JP2000049423A - Flexible substrate - Google Patents
Flexible substrateInfo
- Publication number
- JP2000049423A JP2000049423A JP10215047A JP21504798A JP2000049423A JP 2000049423 A JP2000049423 A JP 2000049423A JP 10215047 A JP10215047 A JP 10215047A JP 21504798 A JP21504798 A JP 21504798A JP 2000049423 A JP2000049423 A JP 2000049423A
- Authority
- JP
- Japan
- Prior art keywords
- flexible substrate
- thermoplastic resin
- resin film
- metal
- flexible
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明はフレキシブル基板の
技術分野にかかり、特に、２枚のフレキシブル基板が張
り合わされたフレキシブル基板に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to the technical field of flexible substrates, and more particularly, to a flexible substrate in which two flexible substrates are bonded.
【０００２】[0002]
【従来の技術】従来より、所望の回路パターンを印刷し
たフレキシブル基板は多用されており、近年では、使用
される箇所の形状に応じた種々の形状のフレキシブル基
板が求められている。2. Description of the Related Art Conventionally, flexible substrates on which a desired circuit pattern has been printed have been widely used, and in recent years, flexible substrates of various shapes corresponding to the shapes of locations to be used have been demanded.
【０００３】図４(ａ)は、Ｔ字形形状のフレキシブル基
板１２２を、長方形形状の原反１２０から裁断する場合
の配置状態を示しており、同図(ａ)では、６枚のフレキ
シブル基板１２２を得ることが可能になっている。FIG. 4A shows an arrangement in which a T-shaped flexible substrate 122 is cut from a rectangular substrate 120. In FIG. 4A, six flexible substrates 122 are shown. It is possible to obtain.
【０００４】しかし、上記のような異形のフレキシブル
基板１２２を裁断する場合には、原反１２２の無駄な部
分が多くなってしまう。[0004] However, when the flexible substrate 122 having the above-mentioned irregular shape is cut, the useless portion of the raw material 122 is increased.
【０００５】そこで従来技術でも対策が採られており、
複数枚のフレキシブル基板を張り合わせ、１枚のフレキ
シブル基板を作製している。図４(ｂ)は、同図(ｃ)のよ
うに、上記Ｔ字形形状のフレキシブル基板１２３を長方
形形状の２枚のフレキシブル基板１２３a、１２３bを貼
り合わせて形成する場合に、各フレキシブル基板１２３
a、１２３bを１枚の原反１２１から裁断する場合の配置
状態を示している。Therefore, measures have been taken in the prior art,
A plurality of flexible substrates are laminated to produce one flexible substrate. FIG. 4B shows a case where the T-shaped flexible substrate 123 is formed by bonding two rectangular flexible substrates 123 a and 123 b as shown in FIG. 123
shows the arrangement in the case of cutting the a, 123 b from a single original sheet 121.
【０００６】この図４(ｂ)の場合、各フレキシブル基板
１２３a、１２３bはそれぞれ８枚ずつ取れるから、それ
らを貼り合わせるとＴ字形形状のフレキシブル基板１２
３が８枚得られる。従って、Ｔ字形形状のフレキシブル
基板１２２を直接裁断する場合よりも多数枚数が得られ
る。[0006] Figure 4 In the case of (b), because taken one by eight each of the flexible substrate 123 a, 123 b is a flexible substrate 12 thereof be bonded when T-shape
8 are obtained. Therefore, a larger number can be obtained than when the T-shaped flexible substrate 122 is directly cut.
【０００７】複数のフレキシブル基板を貼り合わせて１
枚のフレキシブル基板を形成する場合、各フレキシブル
基板を機械的に接続するだけでは足りず、各フレキシブ
ル基板に形成されている金属配線同士を電気的に接続さ
せる必要がある。[0007] By bonding a plurality of flexible substrates,
When forming a plurality of flexible substrates, it is not sufficient to simply connect each flexible substrate mechanically, and it is necessary to electrically connect metal wirings formed on each flexible substrate.
