission lines) formed on the circuit boards 82 and 83 between the photoelectric conversion units 85 and 86 and the card edge connector 84. However, since the area where the high-speed electrical signal is transmitted (hereinafter referred to as the high-speed electrical signal transmission area) and the control circuit area are mixed, noise (electromagnetic wave noise) generated in the control circuit 92 is high-speed. There is a problem of interfering with the electrical signal and degrading the signal quality of the high-speed electrical signal.
  The control circuit 92 transmits a digital signal of several Mb / s (including a clock used for digital communication) as a control signal, and not only noise generated by the control element itself but also the inter-substrate wiring 91 and Noise is also generated in the wiring pattern constituting the control circuit 92. In particular, in the optical module 81 using the two circuit boards 82 and 83, that is, the transmission side circuit board 82 and the reception side circuit board 83, the influence of noise generated in the inter-substrate wiring 91 on the high-speed electrical signal is large. It is required to reduce interference of noise generated in the inter-wiring 91 and reduce deterioration of signal quality of the high-speed electrical signal.
  Accordingly, an object of the present invention is to provide an optical module capable of solving the above-described problems and reducing signal quality deterioration of high-speed electrical signals.
  The present invention has been devised to achieve the above object, and includes a light-emitting element and a driver IC that drives the light-emitting element, and converts an electrical signal into an optical signal. Receiving-side photoelectric conversion that converts a light signal into an electric signal, having a transmission-side circuit board on which a side photoelectric conversion unit is disposed and attached, a light-receiving element and an amplification IC that amplifies an electric signal from the light-receiving element , A receiving side circuit board on which the receiving side photoelectric conversion part is disposed and attached, a card edge connector in which a connection terminal is formed at one end of both circuit boards, the driver IC, and the amplification An optical module comprising a control element for controlling an IC and a control circuit having inter-substrate wiring for communicating a control signal from the control element between the two circuit boards. The control circuits including the inter-wiring are arranged together at the other end portions of the two circuit boards, and the both circuit boards are located closer to the card edge connector than the control circuit area where the control circuits are arranged. This is an optical module in which a photoelectric conversion unit is arranged.
  The transmission-side photoelectric conversion unit is arranged to be biased toward one side of the transmission-side circuit board, and the reception-side photoelectric conversion unit is arranged to be biased toward one side of the reception-side circuit board. The two circuit boards may be arranged with their surfaces facing each other.
  The inter-board wiring may be arranged so as to be electrically connected to both the circuit boards via a connector formed on the back surfaces of the both circuit boards and to bypass the sides of the both circuit boards.
  The control element may be mounted on the back surface of the transmission side circuit board.
  A notch is formed on one side of the transmission side circuit board, and a base made of metal is provided so as to close the notch from the back side of the transmission side circuit board, and the light emitting element and the base are provided on the base. The driver IC is mounted, a notch is formed on one side of the receiving circuit board, and a base made of metal is provided so as to close the notch from the back side of the receiving circuit board. The light receiving element and the amplification IC may be mounted on the base.
  A casing made of metal may be provided so as to cover both the circuit boards, and the both bases may be brought into contact with the casing through a heat dissipation sheet.
  According to the present invention, it is possible to reduce deterioration of signal quality of a high-speed electrical signal.
It is a disassembled perspective view of the optical module which concerns on one embodiment of this invention. It is a perspective view which shows the external appearance of the optical module of FIG. In the optical module of FIG. 1, it is a figure which shows the state which accumulated the transmission side circuit board and the reception side circuit board, (a) is a perspective view, (b) is a side view. (A), (b) is a perspective view of the transmission side circuit board used for the optical module of FIG. (A), (b) is a top view of the transmission side circuit board of FIG. 4, (c) is the side view. (A), (b) is a perspective view of the receiving side circuit board used for the optical module of FIG. (A), (b) is a top view of the receiving side circuit board of FIG. 6, (c) is the side view. It is a side view of the conventional optical module.
  Preferred embodiments of the present invention will be described below with reference to the accompanying drawings.
  In the present embodiment, as an example, a 12-channel bidirectional (transmission 12 channel, reception 12 channel) optical module will be described. Note that the number of channels is not limited to this, and may be, for example, 8-channel bidirectional (8 transmission channels, 8 reception channels) or 4-channel bidirectional (transmission 4 channels, reception 4 channels).
