CN104717850A

CN104717850A - Method for manufacturing local-thick-copper circuit board and local-thick-copper circuit board

Info

Publication number: CN104717850A
Application number: CN201310704307.5A
Authority: CN
Inventors: 陈于春; 沙雷; 崔荣; 刘宝林
Original assignee: Shennan Circuit Co Ltd
Current assignee: Shennan Circuit Co Ltd
Priority date: 2013-12-12
Filing date: 2013-12-19
Publication date: 2015-06-17
Anticipated expiration: 2033-12-19
Also published as: CN104717850B; CN104717849A; CN104717848B; CN104717848A

Abstract

The invention discloses a method for manufacturing a local-thick-copper circuit board and the local-thick-copper circuit board. The method and the local-thick-copper circuit board aim at overcoming the defects existing in the technology for manufacturing the local-thick-copper circuit board through existing local electroplating or existing local etching. The method includes the steps that a thick copper substrate, a first laminated board and a first insulating bonding layer are provided, wherein a first thick copper circuit is arranged on the first face of the thick copper substrate, a first thin copper circuit is arranged on the first face of the first laminated board, and a first through groove matched with the first thick copper circuit is formed in the first insulating bonding layer; the thick copper substrate, the first insulating bonding layer and the first laminated board are pressed to enable the first thick copper circuit to abut against an insulating layer of the first face, provided with the first thin copper circuit, of the first laminated board through the first through groove, and the local-thick-copper circuit board with the first thin copper circuit and the first thick copper circuit on the same layer is obtained.

Description

The manufacture method of a kind of local heavy copper circuit board and local heavy copper circuit board

This application claims and submit on December 12nd, 2013 priority that Patent Office of the People's Republic of China, application number are 201310684084.0, denomination of invention is the Chinese patent application of " manufacture method of a kind of local heavy copper circuit board " to, its full content combines in this application by reference.

Technical field

The present invention relates to circuit board technology field, be specifically related to manufacture method and the local heavy copper circuit board of a kind of local heavy copper circuit board.

Background technology

For the local heavy copper circuit board on same line layer with different-thickness circuit, in prior art, the general method of parcel plating or local etching or both combinations that adopts makes.

Such as, can thicken copper foil layer needing the region plating making thick copper circuit, by copper foil layer needing the region etching making common line subtract thick, then, making thick copper circuit in the region that plating thickeies, subtracting thick region in etching and make common line.

Practice finds, if the drop of zones of different copper thickness is comparatively large such as more than 3OZ(ounce in above-mentioned technique, 1OZ approximates 35 microns), easily there is the problem of pressing from both sides film; And plating thickeies or etches the copper thickness subtracting thick region and can become very uneven, just easily occurs the problem of excessive erosion or deficient corrosion when circuit etching figure; In addition, for the ease of device assembling, adopt the board structure of circuit that the prior art makes, because thick copper circuit extends towards outer-layer circuit layer adjacent thereto, thick copper layer is limited design at internal layer.

Summary of the invention

The embodiment of the present invention provides manufacture method and the local heavy copper circuit board of a kind of local heavy copper circuit board, to solve the above-mentioned various defect that existing local heavy copper circuit board manufacture craft exists.

The manufacture method of a kind of local heavy copper circuit board that the embodiment of the present invention provides, comprising:

Thick copper base and ground floor pressing plate and the first insulating bond are provided, the first surface of described thick copper base has the first thick copper circuit, the first surface of described ground floor pressing plate has the first thin copper wire, described first insulating bond offers the first groove mated with described first thick copper circuit; To described thick copper base, described first insulating bond and described ground floor pressing plate carry out pressing, make described first thick copper circuit be supported on the insulating barrier of the first surface at the first thin copper wire place in described ground floor pressing plate by described first groove, obtained first thin copper wire and the first thick copper circuit are at the local heavy copper circuit board of same layer.

A kind of local heavy copper circuit board that the embodiment of the present invention provides, comprising:

N layer local thick copper circuit layer, N be more than or equal to 1 positive integer, described local thick copper circuit layer comprises thick copper circuit and thin copper wire, and described thick copper circuit is concordant towards the surface outside the heavy copper circuit board of described local with thin copper wire.

Therefore, the thick copper circuit and thin copper wire that belong to same layer in design are produced on thick copper base and laminated sheet by the embodiment of the present invention, and carry out pressing by the insulating bond offering groove, the thick copper circuit be produced on thick copper base is made directly to be touched insulating barrier in laminated sheet by groove, thus, make thick copper circuit and thin copper wire be positioned on same layer, obtain local heavy copper circuit board; Easy discovery, this kind of method can make the circuit board of the thick copper in random layer local; And this kind of method avoids existing parcel plating or the above-mentioned various defect existing for the heavy copper circuit board technique of local etching making local.

Accompanying drawing explanation

In order to be illustrated more clearly in embodiment of the present invention technical scheme, be briefly described to the accompanying drawing used required in embodiment and description of the prior art below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.

Fig. 1 is the flow chart of the manufacture method of the local heavy copper circuit board that the embodiment of the present invention provides;

Fig. 2 a and 2b is the schematic diagram of thick copper base and ground floor pressing plate respectively;

Fig. 3 a is the schematic diagram making thick copper circuit on thick copper base;

Fig. 3 b is the schematic diagram making thin copper wire on ground floor pressing plate;

Fig. 4 is the schematic diagram of insulating bond;

Fig. 5 a and 5b is the schematic diagram of the pressing step in an embodiment;

Fig. 6 a and 6b is the schematic diagram of pressing step in another embodiment;

Fig. 7 is the flow chart of the manufacture method of the local heavy copper circuit board that another embodiment of the present invention provides;

Fig. 8 is the flow chart of the manufacture method of the local heavy copper circuit board of the present invention's application scenarios example;

Fig. 9 a-9h is the schematic diagram of each processing step in the present invention's application scenarios;

Figure 10 is the flow chart of the manufacture method of the local heavy copper circuit board that the embodiment of the present invention three provides;

Figure 11 is the flow chart of the manufacture method of the local heavy copper circuit board of the present invention's application scenarios example;

Figure 12 a-12g is the schematic diagram of each processing step in the present invention's application scenarios;

Figure 13 is the schematic diagram of the local heavy copper circuit board that the embodiment of the present invention provides.

Embodiment

The embodiment of the present invention provides manufacture method and the local heavy copper circuit board of a kind of local heavy copper circuit board, to solve the above-mentioned defect that prior art exists.The present invention program is understood better in order to make those skilled in the art person, below in conjunction with the accompanying drawing in the embodiment of the present invention, technical scheme in the embodiment of the present invention is clearly and completely described, obviously, described embodiment is only the embodiment of a part of the present invention, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtained under creative work prerequisite, should belong to the scope of protection of the invention.

Below by specific embodiment, be described in detail respectively.

Embodiment one

Please refer to Fig. 1, the embodiment of the present invention provides the manufacture method of a kind of local heavy copper circuit board, can comprise:

110, thick copper base and ground floor pressing plate and the first insulating bond are provided, the first surface of described thick copper base has the first thick copper circuit, the first surface of described ground floor pressing plate has the first thin copper wire, described first insulating bond offers the first groove mated with described first thick copper circuit.

For belonging to same layer in design but the different thick copper circuit of thickness and thin copper wire, prior art is on the same metal level of copper-clad plate, adopt parcel plating thickening or local etching to subtract thick technique to make, but inevitably there is problems such as such as pressing from both sides film, excessive erosion or deficient corrosion.

