CN104717850B

CN104717850B - A kind of preparation method of local heavy copper circuit board and local heavy copper circuit board

Info

Publication number: CN104717850B
Application number: CN201310704307.5A
Authority: CN
Inventors: 陈于春; 沙雷; 崔荣; 刘宝林
Original assignee: Shennan Circuit Co Ltd
Current assignee: Shennan Circuit Co Ltd
Priority date: 2013-12-12
Filing date: 2013-12-19
Publication date: 2017-12-12
Anticipated expiration: 2033-12-19
Also published as: CN104717849A; CN104717850A; CN104717848A; CN104717848B

Abstract

The invention discloses a kind of preparation method of local heavy copper circuit board and local heavy copper circuit board, to solve existing parcel plating or local etching makes various defects present in local heavy copper circuit board technique.Methods described includes：Thick copper base and the first laminate and the first insulating bond are provided, first face of the thick copper base has the first thick copper circuit, first face of first laminate has the first thin copper wire, and the first groove matched with first thick copper circuit is offered on first insulating bond；To the thick copper base, first insulating bond and first laminate are pressed, first thick copper circuit is supported by first groove on the insulating barrier in the first face where the first thin copper wire in first laminate, the local heavy copper circuit board of the first thin copper wire and the first thick copper circuit in same layer is made.

Description

A kind of preparation method of local heavy copper circuit board and local heavy copper circuit board

This application claims Patent Office of the People's Republic of China, Application No. 201310684084.0, invention are submitted on December 12nd, 2013 A kind of priority of the Chinese patent application of entitled " preparation method of local heavy copper circuit board ", entire contents pass through reference It is incorporated in the present application.

Technical field

The present invention relates to circuit board technology field, and in particular to a kind of preparation method of local heavy copper circuit board and local thickness Copper circuit board.

Background technology

It is general in the prior art to use for having the local heavy copper circuit board of different-thickness circuit on same line layer The method that parcel plating or local etching or both combine makes.

For example, can thicken needing the region for making thick copper circuit to electroplate on copper foil layer, will need to make on copper foil layer The region etching of common line subtracts thickness, then, makes thick copper circuit in the region that plating thickeies, the region for subtracting thickness in etching makes Common line.

Practice is found, if the drop of different zones copper thickness is larger for example more than 3OZ in above-mentioned technique（Ounce, 1OZ It is approximately equal to 35 microns）, easily there is the problem of folder film；Moreover, the copper thickness that plating thickening or etching subtract thick region can become It is very uneven, the problem of being easy for excessive erosion occur or owing corrosion in circuit etching figure；In addition, filled for the ease of device Match somebody with somebody, the board structure of circuit made using the prior art, because thick copper circuit extends towards outer-layer circuit layer adjacent thereto, thick copper Layer is by limitation design in internal layer.

The content of the invention

The embodiment of the present invention provides a kind of preparation method of local heavy copper circuit board and local heavy copper circuit board, existing to solve Above-mentioned various defects existing for the local heavy copper circuit board manufacture craft having.

A kind of preparation method of local heavy copper circuit board provided in an embodiment of the present invention, including：

There is provided thick copper base and the first laminate and the first insulating bond, the first face of the thick copper base has the One thick copper circuit, the first face of first laminate have the first thin copper wire, offered on first insulating bond The first groove matched with first thick copper circuit；To the thick copper base, first insulating bond and described first Laminate is pressed, and first thick copper circuit is supported first in first laminate by first groove On the insulating barrier in the first face where thin copper wire, the first thin copper wire and the first thick copper circuit is made in the local thick of same layer Copper circuit board.

A kind of local heavy copper circuit board provided in an embodiment of the present invention, including：

N layer part thick copper circuit layers, N are the positive integer more than or equal to 1, and the local thick copper circuit layer includes thick copper cash Flush on the outside of the direction local heavy copper circuit board of road and thin copper wire, the thick copper circuit and thin copper wire.

Therefore the embodiment of the present invention makes the thick copper circuit for belonging to same layer in design and thin copper wire respectively Make on thick copper base and laminate, and the insulating bond by offering groove is pressed, and makes to be produced on thick copper base On thick copper circuit insulating barrier in laminate is directly contacted by groove, so as to be located at thick copper circuit and thin copper wire On same layer, local heavy copper circuit board is obtained；Easily find, this kind of method can make the circuit board of the local thick copper of random layer； Moreover, this kind of method avoid existing parcel plating or local etching make it is upper present in local heavy copper circuit board technique State various defects.

Brief description of the drawings

Technical scheme in order to illustrate the embodiments of the present invention more clearly, below will be to institute in embodiment and description of the prior art The accompanying drawing needed to use is briefly described, it should be apparent that, drawings in the following description are only some implementations of the present invention Example, for those of ordinary skill in the art, on the premise of not paying creative work, can also be obtained according to these accompanying drawings Obtain other accompanying drawings.

Fig. 1 is the flow chart of the preparation method of local heavy copper circuit board provided in an embodiment of the present invention；

Fig. 2 a and 2b are the schematic diagram of thick copper base and the first laminate respectively；

Fig. 3 a are the schematic diagrames that thick copper circuit is made on thick copper base；

Fig. 3 b are the schematic diagrames that thin copper wire is made on the first laminate；

Fig. 4 is the schematic diagram of insulating bond；

Fig. 5 a and 5b are the schematic diagrames of the pressing step in one embodiment；

Fig. 6 a and 6b are the schematic diagrames that step is pressed in another embodiment；

Fig. 7 is the flow chart of the preparation method for the local heavy copper circuit board that another embodiment of the present invention provides；

Fig. 8 is the flow chart of the preparation method of the local heavy copper circuit board of an application scenarios example of the invention；

Fig. 9 a-9h are the schematic diagrames of each processing step in an application scenarios of the invention；

Figure 10 is the flow chart of the preparation method for the local heavy copper circuit board that the embodiment of the present invention three provides；

Figure 11 is the flow chart of the preparation method of the local heavy copper circuit board of an application scenarios example of the invention；

Figure 12 a-12g are the schematic diagrames of each processing step in an application scenarios of the invention；

Figure 13 is the schematic diagram of local heavy copper circuit board provided in an embodiment of the present invention.

Embodiment

The embodiment of the present invention provides a kind of preparation method of local heavy copper circuit board and local heavy copper circuit board, existing to solve There is drawbacks described above existing for technology.In order that those skilled in the art more fully understand the present invention program, below in conjunction with this Accompanying drawing in inventive embodiments, the technical scheme in the embodiment of the present invention is clearly and completely described, it is clear that described Embodiment be only a present invention part embodiment, rather than whole embodiment.Based on the embodiment in the present invention, sheet The every other embodiment that field those of ordinary skill is obtained under the premise of creative work is not made, it should all belong to this Invent the scope of protection.

Below by specific embodiment, it is described in detail respectively.

Embodiment one

Fig. 1 is refer to, the embodiment of the present invention provides a kind of preparation method of local heavy copper circuit board, it may include：

The 110th, thick copper base and the first laminate and the first insulating bond, the first mask of the thick copper base are provided There is the first thick copper circuit, the first face of first laminate has the first thin copper wire, opened on first insulating bond Provided with the first groove matched with first thick copper circuit.

It is to cover for belonging to same layer but the different thick copper circuit of thickness and thin copper wire, prior art in design On the same metal level of copper coin, the technique for being subtracted thickness using parcel plating thickening or local etching is made, but inevitably The problems such as in the presence of such as pressing from both sides film, excessive erosion or owing corrosion.