【０００８】２枚のフレキシブル基板を貼り合わせる場
合の、張り合わせ方法を説明すると、先ず、図３(ａ)に
示すように、ポリイミドフィルム等の樹脂フィルム１１
１上に金属配線１１２が形成されたフレキシブル基板１
０２を用意する。[0008] A method of bonding two flexible substrates together will be described. First, as shown in FIG. 3A, a resin film 11 such as a polyimide film is bonded.
Flexible substrate 1 on which metal wiring 112 is formed
02 is prepared.
【０００９】このフレキシブル基板１０２の金属配線１
１２は、少なくとも一部分が露出している必要があり、
２枚のフレキシブル基板１０２a、１０２bの金属配線１
１２ a、１１２bが露出した部分を互いに向き合わせる
(同図(ｂ))。The metal wiring 1 of this flexible substrate 102
12 must be at least partially exposed,
Two flexible substrates 102a, 102bMetal wiring 1
12 a, 112bFacing exposed parts to each other
(FIG. 2B).
【００１０】露出した金属配線１１２a、１１２bの表面
には、予め半田メッキ被膜１１３a、１１３bを形成して
おき、各金属配線１１２a、１１２bの半田メッキ被膜１
１３a、１１３b同士を密着させ、加圧しながら加熱し、
溶融させると、１層の半田被膜１１４が形成される。従
って、２枚のフレキシブル基板１０２a、１０２bは、金
属配線１１２a、１１２b及び半田被膜１１４を介して接
続され、機械的、電気的に接続され、異形のフレキシブ
ル基板１０３が得られる(同図(ｃ))。[0010] exposed metal wire 112 a, 112 b surface of the previously formed solder plating film 113 a, 113 b, solder plating film 1 of the metal wire 112 a, 112 b
13 a, 113 b each other are brought into close contact with, and heated under pressure,
Upon melting, a single layer of solder coating 114 is formed. Thus, the two flexible substrates 102 a, 102 b are connected via the metal wire 112 a, 112 b and solder coating 114, mechanical, are electrically connected, profile of the flexible substrate 103 is obtained (same Figure (c).
【００１１】しかしながら、近年では、フレキシブル基
板に多数本の金属配線を形成する必要から、金属配線の
微細化と狭ピッチ化が進められており、そのため、フレ
キシブル基板を接合させる部分に金属配線の間隔が狭く
なってきた。However, in recent years, since it is necessary to form a large number of metal wirings on a flexible substrate, miniaturization and narrowing of the metal wirings have been promoted. Is getting smaller.
【００１２】上記のように半田被膜１１３a、１１３bを
溶融させる場合、半田が飛び散るとブリッジ１１６がで
きてしまい、金属配線１１２間が短絡してしまう。金属
配線１１２間の間隔が狭くなると、短絡が生じやすくな
り、その結果、歩留まりが低下してしまうという問題が
ある。[0012] When melting the solder coating 113 a, 113 b as described above, solder will be able splattering the bridge 116, between the metal wiring 112 is short-circuited. When the interval between the metal wirings 112 is narrow, a short circuit is likely to occur, and as a result, there is a problem that the yield is reduced.
【００１３】[0013]
【発明が解決しようとする課題】本発明は上記従来技術
の不都合を解決するために創作されたものであり、その
目的は、高歩留まりでフレキシブル基板を張り合わせら
れる技術を提供することにある。SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned disadvantages of the prior art, and an object of the present invention is to provide a technique capable of bonding a flexible substrate with a high yield.
【００１４】[0014]
【課題を解決するための手段】上記課題を解決するため
に、請求項１記載の発明は、フレキシブル基板であっ
て、非熱可塑性樹脂フィルムと、前記非熱可塑性樹脂フ
ィルム上に形成された熱可塑性樹脂フィルムと、前記熱
可塑性樹脂フィルム表面に形成された金属配線とを有す
ることを特徴とする。According to a first aspect of the present invention, there is provided a flexible substrate, comprising: a non-thermoplastic resin film; and a non-thermoplastic resin film formed on the non-thermoplastic resin film. It is characterized by having a plastic resin film and metal wiring formed on the surface of the thermoplastic resin film.