The embodiment of the present invention is for belonging to same line layer in design but the different thick copper circuit of thickness and thin copper wire, then provide thick copper base and laminated sheet respectively, make said thick copper circuit and thin copper wire respectively, pass through post-processed again, obtained thick copper circuit and thin copper wire are placed in same layer, form the line layer with local thick copper circuit.

Wherein, at least one mask of thick copper base has thick metal layers, and at least one mask of laminated sheet has thin metal layer.Said thick metal layers and thin metal layer are relative appellation, only for showing that the thickness of thick metal layers is greater than the thickness of thin metal layer.Usually, the thickness of thick metal layers can more than 3 or 4 ounces (OZ, 1OZ approximate 35 microns), and the thickness of thin metal layer can below 3 or 2 ounces.

As shown in Figure 2 a, in the present embodiment, for the thick copper circuit part in line layer, provide thick copper base 210.This thick copper base 210 can comprise middle insulating barrier 2101 and be attached to the metal level 2102 of insulating barrier 2101 one or both sides, and wherein, at least the thickness of the metal level 2102 of first surface is identical with the thickness of thick copper circuit part in design.Such as, if the Local Copper of the thick copper circuit part in line layer thick be 6OZ, then the thickness of the metal level 2102 of the first surface of the thick copper base 210 of blanking should be 6OZ; When also having metal level 2102 in the second face, the thickness of the metal level 2102 of second can be 6OZ, also can be the thickness required for other, such as 3OZ or 2OZ etc.Especially, if the thickness of thick copper circuit has exceeded the metal layer thickness that thick copper base can provide in design, such as, suppose that the thickness of thick copper circuit reaches 15OZ, and the metal layer thickness that thick copper base can provide is less than 15OZ, then can electroplate thick copper base, the metal layer thickness plating to the thick copper base first surface of major general thickeies to 15OZ.

As shown in Figure 2 b, in the present embodiment, for the thin copper circuit part in line layer, provide ground floor pressing plate 220.This ground floor pressing plate 220 can comprise middle insulating barrier 2201 and be attached to the metal level 2202 of insulating barrier 2201 one or both sides, and wherein, at least the thickness of the metal level 2202 of first surface is identical with the thickness of copper circuit part thin in design.Such as, if the Local Copper of the thin copper circuit part in line layer thick be 1OZ, then the thickness of the metal level 2202 of the first surface of the ground floor pressing plate 220 of blanking should be 1OZ; When also having metal level 2202 in the second face, the thickness of the metal level 2202 of second can be 1OZ, also can be the thickness required for other, such as 3OZ and even 6OZ etc.Especially, if the thickness of thin copper wire is less than the metal layer thickness that ground floor pressing plate can provide in design, such as, suppose that the thickness of thin copper wire is 0.5OZ, and the metal layer thickness that ground floor pressing plate can provide is minimum for 1OZ, then can etch ground floor pressing plate, the metal layer thickness etching to major general's ground floor pressing plate one side subtracts thick in 0.5OZ.

It should be noted that, the thick copper base 210 provided and the size of ground floor pressing plate 220, the size of the whole line layer in Uniform-design scheme is suitable.Such as, if line layer is of a size of 100mm*300mm in design, then the size of thick copper base 210 and ground floor pressing plate 220 all should be not less than 100mm*300mm.General, the size of thick copper base 210 and ground floor pressing plate 220 should be a bit larger tham the size of the line layer in design, to be convenient to location processing in panel edges Design Orientation hole etc.

As shown in Figure 3 a, the first surface of thick copper base 210 is manufactured with the first thick copper circuit 2103.Usually, the figure of the thick copper circuit on design line layer and thin copper wire, is present on same egative film simultaneously.In the present embodiment, the thin copper wire figure on egative film can be hidden or removes, only retaining thick copper circuit; Or making only comprises the egative film of thick copper circuit figure separately in addition, if made separately in addition, need ensure that the position of thick copper circuit figure on egative film will be consistent.

The present embodiment, utilize the egative film only comprising thick copper circuit figure to make the first thick copper circuit 2103 on thick copper base 210, step can comprise: 1201, on thick copper base 210, cover etchant resist; 1202, by exposing and the described etchant resist that develops, by the figure of thick copper circuit on egative film, the first area of the design section thick copper base 210 first surface corresponding to thick copper circuit is transferred to; 1203, thick copper base 210 is etched, produce corresponding first thick copper circuit 2103.Wherein, the aligning accuracy of egative film and thick copper base 210 be ensured, make thick copper circuit be precisely machined region in correspondence, to avoid having superimposed causing to go wrong during pressing in position with the thin copper wire that makes on ground floor pressing plate.

It should be noted that, in this step, need the Copper Foil in the region thick copper base 210 first surface corresponding to described thin copper wire to remove, expose the insulating barrier 2101 in thick copper base 210, so that pressing that is follow-up and ground floor pressing plate 220.

In some embodiments of the invention, for the ease of carrying out contraposition during follow-up pressing or in order to improve aligning accuracy, in the process of etching first thick copper circuit, required alignment target can be gone out in the fringe region etching and processing of thick copper base 210 simultaneously, herein, the alignment target on this thick copper base 210 is called the first alignment target.Wherein, this first alignment target can be specifically the through hole etched, and the quantity of the first target and distributing position, can determine according to actual needs.

Optionally, after thick copper base 210 processes the first thick copper circuit 2103, can also carry out some conventional treatment to thick copper base 210, such as brown process etc., repeat no more herein.

As shown in Figure 3 b, the first surface of ground floor pressing plate 220 is manufactured with the first thin copper wire 2203.Usually, the figure of the thick copper circuit on design line layer and thin copper wire, is present on same egative film simultaneously.In the present embodiment, the thick copper circuit figure on egative film can be hidden or remove, only retain thin copper wire; Or making only comprises the egative film of thin copper wire figure separately in addition, if made separately in addition, need ensure that the position of thickness line pattern on egative film will be consistent.

The present embodiment, utilize the egative film only comprising thin copper wire figure on ground floor pressing plate 220, make the first thin copper wire 2203, step can comprise: 1301, on ground floor pressing plate 220, cover etchant resist; 1302, by exposing and the described etchant resist that develops, by the figure of copper wire thin on egative film, the second area of the design section described ground floor pressing plate 220 first surface corresponding to thin copper wire is transferred to; 1303, ground floor pressing plate 220 is etched, produce corresponding first thin copper wire 2203.Wherein, the aligning accuracy of egative film and ground floor pressing plate be ensured, make the first thin copper wire be precisely machined region in correspondence, to avoid having superimposed causing to go wrong during pressing in position with the thick copper circuit that makes on thick copper base.

It should be noted that, in this step, need the Copper Foil in the region described ground floor pressing plate 220 first surface corresponding to described thick copper circuit to remove, expose the insulating barrier 2201 in ground floor pressing plate 220, so that the pressing of follow-up and thick copper base 210.

In some embodiments of the invention, for the ease of carrying out contraposition during follow-up pressing or in order to improve aligning accuracy, in the process of the thin copper wire of etching, required alignment target can be gone out in the fringe region etching and processing of ground floor pressing plate 220 simultaneously, herein, the alignment target on this ground floor pressing plate 220 is called the second alignment target.Wherein, this second alignment target can be specifically the through hole etched, and the quantity of the second alignment target and distributing position, can determine according to actual needs.

Optionally, after contraposition 220 processes the first thin copper wire 2203, can also carry out some conventional treatment to contraposition 220, such as brown process etc., repeat no more herein.

