CN113430592A - Neutral tin plating stabilizer and preparation method thereof - Google Patents

Neutral tin plating stabilizer and preparation method thereof Download PDF

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Publication number
CN113430592A
CN113430592A CN202110743787.0A CN202110743787A CN113430592A CN 113430592 A CN113430592 A CN 113430592A CN 202110743787 A CN202110743787 A CN 202110743787A CN 113430592 A CN113430592 A CN 113430592A
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China
Prior art keywords
parts
tin plating
stirring
boric acid
sodium hydroxide
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CN202110743787.0A
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Chinese (zh)
Inventor
朱志豪
谢浩威
邱红艳
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Zhongshan kangdisiwei Technology Co.,Ltd.
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Guangdong Dehao New Chemical Material Co ltd
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    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/30Electroplating: Baths therefor from solutions of tin
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00Electroplating characterised by the article coated

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

The invention discloses a neutral tin plating stabilizer and a preparation method thereof, and particularly relates to the field of electronic electroplating. The neutral tin plating stabilizer comprises sodium gluconate, nitrilotriacetic acid, potassium sodium tartrate, ethylene diamine tetraacetic acid tetrasodium, boric acid, sodium hydroxide and pure water. The method comprises the steps of stirring pure water, adding sodium hydroxide to obtain a sodium hydroxide solution, and adding boric acid to obtain a boric acid solution; and adding sodium gluconate, nitrilotriacetic acid, potassium sodium tartrate and tetrasodium ethylene diamine tetraacetate into the boric acid solution, and continuously stirring to obtain the neutral tin plating stabilizer. The neutral tin plating stabilizer prepared by the method can stabilize the pH value on one hand; on the other hand, the oxidation of the divalent tin can be greatly reduced, and the effect is excellent. The method for preparing the neutral tin plating stabilizer is simple and is easy for industrial mass production.