  FIG. 1 is an exploded perspective view of an optical module according to the present embodiment, and FIG. 2 is a perspective view showing an appearance thereof. FIG. 3 is a diagram showing a state in which the housing and the optical fiber cable are omitted in the optical module of FIG. 1, that is, a state in which the transmission side circuit board and the reception side circuit board are overlapped, and (a) is a perspective view. b) is a side view.
  As illustrated in FIGS. 1 to 3, the optical module 1 includes a light-emitting element and a driver IC that drives the light-emitting element, and includes a transmission-side photoelectric conversion unit 2 that converts an electrical signal into an optical signal, and a transmission-side photoelectric conversion unit. A receiving side photoelectric conversion unit 4 having a transmitting side circuit board 3 to which 2 is arranged and attached, a light receiving element and an amplification IC for amplifying an electric signal from the light receiving element, and converting the optical signal into an electric signal; A receiving-side circuit board 5 on which the receiving-side photoelectric conversion unit 4 is disposed and attached, and a housing 8 including an upper housing 6 and a lower housing 7 that house both circuit boards 3 and 5. ing.
  The transmission side circuit board 3 and the reception side circuit board 5 face each other on the surface on which the transmission side photoelectric conversion unit 2 of the transmission side circuit board 3 is mounted and the surface on which the reception side photoelectric conversion unit 4 of the reception side circuit board 5 is mounted. It is arranged up and down in the state. Note that the upper and lower arrangements of the transmission-side circuit board 3 and the reception-side circuit board 5 conform to the I / O interface standard that uses the optical module 1.
A connection terminal 10 is formed at one end of the transmission side circuit board 3, and a transmission side card edge connector 11 is formed. A connection terminal 12 is formed at one end of the reception side circuit board 5, and a reception side card edge connector 13 is formed. Although not shown, wiring patterns (high-speed electrical signal transmission lines) for transmitting high-speed electrical signals are formed on the circuit boards 3 and 5 between the photoelectric conversion units 2 and 4 and the connection terminals 10 and 12. That is, in the optical module 1, the region between the photoelectric conversion units 2 and 4 and the card edge connectors 11 and 13 is a region where a high-speed electrical signal is transmitted, that is, a high-speed electrical signal transmission region RA .
Further, the optical module 1 has a microcomputer (not shown) as a control element for controlling the driver IC and the amplifier IC and communicates a control signal from the microcomputer between the circuit boards 3 and 5. The control circuit 20 having the inter-substrate wiring 22 is provided. The control circuit 20 is a circuit that transmits a control signal from a microcomputer, which is a control element, and includes wiring patterns formed on the inter-substrate wiring 22 and both circuit boards 3 and 5. Hereinafter referred to area for arranging the control circuit 20 of two circuit boards 3 and 5 and the control circuit region R B.
In the optical module 1 according to the present embodiment, the control circuit 20 including the inter-substrate wiring 22 is arranged in the other end portions of both the circuit boards 3 and 5 and the control circuit 20 is arranged. the card edge connector 11, 13 side of the control circuit region R B, are arranged both photoelectric conversion unit 2 and 4.
That is, the optical module 1, the other end portion side of the control circuit region R B becomes than the position of arranging the two photoelectric conversion portions 2 and 4 of the two circuit boards 3 and 5, both the photoelectric conversion portions of the circuit board 3 and 5 One end side (card edge connectors 11 and 13 side) from the position where 2 and 4 are arranged is a high-speed electric signal transmission region RA where high-speed electric signals are transmitted.
  Hereinafter, each member of the optical module 1 will be described in more detail.
[Transmission side circuit board, Transmission side photoelectric conversion unit]
4 (a) and 4 (b) are perspective views of the transmission side circuit board 3, FIGS. 5 (a) and 5 (b) are plan views thereof, and FIG. 5 (c) is a side view thereof. 4 and 5, the transmission side optical fiber 15 is omitted for simplification of the drawing.
  The transmission side circuit board 3 is composed of, for example, a laminated board. Six pairs (12 pieces) of connection terminals 10 are formed on one end of the surface of the transmission side circuit board 3. A total of seven ground terminals 31 are provided between each pair of connection terminals 10 and on both sides of the six pairs of connection terminals 10. The ground terminal 31 is for adjusting the characteristic impedance, but the ground terminal 31 formed between each pair of the connection terminals 10 also serves to prevent crosstalk between the pair. Further, two control terminals 32 are formed on the further side of the ground terminal 31 formed on one side of the six pairs of connection terminals 10 (right side in FIG. 5A).
  Similarly, six pairs (12 pieces) of connection terminals 10 are formed on one end of the back surface of the transmission-side circuit board 3, and there are a total of between each pair of connection terminals 10 and on both sides of the six pairs of connection terminals 10. Seven ground terminals 31 are provided. In addition, two control terminals 32 are formed further to the side of the ground terminal 31 formed on one side of the six pairs of connection terminals 10 (left side in FIG. 5B). Since the connection terminals 10 correspond to one channel of differential signals with one pair (two), the transmission-side circuit board 3 has 12 channels with a total of 12 pairs (24) of connection terminals 10 on the front and back surfaces. It corresponds. In the optical module 1, for example, a signal of 10 Gb / s is transmitted per channel. Therefore, in the present embodiment, a signal of 120 Gb / s is transmitted.
  A notch 33 for accommodating the transmission side photoelectric conversion unit 2 is formed on one side (on the right side in FIG. 5A) in the longitudinal center of the transmission side circuit board 3. Is provided from the back side of the transmission side circuit board 3. The base 34 is made of a conductive member, for example, a metal such as copper tungsten (Cu-W) or Kovar, and is electrically connected to a ground pattern (not shown) formed in the inner layer of the transmission side circuit board 3. Further, the base 34 is configured to come into contact with the lower housing 7 via a heat radiating sheet (not shown) when the transmitting circuit board 3 is accommodated in the housing 8, and is thermally connected to the lower housing 7. To be intimate.
  On the base 34, the transmission side photoelectric conversion unit 2 is mounted. The transmission side photoelectric conversion unit 2 includes a light emitting element array (for example, VCSEL array) 36, a driver IC 37 that drives the light emitting element array 36, and a lens block 21 disposed above the light emitting element array 36. The light emitting element array 36 includes 12 light emitting elements.
  The light emitting element array 36 and the driver IC 37 are bonded and fixed to the base 34 with a conductive adhesive. Here, the light emitting element array 36 and the driver IC 37 are mounted on the base 34 via the submount 35. On the base 34, a wiring pitch conversion board 40 for converting the wiring pitch is further mounted.
  The wiring patterns (high-speed electrical signal transmission lines) of the light emitting element array 36 and the driver IC 37, the driver IC 37 and the wiring pitch conversion board 40, and the wiring pitch conversion board 40 and the transmission side circuit board 3 are respectively connected by wires (not shown). Yes. The wiring pattern (high-speed electrical signal transmission line) formed on the front surface side of the transmission-side circuit board 3 is connected to the wiring pattern (high-speed electrical signal transmission line) on the back side through a through hole (not shown). The photoelectric conversion unit 2 and the connection terminal 10 on the back side are electrically connected through a through hole.
  The lens block 21 is disposed above the light emitting element array 36. The lens block 21 is supported by a lens frame 38 fixed to the base 34, and is bonded and fixed to the lens frame 38 in a state where the optical axis coincides with the light emitting element array 36. The MT ferrule 17 of the transmission side optical fiber 15 is connected to the lens block 21, and the light emitting element array 36 and the transmission side optical fiber 15 are optically connected via the lens block 21.
  The MT ferrule 17 is fixed to the transmission side photoelectric conversion unit 2 using an MT ferrule holder (not shown). The MT ferrule holder is engaged with the lens frame 38 to fix the MT ferrule 17 to the transmission side photoelectric conversion unit 2. A hole 39 is formed in the transmission side circuit board 3 below the MT ferrule 17 in order to avoid interference with the MT ferrule 17.
  Spacer fixing notches 42 for fixing the spacers 9 are formed on both sides of the transmission side circuit board 3 on the card edge connector 11 side of the position where the transmission side photoelectric conversion unit 2 is mounted.