As shown in Figure 4, the first insulating bond 230 that the present embodiment provides offers mate with the first thick copper circuit 2103 the first groove 2301.This first groove 2301 is for holding the first thick copper circuit 2103 when pressing, make the first thick copper circuit 2103 on thick copper base 210 by after this first groove 2301, directly touch the insulating barrier 2201 of the first surface at the first thin copper wire place in ground floor pressing plate 220.Thus, the thickness of the first insulating bond 230 is preferably not more than the thickness of the first thick copper circuit 2103, and in order to ensure that trace clearance is fully filled, the thickness of the first insulating bond 230 is not preferably less than the thickness of the first thick copper circuit 2103 yet.So, in preferred embodiment, the thickness of the first insulating bond 230 close to or equal the thickness of the first thick copper circuit 2103.

Optionally, the insulating bond adopted in the present embodiment can be prepreg, the PP sheet namely often said in the art, and it is primarily of resin and reinforcing material composition, and reinforcing material is divided into again the several types such as glass-fiber-fabric, paper substrate, composite material.

120, described first insulating bond and described ground floor pressing plate are pressed together on the first surface of described thick copper base, make described first thick copper circuit be supported on the insulating barrier of the first surface at the first thin copper wire place in described ground floor pressing plate by described first groove, obtained first thin copper wire and the first thick copper circuit are at the local heavy copper circuit board of same layer.

As shown in Figure 5 a, in this step, the first insulating bond 230 and ground floor pressing plate 220 are pressed together on the first surface of thick copper base 210.Can position according to said first alignment target and the second alignment target, by thick copper base 210, first insulating bond 230 and ground floor pressing plate 220 accurate contraposition, wherein, need the first surface of thick copper base 210 and the first surface of ground floor pressing plate 220 towards the first insulating bond 230.

As shown in Figure 5 b, be pressing after the schematic diagram of local heavy copper circuit board that obtains.Can find out, the first thick copper circuit 2103 on thick copper base 210 is supported on the insulating barrier 2201 of the first surface at the first thin copper wire 2203 place in ground floor pressing plate 220 by the first groove 2301 on the first insulating bond 230, form the first internal layer circuit layer 310, this the first internal layer circuit layer 310 comprises described first thick copper circuit 2103 and described first thin copper wire 2203, and an end face of the first thick copper circuit 2103 and the first thin copper wire 2203 is all arranged on the insulating barrier 2201 of ground floor pressing plate 220, namely, same layer is positioned in the board structure of circuit of the first thick copper circuit 2103 and the first thin copper wire 2203.

Above, one embodiment of the invention discloses the manufacture method of a kind of local heavy copper circuit board, to make the circuit board with local thick copper circuit structure.Obtained local heavy copper circuit board comprises an internal layer circuit layer, and this internal layer circuit layer includes the thick copper circuit of local and common thin copper wire.

In some embodiments of the invention, as shown in figure 6 a and 6b, second of thick copper base also can have the second thick copper circuit 2104, and said method also can comprise:

130, provide second layer pressing plate 240 and the second insulating bond 250, the first surface of described second layer pressing plate 240 has the second thin copper wire 2403, described second insulating bond 250 offers the second groove 2501 mated with described second thick copper circuit 2104.

140, described second insulating bond 250 and second layer pressing plate 240 are pressed together on second of described thick copper base 210, described second thick copper circuit 2104 is supported on the first surface insulating barrier at the second thin copper wire 2403 place in described second layer pressing plate 240 by described second groove 2501, thus makes the second thick copper circuit 2104 of the described local heavy copper circuit board obtained and the second thin copper wire 2403 at same layer.

In the present embodiment, pressing step 140 can perform after step 120, also can merge into a step with step 120 and perform, namely, in a pressing step, ground floor pressing plate, the first insulating bond, thick copper base, the second insulating bond and the pressing of second layer pressing plate are integrated.

Optionally, said method also can comprise: at second pressing the 3rd insulating bond 270 and first outer layer metal layer 260 of described ground floor pressing plate 220; At second pressing the 4th insulating bond 290 and second outer layer metal layer 280 of described second layer pressing plate 240; Outer-layer circuit is made respectively on described first outer layer metal layer 260 and the second outer layer metal layer 280.Wherein, pressing the 3rd insulating bond and the first outer layer metal layer and the 4th insulating bond and the second outer layer metal layer, can merge into a step with step 120 and step 140, namely, in a pressing step, the above-mentioned whole pressing of each layer is integrated.

Optionally, second of described ground floor pressing plate also has tertiary circuit, and second of described second layer pressing plate also has the 4th circuit.Tertiary circuit can be thin copper wire, also can be thick copper circuit; 4th circuit can be thin copper wire, also can be thick copper circuit.

Optionally, described second of described second insulating bond and second layer pressing plate being pressed together on described thick copper base also can comprise before: on described second layer pressing plate, produce the 3rd alignment target; Accordingly, described second insulating bond and second layer pressing plate are pressed together in the step of second of described thick copper base, adopt described first target and the second target and the 3rd target to position.

Above, the local heavy copper circuit board that the present embodiment obtains includes two internal layer circuit layers, and each internal layer circuit layer wherein includes the thick copper circuit of local and common thin copper wire.

Above, stating on the invention in embodiment, being described in detail to comprising one or two manufacturing process possessing the circuit board of thick copper circuit structure line layer, easy understand, according to such scheme, the more multi-layered circuit board possessing thick copper circuit structure line layer can also be made.

Therefore, in embodiment of the present invention technical scheme, the thick copper circuit and thin copper wire that belong to same layer in design are produced in two copper-clad plates, and carry out pressing by the insulating bond offering groove, the thick copper circuit be produced on thick copper base is made directly to be touched insulating barrier in laminated sheet by groove, thus, make thick copper circuit and thin copper wire be positioned on same layer, obtain required local heavy copper circuit board; Easy discovery, this kind of method can make the circuit board of the thick copper in random layer local; And, this kind of method be not owing to needing to make the circuit with different-thickness at same metal level, thus parcel plating thickening or local etching is not needed to subtract thickness, thus, existing parcel plating or the above-mentioned various defect existing for the heavy copper circuit board technique of local etching making local is avoided.

Embodiment two

Please refer to Fig. 7, the embodiment of the present invention provides the manufacture method of a kind of local heavy copper circuit board, can comprise:

710, provide thick copper base and insulating bond and metal level, the one side of described thick copper base has thick copper circuit, and described insulating bond and metal level have the fluting mated with described thick copper circuit.

In the present embodiment, the thickness of the thick copper circuit formed as required, provides the thick copper base that corresponding copper is thick; The thickness of the thin copper wire formed as required, provides the metal level of respective thickness; According to the thickness difference of thick copper circuit and thin copper wire, provide the insulating bond of respective thickness.General, the thickness of thick copper circuit can at 5OZ or more than 8OZ; The thickness of thin circuit can at below 3OZ.Suppose, provide the thick copper base that 8OZ copper is thick as required, the metal level of 2OZ thickness, then the insulating bond of 6OZ thickness can be provided.Wherein, said insulating bond can be prepreg, and said metal level can be specifically copper foil layer.

In certain embodiments, said thick copper base can be that one side covers thick copper coin, and this one side covers thick copper coin and comprises insulating medium layer and be attached to the laminated thick copper foil layer of dielectric; The thickness of this thick copper foil layer can be equal to or slightly less than the thickness needing the thick copper circuit formed.In embody rule, can by techniques such as the conventional dark milling of control or etchings, the thick copper foil layer covering thick copper coin at above-mentioned one side makes and forms thick copper circuit.When the thickness of thick copper foil layer is less than the thickness of needs, can also thicken by plating the thickness circuit formed.Wherein, said one side covers thick copper coin directly can be purchased and obtain, also can by the two-sided copper foil layer etching removal covering the one side of thick copper coin be obtained, can also obtain by the copper foil layer of common single-side coated copper plate is electroplated thickening, the present invention is not restricted this.

In some other embodiment, said thick copper base also can be double face copper, and this double face copper comprises insulating medium layer and is attached to the copper foil layer on insulating medium layer two sides; Wherein the copper foil layer of one side is the thick copper foil layer suitable with needing the thickness of the thick copper circuit formed, and said quite referring to is equal to or slightly less than; The thickness of the copper foil layer of another side, is not restricted herein, can have any thickness, the copper foil layer of another side can be formed the circuit that any practical needs.

In the present embodiment, need on insulating bond and metal level, process the fluting mated with the thick copper circuit on thick copper base in advance.Said coupling refers to that position is corresponding, and figure is identical, sizableness.Said sizableness can refer to: the One-sided Widths of fluting arrives 0.2mm than the One-sided Widths large 0.1 of corresponding thick copper circuit.Relation below the thickness of this insulating bond and metal level and the thickness demand fulfillment of thick copper circuit: the thickness of described thick copper circuit is greater than the thickness of described insulating bond, but is less than or equal to the thick copper sum of described insulating bond and described metal level; Preferably, the thick copper sum of described insulating bond and described metal level should be made equal with the thickness of thick copper circuit.

In order to ensure to make in follow-up pressing step above-mentioned each layer contraposition accurate, can processing laminated location hole on described thick copper base and insulating bond and metal level respectively in advance in the present embodiment; Make in follow-up pressing step, described lamination location hole can be adopted to position.In embody rule, can bore the two rivet location hole of many groups such as 8 groups as lamination location hole on thick copper base, wherein every 1 group at least comprises 2; Same, two rivet location holes corresponding to many groups such as 8 groups can be bored as lamination location hole in the relevant position of insulating bond and metal level.

Finally, before carrying out the subsequent steps such as pressing, some conventional treatment can also be carried out, such as, thick copper base be carried out brown process etc.

720, described insulating bond and metal laminate are combined in the one side with thick copper circuit of described thick copper base, described thick copper circuit is contained in described fluting, and the top end face of described thick copper circuit and described metal level are positioned at same layer.

In this step, described insulating bond and metal laminate are combined in the one side with thick copper circuit of described thick copper base, after pressing, thick copper circuit is accommodated in the fluting of described insulating bond and metal level, and top, the top of thick copper circuit is through fluting, is positioned at same layer with metal level.In preferred embodiment, by making insulating bond identical with the thickness of thick copper circuit with the thickness sum of metal level, after can making pressing, thick copper circuit is concordant with the surface of metal level.

In above-mentioned bonding processes, the colloidal materials in insulating bond can fill the gap that thick copper circuit and metal level are slotted between inwall; But, also may can spill into thick copper circuit and layer on surface of metal by some colloidal materials in this process, and these excessive glue can affect subsequent etch circuit.In order to remove these excessive glue, and, in order to produce thick copper circuit with thin copper wire make thick copper circuit be connected with thin copper wire follow-up, after above-mentioned pressing step, the embodiment of the present invention also can comprise the following steps: even out, microetch, again even out, heavy copper plating.Be described in detail respectively below:

A, even operation out:

By evening operation out in the present embodiment, the excessive glue of thick copper circuit and layer on surface of metal and other impurity are rooted out totally.It is said that to even operation out can be specifically carry out grinding by abrasive band or sand paper to circuit board surface.In order to reduce excessive glue, in the embodiment of the present invention, preferably adopt the PP sheet of not gummosis or few gummosis as insulating bond.

In addition, if after pressing step, thick copper circuit is higher than layer on surface of metal, then the evening operation out and can also realize the object of surface evening of this step, that is: evening out in operation, not only the excessive glue of thick copper circuit and layer on surface of metal and other impurity are rooted out totally, also the part that thick copper circuit exceeds is rooted out simultaneously.

B, microetch process:

In this step, carry out microetch process to described metal level and described thick copper circuit, the preferred microetch degree of depth is not more than 1OZ.This microetch treatment step is mainly used in realizing following object: the oxide layer being removed thick copper circuit and layer on surface of metal by microetch, and increase the roughness of thick copper circuit and layer on surface of metal, so that when follow-up plating, increase the adhesion of thick copper circuit and layer on surface of metal and electrodeposited coating.In addition, this microetch treatment step also can be used for realizing following object: by subtracting thick by thick copper circuit and metal level microetch, and the excessive glue between thick copper circuit and metal level in gap is exposed, and facilitates follow-up again evening out to operate removal.

C, again even operation out:

In the present embodiment, by again evening operation out, evening in operation first time impurity such as out not rooting out clean excessive glue and rooting out further totally.Such as, after microetch process, the excessive glue between thick copper circuit and metal level in gap can be evened out in operation at this and be rooted out totally.

In addition, after pressing step, thick copper circuit is lower than layer on surface of metal, and there is excessive glue on thick copper circuit surface, namely, excessive glue is arranged in the situation of groove, above-mentioned first time evens operation out and cannot remove these excessive glue, and, due to the protection of excessive glue, thick copper circuit etching can not subtract thick by above-mentioned microetch process, but, because metal level is subtracted thick by microetch, then originally lower than the thick copper circuit of layer on surface of metal after steps A and B process, will become higher than layer on surface of metal, so, this step again even out operation just can the part that the impurity such as the excessive glue on thick copper circuit surface and thick copper circuit exceed be rooted out totally, realize the object of surface evening.

D, heavy copper plating:

After above-mentioned pressing step, thick copper circuit and metal level may have directly contact to realize being connected, but this contact connection is very insecure.In this step, electroplate the heavy copper electrodeposited coating of formation one at thick copper circuit and metal layer by heavy copper, realize metal level and be connected with the reliable of thick copper circuit.In addition, form the situation of groove lower than layer on surface of metal for thick copper circuit after pressing, this step is sunk in copper plating step, will assemble more plated material in the groove of this formation, the plating of the groove of formation is filled and led up, thus makes thick copper circuit concordant with layer on surface of metal.

In the present embodiment, by the microetch degree of depth in control above-mentioned steps and heavy copper electroplating thickness, the thickness of thick copper circuit and metal level can be adjusted to required thickness.

In the embodiment of the present invention, above-mentioned four steps are selectable, and one or more step can be selected to perform according to said sequence.Such as, in a kind of execution mode, little at overflow glue or excessive glue, and metal level and copper thick circuit surface very clean when, even can directly carry out heavy copper plating; In another kind of execution mode, also once can even operation out to remove excessive glue, then carry out heavy copper plating; In another execution mode, above-mentioned A, B, C, D tetra-steps can also be performed successively; In other embodiments, other executive mode can also be had, repeat no longer one by one herein.

In some embodiments of the invention, can also pressing layer pressing plate at the another side of described thick copper base, described laminated sheet comprises at least one layer insulating and at least one deck outer layer metal layer.

730, on described metal level, make thin copper wire, obtained described thick copper circuit and described thin copper wire are positioned at the local heavy copper circuit board of same layer.

In this step, conventional etch process can be adopted to make thin copper wire on the metal layer, thus obtain the local heavy copper circuit board that thick copper circuit and thin copper wire are positioned at same layer.Can, by the graphic designs to thin copper wire, thin copper wire be made to be connected with thick copper circuit in local or to disconnect.

