CN104869757B - 一种cob热电分离铜基板的生产工艺 - Google Patents
一种cob热电分离铜基板的生产工艺 Download PDFInfo
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- CN104869757B CN104869757B CN201510295153.8A CN201510295153A CN104869757B CN 104869757 B CN104869757 B CN 104869757B CN 201510295153 A CN201510295153 A CN 201510295153A CN 104869757 B CN104869757 B CN 104869757B
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- Prior art keywords
- plate
- copper coin
- etching
- completion
- control temperature
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 89
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 89
- 239000010949 copper Substances 0.000 title claims abstract description 89
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 15
- 238000005516 engineering process Methods 0.000 title claims abstract description 12
- 238000000926 separation method Methods 0.000 title claims abstract description 11
- 230000005619 thermoelectricity Effects 0.000 title claims abstract description 11
- 238000005530 etching Methods 0.000 claims abstract description 64
- 238000003825 pressing Methods 0.000 claims abstract description 29
- 238000011179 visual inspection Methods 0.000 claims abstract description 27
- 238000012545 processing Methods 0.000 claims abstract description 24
- 238000003466 welding Methods 0.000 claims abstract description 22
- 239000000463 material Substances 0.000 claims abstract description 14
- 238000005553 drilling Methods 0.000 claims abstract description 12
- 239000003292 glue Substances 0.000 claims abstract description 12
- 238000012360 testing method Methods 0.000 claims abstract description 7
- 239000007788 liquid Substances 0.000 claims description 22
- 238000011161 development Methods 0.000 claims description 21
- 239000007921 spray Substances 0.000 claims description 21
- 238000001035 drying Methods 0.000 claims description 16
- 238000004140 cleaning Methods 0.000 claims description 15
- 239000000428 dust Substances 0.000 claims description 15
- 238000005498 polishing Methods 0.000 claims description 15
- 239000000843 powder Substances 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 13
- 238000005520 cutting process Methods 0.000 claims description 10
- 238000010008 shearing Methods 0.000 claims description 10
- 230000002378 acidificating effect Effects 0.000 claims description 8
- 238000003475 lamination Methods 0.000 claims description 7
- 238000007639 printing Methods 0.000 claims description 7
- 206010023126 Jaundice Diseases 0.000 claims description 5
- 239000003085 diluting agent Substances 0.000 claims description 5
- 238000002845 discoloration Methods 0.000 claims description 5
- 239000002932 luster Substances 0.000 claims description 5
- 239000000523 sample Substances 0.000 claims description 5
- 239000002253 acid Substances 0.000 claims description 3
- 238000002386 leaching Methods 0.000 claims 1
- 239000011120 plywood Substances 0.000 claims 1
- 230000035939 shock Effects 0.000 abstract description 4
- 238000005253 cladding Methods 0.000 abstract description 3
- 241001062009 Indigofera Species 0.000 abstract 1
- 230000000694 effects Effects 0.000 abstract 1
- 230000017525 heat dissipation Effects 0.000 abstract 1
- 238000007711 solidification Methods 0.000 abstract 1
- 230000008023 solidification Effects 0.000 abstract 1
- 239000000243 solution Substances 0.000 description 19
- 239000000047 product Substances 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 5
- 238000001556 precipitation Methods 0.000 description 5
- 229910052709 silver Inorganic materials 0.000 description 5
- 239000004332 silver Substances 0.000 description 5
- CUZMQPZYCDIHQL-VCTVXEGHSA-L calcium;(2s)-1-[(2s)-3-[(2r)-2-(cyclohexanecarbonylamino)propanoyl]sulfanyl-2-methylpropanoyl]pyrrolidine-2-carboxylate Chemical group [Ca+2].N([C@H](C)C(=O)SC[C@@H](C)C(=O)N1[C@@H](CCC1)C([O-])=O)C(=O)C1CCCCC1.N([C@H](C)C(=O)SC[C@@H](C)C(=O)N1[C@@H](CCC1)C([O-])=O)C(=O)C1CCCCC1 CUZMQPZYCDIHQL-VCTVXEGHSA-L 0.000 description 3
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 2
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- FPAFDBFIGPHWGO-UHFFFAOYSA-N dioxosilane;oxomagnesium;hydrate Chemical compound O.[Mg]=O.[Mg]=O.[Mg]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O FPAFDBFIGPHWGO-UHFFFAOYSA-N 0.000 description 2
- 229910001961 silver nitrate Inorganic materials 0.000 description 2
- NDVLTYZPCACLMA-UHFFFAOYSA-N silver oxide Chemical compound [O-2].[Ag+].[Ag+] NDVLTYZPCACLMA-UHFFFAOYSA-N 0.000 description 2
- AKHNMLFCWUSKQB-UHFFFAOYSA-L sodium thiosulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=S AKHNMLFCWUSKQB-UHFFFAOYSA-L 0.000 description 2
- 235000019345 sodium thiosulphate Nutrition 0.000 description 2
- 230000018199 S phase Effects 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 235000019270 ammonium chloride Nutrition 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 230000009172 bursting Effects 0.000 description 1
- 230000035568 catharsis Effects 0.000 description 1
- 238000005660 chlorination reaction Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000012266 salt solution Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- DTPQZKZONQKKSU-UHFFFAOYSA-N silver azanide silver Chemical compound [NH2-].[Ag].[Ag].[Ag+] DTPQZKZONQKKSU-UHFFFAOYSA-N 0.000 description 1
- SDLBJIZEEMKQKY-UHFFFAOYSA-M silver chlorate Chemical compound [Ag+].[O-]Cl(=O)=O SDLBJIZEEMKQKY-UHFFFAOYSA-M 0.000 description 1
- 229910001923 silver oxide Inorganic materials 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000013517 stratification Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
Description
Claims (2)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201510295153.8A CN104869757B (zh) | 2015-06-02 | 2015-06-02 | 一种cob热电分离铜基板的生产工艺 |
Applications Claiming Priority (1)
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CN201510295153.8A CN104869757B (zh) | 2015-06-02 | 2015-06-02 | 一种cob热电分离铜基板的生产工艺 |
Publications (2)
Publication Number | Publication Date |
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CN104869757A CN104869757A (zh) | 2015-08-26 |
CN104869757B true CN104869757B (zh) | 2018-01-30 |
Family
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CN201510295153.8A Active CN104869757B (zh) | 2015-06-02 | 2015-06-02 | 一种cob热电分离铜基板的生产工艺 |
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Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109392256A (zh) * | 2017-08-14 | 2019-02-26 | 东莞市国盈电子有限公司 | 一种防止残铜的半沉铜孔线路板及其制造方法 |
CN107466165A (zh) * | 2017-09-18 | 2017-12-12 | 瑞华高科技电子工业园(厦门)有限公司 | 一种柔性电路板的fr4板补强的方法 |
CN107482001A (zh) * | 2017-09-26 | 2017-12-15 | 深圳市立洋光电子股份有限公司 | 一种超大功率cob光源及其制作工艺 |
CN109905966B (zh) * | 2017-12-07 | 2021-04-27 | 捷惠自动机械股份有限公司 | 一种电路板钻靶及裁磨提升产能的方法 |
CN108966483B (zh) * | 2018-08-01 | 2020-05-19 | 四川海英电子科技有限公司 | 一种高导热高阶高密度印刷电路板的制作工艺 |
CN109587936A (zh) * | 2018-12-13 | 2019-04-05 | 广东全宝科技股份有限公司 | 一种单侧双层线路基板的制作工艺 |
CN109688721A (zh) * | 2019-01-02 | 2019-04-26 | 江门荣信电路板有限公司 | 一种铜基板沉银表面处理工艺 |
CN110112279B (zh) * | 2019-05-21 | 2020-09-01 | 安捷利(番禺)电子实业有限公司 | 一种用于led的热电分离基板的加工方法 |
CN111132471A (zh) * | 2019-12-31 | 2020-05-08 | 安徽全照电子有限公司 | 一种热电分离铜基板生产方法 |
CN113179585A (zh) * | 2021-03-10 | 2021-07-27 | 江苏艾诺信电路技术有限公司 | 一种低损耗pi膜天线板制备方法 |
CN113073366A (zh) * | 2021-03-18 | 2021-07-06 | 东莞市志兴电子五金有限公司 | 一种应用于铜片的蚀刻镀银配合工艺 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102194790A (zh) * | 2010-03-15 | 2011-09-21 | 王湘华 | 热电分离的金属载芯片板 |
CN104159404A (zh) * | 2014-07-31 | 2014-11-19 | 简玉苍 | 分立式热电分离铝基电路板的制作方法 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN102159028B (zh) * | 2011-03-15 | 2012-12-05 | 珠海元盛电子科技股份有限公司 | 一种用于制作银行卡图案的挠性印刷电路板的制作方法 |
-
2015
- 2015-06-02 CN CN201510295153.8A patent/CN104869757B/zh active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102194790A (zh) * | 2010-03-15 | 2011-09-21 | 王湘华 | 热电分离的金属载芯片板 |
CN104159404A (zh) * | 2014-07-31 | 2014-11-19 | 简玉苍 | 分立式热电分离铝基电路板的制作方法 |
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CN104869757A (zh) | 2015-08-26 |
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Denomination of invention: COB thermoelectric separation copper substrate production process Effective date of registration: 20190313 Granted publication date: 20180130 Pledgee: Suining rural commercial bank Limited by Share Ltd Pledgor: Wesky (Suining) Electronics Co., Ltd. Registration number: 2019510000026 |
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Date of cancellation: 20201215 Granted publication date: 20180130 Pledgee: Suining rural commercial bank Limited by Share Ltd. Pledgor: WESKY (SUINING) ELECTRONICS Co.,Ltd. Registration number: 2019510000026 |
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Denomination of invention: Production process of cob thermoelectric separation copper substrate Effective date of registration: 20201217 Granted publication date: 20180130 Pledgee: Suining rural commercial bank Limited by Share Ltd. Pledgor: WESKY (SUINING) ELECTRONICS Co.,Ltd. Registration number: Y2020510000113 |
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Date of cancellation: 20211124 Granted publication date: 20180130 Pledgee: Suining rural commercial bank Limited by Share Ltd. Pledgor: WESKY (SUINING) ELECTRONICS Co.,Ltd. Registration number: Y2020510000113 |
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Denomination of invention: A production process of cob thermoelectric separation copper substrate Effective date of registration: 20211129 Granted publication date: 20180130 Pledgee: Suining rural commercial bank Limited by Share Ltd. Pledgor: WESKY (SUINING) ELECTRONICS Co.,Ltd. Registration number: Y2021980013515 |
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Date of cancellation: 20220329 Granted publication date: 20180130 Pledgee: Suining rural commercial bank Limited by Share Ltd. Pledgor: WESKY (SUINING) ELECTRONICS Co.,Ltd. Registration number: Y2021980013515 |
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Denomination of invention: A production process of cob thermoelectric separation copper substrate Effective date of registration: 20220331 Granted publication date: 20180130 Pledgee: Suining rural commercial bank Limited by Share Ltd. Pledgor: WESKY (SUINING) ELECTRONICS Co.,Ltd. Registration number: Y2022980003697 |
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