Description

Neutral tin plating stabilizer and preparation method thereof
Technical Field
The invention relates to the field of electronic electroplating, in particular to a neutral tin plating stabilizer and a preparation method thereof.
Background
Currently, in miniaturized KOJI (Ko) products and before the products are held with reliable functionality, the products still need to be electrochemically plated with a tin layer to maintain solderability for the subsequent process to be soldered to the circuit board, however, miniaturized products such as chip-resistor, multi-layer capacitor and chip-inductor must be plated with a neutral tin plating system to prevent the products from sticking together during plating, and stabilizers are carried on the shoulders of the system to stabilize pH and reduce oxidation of divalent tin, while most stabilizers used in the market are sodium gluconate, although sodium gluconate can reduce oxidation of divalent tin, the pH value of the system cannot be stabilized, so that the pH value is frequently regulated and controlled to cause instability of the whole system.
Disclosure of Invention
Therefore, the invention provides a neutral tin plating stabilizer and a preparation method thereof, which aim to solve the problem that the prior art can only simply reduce the oxidation of divalent tin and can not stabilize the pH value of a system.
In order to achieve the above purpose, the invention provides the following technical scheme:
according to one aspect of the invention, a neutral tin plating stabilizer is provided, and comprises sodium gluconate, nitrilotriacetic acid, potassium sodium tartrate, ethylenediaminetetraacetic acid tetrasodium salt, boric acid, sodium hydroxide and pure water.
Further, the stabilizer is prepared from the following raw materials in parts by weight: 1-5 parts of sodium gluconate, 2-8 parts of nitrilotriacetic acid, 2-10 parts of potassium sodium tartrate, 1-10 parts of ethylene diamine tetraacetic acid tetrasodium salt, 2-8 parts of boric acid, 3-10 parts of sodium hydroxide and 49-89 parts of pure water.
According to another aspect of the invention, there is provided a method for preparing the neutral tin plating stabilizer, which comprises the following steps:
step one, adding pure water into a stirring tank and starting stirring;
step two, adding sodium hydroxide into the pure water obtained in the step one while stirring, and stirring and dissolving to obtain a sodium hydroxide solution;
adding boric acid into the sodium hydroxide solution, and continuously stirring to obtain a boric acid solution;
and step four, sequentially adding sodium gluconate, nitrilotriacetic acid, potassium sodium tartrate and tetrasodium ethylene diamine tetraacetate into the boric acid solution, and continuously stirring to obtain the neutral tin plating stabilizer.
Further, the stirring speed of the first step is 40-60 r/min.
Further, in the third step, the stirring time is 1 h.
Further, the stirring speed of the third step is 40-60 r/min.
Further, in the fourth step, the stirring time is 6 hours.
Further, the stirring speed of the fourth step is 40-60 r/min.
The invention has the following advantages:
the neutral tin plating stabilizer prepared by the method can stabilize the pH value on one hand; on the other hand, the oxidation of the divalent tin can be greatly reduced, and the effect is excellent. The method for preparing the neutral tin plating stabilizer is simple and is easy for industrial mass production.
Detailed Description
The present invention is described in terms of particular embodiments, other advantages and features of the invention will become apparent to those skilled in the art from the following disclosure, and it is to be understood that the described embodiments are merely exemplary of the invention and that it is not intended to limit the invention to the particular embodiments disclosed. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1 neutral tin plating stabilizer and preparation method thereof
The embodiment provides a preparation method of a neutral tin plating stabilizer, which comprises the following steps:
step 1), respectively weighing 2 parts of sodium gluconate, 3 parts of nitrilotriacetic acid, 5 parts of potassium sodium tartrate, 2 parts of tetrasodium ethylenediamine tetraacetate, 5 parts of sodium hydroxide, 4 parts of boric acid and 78 parts of pure water;
step 2), adding 78 parts of pure water into the stirring tank and starting stirring, wherein the stirring speed is 40-60 r/min;
step 3), slowly adding 5 parts of sodium hydroxide to obtain a sodium hydroxide solution;
step 4), slowly adding 4 parts of boric acid into the sodium hydroxide solution; slowly stirring for 1h at the stirring speed of 40-60r/min to obtain a boric acid solution;
step 5), sequentially adding 2 parts of sodium gluconate, 3 parts of nitrilotriacetic acid, 5 parts of potassium sodium tartrate and 2 parts of tetrasodium ethylene diamine tetraacetate into the boric acid solution; and continuously stirring for 6 hours after adding, wherein the stirring speed is 40-60r/min, and thus obtaining the neutral tin plating stabilizer.
Example 2 neutral tin plating stabilizer and preparation method thereof
The embodiment provides a preparation method of a neutral tin plating stabilizer, which comprises the following steps:
step 1), respectively weighing 3 parts of sodium gluconate, 3 parts of nitrilotriacetic acid, 4 parts of potassium sodium tartrate, 3 parts of tetrasodium ethylenediamine tetraacetate, 5 parts of sodium hydroxide, 4 parts of boric acid and 78 parts of pure water;
step 2), adding 78 parts of pure water into the stirring tank and starting stirring, wherein the stirring speed is 40-60 r/min;
step 3), slowly adding 5 parts of sodium hydroxide to obtain a sodium hydroxide solution;
step 4), slowly adding 4 parts of boric acid into the sodium hydroxide solution; slowly stirring for 1h at the stirring speed of 40-60r/min to obtain a boric acid solution;
step 5), adding 3 parts of sodium gluconate, 3 parts of nitrilotriacetic acid, 4 parts of potassium sodium tartrate and 3 parts of tetrasodium ethylene diamine tetraacetate into the boric acid solution in sequence; and continuously stirring for 6 hours after adding, wherein the stirring speed is 40-60r/min, and thus obtaining the neutral tin plating stabilizer.
Example 3 neutral tin plating stabilizer and preparation method thereof
The embodiment provides a preparation method of a neutral tin plating stabilizer, which comprises the following steps:
