CN109518233B - Conductive solution for preventing miniature electronic component from being stuck on chip and preparation method thereof - Google Patents
Conductive solution for preventing miniature electronic component from being stuck on chip and preparation method thereof Download PDFInfo
- Publication number
- CN109518233B CN109518233B CN201811428925.0A CN201811428925A CN109518233B CN 109518233 B CN109518233 B CN 109518233B CN 201811428925 A CN201811428925 A CN 201811428925A CN 109518233 B CN109518233 B CN 109518233B
- Authority
- CN
- China
- Prior art keywords
- parts
- acid
- conductive
- conductive solution
- stirring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/30—Electroplating: Baths therefor from solutions of tin
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
The embodiment of the invention discloses a conductive solution for preventing a miniature electronic component from being stuck and a preparation method thereof, wherein the conductive solution comprises the following components in parts by weight: 9-30 parts of strong conductive acid, 2.5-15 parts of weak conductive acid and 55-88.5 parts of pure water, the conductive solution has strong conductivity, can effectively prevent miniature electronic components from sticking during electroplating, ensures the reliable functionality of the electronic components, and has the advantages of simple preparation method, low raw material cost, economy and high efficiency.
Description
Technical Field
The embodiment of the invention relates to the technical field of electronic electroplating, in particular to a conductive solution for preventing a miniature electronic component from being stuck and a preparation method thereof.
Background
At present, under the trend of miniaturization development and on the premise of maintaining reliable functionality, a metal tin layer is still required to be electroplated on a product in an electrochemical mode to maintain solderability so that a subsequent process can be smoothly welded on a circuit board, however, because the volume and the surface area of a miniaturized electronic product are small, the conductive solution is easy to stick together during electroplating, can not be separated and cause scrap, and generally needs to be introduced during electroplating, and if the conductivity of the conductive solution is too strong, a large proportion of sticking of the miniature electronic product during electroplating can be caused, therefore, the invention develops the conductive solution with strong conductivity without producing adhesive sheets, and can effectively solve the problem that the miniature electronic products are scrapped in large batch during electroplating.
Disclosure of Invention
Therefore, the embodiment of the invention provides a conductive solution for preventing a miniature electronic component from being stuck and a preparation method thereof, which are used for solving the problem that the existing miniature electronic product is easy to be adhered and scrapped during electroplating.
In order to achieve the above object, an embodiment of the present invention provides the following:
in a first aspect of embodiments of the present invention, a conductive solution for preventing a microelectronic component from being bonded is provided, where the conductive solution includes the following components in parts by weight: 9-30 parts of strong conductive acid, 2.5-15 parts of weak conductive acid and 55-88.5 parts of pure water.
Preferably, the strongly conductive acid includes sulfuric acid, methanesulfonic acid, and sulfamic acid.
Preferably, the weight parts of the sulfuric acid, the methanesulfonic acid and the sulfamic acid in the conductive solution are 3-10 parts, 3-10 parts and 3-10 parts respectively.
Preferably, the weak conductive acid includes citric acid, acrylic acid and boric acid.
Preferably, the weight parts of the citric acid, the acrylic acid and the boric acid in the conductive solution are 1-5 parts, 1-5 parts and 0.5-5 parts.
In a second aspect of embodiments of the present invention, there is provided a method for preparing a conductive solution for preventing a micro electronic component from being attached to a chip, the method comprising the steps of:
step 1), weighing 3-10 parts of strong-conductivity sulfuric acid, 3-10 parts of methanesulfonic acid and 3-10 parts of sulfamic acid, 1-5 parts of weak-conductivity citric acid, 1-5 parts of acrylic acid and 0.5-5 parts of boric acid, and 55-88.5 parts of pure water;
step 2), adding half of the total amount of pure water into a stirring tank and starting stirring, wherein the stirring speed is 10-20 r/min;
step 3), sequentially adding citric acid, boric acid, sulfamic acid and acrylic acid;
step 4), slowly adding methanesulfonic acid;
step 5), slowly adding sulfuric acid;
step 6), slowly stirring for 0.5-1.5h at the stirring speed of 10-20 r/min;
step 7), adding the residual pure water and continuously stirring for 1.5-2.5 h.
