CN104734659B - 发热体、振动器件、电子设备以及移动体 - Google Patents

发热体、振动器件、电子设备以及移动体 Download PDF

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Publication number
CN104734659B
CN104734659B CN201410791057.8A CN201410791057A CN104734659B CN 104734659 B CN104734659 B CN 104734659B CN 201410791057 A CN201410791057 A CN 201410791057A CN 104734659 B CN104734659 B CN 104734659B
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China
Prior art keywords
electrode
pad
face
heater
hole
Prior art date
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CN201410791057.8A
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English (en)
Chinese (zh)
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CN104734659A (zh
Inventor
林谦司
福泽晃弘
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
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Seiko Epson Corp
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Publication date
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Publication of CN104734659A publication Critical patent/CN104734659A/zh
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Publication of CN104734659B publication Critical patent/CN104734659B/zh
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Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/08—Holders with means for regulating temperature
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
    • H03H9/0547—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible
    • H05B3/26—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
    • H05B3/265—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base the insulating base being an inorganic material, e.g. ceramic
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/732—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Oscillators With Electromechanical Resonators (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Micromachines (AREA)
  • Control Of Resistance Heating (AREA)
  • Resistance Heating (AREA)
CN201410791057.8A 2013-12-24 2014-12-18 发热体、振动器件、电子设备以及移动体 Active CN104734659B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013-265873 2013-12-24
JP2013265873A JP6323652B2 (ja) 2013-12-24 2013-12-24 発熱体、振動デバイス、電子機器及び移動体

Publications (2)

Publication Number Publication Date
CN104734659A CN104734659A (zh) 2015-06-24
CN104734659B true CN104734659B (zh) 2019-04-26

Family

ID=53401231

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201410791057.8A Active CN104734659B (zh) 2013-12-24 2014-12-18 发热体、振动器件、电子设备以及移动体

Country Status (4)

Country Link
US (1) US10084429B2 (https=)
JP (1) JP6323652B2 (https=)
CN (1) CN104734659B (https=)
TW (1) TWI660470B (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105024667A (zh) * 2015-07-27 2015-11-04 广东大普通信技术有限公司 一种直接加热式恒温晶体振荡器
CN108141178A (zh) 2015-10-20 2018-06-08 株式会社村田制作所 压电振子、压电振子的温度控制方法以及压电振荡器
JP6665487B2 (ja) * 2015-11-02 2020-03-13 セイコーエプソン株式会社 集積回路装置、電子デバイス、電子機器、および基地局
CN108807513B (zh) * 2017-07-04 2019-08-20 苏州能讯高能半导体有限公司 半导体器件及其制造方法
DE102018105220A1 (de) * 2018-03-07 2019-09-12 Hauni Maschinenbau Gmbh Verfahren zur Fertigung eines elektrisch betreibbaren Heizkörpers für einen Inhalator
JP7694069B2 (ja) 2021-03-11 2025-06-18 セイコーエプソン株式会社 集積回路装置及び発振器
KR20230018953A (ko) 2021-07-30 2023-02-07 엘지디스플레이 주식회사 진동 장치와 이를 포함하는 장치
CN114204907B (zh) * 2021-12-31 2025-06-27 广东大普通信技术股份有限公司 一种ocxo

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5952572A (en) * 1996-01-19 1999-09-14 Matsushita Electric Industrial Co., Ltd. Angular rate sensor and acceleration sensor
JP2007242445A (ja) * 2006-03-09 2007-09-20 Alps Electric Co Ltd マイクロヒータ及びそれを用いたフローセンサ
CN101895270A (zh) * 2009-03-09 2010-11-24 微晶公司 包括热控压电谐振器的振荡器装置
WO2013168332A1 (ja) * 2012-05-09 2013-11-14 パナソニック株式会社 赤外線放射素子

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Publication number Priority date Publication date Assignee Title
JPH1141032A (ja) 1997-07-23 1999-02-12 Chuniti Denki Kogyo Kk 水晶発振子の温度制御装置
JP3248882B2 (ja) 1998-12-28 2002-01-21 東洋通信機株式会社 高安定圧電発振器の構造
JP3793555B2 (ja) 1999-05-31 2006-07-05 京セラ株式会社 円盤状ヒータ
JP2002016065A (ja) 2000-06-29 2002-01-18 Toshiba Corp 半導体装置
JP4483138B2 (ja) 2001-02-09 2010-06-16 エプソントヨコム株式会社 高安定圧電発振器の構造
GB0315526D0 (en) * 2003-07-03 2003-08-06 Qinetiq Ltd Thermal detector
JP2005310494A (ja) 2004-04-20 2005-11-04 Harison Toshiba Lighting Corp ヒータ、加熱装置、画像形成装置
JP4354347B2 (ja) 2004-06-29 2009-10-28 日本電波工業株式会社 水晶発振器
JP4804813B2 (ja) 2005-06-24 2011-11-02 日本電波工業株式会社 圧電発振器
TW200744314A (en) 2006-05-18 2007-12-01 Taitien Electronics Co Ltd Oscillator device capable of keeping constant temperature
JP4641294B2 (ja) 2006-08-29 2011-03-02 日本電波工業株式会社 恒温槽型水晶発振器
US20090051447A1 (en) * 2007-08-24 2009-02-26 Mccracken Jeffrey A Ovenized oscillator
JP5194726B2 (ja) 2007-11-12 2013-05-08 パナソニック株式会社 面状発熱体
EP2447705A1 (en) * 2009-06-25 2012-05-02 Panasonic Corporation Infrared gas detector and infrared gas measuring device
EP2776327B1 (en) * 2011-11-08 2016-02-03 Unilever PLC A carton

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5952572A (en) * 1996-01-19 1999-09-14 Matsushita Electric Industrial Co., Ltd. Angular rate sensor and acceleration sensor
JP2007242445A (ja) * 2006-03-09 2007-09-20 Alps Electric Co Ltd マイクロヒータ及びそれを用いたフローセンサ
CN101895270A (zh) * 2009-03-09 2010-11-24 微晶公司 包括热控压电谐振器的振荡器装置
WO2013168332A1 (ja) * 2012-05-09 2013-11-14 パナソニック株式会社 赤外線放射素子

Also Published As

Publication number Publication date
US20150180443A1 (en) 2015-06-25
CN104734659A (zh) 2015-06-24
TWI660470B (zh) 2019-05-21
JP6323652B2 (ja) 2018-05-16
US10084429B2 (en) 2018-09-25
TW201535634A (zh) 2015-09-16
JP2015122219A (ja) 2015-07-02

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