The embodiment of the present invention, which is directed in design, belongs to same line layer but the different thick copper circuit of thickness and thin copper cash Road, then provide thick copper base and laminate respectively, to make described thick copper circuit and thin copper wire respectively, then by the later stage at Reason, obtained thick copper circuit and thin copper wire are placed in same layer, form the line layer with local thick copper circuit.

Wherein, at least one side of thick copper base has thick metal layers, and at least one side of laminate has thin metal layer.It is described Thick metal layers and thin metal layer be relative appellation, be only used for showing that the thickness of thick metal layers is more than the thickness of thin metal layer Degree.Generally, the thickness of thick metal layers can be at 3 or 4 ounces（OZ, 1OZ are approximately equal to 35 microns）More than, the thickness of thin metal layer can be Less than 3 or 2 ounces.

As shown in Figure 2 a, in the present embodiment, for the thick copper circuit part in line layer, there is provided thick copper base 210.The thickness Copper base 210 can include middle insulating barrier 2101 and be attached to the metal level 2102 of the one or both sides of insulating barrier 2101, its In, the thickness of the metal level 2102 at least the first face is identical with the thickness of thick copper circuit part in design.If for example, line The Local Copper thickness of thick copper circuit part in the floor of road is 6OZ, then the metal level 2102 in the first face of the thick copper base 210 of blanking Thickness should be 6OZ；When also having metal level 2102 in the second face, the thickness of the metal level 2102 in the second face can be 6OZ, can also Be it is other required for thickness, such as 3OZ or 2OZ etc..Particularly, if the thickness of thick copper circuit has exceeded thickness in design The metal layer thickness that copper base can be provided, for example, it is assumed that the thickness of thick copper circuit reaches 15OZ, and thick copper base can be provided Metal layer thickness be less than 15OZ, then thick copper base can be electroplated, at least by the metal thickness in the thick face of copper base first Degree plating, which thickeies, arrives 15OZ.

As shown in Figure 2 b, in the present embodiment, for the thin copper circuit part in line layer, there is provided the first laminate 220.Should First laminate 220 can include middle insulating barrier 2201 and be attached to the metal level of the one or both sides of insulating barrier 2201 2202, wherein, the thickness of the metal level 2202 at least the first face is identical with the thickness of thin copper circuit part in design.Example Such as, if the Local Copper thickness of the thin copper circuit part in line layer is 1OZ, the first face of the first laminate 220 of blanking The thickness of metal level 2202 should be 1OZ；When also having metal level 2202 in the second face, the thickness of the metal level 2202 in the second face can be with Thickness required for being 1OZ or being other, such as 3OZ or even 6OZ etc..Particularly, if thin copper wire in design Thickness be less than the metal layer thickness that can be provided of the first laminate, for example, it is assumed that the thickness of thin copper wire is 0.5OZ, and the The minimum 1OZ of metal layer thickness that one laminate can be provided, then can be etched to the first laminate, at least by first layer The metal layer thickness etching of pressing plate one side subtracts thickness and arrives 0.5OZ.

It should be noted that the size of the laminate 220 of thick copper base 210 and first provided, with design side The size of whole line layer in case is suitable.For example, if the size of line layer is 100mm*300mm in design, The size of the thick laminate 220 of copper base 210 and first all should be not less than 100mm*300mm.In general, thick copper base 210 and The size of one laminate 220 should be slightly larger than design in line layer size, so as in edges of boards edge Design Orientation hole etc. just Processed in positioning.

As shown in Figure 3 a, the first face of thick copper base 210, which makes, the first thick copper circuit 2103.Generally, design line The figure of thick copper circuit and thin copper wire on the floor of road, while be present on same egative film., can be by egative film in the present embodiment On thin copper wire figure cover or remove, only retain thick copper circuit；Or it is fabricated separately only includes thick copper circuit figure in addition Egative film, if being fabricated separately in addition, need to ensure that position of the thick copper circuit figure on egative film will be consistent.

The present embodiment, the first thick copper circuit is made on thick copper base 210 using the egative film for only including thick copper circuit figure 2103, step may include：1201st, etchant resist is covered on thick copper base 210；1202nd, by the exposed and developed etchant resist, By the figure of thick copper circuit on egative film, the of the design section that is transferred on the thick face of copper base 210 first corresponding to thick copper circuit One region；1203rd, thick copper base 210 is etched, produces corresponding first thick copper circuit 2103.Wherein, it is ensured that bottom The aligning accuracy of piece and thick copper base 210, makes thick copper circuit be precisely machined in corresponding region, to avoid and the first laminate The thin copper wire of upper making has overlapping to be gone wrong when causing pressing in position.

It should be noted that in this step, it is necessary to area that the thin copper wire will be corresponded on the thick face of copper base 210 first The copper foil in domain removes, and the insulating barrier 2101 in thick copper base 210 is exposed, in order to the subsequently pressing with the first laminate 220.

In some embodiments of the invention, for the ease of being aligned during follow-up pressing or in order to improve contraposition essence Degree, etch the first thick copper circuit process, can simultaneously thick copper base 210 fringe region etching and processing go out required for Alignment target, herein, the alignment target on the thick copper base 210 is referred to as the first alignment target.Wherein, the first contraposition target Mark can be specifically the through hole etched, the quantity and distributing position of the first target, can be determined according to being actually needed.

Optionally, can also be to thick copper base 210 after the first thick copper circuit 2103 being processed on thick copper base 210 Some conventional treatments, such as brown processing etc. are carried out, is repeated no more herein.

As shown in Figure 3 b, the first face of the first laminate 220, which makes, the first thin copper wire 2203.Generally, design The figure of thick copper circuit and thin copper wire on line layer, while be present on same egative film., can be the bottom of by the present embodiment Thick copper circuit figure on piece is covered or removed, and only retains thin copper wire；Or it is fabricated separately only includes thin copper wire figure in addition The egative film of shape, if being fabricated separately in addition, it need to ensure that position of the thickness line pattern on egative film will be consistent.

The present embodiment, the first thin copper cash is made on the first laminate 220 using the egative film for only including thin copper wire figure Road 2203, step may include：1301st, etchant resist is covered on the first laminate 220；1302nd, by exposed and developed described anti- Film is lost, by the figure of thin copper wire on egative film, is transferred to setting corresponding to thin copper wire on the face of the first laminate 220 first Count the second area in region；1303rd, the first laminate 220 is etched, produces the corresponding first thin copper wire 2203.Its In, it is ensured that the aligning accuracy of egative film and the first laminate, the first thin copper wire is precisely machined in corresponding region, to keep away Exempt from there is overlapping to be gone wrong when causing pressing in position with the thick copper circuit made on thick copper base.

It should be noted that, it is necessary to which the thick copper cash will be corresponded on the face of the first laminate 220 first in this step The copper foil in the region on road removes, and exposes the insulating barrier 2201 in the first laminate 220, in order to follow-up and thick copper base 210 Pressing.

In some embodiments of the invention, for the ease of being aligned during follow-up pressing or in order to improve contraposition essence Degree, the process of thin copper wire is being etched, required pair can be gone out in the fringe region etching and processing of the first laminate 220 simultaneously Position target, herein, is referred to as the second alignment target by the alignment target on first laminate 220.Wherein, the second contraposition target Mark can be specifically the through hole etched, the quantity and distributing position of the second alignment target, can be determined according to being actually needed.

Optionally, after processing the first thin copper wire 2203 in contraposition 220, contraposition 220 can also be carried out Conventional treatment, such as brown processing etc., are repeated no more herein.