Preferably, in the step 1), the stirring time is 1 h.
Preferably, in the step 7), the stirring time is 2 h.
The conductive solution for preventing the micro electronic component from being stuck and the preparation method thereof provided by the embodiment of the invention have the following advantages: through the proper matching of the strong conductive acid component and the weak conductive acid component, the conductive solution which has strong conductivity and can effectively prevent the miniature electronic component from sticking during electroplating is developed, the reliable functionality of the electronic component is ensured, the preparation method is simple, the raw material cost is low, and the method is economical and efficient.
Detailed Description
The present invention is described in terms of particular embodiments, other advantages and features of the invention will become apparent to those skilled in the art from the following disclosure, and it is to be understood that the described embodiments are merely exemplary of the invention and that it is not intended to limit the invention to the particular embodiments disclosed. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1
The preparation method of the conductive solution for preventing the micro electronic component from being stuck comprises the following steps:
step 1), weighing 5 parts of sulfuric acid, 5 parts of methanesulfonic acid, 5 parts of sulfamic acid, 1 part of citric acid, 1 part of acrylic acid, 1 part of boric acid and 82 parts of pure water;
step 2), adding 41 parts of pure water into a stirring tank and starting stirring, wherein the stirring speed is 10-20 r/min;
step 3), sequentially adding citric acid, boric acid, sulfamic acid and acrylic acid;
step 4), slowly adding methanesulfonic acid;
step 5), slowly adding sulfuric acid;
step 6), slowly stirring for 1h at the stirring speed of 10-20 r/min;
step 7), adding the rest pure water and continuously stirring for 2 h.
Example 2
The preparation method of the conductive solution for preventing the micro electronic component from being stuck comprises the following steps:
step 1), weighing 3 parts of sulfuric acid, 3 parts of methanesulfonic acid, 3 parts of sulfamic acid, 3 parts of citric acid, 3 parts of acrylic acid, 3 parts of boric acid and 82 parts of pure water;
step 2), adding 41 parts of pure water into a stirring tank and starting stirring, wherein the stirring speed is 10-20 r/min;
step 3), sequentially adding citric acid, boric acid, sulfamic acid and acrylic acid;
step 4), slowly adding methanesulfonic acid;
step 5), slowly adding sulfuric acid;
step 6), slowly stirring for 1h at the stirring speed of 10-20 r/min;
step 7), adding the rest pure water and continuously stirring for 2 h.
Example 3
The preparation method of the conductive solution for preventing the micro electronic component from being stuck comprises the following steps:
step 1), weighing 10 parts of sulfuric acid, 10 parts of methanesulfonic acid, 10 parts of sulfamic acid, 1 part of citric acid, 1 part of acrylic acid, 1 part of boric acid and 67 parts of pure water;
step 2), adding 33.5 parts of pure water into the stirring tank and starting stirring, wherein the stirring speed is 10-20 r/min;
step 3), sequentially adding citric acid, boric acid, sulfamic acid and acrylic acid;
step 4), slowly adding methanesulfonic acid;
step 5), slowly adding sulfuric acid;
step 6), slowly stirring for 1h at the stirring speed of 10-20 r/min;
step 7), adding the rest pure water and continuously stirring for 2 h.
Example 4
The preparation method of the conductive solution for preventing the micro electronic component from being stuck comprises the following steps:
step 1), weighing 5 parts of sulfuric acid, 5 parts of methanesulfonic acid, 5 parts of sulfamic acid, 5 parts of citric acid, 5 parts of acrylic acid, 5 parts of boric acid and 70 parts of pure water;
step 2), adding 35 parts of pure water into a stirring tank and starting stirring, wherein the stirring speed is 10-20 r/min;
step 3), sequentially adding citric acid, boric acid, sulfamic acid and acrylic acid;
step 4), slowly adding methanesulfonic acid;
step 5), slowly adding sulfuric acid;
step 6), slowly stirring for 1h at the stirring speed of 10-20 r/min;
step 7), adding the rest pure water and continuously stirring for 2 h.