【００１５】請求項２記載の発明は、請求項１記載のフ
レキシブル基板であって、前記金属配線の一部は樹脂フ
ィルムで覆われたことを特徴とする。According to a second aspect of the present invention, there is provided the flexible substrate according to the first aspect, wherein a part of the metal wiring is covered with a resin film.
【００１６】請求項３記載の発明は、請求項１又は請求
項２のいずれか１項記載のフレキシブル基板であって、
前記非熱可塑性樹脂フィルムには、ポリイミドフィルム
が用いられたことを特徴とする。According to a third aspect of the present invention, there is provided the flexible substrate according to any one of the first and second aspects,
A polyimide film is used for the non-thermoplastic resin film.
【００１７】請求項４記載の発明は、請求項１乃至請求
項３のいずれか１項記載のフレキシブル基板であって、
前記熱可塑性樹脂フィルムには、熱可塑性ポリイミドフ
ィルムが用いられたことを特徴とする。According to a fourth aspect of the present invention, there is provided the flexible substrate according to any one of the first to third aspects, wherein:
A thermoplastic polyimide film is used as the thermoplastic resin film.
【００１８】請求項５記載の発明は、請求項１乃至請求
項４のいずれか１項記載のフレキシブル基板であって、
前記金属配線の一部は露出されたことを特徴とする。According to a fifth aspect of the present invention, there is provided the flexible substrate according to any one of the first to fourth aspects, wherein:
A part of the metal wiring is exposed.
【００１９】請求項６記載の発明は、請求項５記載のフ
レキシブル基板であって、前記露出された金属配線の少
なくとも一部には、低融点金属被膜が形成されたことを
特徴とする。According to a sixth aspect of the present invention, there is provided the flexible substrate according to the fifth aspect, wherein a low melting point metal film is formed on at least a part of the exposed metal wiring.
【００２０】請求項７記載の発明は、請求項６記載のフ
レキシブル基板であって、前記低融点金属被膜の材料に
は半田が用いられたことを特徴とする。According to a seventh aspect of the present invention, there is provided the flexible substrate according to the sixth aspect, wherein solder is used as a material of the low-melting point metal coating.
【００２１】請求項８記載の発明は、２枚以上のフレキ
シブル基板の、金属配線同士が当接されて貼り合わされ
たフレキシブル基板であって、少なくとも一方のフレキ
シブル基板には、請求項５乃至請求項７のいずれか１項
記載のフレキシブル基板が用いられ、前記２枚のフレキ
シブル基板が熱圧着されて張り合わされたことを特徴と
する。The invention according to claim 8 is a flexible board in which metal wirings of two or more flexible boards are brought into contact with each other and bonded to each other, and at least one of the flexible boards is attached to at least one of the flexible boards. 7. The flexible substrate according to claim 7, wherein the two flexible substrates are bonded by thermocompression bonding.
【００２２】請求項９記載の発明は、請求項８記載のフ
レキシブル基板であって、前記金属配線同士は、溶融
後、固化した低融点金属被膜によって接続されているこ
とを特徴とする。According to a ninth aspect of the present invention, in the flexible substrate according to the eighth aspect, the metal wirings are connected to each other by a low-melting metal coating solidified after being melted.
【００２３】本発明は上記のように構成されており、非
熱可塑性樹脂フィルムと、その非熱可塑性樹脂フィルム
上に形成された熱可塑性樹脂フィルムと、更にその熱可
塑性樹脂フィルム表面に形成された金属配線とを有する
フレキシブル基板である。The present invention is constituted as described above, and comprises a non-thermoplastic resin film, a thermoplastic resin film formed on the non-thermoplastic resin film, and further formed on the surface of the thermoplastic resin film. This is a flexible substrate having metal wiring.
【００２４】熱可塑性樹脂フィルムは、常温では接着性
を有しないが、加熱すると接着性が発現されるため、熱
可塑性樹脂フィルムを接着剤とし、２枚のフレキシブル
基板を熱圧着し、１枚のフレキシブル基板を作製するこ
とができる。Although a thermoplastic resin film does not have adhesiveness at room temperature, it exhibits adhesiveness when heated. Therefore, a thermoplastic resin film is used as an adhesive, and two flexible substrates are thermocompression-bonded to each other. A flexible substrate can be manufactured.