As shown in figure 4, offered on the first insulating bond 230 that the present embodiment provides and the first thick copper circuit 2103 The first groove 2301 matched somebody with somebody.First groove 2301 is used to accommodate the first thick copper circuit 2103 in pressing, makes thick copper base After the first thick copper circuit 2103 on 210 is by first groove 2301, directly contact first thin in the first laminate 220 The insulating barrier 2201 in the first face where copper wire.Thus, the thickness of the first insulating bond 230 is desirably no more than the first thick copper The thickness of circuit 2103, also, in order to ensure that trace clearance is fully filled, the thickness of the first insulating bond 230 is preferably It is not less than the thickness of the first thick copper circuit 2103.Then, in preferred embodiment, the thickness of the first insulating bond 230 Close or equal to the thickness of the first thick copper circuit 2103.

Optionally, the insulating bond employed in the present embodiment can be prepreg, i.e., often say in the art PP pieces, it is mainly made up of resin and reinforcing material, and reinforcing material is divided into several species such as glass-fiber-fabric, paper substrate, composite again Type.

The 120th, first insulating bond and first laminate are pressed together on to the first face of the thick copper base, made First thick copper circuit supports where the first thin copper wire in first laminate by first groove On insulating barrier simultaneously, the local heavy copper circuit board of the first thin copper wire and the first thick copper circuit in same layer is made.

As shown in Figure 5 a, in this step, the first insulating bond 230 and the first laminate 220 are pressed together on thick copper base 210 the first face.It can be positioned according to described the first alignment target and the second alignment target, by thick copper base 210, first The accurate contraposition of 230 and first laminate of insulating bond 220, wherein it is desired to which the first face of thick copper base 210 and first are laminated The first of plate 220 is facing to the first insulating bond 230.

As shown in Figure 5 b, it is the schematic diagram that presses the local heavy copper circuit board obtained afterwards.As can be seen that thick copper base The first thick copper circuit 2103 on 210 is supported in the first laminate by the first groove 2301 on the first insulating bond 230 On the insulating barrier 2201 in the first face where the first thin copper wire 2203 in 220, the first internal layer circuit layer 310 is formed, this One internal layer circuit layer 310 includes first thick copper circuit 2103 and the first thin copper wire 2203, and the first thick copper circuit 2103 and first the end face of thin copper wire 2203 be respectively positioned on the insulating barrier 2201 in the first laminate 220, i.e. the first thick copper It is located at same layer in the board structure of circuit of 2103 and first thin copper wire 2203 of circuit.

More than, one embodiment of the invention discloses a kind of preparation method of local heavy copper circuit board, has office to make The circuit board of portion's thick copper circuit structure.Obtained local heavy copper circuit board includes an internal layer circuit layer, the internal layer circuit layer bag Include local thick copper circuit and common thin copper wire.

In some embodiments of the invention, as shown in figure 6 a and 6b, the second face of thick copper base can also have the second thickness Copper wire 2104, the above method may also include：

The 130th, second laminate 240 and the second insulating bond 250, the first mask of second laminate 240 are provided There is the second thin copper wire 2403, offer what is matched with second thick copper circuit 2104 on second insulating bond 250 Second groove 2501.

140th, the laminate 240 of the second insulating bond 250 and second is pressed together on the second of the thick copper base 210 Face, second thick copper circuit 2104 is set to support second in second laminate 240 by second groove 2501 On the first face insulating barrier where thin copper wire 2403, so that the second thick copper circuit of the obtained local heavy copper circuit board 2104 and second thin copper wire 2403 in same layer.

In the present embodiment, pressing step 140 can be performed after step 120, and one can also be merged into step 120 Step performs, i.e. in one presses step, by the first laminate, the first insulating bond, thick copper base, the second insulating sticky Knot layer and the pressing of the second laminate are integrated.

Optionally, the above method may also include：The 3rd insulating bond is closed in the second face pressure of first laminate 220 270 and first outer layer metal layer 260；The 4th insulating bond 290 and second is closed in the second face pressure of second laminate 240 Outer layer metal layer 280；Respectively outer-layer circuit is made on the outer layer metal layer 280 of the first outer layer metal layer 260 and second.Its In, the 3rd insulating bond and the first outer layer metal layer and the 4th insulating bond and the second outer layer metal layer are pressed, can be with A step is merged into step 120 and step 140, i.e. in one presses step, by above-mentioned each layer, all pressing is One.

Optionally, the second face of first laminate also has tertiary circuit, and the second face of second laminate is also With the 4th circuit.Tertiary circuit can be thin copper wire or thick copper circuit；4th circuit can be thin copper wire, It can also be thick copper circuit.

Optionally, second face that second insulating bond and the second laminate are pressed together on to the thick copper base It may also include before：The 3rd alignment target is produced on second laminate；Accordingly, by second insulating bond In the step of being pressed together on the second face of the thick copper base with the second laminate, using first target and the second target and 3rd target is positioned.

More than, local heavy copper circuit board made from the present embodiment includes two internal layer circuit layers, each internal layer therein Line layer includes local thick copper circuit and common thin copper wire.

More than, in the above embodiment of the present invention, to possessing the electricity of thick copper circuit structure line layer including one or two The manufacturing process of road plate is described in detail, it is readily appreciated that, according to such scheme, more layers can also be made and possess thick copper circuit The circuit board of structure line layer.

Therefore in technical scheme of the embodiment of the present invention, by belong in design same layer thick copper circuit and Thin copper wire is produced in two copper-clad plates, and the insulating bond by offering groove is pressed, and makes to be produced on Thick copper circuit on thick copper base directly contacts the insulating barrier in laminate by groove, so as to make thick copper circuit and thin copper Circuit is located on same layer, obtains required local heavy copper circuit board；Easily find, this kind of method can make random layer office The circuit board of portion's thickness copper；Moreover, this kind of method due to need not same metal level make with different-thickness circuit, because Subtract thickness without parcel plating thickening or local etching, thus, avoid existing parcel plating or local etching Make the above-mentioned various defects present in local heavy copper circuit board technique.

Embodiment two

Fig. 7 is refer to, the embodiment of the present invention provides a kind of preparation method of local heavy copper circuit board, it may include：

710th, providing thick copper base and insulating bond and metal level, the one side of the thick copper base has thick copper cash Road, there is the fluting matched with the thick copper circuit on the insulating bond and metal level.

In the present embodiment, the thickness of the thick copper circuit formed as needed, there is provided the thick thick copper base of corresponding copper；According to need The thickness for the thin copper wire to be formed, there is provided the metal level of respective thickness；According to the thickness difference of thick copper circuit and thin copper wire, The insulating bond of respective thickness is provided.In general, the thickness of thick copper circuit can be in 5OZ or more than 8OZ；The thickness of thin circuit Can be in below 3OZ.It is assumed that providing 8OZ copper thick thick copper base as needed, the metal level of 2OZ thickness, then 6OZ thickness can be provided The insulating bond of degree.Wherein, described insulating bond can be prepreg, and described metal level can be specifically copper foil Layer.

In certain embodiments, described thick copper base can be that one side covers thick copper coin, and the one side, which covers thick copper coin, to be included absolutely Edge dielectric layer and it is attached to the laminated thick copper foil layer of dielectric；The thickness of the thick copper foil layer, which can be equal to or slightly less than, to be needed The thickness of the thick copper circuit of formation., can be by techniques such as the controlled depth milling of routine or etchings, in above-mentioned one side in concrete application Cover to make on the thick copper foil layer of thick copper coin and form thick copper circuit., can be with when the thickness of thick copper foil layer is less than the thickness needed Formed thickness circuit is thickeied by electroplating.Wherein, described one side covers thick copper coin and can directly purchase to obtain, and can also lead to Cross and obtain the etching removal of the copper foil layer of the two-sided one side for covering thick copper coin, can also be by by the copper foil of common single-side coated copper plate Layer plating thickening obtains, the invention is not limited in this regard.

In some other embodiment, described thick copper base can also be double face copper, and the double face copper includes Insulating medium layer and the copper foil layer for being attached to insulating medium layer two sides；The copper foil layer of wherein one side is the thick copper cash with needing to be formed The suitable thick copper foil layer of the thickness on road, described quite refers to be equal to or slightly less than；The thickness of the copper foil layer of another side, herein not It is restricted, there can be any thickness, the circuit of any practical needs can be formed on the copper foil layer of another side.

, it is necessary to be processed in advance on insulating bond and metal level and the thick copper circuit on thick copper base in the present embodiment The fluting of matching.Described matching refers to position correspondence, and figure is identical, sizableness.Described sizableness can refer to：Open The One-sided Widths of groove bigger than the One-sided Widths of corresponding thick copper circuit 0.1 arrive 0.2mm.The thickness of the insulating bond and metal level Need to meet following relation with the thickness of thick copper circuit：The thickness of the thick copper circuit is more than the thickness of the insulating bond, But less than or equal to the thick copper sum of the insulating bond and the metal level；Preferably, should make the insulating bond and The thick copper sum of the metal level is equal with the thickness of thick copper circuit.

Make above layers contraposition accurate in step to ensure subsequently to press, can be in advance respectively in the thickness in the present embodiment Processing lamination positioning hole on copper base and insulating bond and metal level；So that in subsequently pressing step, can use described Lamination positioning hole is positioned.In concrete application, multigroup such as 8 groups double rivet positioning holes can be bored on thick copper base as lamination Positioning hole, wherein every 1 group comprises at least 2；Likewise, can be multigroup for example in the relevant position of insulating bond and metal level brill Double rivet positioning holes are as lamination positioning hole corresponding to 8 groups.

Finally, before carrying out the subsequent step such as pressing, some conventional treatments can also be carried out, such as thick copper base is entered Row brown processing etc..

The 720th, the insulating bond and metal level are pressed together on to the one side with thick copper circuit of the thick copper base, made The thick copper circuit is contained in the fluting, and the top end face of the thick copper circuit is located at same layer with the metal level.

In this step, the insulating bond and metal level are pressed together on to one with thick copper circuit of the thick copper base Face, after pressing, thick copper circuit is accommodated in the fluting of the insulating bond and metal level, and the top top of thick copper circuit Through fluting, it is located at same layer with metal level.In preferred embodiment, by make the thickness sum of insulating bond and metal level with The thickness of thick copper circuit is identical, after pressing being caused, the flush of thick copper circuit and metal level.

In above-mentioned bonding processes, the colloidal materials in insulating bond can fill thick copper circuit and metal level fluting inwall it Between gap；But should during may can also some colloidal materials spill into thick copper circuit and layer on surface of metal, and this A little excessive glues can influence subsequent etch circuit.In order to remove these excessive glues, and, in order to subsequently produce thick copper circuit and thin copper Circuit simultaneously makes thick copper circuit be connected with thin copper wire, and after above-mentioned pressing step, the embodiment of the present invention may also include following Step：Even out, microetch, even out again, the copper that sinks is electroplated.It is described in detail separately below：

A, operation is evened out：

The excessive glue and other impurity of thick copper circuit and layer on surface of metal can be rooted out by evening operation out in the present embodiment Totally.Described operation of evening out can be specifically that circuit board surface is ground by abrasive band or sand paper.It is excessive in order to reduce Glue, preferably using the PP pieces of not gummosis or few gummosis as insulating bond in the embodiment of the present invention.

In addition, if after pressing step, thick copper circuit is higher than layer on surface of metal, then the operation of evening out of this step can be with The purpose of surface evening is realized, i.e.,：In operation is evened out, not only by the excessive glue of thick copper circuit and layer on surface of metal and other miscellaneous Matter is rooted out totally, while the part for being also higher by thick copper circuit is rooted out.

B, microetch is handled：

In this step, microetch processing is carried out to the metal level and the thick copper circuit, preferably microetch depth is not more than 1OZ.The microetch processing step is mainly used in realizing following purpose：The oxidation of thick copper circuit and layer on surface of metal is removed by microetch Layer, and increase the roughness of thick copper circuit and layer on surface of metal, in follow-up plating, to increase thick copper circuit and metal level table Face and the adhesion of electrodeposited coating.In addition, the microetch processing step can also be used to realize following purpose：By by thick copper circuit and gold Category layer microetch subtracts thickness, exposes the excessive glue between thick copper circuit and metal level in gap, and convenient follow-up even out again operates removal.

C, operation is evened out again：

In the present embodiment, it will can for the first time even in operation that not root out clean excessive glue etc. miscellaneous out by evening operation out again Matter is further rooted out totally.For example, after microetch is handled, the excessive glue between thick copper circuit and metal level in gap can be at this Even out in operation and rooted out totally.

In addition, after for pressing step, thick copper circuit is less than layer on surface of metal, and there is excessive glue on thick copper circuit surface, i.e. The situation of excessive glue in the grooves, above-mentioned first time even operation out and will be unable to remove these excessive glues, are additionally, since the guarantor of excessive glue Shield, the processing of above-mentioned microetch, which can not etch thick copper circuit, subtract thickness, and still, because metal level by microetch subtracts thickness, then script is low In layer on surface of metal thick copper circuit by step A and B processing after, layer on surface of metal, then, this step will be become to be above It is rapid even out again operation can the part that the impurity such as the excessive glue on thick copper circuit surface and thick copper circuit are higher by is rooted out it is dry Only, the purpose of surface evening is realized.

D, the copper that sinks is electroplated：

After above-mentioned pressing step, thick copper circuit and metal level might have directly contact to realize connection, but this It is very insecure to contact connection.In this step, thick copper circuit and metal layer electroplated by heavy copper to be formed one it is heavy Copper electrodeposited coating, realize being reliably connected for metal level and thick copper circuit.In addition, it is less than metal level table for thick copper circuit after pressing Face forms the situation of groove, and this step is sunk in copper plating step, and more plated material will be assembled in the groove of the formation, will The groove plating of formation is filled and led up, so that thick copper circuit is concordant with layer on surface of metal.

, can be by controlling microetch depth and heavy copper electroplating thickness in above-mentioned steps, by thick copper circuit in the present embodiment Required thickness is adjusted to the thickness of metal level.

In the embodiment of the present invention, aforementioned four step is selectable, can select one or more steps according to above-mentioned Order performs.For example, in a kind of embodiment, it is seldom in no excessive glue or excessive glue, and metal level and copper thickness circuit surface In the case of very clean, it might even be possible to directly carry out heavy copper plating；In another embodiment, can also once it be evened out Then operation carries out heavy copper plating to remove excessive glue；In another embodiment, above-mentioned A, B, C, D can also be performed successively Four steps；In other embodiments, there can also be other executive modes, no longer repeat one by one herein.

In some embodiments of the invention, laminate, the laminate can also be pressed in the another side of the thick copper base Including at least one layer of insulating barrier and at least one layer of outer layer metal layer.

730th, thin copper wire is made on the metal level, the thick copper circuit and the thin copper wire is made positioned at same The local heavy copper circuit board of layer.

In this step, conventional etch process can be used to make thin copper wire on the metal layer, so as to obtain thick copper circuit It is located at the local heavy copper circuit board of same layer with thin copper wire.The graphic designs to thin copper wire can be passed through so that thin copper cash Road connects or disconnected with thick copper circuit in part.

For ease of being better understood from technical scheme provided in an embodiment of the present invention, below by the reality under a concrete scene Apply and be introduced exemplified by mode.

