CN113430592A - Neutral tin plating stabilizer and preparation method thereof - Google Patents
Neutral tin plating stabilizer and preparation method thereof Download PDFInfo
- Publication number
- CN113430592A CN113430592A CN202110743787.0A CN202110743787A CN113430592A CN 113430592 A CN113430592 A CN 113430592A CN 202110743787 A CN202110743787 A CN 202110743787A CN 113430592 A CN113430592 A CN 113430592A
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- CN
- China
- Prior art keywords
- parts
- tin plating
- stirring
- boric acid
- sodium hydroxide
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/30—Electroplating: Baths therefor from solutions of tin
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
Description
Test example | Change in pH value (pH) | Divalent tin (Sn)2+)g/L | Tetravalent tin (Sn)4+)g/L |
Example 1 | +0.1 | -0.1 | +0.1 |
Example 2 | +0.1 | -0.1 | +0.1 |
Example 3 | +0.2 | -0.0 | +0.1 |
Example 4 | +0.1 | -0.1 | +0.1 |
Example 5 | +0.1 | -0.05 | +0.05 |
Example 6 | +0.05 | -0.1 | +0.1 |
Comparative example | +0.7 | -0.8 | +1.0 |
Claims (8)
Priority Applications (1)
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CN202110743787.0A CN113430592A (en) | 2021-06-30 | 2021-06-30 | Neutral tin plating stabilizer and preparation method thereof |
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CN202110743787.0A CN113430592A (en) | 2021-06-30 | 2021-06-30 | Neutral tin plating stabilizer and preparation method thereof |
Publications (1)
Publication Number | Publication Date |
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CN113430592A true CN113430592A (en) | 2021-09-24 |
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CN202110743787.0A Pending CN113430592A (en) | 2021-06-30 | 2021-06-30 | Neutral tin plating stabilizer and preparation method thereof |
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CN (1) | CN113430592A (en) |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1837414A (en) * | 2005-03-24 | 2006-09-27 | 广东风华高新科技集团有限公司 | Addictive for tin-electroplating solution of tin methane sulphonate series |
WO2006117920A1 (en) * | 2005-04-28 | 2006-11-09 | Meltex Inc. | Tin plating solution, plating method using the tin plating solution, method for preparing tin plating solution and chip parts having tin plating layer formed by using the tin plating solution |
CN103160870A (en) * | 2011-12-18 | 2013-06-19 | 顾向军 | Tinning solution stabilizer |
CN104593835A (en) * | 2015-02-04 | 2015-05-06 | 广东羚光新材料股份有限公司 | Neutral tin plating solution used in electroplating terminal electrodes of chip component |
CN109518233A (en) * | 2018-11-27 | 2019-03-26 | 东莞美坚化工原料有限公司 | A kind of conducting solution and preparation method thereof preventing miniature electronic component bonding die |
CN110004434A (en) * | 2019-04-02 | 2019-07-12 | 电子科技大学 | Chemical wicking plating solution and plating method for inhibiting printed circuit board tin one of the main divisions of the male role in traditional opera long |
CN112095127A (en) * | 2020-09-29 | 2020-12-18 | 南通麦特隆新材料科技有限公司 | Neutral tin additive and preparation method and application thereof |
CN113930812A (en) * | 2021-11-15 | 2022-01-14 | 广东羚光新材料股份有限公司 | Tin plating solution and tin plating method for chip electronic component |
-
2021
- 2021-06-30 CN CN202110743787.0A patent/CN113430592A/en active Pending
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1837414A (en) * | 2005-03-24 | 2006-09-27 | 广东风华高新科技集团有限公司 | Addictive for tin-electroplating solution of tin methane sulphonate series |
WO2006117920A1 (en) * | 2005-04-28 | 2006-11-09 | Meltex Inc. | Tin plating solution, plating method using the tin plating solution, method for preparing tin plating solution and chip parts having tin plating layer formed by using the tin plating solution |
CN103160870A (en) * | 2011-12-18 | 2013-06-19 | 顾向军 | Tinning solution stabilizer |
CN104593835A (en) * | 2015-02-04 | 2015-05-06 | 广东羚光新材料股份有限公司 | Neutral tin plating solution used in electroplating terminal electrodes of chip component |
CN109518233A (en) * | 2018-11-27 | 2019-03-26 | 东莞美坚化工原料有限公司 | A kind of conducting solution and preparation method thereof preventing miniature electronic component bonding die |
CN110004434A (en) * | 2019-04-02 | 2019-07-12 | 电子科技大学 | Chemical wicking plating solution and plating method for inhibiting printed circuit board tin one of the main divisions of the male role in traditional opera long |
CN112095127A (en) * | 2020-09-29 | 2020-12-18 | 南通麦特隆新材料科技有限公司 | Neutral tin additive and preparation method and application thereof |
CN113930812A (en) * | 2021-11-15 | 2022-01-14 | 广东羚光新材料股份有限公司 | Tin plating solution and tin plating method for chip electronic component |
Non-Patent Citations (1)
Title |
---|
张允诚 等,: "《电镀手册 第4版》", 31 December 2011, 国防工业出版社, * |
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Legal Events
Date | Code | Title | Description |
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PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB03 | Change of inventor or designer information | ||
CB03 | Change of inventor or designer information |
Inventor after: Zhu Zhihao Inventor after: Xie Haowei Inventor before: Zhu Zhihao Inventor before: Xie Haowei Inventor before: Qiu Hongyan |
|
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20211011 Address after: 528447 8 / F, building B, No. 82, Yingfu Second Road, Gangkou Town, Zhongshan City, Guangdong Province Applicant after: Zhongshan kangdisiwei Technology Co.,Ltd. Address before: 526000 shop 9, building 24, donghuju, Xinghu Avenue, Duanzhou District, Zhaoqing City, Guangdong Province Applicant before: Guangdong Dehao new chemical material Co.,Ltd. |
|
RJ01 | Rejection of invention patent application after publication | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20210924 |