【００２５】この場合、金属配線の一部を露出させてお
き、２枚のフレキシブル基板の金属配線同士を当接させ
た状態で熱圧着すると、フレキシブル基板同士を電気的
に接続することができる。In this case, when a part of the metal wiring is exposed and thermocompression bonding is performed with the metal wirings of the two flexible substrates in contact with each other, the flexible substrates can be electrically connected to each other.
【００２６】更に、互いに貼り合わせる２枚のフレキシ
ブル基板のうち、少なくとも一方のフレキシブル基板の
金属配線上に低融点金属被膜を形成しておき、熱圧着す
る際に、その低融点金属被膜を溶融させ、冷却して固化
させると、金属配線と低融点金属被膜が金属結合を形成
するので、低融点金属被膜を介して金属配線同士を電気
的、機械的に接続することが可能になる。Further, of the two flexible substrates to be bonded together, a low-melting metal film is formed on the metal wiring of at least one of the flexible substrates, and when the thermocompression bonding is performed, the low-melting metal film is melted. When cooled and solidified, the metal wiring and the low melting point metal coating form a metal bond, so that the metal wiring can be electrically and mechanically connected via the low melting point metal coating.
【００２７】このような電気的、機械的な接続に用いる
金属配線は露出させておく必要があるが、接続に用いな
い部分の金属配線は樹脂フィルムによって保護しておく
とよい。Although the metal wiring used for such electrical and mechanical connection needs to be exposed, the metal wiring not used for connection is preferably protected by a resin film.
【００２８】２枚のフレキシブル基板を互いに貼り合わ
せる場合、両方のフレキシブル基板の金属配線を熱可塑
性樹脂フィルム上に形成してもよいが、熱可塑性樹脂フ
ィルムの厚みや張り合わせに用いる金属配線部分の面
積、ピッチにもよるが、いずれか一方のフレキシブル基
板の金属配線が熱可塑性樹脂フィルム上に形成されてい
ればよい。When two flexible substrates are bonded to each other, the metal wiring of both flexible substrates may be formed on the thermoplastic resin film. However, the thickness of the thermoplastic resin film and the area of the metal wiring portion used for lamination are set. Depending on the pitch, the metal wiring of either one of the flexible substrates may be formed on the thermoplastic resin film.
【００２９】[0029]
【発明の実施の形態】本発明のフレキシブル基板の実施
形態を、その製造方法と共に図面を用いて説明する。図
１(ａ)〜(ｇ)は、本発明のフレキシブル基板の一例の製
造工程を示している。図１(ａ)を参照し、先ず、脂肪族
アミンと酸無水物から合成された熱可塑性のポリイミド
から成る熱可塑性樹脂フィルム１０と、芳香族アミンと
酸無水物から合成された非熱可塑性の成る非熱可塑性樹
脂フィルム１１とを用意する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a flexible substrate according to the present invention will be described with reference to the drawings together with a method of manufacturing the same. 1A to 1G show a manufacturing process of an example of the flexible substrate of the present invention. Referring to FIG. 1A, first, a thermoplastic resin film 10 made of a thermoplastic polyimide synthesized from an aliphatic amine and an acid anhydride, and a non-thermoplastic film synthesized from an aromatic amine and an acid anhydride. A non-thermoplastic resin film 11 is prepared.