  A microcomputer 41 as a control element and a connector 23 for connecting the inter-substrate wiring 22 are mounted on the back side of the transmission side circuit board 3. The microcomputer 41 is desirably mounted on the transmission side circuit board 3 in order to mainly control the driver IC 37 (setting of the driver IC 37 and the like).
  The microcomputer 41 and the connector 23 are mounted on the other end side (lower side in FIG. 5B) of the transmission side circuit board 3 than the position where the transmission side photoelectric conversion unit 2 is mounted. The microcomputer 41 and the driver IC 37 and the microcomputer 41 and the connector 23 are connected by a wiring pattern (not shown), and the control circuit 20 is collectively arranged on the other end portion side of the transmission side circuit board 3.
  In the present embodiment, the transmission side photoelectric conversion unit 2 is biased to one side side (right side in FIG. 5A) of the transmission side circuit board 3 in the width direction (left and right direction in FIG. 5A). Implemented. That is, the entire transmission side photoelectric conversion unit 2 is mounted on the base 34 so as to be arranged on one side side from the center in the width direction of the transmission side circuit board 3. The transmission-side photoelectric conversion unit 2 may be mounted so as to be biased toward the other side of the transmission-side circuit board 3 in the width direction (left side in FIG. 5A).
[Receiving side circuit board, receiving side photoelectric conversion unit]
6 (a) and 6 (b) are perspective views of the receiving circuit board 5, FIGS. 7 (a) and 7 (b) are plan views thereof, and FIG. 7 (c) is a side view thereof. 6 and 7, the receiving side optical fiber 16 is omitted for simplification of the drawing.
  The receiving side circuit board 5 is made of, for example, a laminated board. Six pairs (12 pieces) of connection terminals 12 are formed on one end of the surface of the reception-side circuit board 5. A total of seven ground terminals 51 are provided between each pair of connection terminals 12 and on both sides of the six pairs of connection terminals 12. Further, two control terminals 52 are formed further to the side of the ground terminal 51 formed on one side of the six pairs of connection terminals 12 (right side in FIG. 7A).
  Similarly, six pairs (12 pieces) of connection terminals 12 are formed at one end of the back surface of the reception-side circuit board 5, and there are a total of between each pair of connection terminals 12 and on both sides of the six pairs of connection terminals 12. Seven ground terminals 51 are provided. Further, two control terminals 52 are formed on the side of the ground terminal 51 formed on one side of the six pairs of connection terminals 12 (left side in FIG. 7B). The reception side circuit board 5 corresponds to 12 channels by a total of 12 pairs (24) of connection terminals 12 on the front and back surfaces. In the optical module 1, for example, a signal of 10 Gb / s is transmitted per channel, and therefore, a signal of 120 Gb / s is received in the present embodiment.
  A notch 53 for accommodating the receiving-side photoelectric conversion unit 4 is formed on one side (on the right side in FIG. 7A) in the longitudinal center of the receiving-side circuit board 5. Is provided from the back side of the receiving circuit board 5. The base 54 is made of a conductive member, for example, a metal such as copper tungsten (Cu-W) or Kovar, and is electrically connected to a ground pattern (not shown) formed in the inner layer of the reception side circuit board 5. The base 54 is brought into contact with the upper housing 6 through a heat-dissipating sheet (not shown) when the receiving circuit board 5 is accommodated in the housing 8, and is in close thermal contact with the upper housing 6. To be done.
  On the base 54, the receiving side photoelectric conversion unit 4 is mounted. The receiving side photoelectric conversion unit 4 includes a light receiving element array (for example, PD array) 56, an amplification IC 57 for amplifying an electric signal from the light receiving element array 56, and a lens block 63 disposed above the light receiving element array 56. Is provided. The light receiving element array 56 includes 12 light receiving elements.
  The light receiving element array 56 and the amplification IC 57 are bonded and fixed to the base 54 with a conductive adhesive. Here, the light receiving element array 56 and the amplification IC 57 are mounted on the base 54 via the submount 55. On the base 54, a wiring pitch conversion substrate 60 for converting the wiring pitch is further mounted.
  The light receiving element array 56 and the amplification IC 57, the amplification IC 57 and the wiring pitch conversion substrate 60, and the wiring pattern (high-speed electrical signal transmission line) of the wiring pitch conversion substrate 60 and the receiving side circuit substrate 5 are connected by wires (not shown). Has been. The wiring pattern (high-speed electrical signal transmission line) formed on the front surface side of the reception-side circuit board 5 is connected to the wiring pattern (high-speed electrical signal transmission line) on the back side through a through hole (not shown). The photoelectric conversion unit 4 and the connection terminal 12 on the back surface side are electrically connected through a through hole.
  A lens block 63 is disposed above the light receiving element array 56. The lens block 63 is supported by a lens frame 58 fixed to the base 54, and is bonded and fixed to the lens frame 58 in a state where the light receiving element array 56 and the optical axis are aligned. The MT ferrule 18 of the reception side optical fiber 16 is connected to the lens block 63, and the light receiving element array 56 and the reception side optical fiber 16 are optically connected via the lens block 63.
  The MT ferrule 18 is fixed to the receiving side photoelectric conversion unit 4 using an MT ferrule holder (not shown). The MT ferrule holder engages with the lens frame 58 to fix the MT ferrule 18 to the reception side photoelectric conversion unit 4. A hole 59 is formed in the receiving circuit board 5 below the MT ferrule 18 in order to avoid interference with the MT ferrule 18.
  Spacer fixing notches 62 for fixing the spacers 9 are formed on both sides of the reception side circuit board 5 on the card edge connector 13 side from the position where the reception side photoelectric conversion unit 4 is mounted.
  A connector 24 for connecting the inter-substrate wiring 22 is mounted on the back surface side of the reception side circuit board 5. The connector 24 is mounted on the other end side (lower side in FIG. 7B) of the receiving side circuit board 5 from the position where the receiving side photoelectric conversion unit 4 is mounted. The connector 24 and the amplification IC 57 are connected by a wiring pattern (not shown), and the control circuit 20 is collectively arranged on the other end side of the reception side circuit board 5.
  In the present embodiment, the reception-side photoelectric conversion unit 4 is arranged in the width direction of the reception-side circuit board 5 (left-right direction in FIG. 7A), similarly to the arrangement of the transmission-side photoelectric conversion unit 2 of the transmission-side circuit board 3. Are mounted so as to be biased toward one side (the right side in FIG. 7A). That is, the entire receiving-side photoelectric conversion unit 4 is mounted on the base 54 so as to be arranged on one side side from the center in the width direction of the receiving-side circuit board 5. When the transmission side photoelectric conversion unit 2 is arranged to be biased to the other side in the width direction of the transmission side circuit board 3, similarly, the reception side photoelectric conversion unit 4 is arranged on the reception side circuit board 5. Mounting is biased toward the other side in the width direction (left side in FIG. 7A).
[Wiring between boards]
The inter-board wiring 22 is for communicating a control signal from the microcomputer 41 between the circuit boards 3 and 5, and the microcomputer 41 and the amplification IC 57 are electrically connected via the inter-board wiring 22. Connected.
  In the present embodiment, an FPC (flexible printed circuit board) is used as the inter-board wiring 22, and the FPC is mounted on both circuit boards 3 and 5 via connectors (FPC connectors) 23 and 24 mounted on the back surfaces of both circuit boards 3 and 5. 5 was electrically connected. The FPC is disposed so as to bypass the sides of the circuit boards 3 and 5 (the right front side in FIG. 1) and wrap around the back surfaces of the circuit boards 3 and 5.
[Spacer]
As shown in FIG. 1, the spacer 9 is a member for keeping the transmission side circuit board 3 and the reception side circuit board 5 at a predetermined interval, and has a plate-shaped plate portion 9a and a predetermined height from both ends thereof. It comprises a prismatic support base 9b formed so as to protrude vertically and pins 9c formed so as to protrude further from the top and bottom of both support bases 9b. The plate portion 9a, the support base 9b, and the pin 9c are integrally formed.
  The spacer 9 has a pin 9c protruding downward inserted in the spacer fixing notch 42 of the transmission side circuit board 3, and a pin 9c protruding upward inserted in the spacer fixing notch 62 of the reception side circuit board 5, so that transmission is performed. It is attached between the side circuit board 3 and the reception side circuit board 5. At this time, the lower surface of the support base 9b is in contact with the surface of the transmission side circuit board 3, and the upper surface of the support base 9b is in contact with the surface of the reception side circuit board 5, depending on the length between the upper surface and the lower surface of the support base 9b. The transmission side circuit board 3 and the reception side circuit board 5 are kept at a predetermined interval. The length between the upper surface and the lower surface of the support base 9b may be the same as the distance to be maintained between the transmission side circuit board 3 and the reception side circuit board 5 defined in the I / O interface standard.
[Optical fiber cable]
The optical fiber cable 14 has twelve transmission-side optical fibers 15 and twelve reception-side optical fibers 16, and these 24 optical fibers 15 and 16 are bundled into a cable.
  A protective cover 19 made of resin for protecting the end of the optical fiber cable 14 is provided at the end of the optical fiber cable 14. The protective cover 19 is made of, for example, rubber boots, and protects the optical fiber cable 14 so that the optical fibers 15 and 16 do not bend beyond an allowable bending radius.
  The optical fiber cable 14 branches at its end into 12 transmission side optical fibers 15 and 12 reception side optical fibers 16. A 12-core MT ferrule 17 is provided at the end of the 12 transmission-side optical fibers 15, and a 12-core MT ferrule 18 is provided at the ends of the 12 reception-side optical fibers 16.
  The MT ferrule 17 of the transmission side optical fiber 15 is fitted with a fitting hole (not shown) formed in the MT ferrule 17 and a fitting pin (not shown) formed in the lens block 21. Connected to block 21. Similarly, the MT ferrule 18 of the receiving optical fiber 16 is fitted with a fitting hole (not shown) formed in the MT ferrule 18 and a fitting pin (not shown) formed in the lens block 63. Thus, the lens block 63 is connected.
[Case, Upper Case, Lower Case]
The optical module 1 has a housing 8 that houses both circuit boards 3 and 5 and both photoelectric conversion units 2 and 4.
  The housing 8 is divided into upper and lower parts and includes an upper housing 6 and a lower housing 7. The upper housing 6 and the lower housing 7 are made of metal. The upper housing 6 and the lower housing 7 are fixed by screws (not shown).
  A flange-like surface for engaging a protective cover 19 formed of a rubber boot provided at an end of the optical fiber cable 14 is provided on the rear surfaces of the upper housing 6 and the lower housing 7 (the surface on the left front side in FIG. 1). Engaging portions 6a and 7a are formed. The optical fiber cable 14 is fixed to the housing 8 by covering the engaging portions 6a and 7a with a protective cover 19 made of rubber boots.
[Operation of this embodiment]
The operation of the present embodiment will be described.
In the optical module 1 according to the present embodiment, the control circuit 20 including the inter-substrate wiring 22 is arranged in the other end portions of both the circuit boards 3 and 5 and the control circuit 20 is arranged. the card edge connector 11, 13 side of the control circuit region R B, are arranged both photoelectric conversion unit 2 and 4.
Thus, the control circuit region R B to arrange the control circuit 20 serving as a source of noise, it becomes possible to high-speed electrical signals are isolated from the high-speed electric signal transmission region R A to be transmitted, as a result, control It is possible to reduce the influence of noise generated in the circuit 20 on the high-speed electrical signal, and to reduce signal quality degradation of the high-speed electrical signal. In the optical module 1, the optical fiber 15 and 16 will cross the control circuit region R B, since the light signals transmitted by the optical fiber 15, 16 is the electromagnetic noise immunity is strong, the control circuit 20 The signal quality is not deteriorated by the influence of noise.
  Furthermore, by arranging both photoelectric conversion units 2 and 4 on the card edge connectors 11 and 13 side, compared to the case where both photoelectric conversion units 2 and 4 are arranged on the other end portions of both circuit boards 3 and 5, The wiring length of the wiring pattern (high-speed electrical signal transmission line) for transmitting high-speed electrical signals can be shortened. Therefore, according to the optical module 1, it is possible to further suppress noise interference and further reduce the deterioration of the signal quality of the high-speed electrical signal.