It refer to Fig. 8, the preparation method of another local heavy copper circuit board of the embodiment of the present invention, it is assumed that required office The thickness of thick copper circuit in portion's heavy copper circuit board is 8OZ, and the thickness of thin copper wire is 2OZ, and this method may include：

801st, thick copper base is made, as illustrated in figures 9 a and 9b, the thick copper base 410 includes insulating medium layer 4101 and thick copper Circuit 4102.Wherein, the thickness of thick copper circuit 4102 is 8OZ.

802nd, processing lamination positioning hole, as shown in figures 9 c and 9d, 8 groups of laminations are processed in the fringe region of thick copper base 410 Positioning hole 4103, wherein every 1 group includes 2.

803rd, insulating bond and metal level are laminated, as shown in figure 9e, there is thick copper circuit 4102 in thick copper base 410 One side pressing insulating bond 420 and metal level 430.

Wherein, the thickness of metal level 430 can be 2OZ, and the thickness of insulating bond 420 can be 6OZ.Insulating bond 420 With on metal level 430 correspond to thick copper circuit 3102 region be pre-machined it is matching with thick copper circuit 4101, through insulation The fluting of tack coat 420 and metal level 430, the width of fluting can wide 0.1- more unilateral than the width of corresponding thick copper circuit 0.2mm.Also, the fringe region on metal level 430 is also machined with lamination positioning hole corresponding with lamination positioning hole 4103 respectively 4303.Described lamination positioning hole 4103 and 4303 can be specifically double rivet positioning holes.In concrete application, lamination can be used Positioning hole 4103 and 4303 is positioned, and rear dynamic substrate 410 and insulating bond 420 and the riveted of metal level 430 are integrated Afterwards, pressed.Described metal level 330 can be specifically copper foil layer, and described insulating bond 420 can specifically be included extremely Few one layer of prepreg.

804th, microetch is carried out after pressing, as shown in figure 9f, metal level 430 is subtracted into thick 1OZ using microetch technique, and will pressure Excessive glue caused by conjunction process is rooted out totally.

805th, electroplated, as shown in figure 9g, electroplated on the surface of metal level 430, an electrodeposited coating 4304 is formed, with reality It is existing：It is 2OZ by the thickness that metal level 430 electroplates thickening 1OZ to metal level 430, by the inwall galvanic metallization of described fluting Or the gap slotted between thick copper circuit 4102 is electroplated and filled, thick copper circuit 4102 is connected with metal level 430, etc. Deng.

806th, line pattern is made, as shown in Fig. 9 h, the thin copper cash to form that thickness is 2OZ is etched on the surface of metal level 430 Road 4302., can be simultaneously by the plating of the logicalnot circuit visuals in the region of thick copper circuit 4102 in this etching step Layer removes, and thick copper circuit 4102 is also revealed.Wherein, by the graphic designs to thick copper circuit and thin copper wire, thickness is made Copper wire and thin copper wire in locally connection or disconnect.

So far, the local heavy copper circuit board of the present embodiment completes.Certainly, some can also be subsequently carried out routinely to grasp Make, such as surface welding resistance, gold-plated etc., no longer repeat one by one herein.

What deserves to be explained is can be seen that from Fig. 9 e to 9h in above-mentioned lamination step, can be in two thick copper bases Laminating over insulating bond 420 and metal level 430 on 410, also, laminated multi-layer is laminated between two thick copper bases Plate, the multilayer laminate may include at least one layer of insulating barrier and at least one layer of metal level.Above layers pressing is integrated can be with The local heavy copper circuit board of following structure is made, the local heavy copper circuit board includes middle multilayer laminate 440, is located at respectively Two layers of local thick copper circuit layer 450 on the two sides of multilayer laminate 440, each of which layer part thick copper circuit layer 450 include Positioned at the thick copper circuit 4102 and thin copper wire 4302 of same layer.

Therefore in the embodiment of the present invention, thick copper circuit is formed on thick copper base in advance, then pressed on thick copper base Close insulating bond and metal level, the top end face and metal level for making thick copper circuit are located at same layer, finally made on the metal layer Thin copper wire, is made thick copper circuit and thin copper wire is located at the local heavy copper circuit board of same layer, achieves following technique effect：

During due to making circuit, layer on surface of metal does not have thickness drop, thus is not in the problem of pressing from both sides film；

Due to being directly to make thin copper wire in relatively thin metal level, do not etch and subtract thick processing, metal level will not be reduced Thickness evenness, thus be not easy appearance corrode or owe corrosion the problem of；

Technical scheme of the embodiment of the present invention is applied in random layer, including any internal layer and top layer, makes local thick copper cash Road；

Also, the outer surface of the local thick copper circuit layer of part heavy copper circuit board of the embodiment of the present invention is smooth, does not interfere with Assembling, can save assembly space.

Embodiment three

Figure 10 is refer to, the embodiment of the present invention provides a kind of preparation method of local heavy copper circuit board, it may include：

1010th, the first face of metal level is etched, wherein, by the logicalnot circuit visuals in thick copper circuit region and thin copper cash The etching of road region subtracts thickness.

In the embodiment of the present invention, by carrying out two-sided etching to metal level, thick copper circuit and thin is produced on the metal layer Copper wire.Described metal level can be specifically thicker copper foil layer or copper coin etc., its thickness can more than 0.35 millimeter, or Person is in 10OZ（Ounce, 1 ounce about schedules 35 microns）More than.In the present embodiment, it is assumed that thick copper circuit and the thickness of thin copper wire Respectively require be 10OZ and 5OZ, then can according to the metal level of the measure same thickness of required thick copper circuit, such as The metal level of 10OZ thickness.

In some embodiments of the invention, before being etched to metal level, locating and machining hole on the metal layer first Positioned for subsequent step, the positioning hole processed comprises at least lamination positioning hole and inner figure positioning hole.Wherein, lamination is fixed Position hole is used in follow-up lamination or pressing step apply, and inner figure positioning hole is then used to apply in subsequent. Under same system control same rig can be utilized to drill out above-mentioned various positioning holes in same once-through operation, so as to Ensure the degree of accuracy of the position of each positioning hole.

In the present embodiment, the region for needing to make thick copper circuit on metal level is referred to as thick copper circuit region, it is necessary to make The region of thin copper wire is referred to as thin copper wire region.In this step, it is etched, is etched in the first face of metal level first Region includes that the logicalnot circuit visuals of line pattern and all thin copper wire region need not be formed in thick copper circuit region, The depth of etching determines that etch depth and the thickness sum of thin copper wire are equal to metal according to the thickness of required thin copper wire The thickness of layer.For example it is assumed that metal layer thickness is 10OZ, and if the thickness requirement of thin copper wire is 5OZ, the depth of this etching Spend for for 5OZ；If the thickness requirement of thin copper wire is 4OZ, the depth of this etching is 6OZ.In being typically designed, if The thickness of thin copper wire is designed as 60% to the 40% of thick copper circuit thickness, then etch depth arrives for the 40% of metal layer thickness 60%.Through this etching after, the thin copper wire region of metal level, which is etched, subtracts thickness, the thick copper circuit region of metal level it is non-thread Road visuals is then etched to form groove, and line pattern is preliminarily formed in thick copper circuit region.

To the etching in the face of metal level first in this step, the inner figure positioning hole of pre-production can be used to be determined Position.In some embodiments of the invention, etching of this step to the face of metal level first may include：Set in the first face of the metal level Etchant resist is put, the etchant resist covers the line pattern part in the thick copper circuit region in the face of metal level first and covers institute The second face of metal level is stated, but exposes the logicalnot circuit visuals in thick copper circuit region and whole thin copper wire regions；It is right The face of metal level first is etched, and etch depth is the thickness that metal layer thickness subtracts the thin copper wire for needing to be formed, real Now to the thickness that subtracts of metal level, the etchant resist is removed after the completion of etching.Wherein, the various positioning holes being pre-machined can use etchant resist Covering, positioning hole is prevented to be etched expansion or deformation etc..Described etchant resist can be specifically dry film against corrosion.