For ease of better understanding the technical scheme that the embodiment of the present invention provides, be that example is introduced below by the execution mode under a concrete scene.

Please refer to Fig. 8, the manufacture method of the another kind of local heavy copper circuit board of the embodiment of the present invention, the thickness of the thick copper circuit in the local heavy copper circuit board required for supposing is 8OZ, and the thickness of thin copper wire is 2OZ, and the method can comprise:

801, make thick copper base, as illustrated in figures 9 a and 9b, this thick copper base 410 comprises insulating medium layer 4101 and thick copper circuit 4102.Wherein, the thickness of thick copper circuit 4102 is 8OZ.

802, processing laminated location hole, as shown in figures 9 c and 9d, processes 8 groups of lamination location holes 4103 at the fringe region of thick copper base 410, and wherein every 1 group comprises 2.

803, lamination insulating bond and metal level, as shown in figure 9e, at the one side pressing insulating bond 420 with thick copper circuit 4102 and the metal level 430 of thick copper base 410.

Wherein, the thickness of metal level 430 can be 2OZ, and the thickness of insulating bond 420 can be 6OZ.Region insulating bond 420 and metal level 430 corresponding to thick copper circuit 3102 is processed with fluting that mate with thick copper circuit 4101, that run through insulating bond 420 and metal level 430 in advance, and the width of fluting can wide 0.1-0.2mm more monolateral than the width of the thick copper circuit of correspondence.Further, the fringe region on metal level 430 is also processed with the lamination location hole 4303 corresponding with lamination location hole 4103 respectively.Said lamination location hole 4103 and 4303 can be specifically two rivet location holes.In embody rule, lamination location hole 4103 and 4303 can be adopted to position, after rear dynamic substrate 410 and insulating bond 420 and metal level 430 riveted being integrated, carry out pressing.Said metal level 330 can be specifically copper foil layer, and said insulating bond 420 specifically can comprise at least one deck prepreg.

804, carry out microetch after pressing, as shown in figure 9f, adopt microetch technique to subtract thick 1OZ metal level 430, and the excessive glue that bonding processes produces is rooted out totally.

805, electroplate, as shown in figure 9g, electroplate on metal level 430 surface, form an electrodeposited coating 4304, to realize: metal level 430 is electroplated and thickeies the thickness of 1OZ to metal level 430 for 2OZ, electroplate fill by the inwall galvanic metallization of said fluting or by the gap between fluting and thick copper circuit 4102, thick copper circuit 4102 is connected with metal level 430, etc.

806, make line pattern, as shown in Fig. 9 h, form at metal level 430 surface etching the thin copper wire 4302 that thickness is 2OZ.In this etching step, the electrodeposited coating of the logicalnot circuit visuals in thick copper circuit 4102 region can be removed simultaneously, thick copper circuit 4102 is also revealed.Wherein, by the graphic designs to thick copper circuit and thin copper wire, thick copper circuit is made to be connected with thin copper wire in local or to disconnect.

So far, the local heavy copper circuit board of the present embodiment completes.Certainly, follow-uply can also carry out some routine operations, such as surperficial welding resistance, gold-plated etc., repeats no longer one by one herein.

What deserves to be explained is, as can be seen from Fig. 9 e to 9h, in above-mentioned lamination step, lamination insulating bond 420 and metal level 430 can be distinguished on two thick copper bases 410, and, between two thick copper bases, be laminated with multilayer laminate, this multilayer laminate can comprise at least one layer insulating and at least one deck metal level.Above-mentioned each lamination is integrated and can obtains the local heavy copper circuit board of following structure, this local heavy copper circuit board comprises middle multilayer laminate 440, lay respectively at the two-layer local thick copper circuit layer 450 on multilayer laminate 440 two sides, wherein every one deck local thick copper circuit layer 450 includes the thick copper circuit 4102 and thin copper wire 4302 that are positioned at same layer.

Therefore, in the embodiment of the present invention, thick copper circuit is formed in advance on thick copper base, pressing insulating bond and metal level on thick copper base again, the top end face of thick copper circuit and metal level is made to be positioned at same layer, finally make thin copper wire on the metal layer, obtained thick copper circuit and thin copper wire are positioned at the local heavy copper circuit board of same layer, achieve following technique effect:

During owing to making circuit, layer on surface of metal does not have thickness drop, thus there will not be the problem of folder film;

Owing to being directly make thin copper wire at thinner metal level, not having etching to subtract thick process, the thickness evenness of metal level can not be reduced, be thus not easy the problem occurring corroding or owe corrosion;

Embodiment of the present invention technical scheme is applicable at random layer, comprises any internal layer and top layer, makes local thick copper circuit;

Further, the outer surface of the local thick copper circuit layer of embodiment of the present invention local heavy copper circuit board is smooth, can not affect assembling, can save assembly space.

Embodiment three

Please refer to Figure 10, the embodiment of the present invention provides the manufacture method of a kind of local heavy copper circuit board, can comprise:

1010, the first surface of etch metal layers, wherein, subtracts thick by the logicalnot circuit visuals in thick copper circuit region and the etching of thin copper wire region.

In the embodiment of the present invention, by carrying out two-sided etching to metal level, produce thick copper circuit and thin copper wire on the metal layer.Said metal level can be specifically thicker copper foil layer or copper coin etc., and its thickness can more than 0.35 millimeter, or at 10OZ(ounce, 1 ounce about due to 35 microns) more than.In the present embodiment, assuming that the thickness of thick copper circuit and thin copper wire requires as 10OZ and 5OZ respectively, then can such as, according to the metal level of the measure same thickness of required thick copper circuit, the metal level of 10OZ thickness.

In some embodiments of the invention, before etching metal level, locating and machining hole is used for subsequent step location first on the metal layer, and the location hole processed at least comprises lamination location hole and inner figure location hole.Wherein, lamination location hole is used for applying in follow-up lamination or pressing step, and inner figure location hole then for applying in subsequent.Can utilize same rig in same once-through operation under same system controls, get out above-mentioned various location holes, thus ensure the accuracy of the position of each location hole.

In the present embodiment, by metal level needing the region making thick copper circuit be called thick copper circuit region, the region making thin copper wire is needed to be called thin copper wire region.In this step, first etch at the first surface of metal level, the region etched comprises in thick copper circuit region the logicalnot circuit visuals and whole thin copper wire region that do not need to form line pattern, the degree of depth of etching is determined according to the thickness of required thin copper wire, and the thickness sum of etch depth and thin copper wire equals the thickness of metal level.Such as, assuming that metal layer thickness is 10OZ, if the thickness requirement of thin copper wire is 5OZ, then the degree of depth of this etching is for being 5OZ; If the thickness requirement of thin copper wire is 4OZ, then the degree of depth of this etching is for being 6OZ.In general design, if be 60% to 40% of thick copper circuit thickness by the Thickness Design of thin copper wire, then etch depth is 40% to 60% of metal layer thickness.After this etching, the thin copper wire region of metal level is subtracted thick by etching, and the logicalnot circuit visuals in the thick copper circuit region of metal level is then formed groove by etching, begins to take shape line pattern in thick copper circuit region.

To the etching of metal level first surface in this step, the inner figure location hole made in advance can be adopted to position.In some embodiments of the invention, this step can comprise the etching of metal level first surface: arrange etchant resist at the first surface of described metal level, described etchant resist covers the line pattern part in the thick copper circuit region of described metal level first surface and covers second of described metal level, but exposes the logicalnot circuit visuals in thick copper circuit region and whole thin copper wire region; Etch described metal level first surface, etch depth is that metal layer thickness deducts the thickness needing the thin copper wire formed, and realizes subtracting of metal level thick, has etched the described etchant resist of rear removal.Wherein, the various location holes processed in advance can cover with etchant resist, prevent location hole from being etched expansion or distortion etc.Said etchant resist can be specifically dry film against corrosion.

