CN111893532A - Electroplating method of circuit board boss - Google Patents
Electroplating method of circuit board boss Download PDFInfo
- Publication number
- CN111893532A CN111893532A CN202010722775.5A CN202010722775A CN111893532A CN 111893532 A CN111893532 A CN 111893532A CN 202010722775 A CN202010722775 A CN 202010722775A CN 111893532 A CN111893532 A CN 111893532A
- Authority
- CN
- China
- Prior art keywords
- electroplating
- boss
- washing
- circuit board
- steps
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses an electroplating method of a circuit board boss, which sequentially comprises the following steps: the method comprises the steps of loading a board, carrying out pretreatment, electroplating copper on a boss on a circuit board, carrying out secondary washing (III), carrying out acid washing (II), electroplating tin on the boss, carrying out secondary washing (IV) and loading the board, wherein the electroplating copper adopts a primary and secondary rectifier motor to carry out electroplating, and the rated current of the primary and secondary rectifier motor is 600A/50A. The invention improves the efficiency and quality of boss electroplating, and the electroplating effect of the boss is good; compared with the conventional motor, the primary and secondary rectifier motor has more stable output current, the electro-coppering does not need to be carried out for multiple times, the flow is reduced, the efficiency is improved, the cost is reduced, the binding force between the boss and the copper layer is enhanced through pretreatment, and the electroplating effect of the boss is improved.
Description
Technical Field
The invention relates to the field of circuit boards, in particular to an electroplating method for a circuit board boss.
Background
Among a plurality of circuit board products, a PCB product with local thick copper in a BGA boss shape is provided, the PCB product is generally provided with a boss which is 1.5-2.5mil higher than the board surface, the boss generally occupies less than 1.5% of the whole board area, a dry film with the thickness of more than 65um is required during manufacturing, edges are fixed, the current of the whole flying target is too small due to too small plated area during electroplating of the boss, fluctuation of a conventionally used rectifier during working is unstable, the fluctuation is more obvious particularly when the current is close to full load or the current is close to the lower limit, and under the condition that the plated area and the plating parameters are fixed, the problem that the plated convex copper has mushroom head phenomenon or insufficient copper plating is caused due to the fluctuation of the current.
Current is one of key factors in the electroplating process of a boss, the electroplating effect is directly influenced by unstable current, the problem that the copper thickness exceeds the standard or is insufficient is solved, the fluctuation of small current within 50A output of a rectifier used at present can have errors of +/-10%, the boss electroplating quality is abnormal due to unstable current output, and the monitoring difficulty in the electroplating process is high. In summary, the boss electroplating of the prior circuit board has the following problems: (1) the output current of the common rectifier fluctuates, and the fluctuation is larger particularly at the lowest limit of rated current output, so that the accuracy of current output is not enough, and the electroplating quality is influenced; (2) mushroom head-shaped burning plates or copper thin conditions appear after electroplating; (3) electroplating needs to be completed for many times, the efficiency is low, and the problem of plate mixing is easy to occur.
Disclosure of Invention
The invention provides an electroplating method for a circuit board boss, which aims to solve the problems of poor electroplating effect and low efficiency of the existing circuit board boss.
The electroplating method of the circuit board boss sequentially comprises the following steps: the electroplating method comprises the steps of loading a board, carrying out pretreatment, electroplating copper on a boss on a circuit board, carrying out secondary washing (III), carrying out acid washing (II), electroplating tin on the boss, carrying out secondary washing (IV) and loading the board, wherein the electroplating copper adopts a primary and secondary rectifier motor to carry out electroplating, the rated current of the primary and secondary rectifier motor is 600A/50A, and the electroplating efficiency and quality are improved.
Optionally, the preprocessing sequentially includes the following steps: oil removal, secondary water washing (I), micro-etching, secondary water washing (II) and acid washing (I), and the electroplating effect is improved.
Optionally, the washing time of the second-stage washing (third) and the second-stage washing (fourth) is 3-5 minutes, and impurities such as copper scraps, tin scraps and the like on the surface of the circuit board are removed.
Optionally, sulfuric acid with the mass percentage concentration of 4-12% is adopted in the second acid washing, the acid washing time is 1-2 minutes, the moisture of the circuit board is reduced, and the wettability of the surface of the circuit board is kept.