In some embodiments of the present invention, standard copper thickness measured zone can be set in the fringe region of metal level in advance, So that the depth etched to this is controlled.It is attached that described standard copper thickness measured zone setting may be provided at metal level edge Closely, its size can be 10*10mm.In a kind of embodiment, the standard copper thickness measured zone is drawn merely by aforesaid way One piece of fixed region, in etching process, the standard copper thickness measured zone does not cover etchant resist, but is covered around the region anti- Lose film, then the region can be etched to form groove, then, it is described etching metal level the first face the step of in, survey can be passed through The depth that the standard copper thickness measured zone etches the groove to be formed is measured, to control the depth of etching.In another embodiment, The standard copper thickness measured zone can process the groove to be formed beforehand through modes such as controlled depth millings, and the depth of groove is equal to metal The thickness of layer subtracts etch depth, i.e. and the thickness of bottom portion of groove is equal to etch depth, then, the first of the etching metal level In the step of face, whether removal can be etched by the metal level for the bottom portion of groove for judging the standard copper thickness measured zone, To be confirmed whether to reach the etch depth of one side etching plan；When bottom portion of groove is just etched clean, stops etching, make erosion Carve depth and be right up to required depth.

1020th, insulating barrier is closed in the first face pressure of the metal level.

In this step, subtract the first face pressure of thickness in being etched for metal level and close insulating barrier, so as to after pressing, to gold Second face of category layer is etched.The pressing step can use the lamination positioning hole of pre-production to be positioned.Described layer Pressure positioning hole can be specifically double rivet positioning holes.The insulating barrier pressed can be specifically prepreg.The insulation pressed The part corresponding to thick copper circuit of layer can offer corresponding groove in advance, can not also open up groove.

More than one can be made in some embodiments of the present invention, in above-mentioned steps 110, and for example two one sides are etched Subtract the metal level of thickness, in this step, after the first face pressure of metal level closes insulating barrier, can also be pressed in the another side of insulating barrier Another metal level.First face of described another metal level has equally carried out etching through above-mentioned steps 110 and has subtracted thick processing, is etched Subtract the logicalnot circuit visuals in thick copper circuit region of the region including another metal level of thickness and thin copper wire region, pressure During conjunction, another metal level first facing to insulating barrier.

1030th, the second face of metal level is etched, wherein, the logicalnot circuit visuals in thin copper wire region is etched and removed, Form thin copper wire；The logicalnot circuit visuals in thick copper circuit region is etched and removed, forms thick copper circuit.

In this step, the second face of metal level is etched, so as to which thick copper circuit and thin copper wire are finally produced Come.In this step, the inner figure positioning hole of pre-production can be used to be positioned, ensured and contraposition during the first facet etch Precision.In this step, removed by the way that the logicalnot circuit visuals in thin copper wire region will be etched, ultimately form thin copper wire； Removed by the way that the logicalnot circuit visuals in thick copper circuit region is etched, ultimately form thick copper circuit.This step etches metal level The second face may include：Etchant resist is set in the second face of metal level, and the etchant resist covers the line map in thin copper wire region Shape part and the line pattern part in thick copper circuit region；The face of metal level second is etched, it would be desirable to etch the non-of removal Line pattern part is fully etched removal, and the etchant resist is removed after the completion of etching.Wherein, the various positioning holes being pre-machined can Covered with etchant resist, prevent positioning hole to be etched expansion or deformation etc..Described etchant resist can be specifically dry film against corrosion.

In some embodiments of the present invention, if the another side of insulating barrier has also pressed another metal level, this step, together Sample is etched to the second face of another metal level, wherein, by the non-thread of the thin copper wire region of another metal level Road visuals etching removes, and forms thin copper wire；By the logicalnot circuit figure portion in the thick copper circuit region of another metal level Divide etching to remove, form thick copper circuit.

By above-mentioned steps, local heavy copper circuit board is finally made, obtained local heavy copper circuit board includes an insulation Layer and a metal level or two metal levels, wherein, each metal level includes thick copper circuit and thin copper wire simultaneously.

In some embodiments of the invention, it can also comprise the following steps：Lamina rara externa, and institute are closed in the second face pressure of metal level Stating lamina rara externa includes outer insulation and outer layer metal layer；The outer layer metal layer is processed as outer-layer circuit layer；It can also wrap Include and the step such as welding resistance or gold-plated processing is carried out on outer-layer circuit layer.Particularly, if obtained local heavy copper circuit board also wraps Another metal level is included, then may also include：Another lamina rara externa, another lamina rara externa are closed in the second face pressure of another metal level Including outer insulation and outer layer metal layer；The outer layer metal layer of another lamina rara externa is processed as outer-layer circuit layer；May be used also The step such as welding resistance or gold-plated processing is carried out to be included on the outer-layer circuit layer.

Therefore the embodiment of the invention discloses a kind of preparation method of local heavy copper circuit board, using elder generation in metal The logicalnot circuit visuals in thick copper circuit region and the etching of thin copper wire region are subtracted thickness by the first face of layer, and in the first face pressure Insulating barrier is closed, the technical scheme of Hou Tongxin roads and thin copper wire is then produced in the second facet etch, to make local thick copper electricity Road plate, the technical scheme have the following technical effect that：

Copper technology is buried relative to existing, reduces cost.Relative to the thick copper technology of existing part, due to metal level Two faces, which are not etched, subtracts thickness, maintains consistency of thickness, and different zones do not have height fall, thus, make thick copper in the second face And the problem of can avoiding pressing from both sides film during thin copper wire, the problem of excessive erosion can be avoided when making thin copper wire or owes corrosion；Also, Because thick copper circuit region does not carry out plating thickening, excessive erosion can also be avoided when etching thick copper circuit or owes asking for corrosion Topic.

It refer to Figure 11, the preparation method of another local heavy copper circuit board of the embodiment of the present invention, it may include：

1101st, the thick copper foil that blanking thickness is 10OZ is as above-mentioned metal level, and quantity can be two pieces；

1102nd, as figure 12 a shows, the locating and machining hole 5101 on metal level 510, the positioning hole 5101 may include internal layer figure Shape positioning hole and lamination positioning hole.Wherein, the line pattern contraposition that inner figure positioning hole is used in subsequent etch process, lamination The interlayer alignment that positioning hole is used in follow-up bonding processes.Described inner figure positioning hole and lamination positioning hole, can be same System control is lower to be drilled out using same rig in same once-through operation, to ensure the degree of accuracy of the position of each positioning hole.

1103rd, as shown in Figure 12b, dry film 520 against corrosion is covered on metal level 510, the dry film 520 against corrosion covers metal The line pattern part in the thick copper circuit region on the second face and the first face of layer 510 and the various positioning holes processed.Its In, if being provided with standard copper thickness measured zone, the standard copper thickness measured zone does not cover dry film against corrosion.

1104th, as shown in fig. 12 c, the first face of metal level 510 is etched and subtracts thickness, etch depth 5OZ, etched Finish, remove dry film 520 against corrosion.It can be seen that from Figure 12 c, after this etching, the thin copper wire region quilt of whole of metal level 510 Etching subtracts thickness to 5OZ, and the logicalnot circuit visuals in thick copper circuit region, which is also etched, subtracts thick formation groove 5102, so as in thick copper Land preliminarily forms thick copper circuit.

1105th, as shown in figure 12d, insulating barrier is pressed, including：The first metal layer is pressed respectively on the two sides of insulating barrier 530 510A and second metal layer 510B, the first metal layer 510A and second metal layer 510B have been subjected to above-mentioned steps 1101- 1104 are disposed, and two respectively controlling oneself for metal level are etched subtract thickness first facing to insulating barrier 530 during pressing, are not etched Subtract the second face of thickness then outwardly.

1106th, such as Figure 12 e, dry film 540 against corrosion is set in the second face of metal level, the dry film 540 against corrosion covers the first He Positioning hole in second metal layer and needing to form the part of line pattern, including the line pattern part in thick copper circuit region and The line pattern part in thin copper wire region.

1107th, such as Figure 12 f, the second face of metal level is etched, by not by the region of the covering protection of dry film 540 against corrosion Etching is removed, and thick copper circuit 5103A and thin copper wire 5104A is finally formed on the first metal layer 510A, and in the second gold medal Thick copper circuit 5103B and thin copper wire 5104B are formed on category layer 510B.Wherein, thick copper circuit is formed on the first metal layer 510A 5103A and thin copper wire 5104A forms First partial thick copper circuit layer 570, and thick copper circuit is formed on second metal layer 510B 5103B and thin copper wire 5104B is not into the second local thick copper circuit layer 580.

1108th, such as Figure 12 g, lamina rara externa is pressed respectively in the second face of two metal levels, it is exhausted that the lamina rara externa includes outer layer Edge layer 550 and outer layer metal layer 560.Subsequently also it can make outer-layer circuit layer in outer layer metal layer 560.

So far, be made required local heavy copper circuit board, the local heavy copper circuit board include two internal layer circuit layers and Two outer-layer circuit layers, wherein, each internal layer circuit layer includes thick copper circuit and thin copper wire.Described thick copper circuit can For carrying high current（Such as the electric current more than 50A）, described thin copper wire is for carrying normal signal.

In summary, the embodiment of the invention discloses a kind of preparation method of local heavy copper circuit board, using elder generation in metal The logicalnot circuit visuals in thick copper circuit region and the etching of thin copper wire region are subtracted thickness by the first face of layer, and in the first face pressure Insulating barrier is closed, the technical scheme of Hou Tongxin roads and thin copper wire is then produced in the second facet etch, to make local thick copper electricity Road plate, the technical scheme have the following technical effect that：

Example IV

Figure 13, a kind of local heavy copper circuit board of the embodiment of the present invention are refer to, the local heavy copper circuit board 1300 can wrap Include：N layer parts thick copper circuit 1301, N are the positive integer more than or equal to 1, and the local thick copper circuit layer 1301 includes being located at The direction office of the thick copper circuit 1302 and thin copper wire 1303 of same layer, the thick copper circuit 1302 and thin copper wire 1303 The flush in the outside of portion's heavy copper circuit board 130.It is pointed out that thick copper circuit 1302 exceeds the thin surface of copper wire 1303 Projection towards the inner side of local heavy copper circuit board 1300.

In some embodiments of the invention, at least one layer in the N layers part thick copper circuit layer 1301 is positioned at described The internal layer of local heavy copper circuit board.

In some embodiments of the invention, N is positive integer more than or equal to 2, the N layers part thick copper circuit layer The 1 layer or 2 layers top layer for being located at the local heavy copper circuit board in 1301.

In some embodiments of the invention, N is positive integer more than or equal to 2, the N layers part thick copper circuit layer The 1 layer or 2 layers top layer for being located at the local heavy copper circuit board in 1301, and in the N layers part thick copper circuit layer 1301 At least one layer is located at the internal layer of the local heavy copper circuit board.

In summary, the embodiment of the invention discloses a kind of local heavy copper circuit board, the local heavy copper circuit board to be included extremely Few one layer of local thick copper circuit layer, the local thick copper circuit layer include the thick copper circuit and thin copper wire positioned at same layer, institute State the flush on the outside of the direction local heavy copper circuit board of thick copper circuit and thin copper wire；So as to the thick copper of this kind of part Circuit board has the following technical effect that：

Traditional method that local heavy copper circuit board is made using parcel plating and local etching technique is typically only capable to make Go out the circuit board that local thick copper circuit layer is located at internal layer；And the local thick copper circuit layer in the local heavy copper circuit board of the present invention can position In random layer, so as to have and more be widely applied.

Traditional local heavy copper circuit board made using parcel plating and local etching technique, the thick copper cash of part therein The projection of the thick copper circuit of road floor causes thick copper circuit and the outer surface of thin copper wire not concordant towards outside, then, when When the local thick copper circuit layer is as top layer, make the surface irregularity of circuit board, it is impossible to convenient to carry out Surface Machining processing, example Such as welding resistance, gold-plated processing etc. can be difficult to because of surface irregularity, and, the out-of-flatness on surface can influence the assembling of circuit board, Easily cause space waste.

For ease of further understanding the local heavy copper circuit board of the embodiment of the present invention, below, method described above is implemented respectively Exemplified by three kinds of local heavy copper circuit boards made from one to three kind of example, it is described in further details：

Embodiment five

Fig. 6 b and Fig. 2 a to Fig. 6 a are refer to, the embodiment of the present invention provides a kind of local heavy copper circuit board, and this is local thick Copper circuit board may include：

Positioned at the 310 and second local thick copper circuit layer 320 of First partial thick copper circuit layer of internal layer, wherein, First partial Thick copper circuit layer 310 includes the first thick copper circuit 2103 and the first thin copper wire 2203 positioned at same layer, and the first thick copper cash Flush on the outside of the direction part heavy copper circuit board of 2103 and first thin copper wire 2203 of road；Second local thick copper circuit layer 320 include the second thick copper circuits 2104 and the second thin copper wire 2403 positioned at same layer, and the second thick copper circuit 2104 and the Flush on the outside of the direction part heavy copper circuit board of two thin copper wires 2403.

It can be seen that the embodiment of the invention discloses a kind of local heavy copper circuit board for including two layers of local thick copper circuit layer, and This two layers local thick copper circuit layer is respectively positioned on internal layer.

The method that local heavy copper circuit board provided in an embodiment of the present invention can use embodiment one to record is made, on the office Portion's heavy copper circuit board more detailed description refer to the record in embodiment one.

But it should be recognized that using quote embodiment one method can obtained local heavy copper circuit board be not limited to it is above-mentioned Structure, including the local heavy copper circuit board of any one or more internal layer part thick copper circuit layers can all use the method for embodiment one It is made.

Embodiment six

Fig. 9 h and Fig. 9 a-9g are refer to, the embodiment of the present invention provides a kind of local heavy copper circuit board, the local thick copper electricity Road plate may include：

Middle multilayer laminate 440, respectively positioned at two layers of local thick copper circuit layer 450 on the two sides of multilayer laminate 440, Each of which layer part thick copper circuit layer 450 includes the thick copper circuit 4102 and thin copper wire 4302 positioned at same layer；And Flush on the outside of the thick copper circuit 4102 of same layer and the direction part heavy copper circuit board of thin copper wire 4302.

It can be seen that the embodiment of the invention discloses a kind of local heavy copper circuit board for including two layers of local thick copper circuit layer, and This two layers local thick copper circuit layer is respectively positioned on top layer.

Furthermore it is also possible to continue to be laminated outer layer in the outside of local thick copper circuit layer 450 so that local thick copper circuit layer 450 are located at the internal layer of local heavy copper circuit board.

The method that local heavy copper circuit board provided in an embodiment of the present invention can use embodiment two to record is made, on the office Portion's heavy copper circuit board more detailed description refer to the record in embodiment two.

But it should be recognized that using quote embodiment two method can obtained local heavy copper circuit board be not limited to it is above-mentioned Structure, including any one or more local thick copper circuit layers（Internal layer or top layer can be located at）Local heavy copper circuit board all may be used It is made using the method for embodiment two.