In some embodiments of the present invention, in advance the thick measured zone of standard copper can be set at the fringe region of metal level, to control the degree of depth of this etching.The thick measured zone of said standard copper arranges and can be arranged on metal level adjacent edges, and its size can be 10*10mm.In a kind of execution mode, the thick measured zone of this standard copper is only the one piece of region delimited by the way, in etching process, the thick measured zone of this standard copper does not cover etchant resist, but surrounding's covering etchant resist in this region, then this region can be formed groove by etching, so, in the step of the first surface of described etch metal layers, by measuring the degree of depth of the groove that the thick measured zone etching of described standard copper is formed, the degree of depth etched can be controlled.In another kind of execution mode, the thick measured zone of this standard copper can be in advance by controlling the groove that the modes such as dark milling are processed to form, the thickness that the degree of depth of groove equals metal level deducts etch depth, namely, the thickness of bottom portion of groove equals etch depth, so, in the step of the first surface of described etch metal layers, can by judging whether the metal level of the bottom portion of groove of the thick measured zone of described standard copper is removed by etching, is confirmed whether the etch depth reaching one side etching plan; When bottom portion of groove is just clean by etching, stops etching, make the degree of depth that etch depth just in time reaches required.

1020, at the first surface pressing insulating barrier of described metal level.

In this step, subtracted thick first surface pressing insulating barrier etching of metal level, so that after pressing, the second face of metal level is etched.This pressing step can adopt the lamination location hole made in advance to position.Said lamination location hole can be specifically two rivet location holes.The insulating barrier of institute's pressing can be specifically prepreg.The part corresponding to thick copper circuit of the insulating barrier of institute's pressing can offer corresponding groove in advance, also can not offer groove.

In some embodiments of the present invention, more than one such as two one sides can be made in above-mentioned steps 110 and subtracted thick metal level by etching, in this step, after the first surface pressing insulating barrier of metal level, can also at another metal level of another side pressing of insulating barrier.The first surface of another metal level said has carried out etching subtracting thick process through above-mentioned steps 110 equally, subtracted thick region by etching and comprise the logicalnot circuit visuals in the thick copper circuit region of another metal level described and thin copper wire region, during pressing, the first surface of this another metal level is towards insulating barrier.

1030, second of etch metal layers, wherein, removes the etching of the logicalnot circuit visuals in thin copper wire region, forms thin copper wire; The etching of the logicalnot circuit visuals in thick copper circuit region is removed, forms thick copper circuit.

In this step, the second face of metal level is etched, thick copper circuit and thin copper wire are finally made.In this step, the inner figure location hole made in advance can be adopted to position, ensure aligning accuracy when etching with first surface.In this step, removed by the logicalnot circuit visuals etching in just thin copper wire region, the thin copper wire of final formation; By the etching of the logicalnot circuit visuals in thick copper circuit region being removed, finally form thick copper circuit.Second of this step etch metal layers can comprise: second at metal level arranges etchant resist, and described etchant resist covers the line pattern part in thin copper wire region and the line pattern part in thick copper circuit region; Metal level second face is etched, the logicalnot circuit visuals needing etching to remove is etched removal completely, has etched the described etchant resist of rear removal.Wherein, the various location holes processed in advance can cover with etchant resist, prevent location hole from being etched expansion or distortion etc.Said etchant resist can be specifically dry film against corrosion.

In some embodiments of the present invention, if the another side of insulating barrier also pressing have another metal level, then this step, equally the second face of another metal level described is etched, wherein, the etching of the logicalnot circuit visuals in the thin copper wire region of another metal level described is removed, forms thin copper wire; The etching of the logicalnot circuit visuals in the thick copper circuit region of another metal level described is removed, forms thick copper circuit.

Through above-mentioned steps, final obtained local heavy copper circuit board, obtained local heavy copper circuit board comprises an insulating barrier and a metal level or two metal levels, and wherein, each metal level comprises thick copper circuit and thin copper wire all simultaneously.

In some embodiments of the invention, second pressing lamina rara externa at metal level can also be comprised the steps:, and described lamina rara externa comprises outer insulation and outer layer metal layer; Described outer layer metal layer is processed as outer-layer circuit layer; Can also be included on outer-layer circuit layer and carry out the step such as welding resistance or gold-plated process.Especially, if obtained local heavy copper circuit board also comprises another metal level, then also can comprise: at second another lamina rara externa of pressing of another metal level described, another lamina rara externa described comprises outer insulation and outer layer metal layer; The outer layer metal layer of another lamina rara externa described is processed as outer-layer circuit layer; Can also be included on this outer-layer circuit layer and carry out the step such as welding resistance or gold-plated process.

Therefore, the embodiment of the invention discloses the manufacture method of a kind of local heavy copper circuit board, adopt and first at the first surface of metal level, the logicalnot circuit visuals in thick copper circuit region and the etching of thin copper wire region are subtracted thick, and at first surface pressing insulating barrier, then the technical scheme of Hou Tongxin road and thin copper wire is produced at the second facet etch, make local heavy copper circuit board, this technical scheme has following technique effect:

Bury copper technology relative to existing, reduce cost.Relative to the thick copper technology in existing local, because metal level second face is not subtracted thick by etching, maintain consistency of thickness, zones of different does not have height fall, thus, the problem of pressing from both sides film can be avoided when making thick copper and thin copper wire for second, the problem of excessive erosion or deficient corrosion when making thin copper wire, can be avoided; Further, do not carry out plating due to thick copper circuit region and thicken, during etching thick copper circuit, can avoid the problem of excessive erosion or deficient corrosion yet.

Please refer to Figure 11, the manufacture method of the another kind of local heavy copper circuit board of the embodiment of the present invention, can comprise:

1101, blanking thickness be the thick Copper Foil of 10OZ as above-mentioned metal level, and quantity can be two pieces;

1102, as figure 12 a shows, locating and machining hole 5101 on metal level 510, this location hole 5101 can comprise inner figure location hole and lamination location hole.Wherein, inner figure location hole is used for the line pattern contraposition in subsequent etch process, and lamination location hole is used for the interlayer alignment in follow-up bonding processes.Said inner figure location hole and lamination location hole, can utilize same rig to get out in same once-through operation, to ensure the accuracy of the position of each location hole under same system controls.

1103, as shown in Figure 12b, metal level 510 covers dry film 520 against corrosion, the line pattern part in the thick copper circuit region on second of described dry film 520 covering metal layer 510 against corrosion and first surface and the various location holes processed.Wherein, if be provided with the thick measured zone of standard copper, then the thick measured zone of this standard copper does not cover dry film against corrosion.

1104, as shown in fig. 12 c, carry out etching to the first surface of metal level 510 and subtract thick, etch depth is 5OZ, etches complete, removes dry film 520 against corrosion.Can find out from Figure 12 c, after this etching, the whole thin copper wire region of metal level 510 is subtracted thick in 5OZ by etching, the logicalnot circuit visuals in thick copper circuit region is also subtracted thick formation groove 5102 by etching, thus begins to take shape thick copper circuit in thick copper circuit region.

1105, as shown in figure 12d, pressing insulating barrier, comprise: at the two sides of insulating barrier 530 difference pressing the first metal layer 510A and the second metal level 510B, this the first metal layer 510A and the second metal level 510B is disposed through above-mentioned steps 1101-1104 all, respectively the controlling oneself to be eclipsed to carve and subtract thick first surface towards insulating barrier 530 of two metal levels during pressing, not by etching subtract thick second then outwardly.