  In general, the transmission-side optical fiber 15 and the reception-side optical fiber 16 are formed with a surplus length in order to prevent damage caused by the optical fiber cable 14 being pulled, and the surplus length portion is formed in the housing 8. In the optical module 1, since both the photoelectric conversion units 2 and 4 are arranged on the card edge connectors 11 and 13 side, both circuit boards 3 and 3 behind the photoelectric conversion units 2 and 4 are accommodated. A space is formed between the two circuit boards 3 and 5, and the extra length portions of the optical fibers 15 and 16 are easily accommodated in the space between the circuit boards 3 and 5.
  In the optical module 1, the transmission-side photoelectric conversion unit 2 is arranged so as to be biased toward one side of the transmission-side circuit board 3, and the reception-side photoelectric conversion unit 4 is arranged on one side of the reception-side circuit board 5. Since the two circuit boards 3 and 5 are arranged with their surfaces facing each other, the two photoelectric conversion units 2 and 4 are placed between the two circuit boards 3 and 5 without interfering with each other. Can be arranged in parallel in the width direction, and a compact optical module 1 can be realized.
  Further, in the optical module 1, the inter-substrate wiring 22 is arranged so as to bypass the sides of the two circuit boards 3, 5, so that the inter-substrate wiring 22 extends from the MT ferrules 17, 18 to the optical fibers 15, 16. The extra length portions of the optical fibers 15 and 16 can be easily accommodated between the circuit boards 3 and 5 without interference.
  Further, in the optical module 1, since both the photoelectric conversion units 2 and 4 are mounted on the bases 34 and 54 made of metal, and the bases 34 and 54 are brought into contact with the housing 8 through the heat dissipation sheet, both photoelectric conversions are performed. The heat generated in the portions 2 and 4 can be efficiently radiated to the outside through the bases 34 and 54 and the housing 8.
Incidentally, the viewpoint in the above embodiment, than the control circuit region R B was to place both photoelectric conversion unit 2 and 4 in the card edge connector 11, 13 side, to shorten the wiring length of the high-speed electric signal transmission line Therefore, it is preferable that both the photoelectric conversion units 2 and 4 are arranged on the card edge connectors 11 and 13 side as much as possible. However, if the photoelectric conversion units 2 and 4 are too close to the card edge connectors 11 and 13, the wiring pitch between the transmission side photoelectric conversion unit 2 and the connection terminal 10 or between the reception side photoelectric conversion unit 4 and the connection terminal 12 is reduced. Since conversion becomes difficult, both photoelectric conversion units 2 and 4 may be arranged close to the card edge connectors 11 and 13 to the extent that the wiring pitch can be converted.
Further, the control circuit region R B in terms of isolating the high-speed electric signal transmission region R A is preferably separated as much as possible the control circuit region R B and the high-speed electric signal transmission region R A. However, since the length of the housing 8 is determined by the standard, the lengths of the two circuit boards 3 and 5 accommodated in the housing 8 are limited to the length of the housing 8 or less. Therefore, it is desirable to arrange the control circuit 20 on the other end side of the circuit boards 3 and 5 as much as possible.
  In the above-described embodiment, the case where the FPC is used as the inter-substrate wiring 22 has been described. Although it is conceivable to use a connector for directly connecting both circuit boards 3 and 5 as the inter-board wiring 22, the connector should be arranged avoiding the optical fibers 15 and 16 extending from the MT ferrules 17 and 18. Therefore, it is desirable to use an FPC or a cable array that can bypass the sides of both circuit boards 3 and 5 as the inter-substrate wiring 22.
  The optical module 1 is used as, for example, an optical active cable in which the optical module 1 is provided at both ends of the optical fiber cable 14. This optical active cable is used for connecting devices by connecting the optical module 1 at one end to one device and the optical module 1 at the other end to another device.
  The present invention is not limited to the above-described embodiment, and it is needless to say that various modifications can be made without departing from the spirit of the present invention.