Optionally, the second-stage water washing (III), the acid washing (II) and the second-stage water washing (IV) are treated in a soaking mode, and the effect is good.
Optionally, the oil removal is performed by using an acidic oil removal agent, so that the oil removal effect is good, and the subsequent process treatment is facilitated.
Optionally, the washing time of the second-stage washing (I) and the second-stage washing (II) is 3-5 minutes, and the effect is good.
Optionally, sulfuric acid with the mass percentage concentration of 4-12% is adopted in the first acid washing step, the acid washing time is 1-2 minutes, the moisture of the circuit board is reduced, and the electroplating quality is improved.
Optionally, the second-stage water washing (I), the second-stage water washing (II) and the acid washing (I) are treated in a soaking mode, and the effect is good.
Compared with the prior art, the invention has the beneficial effects that: the invention provides an electroplating method of a circuit board boss, which improves the efficiency and quality of boss electroplating and has good boss electroplating effect; compared with the conventional motor, the primary and secondary rectifier motor has more stable output current, the electro-coppering does not need to be carried out for multiple times, the flow is reduced, the efficiency is improved, the cost is reduced, the binding force between the boss and the copper layer is enhanced through pretreatment, and the electroplating effect of the boss is improved.
Detailed Description
In order to explain the technical solution of the present invention in detail, the technical solution of the embodiment of the present invention will be clearly and completely described below. It is to be understood that the embodiments described are only a few embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the described embodiments of the invention without any inventive step, are within the scope of protection of the invention.
The electroplating method of the circuit board boss sequentially comprises the following steps:
plate loading and pretreatment: the pretreatment sequentially comprises the following steps: the method comprises the following steps of (1) oil removal, secondary water washing (I), microetching and secondary water washing (II) acid washing (I), wherein oil stains, stains and surface oxides on the surface of the circuit board can be removed by the oil removal, and the electroplating quality can be improved; in some embodiments, the oil removal is performed by using an acidic oil removal agent, the washing time of the second-stage washing (first) and the second-stage washing (second) is 3-5 minutes, the acid washing (first) is performed by using sulfuric acid with the mass percentage concentration of 4-12%, the acid washing time is 1-2 minutes, and the second-stage washing (first), the second-stage washing (second) and the acid washing (first) are performed by soaking. The micro-etching can coarsen the surface of the circuit board, improve the binding force between copper and the surface of the boss, the acid washing (I) can reduce the water content on the surface of the circuit board after the step of secondary water washing (II), and the circuit board keeps certain wettability, thereby being beneficial to improving the electroplating effect.
Electroplating copper on the lug boss on the circuit board: the electroplating copper adopts the primary and secondary rectifier motors to carry out electroplating, the rated current of the primary and secondary rectifier motors is 600A/50A, the primary and secondary rectifier motors have the advantages of stable output current, adjustable current, high current output precision and the like, the problem of excessively thick electroplating or excessively thin electroplating is avoided, the condition of needing multiple times of electroplating is avoided, and the production efficiency and the electroplating quality are improved.
The current of primary and secondary rectifier motor is adjustable, can output heavy current, also can output stable undercurrent, when output current is undercurrent (within 50A), can automatic identification electric current change for the undercurrent mode that rated current is 50A, the output current of undercurrent is stable, does not have the phenomenon that the electric current falls or the electric current is too big, has reduced the flow that needs to carry out many times copper plating, has improved the quality and the efficiency of electroplating.
Second-stage water washing (III): in some embodiments, the second-stage water washing (third) is carried out for 3-5 minutes, and the second-stage water washing (third) is carried out in a soaking mode.
Acid washing (II): in some embodiments, the second step of pickling adopts 4-12% sulfuric acid by mass percentage, the pickling time is 1-2 minutes, and the second step of pickling is carried out in a soaking mode; and the acid washing step (II) can reduce the moisture of the circuit board, avoid the dilution effect of the subsequent tin plating on the tin liquid and ensure the tin plating quality.
Electroplating tin on the boss: a tin layer is formed on the copper surface of the boss.
Second-stage water washing (fourth) and lower plate: in some embodiments, the second-stage water washing (fourth) is carried out for 3-5 minutes, and the second-stage water washing (fourth) is carried out in a soaking mode.
The invention provides an electroplating method of a circuit board boss, which improves the efficiency and quality of boss electroplating and has good boss electroplating effect; compared with the conventional motor, the primary and secondary rectifier motor has more stable output current, the electro-coppering does not need to be carried out for multiple times, the flow is reduced, the efficiency is improved, the cost is reduced, the binding force between the boss and the copper layer is enhanced through pretreatment, and the electroplating effect of the boss is improved.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that changes may be made in the embodiments and/or equivalents thereof without departing from the spirit and scope of the invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention shall fall within the protection scope of the present invention.
Claims (9)
1. The electroplating method of the circuit board boss is characterized in that: the method sequentially comprises the following steps: the method comprises the steps of loading a board, carrying out pretreatment, electroplating copper on a boss on a circuit board, carrying out secondary washing (III), carrying out acid washing (II), electroplating tin on the boss, carrying out secondary washing (IV) and loading the board, wherein the electroplating copper adopts a primary and secondary rectifier motor to carry out electroplating, and the rated current of the primary and secondary rectifier motor is 600A/50A.
2. The electroplating method of the circuit board boss as claimed in claim 1, wherein the electroplating method comprises the following steps: the pretreatment sequentially comprises the following steps: oil removal, secondary water washing (I), micro-etching, secondary water washing (II) and acid washing (I).
3. The electroplating method of the circuit board boss as claimed in claim 1, wherein the electroplating method comprises the following steps: and the washing time of the second-stage washing (III) and the second-stage washing (IV) is 3-5 minutes.
4. The electroplating method of the circuit board boss as claimed in claim 1, wherein the electroplating method comprises the following steps: and the second step of acid washing adopts sulfuric acid with the mass percentage concentration of 4-12%, and the acid washing time is 1-2 minutes.
5. The electroplating method of the circuit board boss as claimed in claim 1, wherein the electroplating method comprises the following steps: and the second-stage water washing (III), the acid washing (II) and the second-stage water washing (IV) are treated in a soaking mode.
6. The electroplating method of the circuit board boss as claimed in claim 2, wherein the electroplating method comprises the following steps: the oil removal is carried out by adopting an acidic oil removal agent.
7. The electroplating method of the circuit board boss as claimed in claim 2, wherein the electroplating method comprises the following steps: and the washing time of the second-stage washing (I) and the second-stage washing (II) is 3-5 minutes.
8. The method for electroplating the boss of the circuit board according to the claim 2, wherein the method comprises the following steps: the first acid washing step is to use sulfuric acid with the mass percentage concentration of 4-12%, and the acid washing time is 1-2 minutes.
9. The method for electroplating the boss of the circuit board according to the claim 2, wherein the method comprises the following steps: and the secondary water washing (I), the secondary water washing (II) and the acid washing (I) are treated in a soaking mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010722775.5A CN111893532A (en) | 2020-07-24 | 2020-07-24 | Electroplating method of circuit board boss |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010722775.5A CN111893532A (en) | 2020-07-24 | 2020-07-24 | Electroplating method of circuit board boss |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111893532A true CN111893532A (en) | 2020-11-06 |
Family
ID=73190093
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010722775.5A Pending CN111893532A (en) | 2020-07-24 | 2020-07-24 | Electroplating method of circuit board boss |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111893532A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103849915A (en) * | 2012-12-06 | 2014-06-11 | 北大方正集团有限公司 | Electroplating device and method of plating copper in via hole of PCB (Printed Circuit Board) |
| CN104404605A (en) * | 2014-12-03 | 2015-03-11 | 东莞市智和胜电器有限公司 | Electroplating device with two output rectifiers |
| CN104717850A (en) * | 2013-12-12 | 2015-06-17 | 深南电路有限公司 | Method for manufacturing local-thick-copper circuit board and local-thick-copper circuit board |
| TWM537336U (en) * | 2016-08-22 | 2017-02-21 | Allied Circuit Co Ltd | Electroplating power supply equipment of printed circuit board and real-time monitoring system thereof |
| CN207638577U (en) * | 2017-12-15 | 2018-07-20 | 鹤山安栢电路版厂有限公司 | Automatic nickel gold production line commutation system |
| CN108315808A (en) * | 2018-05-09 | 2018-07-24 | 东莞市威力固电路板设备有限公司 | A kind of electroplating production facility |
| CN111432569A (en) * | 2020-03-22 | 2020-07-17 | 深圳市飞翔电路有限公司 | Manufacturing method of gold finger with locally plated copper and thickened surface |
| CN111954390A (en) * | 2020-08-17 | 2020-11-17 | 龙岩金时裕电子有限公司 | Method for manufacturing thick copper circuit board |
-
2020
- 2020-07-24 CN CN202010722775.5A patent/CN111893532A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103849915A (en) * | 2012-12-06 | 2014-06-11 | 北大方正集团有限公司 | Electroplating device and method of plating copper in via hole of PCB (Printed Circuit Board) |
| CN104717850A (en) * | 2013-12-12 | 2015-06-17 | 深南电路有限公司 | Method for manufacturing local-thick-copper circuit board and local-thick-copper circuit board |
| CN104404605A (en) * | 2014-12-03 | 2015-03-11 | 东莞市智和胜电器有限公司 | Electroplating device with two output rectifiers |
| TWM537336U (en) * | 2016-08-22 | 2017-02-21 | Allied Circuit Co Ltd | Electroplating power supply equipment of printed circuit board and real-time monitoring system thereof |
| CN207638577U (en) * | 2017-12-15 | 2018-07-20 | 鹤山安栢电路版厂有限公司 | Automatic nickel gold production line commutation system |
| CN108315808A (en) * | 2018-05-09 | 2018-07-24 | 东莞市威力固电路板设备有限公司 | A kind of electroplating production facility |
| CN111432569A (en) * | 2020-03-22 | 2020-07-17 | 深圳市飞翔电路有限公司 | Manufacturing method of gold finger with locally plated copper and thickened surface |
| CN111954390A (en) * | 2020-08-17 | 2020-11-17 | 龙岩金时裕电子有限公司 | Method for manufacturing thick copper circuit board |
Non-Patent Citations (1)
| Title |
|---|
| 丁明军: "《PCB制图与制版实训》", 31 March 2018, 浙江科学技术出版社 * |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20140342178A1 (en) | Electrolytic copper foil, and circuit board and flexible circuit board using the electrolytic copper foil | |
| CN103052270A (en) | Method for plating copper and tin on metal circuit board through pattern plating | |
| KR102412968B1 (en) | Electro Sn plated steel sheet | |
| CN108300872A (en) | The devices and methods therefor of tin is recycled for circuit board | |
| CN109208050B (en) | Surface treatment method for improving corrosion resistance of electrolytic copper foil | |
| CN101389442A (en) | Improved alloy and anode for use in the electrowinning of metals | |
| CN109457272A (en) | The stabilizer and electrolyte of alkali etching regeneration cathode copper | |
| CN111893532A (en) | Electroplating method of circuit board boss | |
| CN104451796A (en) | Surface treatment process for high-frequency microwave printed board | |
| CN101388350B (en) | Tinning method for SMD stamp-mounting-paper diode | |
| CN101945544A (en) | Method for manufacturing flexible circuit board | |
| CN102312265A (en) | Preparation method for anode oxidation film of aluminum or aluminum alloy | |
| CN110359051B (en) | Method for recycling waste etching liquid of circuit board | |
| CN113564684B (en) | Electrolytic stripping agent and application thereof | |
| Jordan | Electrodeposition of Tin-Lead Alloys | |
| CN110724980B (en) | Local chromium plating method for stainless steel bolt | |
| CN111472027B (en) | Electrotinning additive and preparation method and use method thereof | |
| CN109518233B (en) | Conductive solution for preventing miniature electronic component from being stuck on chip and preparation method thereof | |
| CN208430213U (en) | Device for circuit board recycling tin | |
| CN111690933A (en) | Deplating solution and deplating method for unqualified cadmium-plated layer | |
| CN115125593B (en) | Application of chelating agent in PCB preparation | |
| CN1259743C (en) | Surface treatment method for positive current collector of alkaline zinc-manganese battery with inner surface provided with cog structure | |
| CN108998817B (en) | Additive for priming nickel plating solution and application thereof | |
| CN110117800B (en) | Electrotinning treatment process | |
| KR102618832B1 (en) | Copper-tin alloy layer forming method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20201106 |