1106, as Figure 12 e, second at metal level arranges dry film 540 against corrosion, this dry film 540 against corrosion covers the location hole on the first and second metal levels and needs to be formed the part of line pattern, comprises the line pattern part in thick copper circuit region and the line pattern part in thin copper wire region.

1107, as Figure 12 f; second face of metal level is etched; to do not removed by the etching of the region of dry film 540 covering protection against corrosion; finally on the first metal layer 510A, form thick copper circuit 5103A and thin copper wire 5104A, and form thick copper circuit 5103B and thin copper wire 5104B on the second metal level 510B.Wherein, the first metal layer 510A is formed formation thick copper circuit 5103B and thin copper wire 5104B on thick copper circuit layer 570, the second metal level 510B of thick copper circuit 5103A and thin copper wire 5104A composition first local and do not become the second local thick copper circuit layer 580.

1108, as Figure 12 g, at second difference pressing lamina rara externa of two metal levels, described lamina rara externa comprises outer insulation 550 and outer layer metal layer 560.Follow-uply also can make outer-layer circuit layer at outer layer metal layer 560.

So far, obtained required local heavy copper circuit board, this local heavy copper circuit board comprises two internal layer circuit layers and two outer-layer circuit layers, and wherein, each internal layer circuit layer has included thick copper circuit and thin copper wire.Said thick copper circuit can be used for bearing great current (such as more than the electric current of 50A), and said thin copper wire is for carrying normal signal.

In sum, the embodiment of the invention discloses the manufacture method of a kind of local heavy copper circuit board, adopt and first at the first surface of metal level, the logicalnot circuit visuals in thick copper circuit region and the etching of thin copper wire region are subtracted thick, and at first surface pressing insulating barrier, then the technical scheme of Hou Tongxin road and thin copper wire is produced at the second facet etch, make local heavy copper circuit board, this technical scheme has following technique effect:

Embodiment four

Please refer to Figure 13, a kind of local heavy copper circuit board of the embodiment of the present invention, this local heavy copper circuit board 1300 can comprise: N layer local thick copper circuit 1301, N be more than or equal to 1 positive integer, described local thick copper circuit layer 1301 comprises the thick copper circuit 1302 and thin copper wire 1303 that are positioned at same layer, and described thick copper circuit 1302 is concordant towards the surface outside described local heavy copper circuit board 130 with thin copper wire 1303.It is pointed out that the inner side of projection towards local heavy copper circuit board 1300 exceeding thin copper wire 1303 surface of thick copper circuit 1302.

In some embodiments of the invention, at least one deck in described N layer local thick copper circuit layer 1301 is positioned at the internal layer of described local heavy copper circuit board.

In some embodiments of the invention, N be more than or equal to 2 positive integer, 1 layer or 2 layers in described N layer local thick copper circuit layer 1301 top layer being positioned at described local heavy copper circuit board.

In some embodiments of the invention, N be more than or equal to 2 positive integer, 1 layer or 2 layers in described N layer local thick copper circuit layer 1301 top layer being positioned at described local heavy copper circuit board, and at least one deck in described N layer local thick copper circuit layer 1301 is positioned at the internal layer of described local heavy copper circuit board.

In sum, the embodiment of the invention discloses a kind of local heavy copper circuit board, this local heavy copper circuit board comprises at least one deck local thick copper circuit layer, described local thick copper circuit layer comprises the thick copper circuit and thin copper wire that are positioned at same layer, and described thick copper circuit is concordant towards the surface outside the heavy copper circuit board of described local with thin copper wire; Thus this kind of local heavy copper circuit board has following technique effect:

The method that traditional employing parcel plating and local etching technique make local heavy copper circuit board can only produce the circuit board that local thick copper circuit layer is positioned at internal layer usually; And the local thick copper circuit layer in the heavy copper circuit board of the present invention local can be positioned at random layer, thus, have and apply more widely.

The local heavy copper circuit board that traditional employing parcel plating and local etching technique make, the projection of the thick copper circuit of local thick copper circuit layer wherein toward the outer side, cause thick copper circuit not concordant with the outer surface of thin copper wire, then, when this local thick copper circuit layer is as top layer, make the surface irregularity of circuit board, Surface Machining process can not easily be carried out, such as welding resistance, gold-plated process etc. can be difficult to carry out because of surface irregularity, and the out-of-flatness on surface can affect the assembling of circuit board, easily causes space waste.

For ease of understanding the local heavy copper circuit board of the embodiment of the present invention further, below, respectively for three kinds of local heavy copper circuit boards that above-mentioned embodiment of the method one to three kind is obtained, be described in further details:

Embodiment five

Please refer to Fig. 6 b and Fig. 2 a to Fig. 6 a, the embodiment of the present invention provides a kind of local heavy copper circuit board, and this local heavy copper circuit board can comprise:

Be positioned at the first local thick copper circuit layer 310 and the second local thick copper circuit layer 320 of internal layer, wherein, first local thick copper circuit layer 310 comprises the first thick copper circuit 2103 and the first thin copper wire 2203 being positioned at same layer, and the first thick copper circuit 2103 and the first thin copper wire 2203 is concordant towards the surface outside the heavy copper circuit board of local; Second local thick copper circuit layer 320 comprises the second thick copper circuit 2104 and the second thin copper wire 2403 being positioned at same layer, and the second thick copper circuit 2104 and the second thin copper wire 2403 is concordant towards the surface outside the heavy copper circuit board of local.

Visible, the embodiment of the invention discloses a kind of local heavy copper circuit board comprising two-layer local thick copper circuit layer, and this two-layer local thick copper circuit layer is all positioned at internal layer.

The method that the local heavy copper circuit board that the embodiment of the present invention provides can adopt embodiment one to record obtains, and please refer to the record in embodiment one about this local heavy copper circuit board more detailed description.

But it should be noted that, adopt and quote the local heavy copper circuit board that embodiment one method can obtain and be not limited to said structure, the local heavy copper circuit board comprising any one or more internal layer local thick copper circuit layer all can adopt embodiment one method to obtain.

Embodiment six

Please refer to Fig. 9 h and Fig. 9 a-9g, the embodiment of the present invention provides a kind of local heavy copper circuit board, and this local heavy copper circuit board can comprise:

Middle multilayer laminate 440, lays respectively at the two-layer local thick copper circuit layer 450 on multilayer laminate 440 two sides, and wherein every one deck local thick copper circuit layer 450 includes the thick copper circuit 4102 and thin copper wire 4302 that are positioned at same layer; And be positioned at the thick copper circuit 4102 of same layer and the concordant towards the surface outside the heavy copper circuit board of local of thin copper wire 4302.

Visible, the embodiment of the invention discloses a kind of local heavy copper circuit board comprising two-layer local thick copper circuit layer, and this two-layer local thick copper circuit layer is all positioned at top layer.

In addition, lamination can also be continued in the outside of local thick copper circuit layer 450 outer, make local thick copper circuit layer 450 be positioned at the internal layer of local heavy copper circuit board.

The method that the local heavy copper circuit board that the embodiment of the present invention provides can adopt embodiment two to record obtains, and please refer to the record in embodiment two about this local heavy copper circuit board more detailed description.

But it should be noted that, adopt and quote the local heavy copper circuit board that embodiment two method can obtain and be not limited to said structure, the local heavy copper circuit board comprising any one or more local thick copper circuit layer (can be positioned at internal layer or top layer) all can adopt embodiment two method to obtain.