Examples of the experiments
The test method is as follows: preparing tin methane sulfonate (Sn) with the same concentration2+12 g/L) and a tin plating additive, wherein 4% by volume of tin methane sulfonate and 5% by volume of the tin plating additive are respectively mixed with 30% of the conductive solution obtained in the embodiments 1-4 of the invention to prepare an electroplating solution, the electroplating solution is prepared by the same method with a commercially available common conductive solution as a comparative example, and a certain amount of three mainstream miniaturized passive components, namely an 0402-specification chip resistor, an 0402-specification multilayer capacitor and an 0402-specification chip inductor, are respectively barrel-plated in the prepared electroplating solution for 90min, the weight of the inseparable product and the total weight of the product are weighed to calculate the percentage of the adhesion rate, and the percentage of the adhesion rate is × 100% of the inseparable product weight/the total weight of the product.
The percent bond test data results are given in the following table:
| test example | Chip resistor (0402) | Multilayer capacitor (0402) | Chip inductor (0402) |
| Example 1 | 0 | 0 | 0 |
| Example 2 | 0 | 0 | 0 |
| Example 3 | 0 | 0 | 0 |
| Example 4 | 0 | 0 | 0 |
| Comparative example | 0.5％-3％ | 0.3％-1.3％ | 0.3％-1.0％ |
The results show that: the electroplating solutions prepared by the conductive solutions provided by the embodiments 1-4 of the invention have no electronic component sticking condition, have excellent effect, and can effectively solve the sticking problem of the miniaturized passive component during electroplating.
Although the invention has been described in detail above with reference to a general description and specific examples, it will be apparent to one skilled in the art that modifications or improvements may be made thereto based on the invention. Accordingly, such modifications and improvements are intended to be within the scope of the invention as claimed.
Claims (4)
1. The conductive solution for preventing the miniature electronic component from being stuck is characterized by comprising the following components in parts by weight: 9-30 parts of strong conductive acid, 2.5-15 parts of weak conductive acid and 55-88.5 parts of pure water, wherein the strong conductive acid comprises sulfuric acid, methanesulfonic acid and sulfamic acid, the weight parts of the sulfuric acid, the methanesulfonic acid and the sulfamic acid in the conductive solution are respectively 3-10 parts, 3-10 parts and 3-10 parts, the weak conductive acid comprises citric acid, acrylic acid and boric acid, and the weight parts of the citric acid, the acrylic acid and the boric acid in the conductive solution are respectively 1-5 parts, 1-5 parts and 0.5-5 parts.
2. A preparation method of a conductive solution for preventing a miniature electronic component from being stuck is characterized by comprising the following steps:
step 1), weighing 3-10 parts of strong-conductivity sulfuric acid, 3-10 parts of methanesulfonic acid and 3-10 parts of sulfamic acid, 1-5 parts of weak-conductivity citric acid, 1-5 parts of acrylic acid and 0.5-5 parts of boric acid, and 55-88.5 parts of pure water;
step 2), adding half of the total amount of pure water into a stirring tank and starting stirring, wherein the stirring speed is 10-20 r/min;
step 3), sequentially adding citric acid, boric acid, sulfamic acid and acrylic acid;
step 4), slowly adding methanesulfonic acid;
step 5), slowly adding sulfuric acid;
step 6), slowly stirring for 0.5-1.5h at the stirring speed of 10-20 r/min;
step 7), adding the residual pure water and continuously stirring for 1.5-2.5 h.
3. The method for preparing the conductive solution for preventing the micro electronic component from being stuck according to claim 2, wherein in the step 6), the stirring time is 1 h.