step 1), respectively weighing 3 parts of sodium gluconate, 4 parts of nitrilotriacetic acid, 4 parts of potassium sodium tartrate, 4 parts of tetrasodium ethylenediamine tetraacetate, 5 parts of sodium hydroxide, 2 parts of boric acid and 78 parts of pure water;
step 2), adding 78 parts of pure water into the stirring tank and starting stirring, wherein the stirring speed is 40-60 r/min;
step 3), slowly adding 5 parts of sodium hydroxide to obtain a sodium hydroxide solution;
step 4), slowly adding 2 parts of boric acid into the sodium hydroxide solution; slowly stirring for 1h at the stirring speed of 40-60r/min to obtain a boric acid solution;
step 5), adding 3 parts of sodium gluconate, 4 parts of nitrilotriacetic acid, 4 parts of potassium sodium tartrate and 4 parts of tetrasodium ethylene diamine tetraacetate into the boric acid solution in sequence; and continuously stirring for 6 hours after adding, wherein the stirring speed is 40-60r/min, and thus obtaining the neutral tin plating stabilizer.
Example 4 neutral tin plating stabilizer and preparation method thereof
The embodiment provides a preparation method of a neutral tin plating stabilizer, which comprises the following steps:
step 1), respectively weighing 1 part of sodium gluconate, 2 parts of nitrilotriacetic acid, 5 parts of potassium sodium tartrate, 4 parts of tetrasodium ethylenediamine tetraacetate, 5 parts of sodium hydroxide, 5 parts of boric acid and 78 parts of pure water;
step 2), adding 78 parts of pure water into the stirring tank and starting stirring, wherein the stirring speed is 40-60 r/min;
step 3), slowly adding 5 parts of sodium hydroxide to obtain a sodium hydroxide solution;
step 4), slowly adding 5 parts of boric acid into the sodium hydroxide solution; slowly stirring for 1h at the stirring speed of 40-60r/min to obtain a boric acid solution;
step 5), sequentially adding 1 part of sodium gluconate, 2 parts of nitrilotriacetic acid, 5 parts of potassium sodium tartrate and 4 parts of tetrasodium ethylene diamine tetraacetate into the boric acid solution; and continuously stirring for 6 hours after adding, wherein the stirring speed is 40-60r/min, and thus obtaining the neutral tin plating stabilizer.
Example 5 neutral tin plating stabilizer and preparation method thereof
The embodiment provides a preparation method of a neutral tin plating stabilizer, which comprises the following steps:
step 1), respectively weighing 1 part of sodium gluconate, 2 parts of nitrilotriacetic acid, 10 parts of potassium sodium tartrate, 10 parts of tetrasodium ethylenediamine tetraacetate, 3 parts of sodium hydroxide, 2 parts of boric acid and 72 parts of pure water;
step 2), adding 72 parts of pure water into a stirring tank and starting stirring, wherein the stirring speed is 40-60 r/min;
step 3), slowly adding 3 parts of sodium hydroxide to obtain a sodium hydroxide solution;
step 4), slowly adding 2 parts of boric acid into the sodium hydroxide solution; slowly stirring for 1h at the stirring speed of 40-60r/min to obtain a boric acid solution;
step 5), sequentially adding 1 part of sodium gluconate, 2 parts of nitrilotriacetic acid, 10 parts of potassium sodium tartrate and 10 parts of tetrasodium ethylene diamine tetraacetate into the boric acid solution; and continuously stirring for 6 hours after adding, wherein the stirring speed is 40-60r/min, and thus obtaining the neutral tin plating stabilizer.
Example 6 neutral tin plating stabilizer and preparation method thereof
The embodiment provides a preparation method of a neutral tin plating stabilizer, which comprises the following steps:
step 1), respectively taking 5 parts of sodium gluconate, 8 parts of nitrilotriacetic acid, 2 parts of potassium sodium tartrate, 1 part of tetrasodium ethylenediamine tetraacetate, 10 parts of sodium hydroxide, 8 parts of boric acid and 66 parts of pure water;
step 2), adding 66 parts of pure water into the stirring tank and starting stirring, wherein the stirring speed is 40-60 r/min;
step 3), slowly adding 10 parts of sodium hydroxide to obtain a sodium hydroxide solution;
step 4), slowly adding 8 parts of boric acid into the sodium hydroxide solution; slowly stirring for 1h at the stirring speed of 40-60r/min to obtain a boric acid solution;
step 5), adding 5 parts of sodium gluconate, 8 parts of nitrilotriacetic acid, 2 parts of potassium sodium tartrate and 1 part of tetrasodium ethylene diamine tetraacetate into the boric acid solution in sequence; and continuously stirring for 6 hours after adding, wherein the stirring speed is 40-60r/min, and thus obtaining the neutral tin plating stabilizer.
Examples of the experiments
The test method is as follows: preparing tin methane sulfonate (Sn) with the same concentration2+12g/L) and a tin plating additive, wherein a plating solution is prepared by mixing 4% by volume of tin methanesulfonate and 5% by volume of the tin plating additive with 10% of the novel stabilizer for neutral tin plating obtained in examples 1 to 4 of the present invention, and a commercially available common conductive solution is used as a comparative example, the pH is adjusted to 3.5(pH 3.5), and a certain amount of three main-flow miniaturized passive components are prepared: respectively barrel-plating 0402 chip resistor, 0402 chip capacitor and 0402 chip inductor in prepared electroplating solution at 0.5ASD for 200 hr, andchecking for pH change, divalent tin (Sn)2+) Change and tetravalent tin (Sn)4 +) And (4) changing. The results are shown in Table 1.
TABLE 1 variation of pH, stannous and stannic in examples 1-4 and comparative examples
Test example Change in pH value (pH) Divalent tin (Sn)2+)g/L Tetravalent tin (Sn)4+)g/L
Example 1 +0.1 -0.1 +0.1
Example 2 +0.1 -0.1 +0.1
Example 3 +0.2 -0.0 +0.1
Example 4 +0.1 -0.1 +0.1
Example 5 +0.1 -0.05 +0.05
Example 6 +0.05 -0.1 +0.1
Comparative example +0.7 -0.8 +1.0
As shown in Table 1, the novel stabilizer composition for neutral tin plating provided by the invention can stabilize the pH value and greatly reduce the oxidation of divalent tin, and has excellent effect.
Although the invention has been described in detail above with reference to a general description and specific examples, it will be apparent to one skilled in the art that modifications or improvements may be made thereto based on the invention. Accordingly, such modifications and improvements are intended to be within the scope of the invention as claimed.