Embodiment seven

Please refer to Figure 12 f and Figure 12 a-12e, the embodiment of the present invention provides a kind of local heavy copper circuit board, and this local heavy copper circuit board can comprise:

Middle insulating barrier 530, be respectively formed at first local thick copper circuit layer 570 and the second local thick copper circuit layer 580 on insulating barrier 530 two sides, wherein, first local thick copper circuit layer 570 comprises thick copper circuit 5103A and thin copper wire 5104A, and the second local thick copper circuit layer 580 comprises thick copper circuit 5103B and thin copper wire 5104B; Further, thick copper circuit 5103A is concordant with the surface toward the outer side of thin copper wire 5104A, and the bossing exceeding thin copper wire 5104A inner surface of thick copper circuit 5103A is towards inner side; Thick copper circuit 5103B is concordant with the surface toward the outer side of thin copper wire 5104B, and thick copper circuit 5103B exceeds the bossing of thin copper wire 5104B inner surface towards inner side.

In addition, lamination skin can also be continued in the outside of the first local thick copper circuit layer 570 and the second local thick copper circuit layer 580 respectively, make the first local thick copper circuit layer 570 and the second local thick copper circuit layer 580 be positioned at the internal layer of local heavy copper circuit board.

The method that the local heavy copper circuit board that the embodiment of the present invention provides can adopt embodiment three to record obtains, and please refer to the record in embodiment three about this local heavy copper circuit board more detailed description.

But it should be noted that, adopt and quote the local heavy copper circuit board that embodiment three method can obtain and be not limited to said structure, the local heavy copper circuit board comprising any one or more local thick copper circuit layer (can be positioned at internal layer or top layer) all can adopt embodiment tripartite method to obtain.In sum, the embodiment of the invention discloses a kind of local heavy copper circuit board, this local heavy copper circuit board comprises at least one deck local thick copper circuit layer, described local thick copper circuit layer comprises the thick copper circuit and thin copper wire that are positioned at same layer, and described thick copper circuit is concordant towards the surface outside the heavy copper circuit board of described local with thin copper wire; Thus this kind of local heavy copper circuit board has following technique effect:

In the above-described embodiments, the description of each embodiment is all emphasized particularly on different fields, in certain embodiment, there is no the part described in detail, can see the associated description of other embodiment.

It should be noted that, for aforesaid each embodiment of the method, in order to simple description, therefore it is all expressed as a series of combination of actions, but those skilled in the art should know, the present invention is not by the restriction of described sequence of movement, because according to the present invention, some step can adopt other order or carry out simultaneously.Secondly, those skilled in the art also should know, the embodiment described in specification all belongs to preferred embodiment, and involved action and module might not be that the present invention is necessary.

Above the manufacture method of a kind of local heavy copper circuit board that the embodiment of the present invention provides is described in detail with local heavy copper circuit board, but the explanation of above embodiment just understands method of the present invention and core concept thereof for helping, and should not be construed as limitation of the present invention.Those skilled in the art, according to thought of the present invention, in the technical scope that the present invention discloses, the change that can expect easily or replacement, all should be encompassed within protection scope of the present invention.

Claims

1. a manufacture method for local heavy copper circuit board, is characterized in that, comprising:

Thick copper base and ground floor pressing plate and the first insulating bond are provided, the first surface of described thick copper base has the first thick copper circuit, the first surface of described ground floor pressing plate has the first thin copper wire, described first insulating bond offers the first groove mated with described first thick copper circuit;

Described first insulating bond and described ground floor pressing plate are pressed together on the first surface of described thick copper base, make described first thick copper circuit be supported on the insulating barrier of the first surface at the first thin copper wire place in described ground floor pressing plate by described first groove, obtained first thin copper wire and the first thick copper circuit are at the local heavy copper circuit board of same layer.

2. method according to claim 1, is characterized in that, described in provide thick copper base to comprise:

Thick copper base covers etchant resist; By exposing and the described etchant resist that develops, by the first surface of the first thick copper circuit Graphic transitions to described thick copper base; Described thick copper base is etched, produces described first thick copper circuit.

3. method according to claim 1, is characterized in that, described in provide ground floor pressing plate to comprise:

Ground floor pressing plate covers etchant resist; By exposing and the described etchant resist that develops, by the first surface of the first thin copper wire Graphic transitions to described ground floor pressing plate; Described ground floor pressing plate is etched, produces described first thin copper wire.

4. method according to claim 1, is characterized in that, described to described thick copper base, and described first insulating bond and described ground floor pressing plate also comprise before carrying out pressing:

Described thick copper base produces the first alignment target;

The second alignment target produced by described ground floor pressing plate;

Accordingly, to described thick copper base, described first insulating bond and described ground floor pressing plate carry out in the step of pressing, adopt described first target and described second target to position.

5. method according to claim 4, is characterized in that:

Described first target is the through hole on described thick copper base;

Described second target is the through hole on described ground floor pressing plate.

6., according to described method arbitrary in claim 1 to 5, it is characterized in that, second of described thick copper base also has the second thick copper circuit, and described method also comprises:

There is provided second layer pressing plate and the second insulating bond, the first surface of described second layer pressing plate has the second thin copper wire, described second insulating bond offers the second groove mated with described second thick copper circuit;

Described second insulating bond and second layer pressing plate are pressed together on second of described thick copper base, described second thick copper circuit is supported by described second groove on the insulating barrier of the first surface at the second thin copper wire place in described second layer pressing plate, thus makes the second thick copper circuit of the described local heavy copper circuit board obtained and the second thin copper wire at same layer.

7. method according to claim 6, is characterized in that, second of described ground floor pressing plate also has tertiary circuit, and second of described second layer pressing plate also has the 4th circuit.

8. method according to claim 6, is characterized in that, also comprises:

At second pressing the 3rd insulating bond and first outer layer metal layer of described ground floor pressing plate;

At second pressing the 4th insulating bond and second outer layer metal layer of described second layer pressing plate;

Outer-layer circuit is made respectively on described first outer layer metal layer and the second outer layer metal layer.

9. method according to claim 6, is characterized in that, described second of described second insulating bond and second layer pressing plate being pressed together on described thick copper base also comprises before:

Described second layer pressing plate is produced the 3rd alignment target;

Accordingly, described second insulating bond and second layer pressing plate are pressed together in the step of second of described thick copper base, adopt described 3rd target to position.

10. method according to claim 9, is characterized in that:

Described 3rd target is the through hole on described second layer pressing plate.

11. 1 kinds of local heavy copper circuit boards, it is characterized in that, comprise: N layer local thick copper circuit layer, N be more than or equal to 1 positive integer, described local thick copper circuit layer comprises thick copper circuit and thin copper wire, and described thick copper circuit is concordant towards the surface outside the heavy copper circuit board of described local with thin copper wire.

12. local according to claim 11 heavy copper circuit boards, is characterized in that, at least one deck in the thick copper circuit layer of described N layer local is positioned at the internal layer of described local heavy copper circuit board.

13. local according to claim 11 heavy copper circuit boards, is characterized in that, N be more than or equal to 2 positive integer, 1 layer or 2 layers in the thick copper circuit layer of the described N layer local top layer being positioned at described local heavy copper circuit board.

14. local according to claim 11 heavy copper circuit boards, it is characterized in that, N be more than or equal to 2 positive integer, 1 layer or 2 layers in the thick copper circuit layer of the described N layer local top layer being positioned at described local heavy copper circuit board, and at least one deck in the thick copper circuit layer of described N layer local is positioned at the internal layer of described local heavy copper circuit board.