4. The method for preparing the conductive solution for preventing the micro electronic component from being stuck according to claim 2, wherein in the step 7), the stirring time is 2 hours.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811428925.0A CN109518233B (en) | 2018-11-27 | 2018-11-27 | Conductive solution for preventing miniature electronic component from being stuck on chip and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811428925.0A CN109518233B (en) | 2018-11-27 | 2018-11-27 | Conductive solution for preventing miniature electronic component from being stuck on chip and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109518233A CN109518233A (en) | 2019-03-26 |
| CN109518233B true CN109518233B (en) | 2020-07-14 |
Family
ID=65793502
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811428925.0A Active CN109518233B (en) | 2018-11-27 | 2018-11-27 | Conductive solution for preventing miniature electronic component from being stuck on chip and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109518233B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113430592A (en) * | 2021-06-30 | 2021-09-24 | 广东德浩化工新材料有限公司 | Neutral tin plating stabilizer and preparation method thereof |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03146689A (en) * | 1989-10-31 | 1991-06-21 | Nec Kansai Ltd | Solder and tin plating solution |
| JP4632186B2 (en) * | 2007-08-01 | 2011-02-16 | 太陽化学工業株式会社 | Tin electrolytic plating solution for electronic parts, tin electrolytic plating method for electronic parts and tin electrolytic plated electronic parts |
| JP5583894B2 (en) * | 2008-06-12 | 2014-09-03 | ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． | Electrotin plating solution and electrotin plating method |
| CN104213165B (en) * | 2013-05-31 | 2019-03-01 | 谢君广 | Mount the vibration of ultrasonic wave electro-plating method and electroplanting device of chip electronic component |
| CN103757669B (en) * | 2014-01-21 | 2016-05-25 | 广东光华科技股份有限公司 | Electroplate tin liquor |
-
2018
- 2018-11-27 CN CN201811428925.0A patent/CN109518233B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN109518233A (en) | 2019-03-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101906630B (en) | Black surface treatment process of electrolytic copper foil | |
| CN101962790B (en) | Electrolyte composition for half bright acid tinning | |
| CN112226790B (en) | Production method of ultrathin high-strength electronic copper foil | |
| CN101935836B (en) | Surface treatment process of reddened copper foil for high-grade FR-4 copper-clad plate | |
| CN100370062C (en) | Composition for plating pure tin and electronic component employing the same | |
| JP4812365B2 (en) | Tin electroplating solution and tin electroplating method | |
| CN101935856A (en) | Back face treatment process of electrolytic copper foil | |
| CN104694939A (en) | Surface treatment technology for ultralow-surface-roughness copper foil | |
| CN112981481B (en) | Ultrathin copper foil and preparation method thereof | |
| CN109518233B (en) | Conductive solution for preventing miniature electronic component from being stuck on chip and preparation method thereof | |
| CN110254025B (en) | Copper-clad plate production treatment process | |
| CN113584537B (en) | Ultra-thin copper foil with resin layer and extremely low roughness and manufacturing method thereof | |
| CN109594107A (en) | A kind of electrotinning additive and preparation method thereof | |
| CN103966606A (en) | Copper reduction etching liquid for printed circuit boards | |
| CN104451796A (en) | Surface treatment process for high-frequency microwave printed board | |
| CN103266336B (en) | A kind of thick copper circuit board copper face thickening method | |
| CN103498175B (en) | The electro-plating method of lead frame | |
| CN112839436A (en) | Electrolytic copper foil for high-frequency high-speed printed circuit board and preparation method thereof | |
| CN108950614B (en) | VCP high-efficiency copper plating brightener | |
| CN102196677B (en) | PCB (Printed Circuit Board) double-sided jack machining process | |
| CN111118501A (en) | Tin surface protective agent and preparation method thereof | |
| CN105200479A (en) | Additive, electroplating liquid and method for roughening rolled copper foil | |
| CN208128629U (en) | FPC based on high frequency FRCC Yu FCCL single sided board | |
| CN101388350B (en) | Tinning method for SMD stamp-mounting-paper diode | |
| CN104479579A (en) | Ultrathin PI cover film and preparation method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |