CN114545568A

CN114545568A - Optical module

Info

Publication number: CN114545568A
Application number: CN202011354825.5A
Authority: CN
Inventors: 郭蓉
Original assignee: Hisense Broadband Multimedia Technology Co Ltd
Current assignee: Hisense Broadband Multimedia Technology Co Ltd
Priority date: 2020-11-26
Filing date: 2020-11-26
Publication date: 2022-05-27
Anticipated expiration: 2040-11-26
Also published as: CN114545568B

Abstract

The application discloses an optical module, which comprises a circuit board, a first optical submodule and a second optical submodule, wherein a first high-speed FPC (flexible printed circuit) pad, a first low-speed FPC pad and a second high-speed FPC pad which are positioned on the same side surface of the circuit board are arranged on the circuit board; the first optical secondary module is electrically connected with the first high-speed FPC bonding pad through the first high-speed flexible circuit board and is electrically connected with the first low-speed FPC bonding pad through the first low-speed flexible circuit board, and the second optical secondary module is electrically connected with the second high-speed FPC bonding pad through the second high-speed flexible circuit board. The circuit board of this application adopts the design of the double pad of two flexible circuit boards of high low-speed, has not only effectively saved the space of circuit board, has improved the transmission quality of multiclass signal again.

Description

Optical module

Technical Field

The application relates to the technical field of optical communication, in particular to an optical module.

Background

In the novel business and application modes of cloud computing, mobile internet, video and the like, an optical communication technology is used, and in optical communication, an optical module is a tool for realizing the interconversion of photoelectric signals and is one of key devices in optical communication equipment. The optical module is mainly used for photoelectric and electro-optical conversion, an electric signal is converted into an optical signal by a transmitting end of the optical module and is transmitted out through an optical fiber, and a received optical signal is converted into an electric signal by a receiving end of the optical module.

In order to realize the above-mentioned photoelectric conversion function, a standard optical module generally includes a circuit board, and a transmitter sub-module and a receiver sub-module connected to the circuit board. In the high-speed optical communication module, the tosa and the rosa are usually connected to a Circuit board through a Flexible Printed Circuit (FPC) to implement high-speed and low-speed signal transmission between the tosa and the Circuit board. Specifically, the circuit board is provided with an FPC (flexible printed circuit) pad for connecting the flexible circuit board, the flexible circuit board is provided with a pad, one end of the flexible circuit board, which is provided with the pad, is connected with the FPC pad, and the other end of the flexible circuit board is connected with an optical device of the light-emitting secondary module or the light-receiving secondary module. In order to facilitate the transmission of high and low speed signals, the rosa is generally connected to the circuit board through two flexible circuit boards, one flexible circuit board transmits high speed signals, and the other flexible circuit board transmits low speed signals.

However, when the rosa is connected to the circuit board through two flexible circuit boards, four FPC pads for connecting the flexible circuit boards need to be disposed on the circuit board, which occupies a larger space of the circuit board, and the size of the circuit board is larger for placing devices such as circuit traces, electronic components, and chips, which is not favorable for the miniaturization development of the optical module.

Disclosure of Invention

The application provides an optical module to when solving optical emission submodule, optical reception submodule and being connected with the circuit board through a plurality of flexible circuit board respectively, cause the circuit board size great, be unfavorable for the miniaturized problem of developing of optical module.

In order to solve the technical problem, the embodiment of the application discloses the following technical scheme:

the embodiment of the application discloses an optical module, includes:

the circuit board is provided with a photoelectric chip, a first high-speed FPC bonding pad, a first low-speed FPC bonding pad and a second high-speed FPC bonding pad;

the first optical secondary module is electrically connected with the circuit board, is electrically connected with the first high-speed FPC bonding pad through a first high-speed flexible circuit board, and is electrically connected with the first low-speed FPC bonding pad through a first low-speed flexible circuit board;

the second optical submodule is electrically connected with the circuit board and is electrically connected with the second high-speed FPC bonding pad through a second high-speed flexible circuit board;

the first high-speed FPC pad, the first low-speed FPC pad and the second high-speed FPC pad are positioned on the same side face of the circuit board, the first high-speed FPC pad and the first low-speed FPC pad are arranged left and right along the length direction of the circuit board, and the first low-speed FPC pad and the second high-speed FPC pad are arranged front and back along the width direction of the circuit board;

the first high-speed FPC pad is electrically connected with the signal pad of the photoelectric chip through a first high-speed differential pair wire, the first low-speed FPC pad is electrically connected with the signal pad of the photoelectric chip through a low-speed signal wire, and the second high-speed FPC pad is electrically connected with the signal pad of the photoelectric chip through a second high-speed differential pair wire.

The optical module comprises a circuit board, a first optical submodule and a second optical submodule, wherein the circuit board is provided with a photoelectric chip, a first high-speed FPC (flexible printed circuit) bonding pad, a first low-speed FPC bonding pad and a second high-speed FPC bonding pad; the second optical secondary module is electrically connected with the second high-speed FPC bonding pad through a second high-speed flexible circuit board; the first high-speed FPC bonding pad, the first low-speed FPC bonding pad and the second high-speed FPC bonding pad are positioned on the same side face of the circuit board, the first high-speed FPC bonding pad and the first low-speed FPC bonding pad are arranged left and right along the length direction of the circuit board, and the first low-speed FPC bonding pad and the second high-speed FPC bonding pad are arranged front and back along the width direction of the circuit board; the first high-speed FPC bonding pad is electrically connected with the signal bonding pad of the photoelectric chip through the first high-speed differential pair wiring, the first low-speed FPC bonding pad is electrically connected with the signal bonding pad of the photoelectric chip through the low-speed signal wiring, and the second high-speed FPC bonding pad is electrically connected with the signal bonding pad of the photoelectric chip through the second high-speed differential pair wiring. The optical subassembly is arranged side by side with the second optical subassembly, the first optical subassembly is welded with a circuit board through double-row pads of double flexible circuit boards, on the circuit board, a first high-speed FPC pad connected with a first high-speed flexible circuit board and a first low-speed FPC pad connected with a first low-speed flexible circuit board are arranged left and right along the length direction of the circuit board, the first low-speed FPC pad connected with the first low-speed flexible circuit board and a second high-speed FPC pad connected with a second high-speed flexible circuit board are arranged front and back along the width direction of the circuit board, so that signals covered by a laser with the speed of 200G are too many, and under the structural limitation of QSFP-DD interface packaging, the space of the circuit board can be effectively saved, the limitation of the structural width of a miniaturized optical module is met, and further the miniaturization development of the optical module is facilitated. In addition, the double flexible circuit boards are used for respectively transmitting high-speed signals and low-speed signals, so that the requirement that the laser with the speed of 200G covers excessive signals can be met, and the signal transmission quality can be improved.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application.

Drawings

In order to more clearly explain the technical solution of the present application, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious to those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.

Fig. 1 is a schematic diagram of a connection relationship of an optical communication terminal;

fig. 2 is a schematic structural diagram of an optical network terminal;

fig. 3 is a schematic structural diagram of an optical module according to an embodiment of the present application;

fig. 4 is an exploded schematic view of an optical module according to an embodiment of the present disclosure;

fig. 5 is an assembly schematic diagram of a circuit board, a flexible circuit board, a tosa, and a rosa in an optical module according to an embodiment of the present disclosure;

fig. 6 is an assembly diagram of a circuit board, a flexible circuit board, and a tosa in an optical module according to an embodiment of the present disclosure;

fig. 7 is a partially exploded schematic view of a light emission sub-module in an optical module according to an embodiment of the present disclosure;

fig. 8 is a schematic partial structure diagram of a light emission submodule in an optical module according to an embodiment of the present disclosure;

fig. 9 is a schematic structural diagram of a first high-speed flexible circuit board in an optical module according to an embodiment of the present application;

fig. 10 is a schematic structural diagram of a first low-speed flexible circuit board in an optical module according to an embodiment of the present disclosure;

fig. 11 is a schematic structural diagram of a circuit board in an optical module according to an embodiment of the present disclosure;

fig. 12 is a schematic view illustrating an assembly of a light receiving sub-assembly and a circuit board in an optical module according to an embodiment of the present disclosure;

fig. 13 is a schematic partial structure diagram of an optical receive sub-module in an optical module according to an embodiment of the present disclosure.

Detailed Description

In order to make those skilled in the art better understand the technical solutions in the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

One of the core links of optical fiber communication is the interconversion of optical and electrical signals. The optical fiber communication uses optical signals carrying information to transmit in information transmission equipment such as optical fibers/optical waveguides, and the information transmission with low cost and low loss can be realized by using the passive transmission characteristic of light in the optical fibers/optical waveguides; meanwhile, the information processing device such as a computer uses an electric signal, and in order to establish information connection between the information transmission device such as an optical fiber or an optical waveguide and the information processing device such as a computer, it is necessary to perform interconversion between the electric signal and the optical signal.

The optical module realizes the function of interconversion of optical signals and electrical signals in the technical field of optical fiber communication, and the interconversion of the optical signals and the electrical signals is the core function of the optical module. The optical module is electrically connected with an external upper computer through a golden finger on an internal circuit board of the optical module, and the main electrical connection comprises power supply, I2C signals, data information, grounding and the like; the electrical connection mode realized by the gold finger has become the mainstream connection mode in the optical module industry, and on the basis of the mainstream connection mode, the definition of the pins on the gold finger forms various industry protocols/specifications.

Fig. 1 is a schematic diagram of connection relationship of an optical communication terminal. As shown in fig. 1, the connection of the optical communication terminal mainly includes interconnection among the optical network terminal 100, the optical module 200, the optical fiber 101, and the network cable 103.

One end of the optical fiber 101 is connected with a remote server, one end of the network cable 103 is connected with a local information processing device, and the connection between the local information processing device and the remote server is completed by the connection between the optical fiber 101 and the network cable 103; and the connection between the optical fiber 101 and the network cable 103 is made by the optical network terminal 100 having the optical module 200.

An optical port of the optical module 200 is externally accessed to the optical fiber 101, and establishes bidirectional optical signal connection with the optical fiber 101; an electrical port of the optical module 200 is externally connected to the optical network terminal 100, and establishes bidirectional electrical signal connection with the optical network terminal 100; the optical module realizes the mutual conversion of optical signals and electric signals, thereby realizing the establishment of information connection between the optical fiber and the optical network terminal. Specifically, the optical signal from the optical fiber is converted into an electrical signal by the optical module and then input to the optical network terminal 100, and the electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module and input to the optical fiber.

The optical network terminal is provided with an optical module interface 102, which is used for accessing an optical module 200 and establishing bidirectional electric signal connection with the optical module 200; the optical network terminal is provided with a network cable interface 104, which is used for accessing the network cable 103 and establishing bidirectional electric signal connection with the network cable 103; the optical module 200 is connected to the network cable 103 via the optical network terminal 100. Specifically, the optical network terminal transmits a signal from the optical module to the network cable and transmits the signal from the network cable to the optical module, and the optical network terminal serves as an upper computer of the optical module to monitor the operation of the optical module.

At this point, a bidirectional signal transmission channel is established between the remote server and the local information processing device through the optical fiber, the optical module, the optical network terminal and the network cable.

Common information processing apparatuses include routers, switches, electronic computers, and the like; the optical network terminal is an upper computer of the optical module, provides data signals for the optical module, and receives the data signals from the optical module, and the common upper computer of the optical module also comprises an optical line terminal and the like.

Fig. 2 is a schematic diagram of an optical network terminal structure. As shown in fig. 2, the optical network terminal 100 has a circuit board 105, and a cage 106 is disposed on a surface of the circuit board 105; an electric connector is arranged in the cage 106 and used for connecting an electric port of an optical module such as a golden finger; the cage 106 is provided with a heat sink 107, and the heat sink 107 has a first boss portion such as a fin that increases a heat radiation area.

The optical module 200 is inserted into the optical network terminal 100, specifically, an electrical port of the optical module is inserted into an electrical connector inside the cage 106, and an optical port of the optical module is connected to the optical fiber 101.

The cage 106 is positioned on the circuit board, and the electrical connector on the circuit board is wrapped in the cage, so that the electrical connector is arranged in the cage; the optical module is inserted into the cage, held by the cage, and the heat generated by the optical module is conducted to the cage 106 and then diffused by the heat sink 107 on the cage.

Fig. 3 is a schematic structural diagram of an optical module according to an embodiment of the present application, and fig. 4 is an exploded schematic diagram of the optical module according to the embodiment of the present application. As shown in fig. 3 and 4, an optical module 200 provided in the embodiment of the present application includes an upper housing 201, a lower housing 202, an unlocking member 203, a circuit board 300, a first optical sub-module (a tosa 400 or a tosa 500), and a second optical sub-module (a tosa 500 or a tosa 400).

The upper shell 201 is covered on the lower shell 202 to form a wrapping cavity with two openings; the outer contour of the packaging cavity generally presents a square body. Specifically, the lower housing 202 includes a main board and two side boards located at two sides of the main board and arranged perpendicular to the main board; the upper shell comprises a cover plate, and the cover plate covers two side plates of the upper shell to form a wrapping cavity; the upper shell may further include two side walls disposed at two sides of the cover plate and perpendicular to the cover plate, and the two side walls are combined with the two side plates to cover the upper shell 201 on the lower shell 202.

The two openings can be two end openings (204, 205) located at the same end of the optical module, or two openings located at different ends of the optical module; one opening is an electric port 204, and a gold finger of the circuit board extends out of the electric port 204 and is inserted into an upper computer such as an optical network terminal; the other opening is an optical port 205 for external optical fiber access to connect the first optical sub-module and the second optical sub-module inside the optical module; the photoelectric devices such as the circuit board 300, the first optical sub-module, the second optical sub-module and the like are positioned in the packaging cavity.

The assembly mode of combining the upper shell and the lower shell is adopted, so that the circuit board 300, the first optical sub-module, the second optical sub-module and other devices can be conveniently installed in the shells, and the outermost packaging protection shell of the modules is formed by the upper shell and the lower shell; the upper shell and the lower shell are made of metal materials generally, electromagnetic shielding and heat dissipation are achieved, the shell of the optical module cannot be made into an integral component generally, and therefore when devices such as a circuit board are assembled, the positioning component, the heat dissipation component and the electromagnetic shielding component cannot be installed, and production automation is not facilitated.

The unlocking component 203 is located on the outer wall of the wrapping cavity/lower shell 202, and is used for realizing the fixed connection between the optical module and the upper computer or releasing the fixed connection between the optical module and the upper computer.

The unlocking component 203 is provided with a clamping component matched with the upper computer cage; the end of the unlocking member 203 is pulled to make the unlocking member 203 relatively move on the surface of the outer wall; the optical module is inserted into the cage of the upper computer, and the optical module is fixed in the cage of the upper computer by the clamping component of the unlocking component 203; by pulling the unlocking member 203, the engaging member of the unlocking member 203 moves along with the unlocking member, and further, the connection relationship between the engaging member and the upper computer is changed, so that the engagement relationship between the optical module and the upper computer is released, and the optical module can be drawn out from the cage of the upper computer.

The circuit board 300 is provided with circuit traces, electronic components (such as capacitors, resistors, triodes, and MOS transistors), and chips (such as an MCU, a laser driver chip, a limiting amplifier chip, a clock data recovery CDR, a power management chip, and a data processing chip DSP).

The circuit board 300 is used to provide signal circuits for signal electrical connection, which can provide signals. The circuit board 300 connects the electrical devices in the optical module together according to the circuit design through circuit wiring to realize the electrical functions of power supply, electrical signal transmission, grounding and the like.

The circuit board is generally a hard circuit board, and the hard circuit board can also realize a bearing effect due to the relatively hard material of the hard circuit board, for example, the hard circuit board can stably bear a chip; when the optical transceiver component is positioned on the circuit board, the rigid circuit board can also provide stable bearing; the hard circuit board can also be inserted into an electric connector in the upper computer cage, and specifically, a metal pin/golden finger is formed on the surface of the tail end of one side of the hard circuit board and is used for being connected with the electric connector; these are not easily implemented with flexible circuit boards.

A flexible circuit board is also used in a part of the optical module to supplement the rigid circuit board; the flexible circuit board is generally used in combination with a rigid circuit board, for example, the rigid circuit board may be connected to the optical transceiver module by using the flexible circuit board.

Fig. 5 is an assembly diagram of the circuit board 300, the tosa 400, and the rosa 500 in the optical module according to the embodiment of the present disclosure. As shown in fig. 5, for the 200G LMQ3618-PC optical module, the first optical sub-module and the second optical sub-module are arranged on the circuit board 300 at the same time, one end of the first high-speed flexible circuit board 410 and one end of the first low-speed flexible circuit board 420 are electrically connected to the first optical sub-module, and the other end of the first high-speed flexible circuit board 410 and the other end of the first low-speed flexible circuit board 420 are electrically connected to the circuit board 300, so as to realize the transmission of high-speed and low-speed signals between the first optical sub-module and the circuit board 300; one end of the second high-speed flexible circuit board 510 is inserted into the second optical sub-module, and the other end is electrically connected to the circuit board 300, so as to implement high-speed signal transmission between the second optical sub-module and the circuit board 300.

Specifically, the circuit board 300 is provided with a photoelectric chip 310, a first high-speed FPC pad, a first low-speed FPC pad, and a second high-speed FPC pad, one end of the first high-speed flexible circuit board 410 is connected to the first optical sub-module, and the other end is electrically connected to the first high-speed FPC pad, and the first high-speed FPC pad is electrically connected to the signal pad of the photoelectric chip 310 through a first high-speed differential pair routing, so as to realize high-speed signal transmission between the first optical sub-module and the circuit board 300; one end of the first low-speed flexible circuit board 420 is connected to the first optical sub-assembly, the other end is electrically connected to the first low-speed FPC bonding pad, and the first low-speed FPC bonding pad is electrically connected to the signal bonding pad of the optoelectronic chip 310 through the low-speed signal trace, so as to realize the low-speed signal transmission between the first optical sub-assembly and the circuit board 300. One end of the second high-speed flexible circuit board 510 is inserted into the second optical sub-module, and the other end is electrically connected to the second high-speed FPC pad, which is electrically connected to the signal pad of the optoelectronic chip 310 through the second high-speed differential pair trace, so as to realize high-speed signal transmission between the second optical sub-module and the circuit board 300.

When the first optical sub-module and the second optical sub-module are arranged in the same row, since the layout of the circuit traces, electronic components, chips, etc. on the circuit board 300 is dense, and there is no space on the lower side of the circuit board 300 for placing more flexible circuit board connection pads, the first high-speed FPC pad, the first low-speed FPC pad, which connect the first high-speed flexible circuit board 410 and the first low-speed flexible circuit board 420, and the second high-speed FPC pad, which connect the second high-speed flexible circuit board 510, can all be placed on the upper side of the circuit board 300.

In addition, the width of the circuit board 300 is limited by the QSFP-DD interface package, after a space for complete machine assembly is reserved, only 14.75mm of width is left for connecting the receiving and transmitting flexible circuit board with the circuit board 300, and after the width of the interface pad of the receiving end flexible circuit board is reserved, only 7.37mm of width is left for the transmitting end, so that the first high-speed FPC pad and the first low-speed FPC pad which are positioned on the same side of the circuit board 300 cannot be arranged on the circuit board 300 side by side, and the first high-speed FPC pad and the first low-speed FPC pad can be arranged on the circuit board 300 in a double row, that is, the first high-speed FPC pad and the first low-speed FPC pad are arranged left and right along the length direction of the circuit board 300. Since the first optical sub-assembly and the second optical sub-assembly are disposed side by side on the circuit board 300, the first low-speed FPC pad and the second high-speed FPC pad are disposed back and forth along the width direction of the circuit board 300.

The first high-speed FPC pad and the first low-speed FPC pad are arranged between the end part of one end of the circuit board 300 and the photoelectric chip 310, the first high-speed FPC pad is close to the photoelectric chip 310, and the first low-speed FPC pad is close to the end part of the circuit board 300. Specifically, in the embodiment of the present application, the left-right direction is the length direction of the circuit board 300, and the front-back direction is the width direction of the circuit board 300, so the first low-speed FPC pad is close to the left end of the circuit board 300, the first high-speed FPC pad is located on the right side of the first low-speed FPC pad, the second high-speed FPC pad is close to the left end of the circuit board 300, and the second high-speed FPC pad is located on the back side of the first low-speed FPC pad.

In the embodiment of the present application, the first optical subassembly may be the tosa 400, the second optical subassembly may be the rosa 500, the first high speed pcb is the first high speed pcb 410 connected to the tosa 400, the first low speed pcb is the first low speed pcb 420 connected to the tosa 400, and the second high speed pcb is the second high speed pcb 510 connected to the rosa 500. Because the optical receive sub-module 500 is electrically connected to the circuit board 300 through the dual flexible circuit boards, the circuit board 300 is further provided with a second low-speed FPC pad, one end of the second low-speed flexible circuit board 520 is inserted into the optical receive sub-module 500, and the other end of the second low-speed flexible circuit board is electrically connected to the second low-speed FPC pad, and the second low-speed FPC pad is electrically connected to the receive signal pad of the optoelectronic chip 310 through the low-speed signal traces, so as to realize the low-speed signal transmission between the optical receive sub-module 500 and the circuit board 300.

The first optical subassembly may also be the rosa 500, the second optical subassembly may also be the rosa 400, the first high speed flexible circuit board is the second high speed flexible circuit board 510 connected to the rosa 500, the first low speed flexible circuit board is the second low speed flexible circuit board 520 connected to the rosa 500, and the second high speed flexible circuit board is the first high speed flexible circuit board 410 connected to the rosa 400. Since the rosa 400 is electrically connected to the circuit board 300 through the double flexible circuit boards, the circuit board 300 is further provided with a second low-speed FPC bonding pad, the low-speed flexible circuit board connected to the second low-speed FPC bonding pad is the first low-speed flexible circuit board 420 connected to the rosa 400, and the second low-speed FPC bonding pad is electrically connected to the transmission signal bonding pad of the optoelectronic chip 310 through the low-speed signal trace, so as to realize the low-speed signal transmission between the rosa 400 and the circuit board 300.

A space for placing a flexible circuit board connecting pad is reserved on the lower side surface of the circuit board 300, so that a second low-speed FPC pad and a second high-speed FPC pad can be respectively placed on different sides of the circuit board 300, namely, the first high-speed FPC pad, the first low-speed FPC pad and the second high-speed FPC pad are positioned on the upper side surface of the circuit board 300, and the second low-speed FPC pad is positioned on the lower side surface of the circuit board 300; the second high-speed FPC bonding pad and the second low-speed FPC bonding pad may be placed on the upper side of the circuit board 300, that is, the first high-speed FPC bonding pad, the first low-speed FPC bonding pad, the second high-speed FPC bonding pad and the second low-speed FPC bonding pad are all located on the upper side of the circuit board 300, so that the space on the lower side of the circuit board 300 may be saved.

Fig. 6 is an assembly schematic diagram of the optical transmitter sub-assembly 400 and the circuit board 300 in the optical module provided in the embodiment of the present application, fig. 7 is a partially exploded schematic diagram of the optical transmitter sub-assembly 400 in the optical module provided in the embodiment of the present application, and fig. 8 is a schematic structural diagram of a light emitting device in the optical transmitter sub-assembly 400 in the optical module provided in the embodiment of the present application. As shown in fig. 6, 7 and 8, the tosa 400 includes an emission housing 430 and a ceramic transfer block 440 inserted into the emission housing 430, a light emitting device 450 is disposed in the emission housing 430, the light emitting device 450 is electrically connected to the ceramic transfer block through a signal line, one end of the first high-speed flexible circuit board 410 is electrically connected to one side of the ceramic transfer block 440, the other end of the first high-speed flexible circuit board is electrically connected to the first high-speed FPC pad, one end of the first low-speed flexible circuit board 420 is electrically connected to the other side of the ceramic transfer block 440, and the other end of the first low-speed flexible circuit board is electrically connected to the first low-speed FPC pad.

The light emitting device 450 in the tosa 400 includes a plurality of laser assemblies, a plurality of collimating lenses, a light multiplexer, and a light prism, wherein the plurality of laser assemblies emit a plurality of light beams with different wavelengths, and the plurality of collimating lenses are respectively disposed in the light emitting directions of the plurality of laser assemblies to convert the plurality of light beams with different wavelengths into a plurality of collimated light beams; the light multiplexer is arranged in the light emergent direction of the collimating lenses, a plurality of collimated light beams enter the light multiplexer, the plurality of collimated light beams entering the light multiplexer can be reflected in the light multiplexer, and finally multiplexed into a composite light beam; the composite light beam is input into the optical fiber adapter after passing through the optical prism, and the emission of the signal light is realized.

The light emitting device 450 further includes a laser driver, and the plurality of laser components are respectively connected to the laser driver through gold wires, and the laser driver drives the laser components through the gold wires, so that the laser components emit light beams. The plurality of laser components, the laser driver, and the like are connected to the ceramic junction block 440 by gold wires, respectively. One side of the ceramic adaptor block 440 facing the circuit board 300 is provided with a boss, the upper side of the boss is electrically connected to the first high-speed flexible circuit board 410, and the lower side of the boss is electrically connected to the first low-speed flexible circuit board 420, so that the transmission of high-speed signals and low-speed signals between the tosa 400 and the circuit board 300 is realized through the first high-speed flexible circuit board 410 and the first low-speed flexible circuit board 420.

In this embodiment, a plurality of grooves are formed on one side of the ceramic transfer block 440 close to the laser device, and the laser device, the laser driver, etc. are connected to the grooves on different layers of the ceramic transfer block 440 through gold wires, for example, a high-speed signal is connected to the groove on the upper side of the ceramic transfer block 440 close to the ceramic transfer block 440 through a gold wire, and a low-speed signal is connected to the groove on the lower side of the ceramic transfer block 440 close to the ceramic transfer block 440 through a gold wire. As such, the high speed signal is transmitted to the circuit board 300 through the first high speed flexible circuit board 410 connected to the upper side of the boss, and the low speed signal is transmitted to the circuit board 300 through the first low speed flexible circuit board 420 connected to the lower side of the boss.

Fig. 9 is a schematic structural diagram of a first high-speed flexible circuit board 410 in an optical module according to an embodiment of the present application. As shown in fig. 9, one end of the first high-speed flexible circuit board 410 is provided with a plurality of pairs of high-speed signal pair pads 412, a plurality of isolation pads 413 and a high-speed positioning pad 411, the high-speed signal pair pads 412 and the isolation pads 413 are arranged along the width direction of the first high-speed flexible circuit board 410, and adjacent high-speed signal pair pads 412 are spaced by the isolation pads 413; the high-speed positioning bonding pad 411 and the high-speed signal pair bonding pad 412 are sequentially arranged along the length direction of the first high-speed flexible circuit board 410, and the first high-speed flexible circuit board 410 is connected with the first high-speed FPC bonding pad in a positioning mode through the high-speed positioning bonding pad 411.

Specifically, one end of the first high-speed flexible circuit board 410 is provided with four pairs of high-speed signal pair pads 412 and five isolation pads 413, and the two isolation pads 413 are respectively located at the edge of the first high-speed flexible circuit board 410 in the width direction, that is, one isolation pad 413 is located at the upper side edge of the first high-speed flexible circuit board 410, and the other isolation pad 413 is located at the lower side edge of the first high-speed flexible circuit board 410. The other three isolation pads 413 are respectively located between the four pairs of high-speed signal pair pads 412, that is, the four pairs of high-speed signal pair pads 412 are respectively separated by the three isolation pads 413, so as to avoid interference between adjacent high-speed signal pair pads 412.

The first high-speed FPC pads on the circuit board 300 are FPC pads corresponding to the four pairs of high-speed signal pair pads 412 and the five isolation pads 413 on the first high-speed flexible circuit board 410, and the four pairs of high-speed signal pair pads 412 and the five isolation pads 413 on the first high-speed flexible circuit board 410 are respectively connected to the first high-speed FPC pads in a one-to-one correspondence.

The high speed capture pad 411 and the high speed signal pair pad 412 are sequentially disposed along the length direction of the first high speed flexible circuit board 410, that is, the high speed signal pair pad 412 and the isolation pad 413 are both disposed at the right side end of the first high speed flexible circuit board 410, and the high speed capture pad 411 is disposed at the left side of the high speed signal pair pad 412. The high-speed positioning bonding pads 411 are arc-shaped bonding pads, the first high-speed FPC bonding pads comprise arc-shaped FPC bonding pads corresponding to the high-speed positioning bonding pads 411, and the high-speed positioning bonding pads 411 are connected with the arc-shaped FPC bonding pads in a one-to-one correspondence mode, so that the first high-speed flexible circuit board 410 is connected with the circuit board 300 in a positioning mode. In the embodiment of the present application, the circular-arc-shaped bonding pad may be a semicircular bonding pad or a semi-elliptical bonding pad.

Fig. 10 is a schematic structural diagram of a first low-speed flexible circuit board 420 in an optical module according to an embodiment of the present application. As shown in fig. 10, one end of the first low-speed flexible circuit board 420 is provided with a first group of low-speed signal pads 421 and a second group of low-speed signal pads 422, the first group of low-speed signal pads 421 are arranged along the width direction of the first low-speed flexible circuit board 420, the first group of low-speed signal pads 421 and the second group of low-speed signal pads 422 are sequentially arranged along the length direction of the first low-speed flexible circuit board 420, and the first group of low-speed signal pads 421 are arranged at the right end of the first low-speed flexible circuit board 420. The second group of low-speed signal pads 422 may be positioning pads, and the first low-speed flexible circuit board 420 is connected with the first low-speed FPC pads in a positioning manner through the second group of low-speed signal pads 422.

The second group of low-speed signal pads 422 may also be low-speed signal pads, i.e., the second group of low-speed signal pads 422 may perform both the positioning function and the low-speed signal transmission. The first low-speed FPC bonding pad comprises a first group of low-speed FPC bonding pads and a second group of low-speed FPC bonding pads which are sequentially arranged along the length direction of the circuit board 300, the first group of low-speed signal bonding pads 421 are electrically connected with the first group of low-speed FPC bonding pads, and the second group of low-speed signal bonding pads 422 are electrically connected with the second group of low-speed FPC bonding pads.

In the 200G LMQ3618-PC optical module, the low speed signal of the tosa 400 plus the GND signal has 16 signals, so the first group of low speed signal pads 421 may include 16 low speed signal pads for transmitting the low speed signal and the GND signal; the second group of low-speed signal pads 422 are low-speed positioning pads, and the first low-speed flexible circuit board 420 is connected with the circuit board 300 in a positioning mode through the second group of low-speed signal pads 422. The first group of low-speed signal pads 421 may also include 14 low-speed signal pads, and the second group of low-speed signal pads 422 may include 2 low-speed signal pads for transmitting low-speed signals and GND signals, respectively.

Fig. 11 is a schematic structural diagram of a circuit board 300 in an optical module according to an embodiment of the present application. As shown in fig. 11, the first high-speed FPC pad 320, the first low-speed FPC pad 330, and the second high-speed FPC pad 340 are located on the same side of the circuit board 300, and the second high-speed FPC pad 340 and the second low-speed FPC pad are located on opposite sides of the circuit board 300, respectively; the first high-speed FPC pad 320 and the first low-speed FPC pad 330 are disposed left and right along the length direction of the circuit board 300, the first low-speed FPC pad 330 is located at the left end of the circuit board 300, and the first high-speed FPC pad 320 is located at the right side of the first low-speed FPC pad 330. The first low-speed FPC pad 330 and the second high-speed FPC pad 340 are disposed back and forth along the width direction of the circuit board 300, that is, the second high-speed FPC pad 340 is located at the rear side of the first low-speed FPC pad 330.

In the embodiment of the present application, a gold finger is disposed at an end of the circuit board 300 away from the tosa 400, that is, the gold finger is disposed at the right side of the circuit board 300, the optoelectronic chip 310 is disposed between the first high-speed FPC pad 320 and the gold finger, a first signal pad is disposed at one side of the optoelectronic chip 310 facing the gold finger, and the first signal pad is electrically connected to the gold finger through a signal trace; a second signal pad and a third signal pad are respectively arranged on two sides of the photoelectric chip 310 adjacent to the first signal pad, that is, the first signal pad is arranged on the right side of the photoelectric chip 310, the second signal pad is arranged on the upper side of the photoelectric chip 310, and the third signal pad is arranged on the lower side of the photoelectric chip 310.

The second signal bonding pad comprises a first high-speed signal bonding pad and a first low-speed signal bonding pad, the first high-speed FPC bonding pad is electrically connected with the first high-speed signal bonding pad through a first high-speed differential pair wiring, and the first low-speed FPC bonding pad is electrically connected with the first low-speed signal bonding pad through a low-speed signal wiring. Thus, the photoelectric chip 310 is electrically connected to the first high-speed FPC pad 320 and the first low-speed FPC pad 330, and then one end of the first high-speed flexible circuit board 410 is connected to the first high-speed FPC pad 320, and one end of the first low-speed flexible circuit board 420 is connected to the first low-speed FPC pad 330, so that the photoelectric chip 310 is electrically connected to the light emission sub-module 400.

Fig. 12 is an assembly schematic diagram of the optical receive sub-assembly 500 and the circuit board 300 in the optical module according to the embodiment of the present application, and fig. 13 is a partial structural schematic diagram of the optical receive sub-assembly 500 in the optical module according to the embodiment of the present application. As shown in fig. 12 and 13, the rosa 500 includes a receiving housing 530, a light receiving device is disposed in the receiving housing 530, and one end of the second high-speed flexible circuit board 510 and one end of the second low-speed flexible circuit board 520 are inserted into the receiving housing 530 and are electrically connected to the light receiving device through signal lines. In this embodiment, the optical receiver device may include an optical prism, an optical demultiplexer, a photodetector, a transimpedance amplifier, and the like, and the signal light transmitted into the optical receive sub-module 500 via the optical fiber adapter is incident into the optical demultiplexer via the optical prism, and a composite light beam is demultiplexed into multiple signal lights with different wavelengths by the optical demultiplexer, and the multiple signal lights with different wavelengths sequentially enter the photodetector and the transimpedance amplifier to convert the optical signal into an electrical signal. The transimpedance amplifier is electrically connected to the second high-speed flexible circuit board 510 and the second low-speed flexible circuit board 520 through gold wires, respectively, and the high-speed signal is electrically connected to one end of the second high-speed flexible circuit board 510 through a gold wire, and the low-speed signal is electrically connected to one end of the second low-speed flexible circuit board 520 through a gold wire. The other end of the second high-speed flexible circuit board 510 is electrically connected to the second high-speed FPC pad 340 on the circuit board 300, and the other end of the second low-speed flexible circuit board 520 is electrically connected to the second low-speed FPC pad on the circuit board 300.

The second high-speed FPC bonding pad 340 and the second low-speed FPC bonding pad on the circuit board 300 may be electrically connected to a third signal bonding pad on the optoelectronic chip 310 through signal traces, specifically, the third signal bonding pad includes a second high-speed signal bonding pad and a second low-speed signal bonding pad, the second high-speed FPC bonding pad 340 is electrically connected to the second high-speed signal bonding pad through a second high-speed differential pair trace, and the second low-speed FPC bonding pad is electrically connected to the second low-speed signal bonding pad through a low-speed signal trace; one end of the second high-speed flexible circuit board 510 is connected to the second high-speed FPC pad 340, and one end of the second low-speed flexible circuit board 520 is connected to the second low-speed FPC pad, so that the electrical connection between the optoelectronic chip 310 and the optical subassembly 500 is achieved.

The optical module comprises a circuit board, a light emission submodule and a light receiving submodule, wherein a photoelectric chip, a first high-speed FPC (flexible printed circuit) pad, a first low-speed FPC pad, a second high-speed FPC pad and a second low-speed FPC pad are arranged on the circuit board; for emitting signal light; the light receiving secondary module is electrically connected with a second high-speed FPC bonding pad through a second high-speed flexible circuit board and is electrically connected with a second low-speed FPC bonding pad through a second low-speed flexible circuit board; for receiving signal light; the first high-speed FPC bonding pad, the first low-speed FPC bonding pad and the second high-speed FPC bonding pad are positioned on the same side face of the circuit board, and the second high-speed FPC bonding pad and the second low-speed FPC bonding pad are respectively positioned on two opposite side faces of the circuit board; the first high-speed FPC bonding pad and the first low-speed FPC bonding pad are arranged left and right along the length direction of the circuit board, and the first low-speed FPC bonding pad and the second high-speed FPC bonding pad are arranged front and back along the width direction of the circuit board; the first high-speed FPC bonding pad is electrically connected with a transmitting signal bonding pad of the photoelectric chip through a high-speed differential pair wire, the first low-speed FPC bonding pad is electrically connected with the transmitting signal bonding pad of the photoelectric chip through a low-speed signal wire, the second high-speed FPC bonding pad is electrically connected with a receiving signal bonding pad of the photoelectric chip through a high-speed differential pair wire, and the second low-speed FPC bonding pad is electrically connected with the receiving signal bonding pad of the photoelectric chip through a low-speed signal wire. The optical transmitter sub-module is welded with the circuit board through double rows of pads of double flexible circuit boards, the optical receiver sub-module is welded with the circuit board through double flexible circuit boards, on the circuit board, a high-speed FPC (flexible printed circuit) pad and a low-speed FPC pad of a transmitting end are arranged left and right along the length direction of the circuit board, the high-speed FPC pad and the low-speed FPC pad of a receiving end are respectively positioned on different sides of the circuit board, the FPC pad of the transmitting end and the FPC pad of the receiving end are arranged front and back along the width direction of the circuit board, so that excessive signals are covered by a laser at a 200G rate, and the QSFP-DD interface packaging structure is limited, the space of the circuit board is effectively saved, the limitation of the structure width of a miniaturized optical module is met, and further the miniaturization development of the optical module is facilitated. In addition, the double flexible circuit boards are used for respectively transmitting high-speed signals and low-speed signals, so that the requirement that the laser with the speed of 200G covers excessive signals can be met, and the transmission quality of the signals is improved.

The flexible circuit board that this application embodiment provided adopts double-row pad design, and it is not only limited to the flexible circuit board of being connected with the optical receive submodule, also is applicable to the flexible circuit board of being connected with the optical transmit submodule equally, has both satisfied the transmission integrality of optical module multiclass signal, has satisfied the restrictive of optical module structural width again, is favorable to the miniaturized development of optical module.

It should be noted that, in the present specification, the terms "comprises", "comprising" or any other variation thereof are intended to cover a non-exclusive inclusion, so that a circuit structure, an article or a device including a series of elements includes not only those elements but also other elements not explicitly listed or inherent to such circuit structure, article or device. Without further limitation, the presence of an element identified by the phrase "comprising an … …" does not exclude the presence of other like elements in a circuit structure, article or device comprising the element.

Other embodiments of the present application will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure herein. This application is intended to cover any variations, uses, or adaptations of the invention following, in general, the principles of the application and including such departures from the present disclosure as come within known or customary practice within the art to which the invention pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the application being indicated by the following claims.

The above-described embodiments of the present application do not limit the scope of the present application.

Claims

1. A light module, comprising:

2. The optical module as claimed in claim 1, wherein the first optical sub-module is an optical transmitter sub-module, the second optical sub-module is an optical receiver sub-module, the circuit board further has a second low-speed FPC pad thereon, and the second optical sub-module is electrically connected to the second low-speed FPC pad through a second low-speed flexible circuit board; the second high-speed FPC bonding pad and the second low-speed FPC bonding pad are located on different sides of the circuit board, and the second low-speed FPC bonding pad is electrically connected with the receiving signal bonding pad of the photoelectric chip through low-speed signal wiring.

3. The optical module as claimed in claim 1, wherein the first optical sub-module is a light receiving sub-module, the second optical sub-module is a light emitting sub-module, the circuit board further has a second low speed FPC pad thereon, and the second optical sub-module is electrically connected to the second low speed FPC pad through a second low speed flexible circuit board; the second high-speed FPC bonding pad and the second low-speed FPC bonding pad are located on different sides of the circuit board, and the second low-speed FPC bonding pad is electrically connected with the transmitting signal bonding pad of the photoelectric chip through low-speed signal wiring.

4. The optical module according to claim 2 or 3, wherein a gold finger is disposed at an end of the circuit board away from the tosa, a first signal pad is disposed at a side of the optoelectronic chip facing the gold finger, and the first signal pad is electrically connected to the gold finger through a signal trace;

a second signal pad and a third signal pad are respectively arranged on two sides of the photoelectric cell sheet adjacent to the first signal pad, the second signal pad comprises a first high-speed signal pad and a first low-speed signal pad, the first high-speed FPC pad is electrically connected with the first high-speed signal pad through the first high-speed differential pair wiring, and the first low-speed FPC pad is electrically connected with the first low-speed signal pad through the low-speed signal wiring; the third signal bonding pad comprises a second high-speed signal bonding pad and a second low-speed signal bonding pad, the second high-speed FPC bonding pad is electrically connected with the second high-speed signal bonding pad through the second high-speed differential pair wiring, and the second low-speed FPC bonding pad is electrically connected with the second low-speed signal bonding pad through the low-speed signal wiring.

5. The optical module of claim 1, wherein the first high speed FPC pad and the first low speed FPC pad are disposed between an end of one end of the circuit board and the optoelectronic chip, the first high speed FPC pad is proximate to the optoelectronic chip, and the first low speed FPC pad is proximate to an end of the circuit board.

6. The optical module according to claim 5, wherein one end of the first high-speed flexible circuit board is provided with a plurality of pairs of high-speed signal pair pads, a plurality of isolation pads and a high-speed positioning pad, and adjacent high-speed signal pair pads are spaced by the isolation pads; the high-speed positioning welding disc and the high-speed signal welding disc are sequentially arranged along the length direction of the first high-speed flexible circuit board, and the first high-speed flexible circuit board is connected with the first high-speed FPC welding disc in a positioning mode through the high-speed positioning welding disc.

7. The optical module according to claim 6, wherein one end of the first high-speed flexible circuit board is provided with four pairs of high-speed signal pair pads and five isolation pads, two of the isolation pads are respectively located at edges of the first high-speed flexible circuit board in the width direction, and the other three isolation pads are respectively located between four pairs of high-speed signal pair pads for separating the four pairs of high-speed signal pair pads.

8. The optical module according to claim 1, wherein a first group of low-speed signal pads and a second group of low-speed signal pads are disposed at one end of the first low-speed flexible circuit board, the first group of low-speed signal pads and the second group of low-speed signal pads are sequentially disposed along a length direction of the first low-speed flexible circuit board, and the first group of low-speed signal pads are close to an end of the circuit board; the second group of low-speed signal bonding pads are positioning bonding pads, and the first low-speed flexible circuit board is connected with the first low-speed FPC bonding pads in a positioning mode through the second group of low-speed signal bonding pads.

9. The optical module of claim 8, wherein the second group of low-speed signal pads are low-speed signal pads, and the first low-speed FPC pads comprise a first group of low-speed FPC pads and a second group of low-speed FPC pads which are sequentially arranged along the length direction of the circuit board, the first group of low-speed signal pads are electrically connected with the first group of low-speed FPC pads, and the second group of low-speed signal pads are electrically connected with the second group of low-speed FPC pads.

10. The light module of claim 9, wherein the first set of low speed signal pads comprises 14 low speed signal pads and the second set of low speed signal pads comprises 2 signal pads.