Claims (8)

1. The neutral tin plating stabilizer is characterized by comprising sodium gluconate, nitrilotriacetic acid, potassium sodium tartrate, ethylenediaminetetraacetic acid tetrasodium salt, boric acid, sodium hydroxide and pure water.
2. The neutral tin plating stabilizer of claim 1, which is prepared from the following raw materials in parts by weight: 1-5 parts of sodium gluconate, 2-8 parts of nitrilotriacetic acid, 2-10 parts of potassium sodium tartrate, 1-10 parts of ethylene diamine tetraacetic acid tetrasodium salt, 2-8 parts of boric acid, 3-10 parts of sodium hydroxide and 49-89 parts of pure water.
3. A method of preparing a neutral tin plating stabilizer according to claim 1 or 2, characterized in that the method comprises the steps of:
step one, adding pure water into a stirring tank and starting stirring;
step two, adding sodium hydroxide into the pure water obtained in the step one while stirring, and stirring and dissolving to obtain a sodium hydroxide solution;
adding boric acid into the sodium hydroxide solution, and continuously stirring to obtain a boric acid solution;
and step four, sequentially adding sodium gluconate, nitrilotriacetic acid, potassium sodium tartrate and tetrasodium ethylene diamine tetraacetate into the boric acid solution, and continuously stirring to obtain the neutral tin plating stabilizer.
4. The method of claim 3, wherein the first step is performed at a stirring speed of 40-60 r/min.
5. The method of claim 3, wherein the stirring time in step three is 1 hour.
6. The method for preparing a neutral tin plating stabilizer according to claim 3, wherein the stirring speed in the third step is 40 to 60 r/min.
7. The method of claim 3, wherein the stirring time in step four is 6 hours.
8. The method of preparing a neutral tin plating stabilizer according to claim 3, wherein the stirring speed in the fourth step is 40 to 60 r/min.
CN202110743787.0A 2021-06-30 2021-06-30 Neutral tin plating stabilizer and preparation method thereof Pending CN113430592A (en)

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Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1837414A (en) * 2005-03-24 2006-09-27 广东风华高新科技集团有限公司 Addictive for tin-electroplating solution of tin methane sulphonate series
WO2006117920A1 (en) * 2005-04-28 2006-11-09 Meltex Inc. Tin plating solution, plating method using the tin plating solution, method for preparing tin plating solution and chip parts having tin plating layer formed by using the tin plating solution
CN103160870A (en) * 2011-12-18 2013-06-19 顾向军 Tinning solution stabilizer
CN104593835A (en) * 2015-02-04 2015-05-06 广东羚光新材料股份有限公司 Neutral tin plating solution used in electroplating terminal electrodes of chip component
CN109518233A (en) * 2018-11-27 2019-03-26 东莞美坚化工原料有限公司 A kind of conducting solution and preparation method thereof preventing miniature electronic component bonding die
CN110004434A (en) * 2019-04-02 2019-07-12 电子科技大学 Chemical wicking plating solution and plating method for inhibiting printed circuit board tin one of the main divisions of the male role in traditional opera long
CN112095127A (en) * 2020-09-29 2020-12-18 南通麦特隆新材料科技有限公司 Neutral tin additive and preparation method and application thereof
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WO2006117920A1 (en) * 2005-04-28 2006-11-09 Meltex Inc. Tin plating solution, plating method using the tin plating solution, method for preparing tin plating solution and chip parts having tin plating layer formed by using the tin plating solution
CN103160870A (en) * 2011-12-18 2013-06-19 顾向军 Tinning solution stabilizer
CN104593835A (en) * 2015-02-04 2015-05-06 广东羚光新材料股份有限公司 Neutral tin plating solution used in electroplating terminal electrodes of chip component
CN109518233A (en) * 2018-11-27 2019-03-26 东莞美坚化工原料有限公司 A kind of conducting solution and preparation method thereof preventing miniature electronic component bonding die
CN110004434A (en) * 2019-04-02 2019-07-12 电子科技大学 Chemical wicking plating solution and plating method for inhibiting printed circuit board tin one of the main divisions of the male role in traditional opera long
CN112095127A (en) * 2020-09-29 2020-12-18 南通麦特隆新材料科技有限公司 Neutral tin additive and preparation method and application thereof
CN113930812A (en) * 2021-11-15 2022-01-14 广东羚光新材料股份有限公司 Tin plating solution and tin plating method for chip electronic component

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Inventor after: Zhu Zhihao

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Address before: 526000 shop 9, building 24, donghuju, Xinghu Avenue, Duanzhou District, Zhaoqing City, Guangdong Province

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Application publication date: 20210924