CN104821301B - 散热板和半导体装置 - Google Patents

散热板和半导体装置 Download PDF

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Publication number
CN104821301B
CN104821301B CN201410714866.9A CN201410714866A CN104821301B CN 104821301 B CN104821301 B CN 104821301B CN 201410714866 A CN201410714866 A CN 201410714866A CN 104821301 B CN104821301 B CN 104821301B
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China
Prior art keywords
opening
plate
wall
plate portion
frame
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CN201410714866.9A
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English (en)
Chinese (zh)
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CN104821301A (zh
Inventor
米持雅弘
竹内今朝幸
根来修司
关雅文
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Shinko Electric Co Ltd
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Shinko Electric Co Ltd
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Publication of CN104821301A publication Critical patent/CN104821301A/zh
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4878—Mechanical treatment, e.g. deforming
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/492—Bases or plates or solder therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Resistance Heating (AREA)
CN201410714866.9A 2014-01-30 2014-12-01 散热板和半导体装置 Active CN104821301B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014-015834 2014-01-30
JP2014015834A JP6190732B2 (ja) 2014-01-30 2014-01-30 放熱板及び半導体装置

Publications (2)

Publication Number Publication Date
CN104821301A CN104821301A (zh) 2015-08-05
CN104821301B true CN104821301B (zh) 2018-09-04

Family

ID=53679722

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201410714866.9A Active CN104821301B (zh) 2014-01-30 2014-12-01 散热板和半导体装置

Country Status (3)

Country Link
US (1) US9184106B2 (enExample)
JP (1) JP6190732B2 (enExample)
CN (1) CN104821301B (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106486430B (zh) * 2015-08-28 2019-01-11 比亚迪股份有限公司 Igbt用散热底板及其制造方法
JP6780710B2 (ja) * 2016-12-28 2020-11-04 株式会社村田製作所 回路モジュール
CN108630636B (zh) * 2017-03-24 2022-01-14 德昌电机(深圳)有限公司 Mos器件安装结构、控制器及电动助力转向系统
CN114883278A (zh) * 2022-04-27 2022-08-09 超聚变数字技术有限公司 电子设备、集成电路及半导体器件

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6580611B1 (en) * 2001-12-21 2003-06-17 Intel Corporation Dual-sided heat removal system
CN102543913A (zh) * 2010-10-29 2012-07-04 新光电气工业株式会社 布线衬底、电子装置和制造布线衬底的方法
CN102693963A (zh) * 2011-03-25 2012-09-26 富士通半导体股份有限公司 半导体器件及其制造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3220105B2 (ja) * 1998-02-25 2001-10-22 株式会社鈴木 半導体装置用ヒートスプレッダと半導体装置用パッケージ
JP2005034857A (ja) * 2003-07-17 2005-02-10 Aisin Seiki Co Ltd カシメ部材およびカシメ方法
JP2007012928A (ja) * 2005-06-30 2007-01-18 Allied Material Corp 放熱基板とそれを備えた半導体装置
JP4788705B2 (ja) * 2007-11-14 2011-10-05 トヨタ自動車株式会社 リフタのかしめ構造
JP5271886B2 (ja) * 2009-12-08 2013-08-21 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6580611B1 (en) * 2001-12-21 2003-06-17 Intel Corporation Dual-sided heat removal system
CN102543913A (zh) * 2010-10-29 2012-07-04 新光电气工业株式会社 布线衬底、电子装置和制造布线衬底的方法
CN102693963A (zh) * 2011-03-25 2012-09-26 富士通半导体股份有限公司 半导体器件及其制造方法

Also Published As

Publication number Publication date
CN104821301A (zh) 2015-08-05
JP6190732B2 (ja) 2017-08-30
US9184106B2 (en) 2015-11-10
JP2015142108A (ja) 2015-08-03
US20150214131A1 (en) 2015-07-30

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