【００３０】熱可塑性樹脂フィルム１０(好適な厚みは
１５μ〜５０μｍ。ここでは２５μｍのポリイミドフィ
ルムを用いた。)の両面には接着層を形成しておき(接着
層及びその接着層上に貼付される剥離紙は図示しな
い。)、片面の接着層を露出させ、熱可塑性樹脂フィル
ム１０を非熱可塑性樹脂フィルム１１(好適な厚みは１
０μ〜５０μｍ。ここではデュポン社製商品名カプト
ン、厚み２５μｍのポリイミドフィルムを用いた。)側
に貼付し(同図(ｂ))、次いで、他の接着層を露出させ、
金属箔９(好適な厚みは５μ〜７５μｍ、ここでは１８
μｍの銅箔ものを用いた。)を熱可塑性樹脂フィルム１
０表面に貼付する(同図(ｃ))。Adhesive layers are formed on both surfaces of the thermoplastic resin film 10 (preferable thickness is 15 μm to 50 μm; a 25 μm polyimide film is used here) (the adhesive layer and the adhesive layer are adhered on the adhesive layer). Release paper is not shown), the adhesive layer on one side is exposed, and the thermoplastic resin film 10 is turned into a non-thermoplastic resin film 11 (preferable thickness is 1
0 μm to 50 μm. Here, a polyimide film of Kapton (trade name, manufactured by DuPont) having a thickness of 25 μm was used. ) Side ((b) in the same figure), then exposing the other adhesive layer,
Metal foil 9 (preferably 5 μm to 75 μm, here 18 μm
A μm copper foil was used. ) To thermoplastic resin film 1
Affixed to the surface 0 (FIG. 3 (c)).
【００３１】次に、感光性ドライフィルムやレジスト膜
を用いたフォトリソグラフ工程によって金属箔９をパタ
ーニングし、銅から成る金属配線８を形成する(同図
(ｄ))。金属配線８のパターン幅は、通常１００μｍ程
度、ピッチは１０μ〜２００μｍ程度である。ここでは
２００μｍ(０．２ｍｍ)に形成した。Next, the metal foil 9 is patterned by a photolithographic process using a photosensitive dry film or a resist film to form a metal wiring 8 made of copper (FIG. 1).
(d)). The pattern width of the metal wiring 8 is usually about 100 μm, and the pitch is about 10 μm to 200 μm. Here, the thickness was set to 200 μm (0.2 mm).
【００３２】この金属配線８には、フレキシブル基板１
０同士を接続させたり、フレキシブル基板１０と他の電
気部材とを接続させる幅広の接点部と、搭載される半導
体素子間や、半導体素子と接点部とを接続させる細長の
配線部とが形成されている。The metal wiring 8 includes a flexible substrate 1
A wide contact portion for connecting the 0s or connecting the flexible substrate 10 and another electric member, and a narrow wiring portion for connecting between the semiconductor elements to be mounted or for connecting the semiconductor element and the contact portion are formed. ing.
【００３３】同図(ｄ)の符号１２は、上記の接点部を示
しており、符号１７は配線部を示している。金属配線８
を形成し、整面処理を行った後、この図１(ｄ)に示すよ
うに、接点部１２は露出させた状態で、配線部１７上に
カバーフィルム１９を貼付する。Reference numeral 12 in FIG. 3D indicates the above-mentioned contact portion, and reference numeral 17 indicates a wiring portion. Metal wiring 8
Then, after performing the surface conditioning process, a cover film 19 is stuck on the wiring portion 17 with the contact portion 12 exposed as shown in FIG. 1D.
【００３４】その状態で低融点金属(ここではＳｎ：Ｐ
ｂ＝６：４の半田を用いた。)のメッキ液に浸漬すると
接点部１２上に低融点金属被膜１３が形成され、フレキ
シブル基板２が得られる(同図(ｅ))。低融点金属被膜１
３の膜厚は、好適には１μ〜１０μｍである。ここでは
膜厚３μｍに形成した。In that state, a low melting point metal (here, Sn: P
b = 6: 4 solder was used. 2), a low-melting metal film 13 is formed on the contact portion 12 to obtain the flexible substrate 2 (FIG. 3E). Low melting point metal coating 1
3 preferably has a thickness of 1 μm to 10 μm. Here, the film thickness is 3 μm.