DESCRIPTION OF SYMBOLS 1 Optical module 2 Transmission side photoelectric conversion part 3 Transmission side circuit board 4 Reception side photoelectric conversion part 5 Reception side circuit board 6 Upper housing | casing 7 Lower housing 8 Housing | casing 9 Spacer 10, 12 Connection terminal 11, 13 Card edge connector 14 between the optical fiber cable 15 transmits optical fiber 16 receives optical fiber 17, 18 MT ferrule 20, a control circuit 22 board wiring R A high-speed electric signal transmission region R B control circuit region

Claims (6)

  1. A transmission-side photoelectric conversion unit that includes a light-emitting element and a driver IC that drives the light-emitting element, and converts an electrical signal into an optical signal;
    A transmission side circuit board on which the transmission side photoelectric conversion unit is arranged and attached; and
    A light-receiving element and an amplifying IC that amplifies an electric signal from the light-receiving element, and a receiving-side photoelectric conversion unit that converts the optical signal into an electric signal;
    A receiving-side circuit board on which the receiving-side photoelectric conversion unit is disposed and attached;
    A card edge connector in which a connection terminal is formed at one end of both circuit boards;
    A control circuit having a control element for controlling the driver IC and the amplification IC, and a circuit for inter-substrate wiring for communicating a control signal from the control element between the circuit boards. In the optical module
    The control circuit including the inter-board wiring is arranged together on the other end of the circuit boards, and the card edge connector side than the control circuit area where the control circuit is arranged, Arranging both the photoelectric conversion units ,
    A transmission side optical fiber introduced from the other end side of the transmission side circuit board is connected to the transmission side photoelectric conversion unit,
    The receiving side photoelectric conversion unit is connected to a receiving side optical fiber introduced from the other end side of the receiving side circuit board,
    The transmission side circuit board and the reception side circuit board face the surface of the transmission side circuit board on which the transmission side photoelectric conversion unit is mounted and the surface of the reception side circuit board on which the reception side photoelectric conversion unit is mounted. An optical module, wherein the optical modules are arranged one above the other in a combined state .
  2. The transmission-side photoelectric conversion unit is arranged to be biased toward one side of the transmission-side circuit board, and the reception-side photoelectric conversion unit is arranged to be biased toward one side of the reception-side circuit board. ,
    The optical module according to claim 1, wherein the two circuit boards are arranged with their surfaces facing each other.
  3.   3. The inter-board wiring is disposed so as to be electrically connected to both the circuit boards via a connector formed on the back surfaces of the both circuit boards and to bypass the sides of the both circuit boards. The optical module as described.
  4.   The optical module according to claim 3, wherein the control element is mounted on a back surface of the transmitting circuit board.
  5. A notch is formed on one side of the transmission side circuit board, and a base made of metal is provided so as to close the notch from the back side of the transmission side circuit board, and the light emitting element and the base are provided on the base. While mounting the driver IC,
    A notch is formed on one side of the receiving side circuit board, and a base made of metal is provided so as to close the notch from the back side of the receiving side circuit board, and the light receiving element and the base are provided on the base. The optical module according to claim 2, wherein the amplification IC is mounted.
  6. Provide a housing made of metal so as to cover both circuit boards,
    The optical module according to claim 5, wherein both the bases are brought into contact with the housing through a heat dissipation sheet.
JP2009259083A 2009-11-12 2009-11-12 Optical module Expired - Fee Related JP5233965B2 (en)

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JP5234059B2 (en) * 2010-07-02 2013-07-10 住友電気工業株式会社 Optical transceiver module
JP5879810B2 (en) * 2011-08-12 2016-03-08 日立金属株式会社 Optical module and cable with optical module
JP5900133B2 (en) * 2012-04-27 2016-04-06 日立金属株式会社 Optical module
CN103323921B (en) * 2013-06-21 2015-08-12 武汉电信器件有限公司 A kind of parallel transmission optical device of highly dense type
JP2015008380A (en) * 2013-06-25 2015-01-15 日立金属株式会社 Optical active cable and optical transmission system
JP6459615B2 (en) 2015-02-24 2019-01-30 住友電気工業株式会社 Optical data link

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JP2002261265A (en) * 2001-03-06 2002-09-13 Sumitomo Electric Ind Ltd Optical communication device
JP4134564B2 (en) * 2002-01-31 2008-08-20 住友電気工業株式会社 Optical communication module and optical communication module product
JP3850750B2 (en) * 2002-04-03 2006-11-29 シャープ株式会社 Two-way communication device
US7125261B2 (en) * 2004-10-05 2006-10-24 Sumitomo Electric Industries, Ltd. Optical transceiver with a pluggable function
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