Embodiment seven

Figure 12 f and Figure 12 a-12e are refer to, the embodiment of the present invention provides a kind of local heavy copper circuit board, and this is local thick Copper circuit board may include：

Middle insulating barrier 530, it is respectively formed at the First partial thick copper circuit layer 570 and second on the two sides of insulating barrier 530 Local thick copper circuit layer 580, wherein, First partial thick copper circuit layer 570 includes thick copper circuit 5103A and thin copper wire 5104A, Second local thick copper circuit layer 580 includes thick copper circuit 5103B and thin copper wire 5104B；Also, thick copper circuit 5103A and thin Flush on the outside of copper wire 5104A direction, thick copper circuit 5103A's exceeds the convex of thin copper wire 5104A inner surfaces Rise and be partially toward inner side；Flush on the outside of thick copper circuit 5103B and thin copper wire 5104B direction, thick copper circuit 5103B Bossing beyond thin copper wire 5104B inner surfaces is towards inner side.

Furthermore it is also possible to respectively the outside of 570 and second local thick copper circuit layer 580 of First partial thick copper circuit layer after Subsequent layers press outer layer so that 570 and second local thick copper circuit layer 580 of First partial thick copper circuit layer is located at local heavy copper circuit board Internal layer.

The method that local heavy copper circuit board provided in an embodiment of the present invention can use embodiment three to record is made, on the office Portion's heavy copper circuit board more detailed description refer to the record in embodiment three.

But it should be recognized that using quote embodiment three method can obtained local heavy copper circuit board be not limited to it is above-mentioned Structure, including any one or more local thick copper circuit layers（Internal layer or top layer can be located at）Local heavy copper circuit board all may be used It is made using embodiment tripartite's method.In summary, the embodiment of the invention discloses a kind of local heavy copper circuit board, the local thick copper Circuit board includes at least one layer of local thick copper circuit layer, the local thick copper circuit layer include positioned at same layer thick copper circuit and Flush on the outside of the direction local heavy copper circuit board of thin copper wire, the thick copper circuit and thin copper wire；So as to be somebody's turn to do The local heavy copper circuit board of kind has the following technical effect that：

In the above-described embodiments, the description to each embodiment all emphasizes particularly on different fields, and is not described in some embodiment Part, may refer to the associated description of other embodiments.

It should be noted that for foregoing each method embodiment, in order to be briefly described, therefore it is all expressed as a series of Combination of actions, but those skilled in the art should know, the present invention is not limited by described sequence of movement because according to According to the present invention, some steps can use other orders or carry out simultaneously.Secondly, those skilled in the art should also know, Embodiment described in this description belongs to preferred embodiment, and not necessarily the present invention must for involved action and module Must.

A kind of preparation method of the local heavy copper circuit board provided above the embodiment of the present invention and local thick copper circuit Plate is described in detail, but the explanation of above example is only intended to help the method and its core concept for understanding the present invention, It should not be construed as limiting the invention.Those skilled in the art, according to the present invention thought, the invention discloses In technical scope, the change or replacement that can readily occur in should be all included within the scope of the present invention.

Claims

A kind of 1. preparation method of local heavy copper circuit board, it is characterised in that including：

Thick copper base and the first laminate and the first insulating bond are provided, the first face of the thick copper base has the first thickness Copper wire, the first face of first laminate have the first thin copper wire, are offered on first insulating bond and institute State the first groove of the first thick copper circuit matching；

First insulating bond and first laminate are pressed together on to the first face of the thick copper base, make described first Thick copper circuit supports the exhausted of the first face where the first thin copper wire in first laminate by first groove In edge layer, the local heavy copper circuit board of the first thin copper wire and the first thick copper circuit in same layer is made.
2. according to the method for claim 1, it is characterised in that the thick copper base of offer includes：

Etchant resist is covered on thick copper base；By the exposed and developed etchant resist, the first thick copper circuit pattern transfer is arrived First face of the thick copper base；The thick copper base is etched, produces first thick copper circuit.
3. according to the method for claim 1, it is characterised in that the first laminate of the offer includes：

In the first laminate overlying lid etchant resist；By the exposed and developed etchant resist, by the first thin copper wire pattern transfer To the first face of first laminate；First laminate is etched, produces the described first thin copper wire.
4. according to the method for claim 1, it is characterised in that described to the thick copper base, first insulation adhesive Layer and first laminate also include before being pressed：

The first alignment target is produced on the thick copper base；

The second alignment target is produced on first laminate；

Accordingly, in the step of being pressed to the thick copper base, first insulating bond and first laminate, Positioned using first target and second target.
5. according to the method for claim 4, it is characterised in that：

First target is the through hole on the thick copper base；

Second target is the through hole on first laminate.
6. according to any described method in claim 1 to 5, it is characterised in that the second face of the thick copper base also has Second thick copper circuit, methods described also include：

The second laminate and the second insulating bond are provided, the first face of second laminate has the second thin copper wire, institute State the second groove for offering on the second insulating bond and being matched with second thick copper circuit；

Second insulating bond and the second laminate are pressed together on to the second face of the thick copper base, make the described second thick copper Circuit is supported by second groove on the insulating barrier in the first face in second laminate where the second thin copper wire, So that the second thick copper circuit of the obtained local heavy copper circuit board and the second thin copper wire are in same layer.
7. according to the method for claim 6, it is characterised in that the second face of first laminate also has the 3rd line Road, the second face of second laminate also have the 4th circuit.
8. according to the method for claim 6, it is characterised in that also include：

The 3rd insulating bond and the first outer layer metal layer are closed in the second face pressure of first laminate；

The 4th insulating bond and the second outer layer metal layer are closed in the second face pressure of second laminate；

Respectively outer-layer circuit is made on first outer layer metal layer and the second outer layer metal layer.
9. according to the method for claim 6, it is characterised in that described by second insulating bond and the second laminate Also include before being pressed together on the second face of the thick copper base：

The 3rd alignment target is produced on second laminate；

Accordingly, the step of second insulating bond and the second laminate being pressed together on the second face of the thick copper base In, positioned using the 3rd target.
10. according to the method for claim 9, it is characterised in that：

3rd target is the through hole on second laminate.
A kind of 11. local heavy copper circuit board, it is characterised in that including：N layer part thick copper circuit layers, the N be more than or equal to 1 positive integer, the local thick copper circuit layer include thick copper circuit and thin copper wire, the thick copper circuit and thin copper wire direction Flush on the outside of the local heavy copper circuit board；

The local thick copper circuit layer includes thick copper base and the first laminate and the first insulating bond, the thick copper base The first face there is the first thick copper circuit, the first face of first laminate has the first thin copper wire, first insulation The first groove matched with first thick copper circuit is offered on tack coat；

First insulating bond and first laminate are pressed together on the first face of the thick copper base, make first thickness Copper wire supports the insulation in the first face where the first thin copper wire in first laminate by first groove On layer.
12. local heavy copper circuit board according to claim 11, it is characterised in that in the N layers part thick copper circuit layer At least one layer be located at the internal layer of the local heavy copper circuit board.
13. local heavy copper circuit board according to claim 11, it is characterised in that N is the positive integer more than or equal to 2, The 1 layer or 2 layers top layer for being located at the local heavy copper circuit board in the N layers part thick copper circuit layer.
14. local heavy copper circuit board according to claim 11, it is characterised in that N is the positive integer more than or equal to 2, The 1 layer or 2 layers top layer for being located at the local heavy copper circuit board in the N layers part thick copper circuit layer, and the N layers are local thick At least one layer in copper wire layer is located at the internal layer of the local heavy copper circuit board.