【００３５】次に、上記構造の２枚のフレキシブル基板
２a、２bを用意し、その接点部１２ a、１２bを向き合わ
せ(同図(ｆ))、接点部１２a、１２b上の低融点金属被膜
１３ a、１３b同士を密着させた状態で熱圧着する。熱圧
着条件の一例として、加熱温度１５０〜３００℃、圧力
２０〜５０ｋｇ／ｃｍ2で１０〜２０秒間圧着する。こ
こでは２００℃、３０ｋｇ／ｃｍ2で１０秒間圧着し
た。Next, two flexible substrates having the above structure
2a, 2bAnd the contact portion 12 a, 12bFace to face
(FIG. (F)), contact portion 12a, 12bLow melting metal coating on
13 a, 13bThermocompression bonding is performed in a state where they are in close contact with each other. Heat pressure
As an example of the wearing conditions, a heating temperature of 150 to 300 ° C., pressure
20-50kg / cmTwoFor 10 to 20 seconds. This
Here, 200 ° C, 30kg / cmTwoAnd crimp for 10 seconds
Was.
【００３６】フレキシブル基板２a、２bが熱圧着される
際には、先ず、非熱可塑性フィルム１１a、１１bを介し
て、熱可塑性樹脂フィルム１０a、１０b及び接点部１２
a、１２bが加熱され、熱可塑性樹脂フィルム１０a、１
０bが昇温して軟化する。When the flexible substrates 2 a and 2 b are thermocompression bonded, first, the thermoplastic resin films 10 a and 10 b and the contact portions 12 are interposed via the non-thermoplastic films 11 a and 11 b.
a, 12 b is heated, the thermoplastic resin film 10 a, 1
0 b is softened the temperature was raised.
【００３７】加熱前は、各接点部１２a間(及び接点部１
２b間)に位置する熱可塑性樹脂フィルム１０a、１０b同
士は接触していないが、軟化すると接点部１２a間(及び
接点部１２b間)に押し出され、その間に流れ込む。[0037] before heating, between the contact portions 12 a (and the contact part 1
2 Thermoplastic resin film 10 a located b between), 10 b each other but not in contact, extruded into the softened between contact portions 12 a (and the inter-contact portions 12 b), flows therebetween.
【００３８】熱可塑性樹脂フィルム１０a、１０bの軟化
後、接点部１２a、１２bが昇温し、低融点金属の融点以
上になると低融点金属被膜１３a、１３bが溶融する。こ
のとき、本発明のフレキシブル基板２a、２bでは、各接
点部１２a間(及び接点部１２ b間)が軟化した熱可塑性樹
脂フィルム１０a、１０bで充填さた状態になっているの
で、低融点金属被膜１３a、１３bの溶融物が飛散したり
流れ出したりすることはなく、ブリッジが形成されるこ
とはない。Thermoplastic resin film 10a, 10bSoftening
Later, the contact portion 12a, 12bTemperature rises below the melting point of the low melting point metal.
Above, low melting metal coating 13a, 13bMelts. This
, The flexible substrate 2 of the present inventiona, 2bThen, each contact
Dot part 12aBetween (and contact 12 bThermoplastic tree with softened
Fat film 10a, 10bIt's filled with
And the low melting point metal coating 13a, 13bOf the molten material
It does not flow out and forms a bridge.
And not.
【００３９】圧着させた後、冷却すると、溶融した二層
の低融点金属被膜１３a、１３bは一体となり、一層の低
融点金属被膜１４が形成される。接点部１２a、１２b及
び低融点金属被膜１４が一体となって接続部１６が形成
される。After being pressed and cooled, the two molten low-melting metal films 13 a and 13 b are united to form a single low-melting metal film 14. The contact portions 12 a and 12 b and the low-melting metal coating 14 are integrated to form a connection portion 16.
【００４０】各接点部１２a、１２b表面の銅は、その低
融点金属被膜１４と金属結合を形成しており、従って、
２枚のフレキシブル基板２a、２bは、接続部１６によっ
て電気的、機械的に接続される。この接続部１６の周囲
には低融点金属被膜１４がはみ出た部分によって膨出部
分１４'が形成されている。The copper on the surface of each of the contact portions 12 a and 12 b forms a metal bond with the low melting point metal coating 14,
The two flexible substrates 2 a and 2 b are electrically and mechanically connected by a connection portion 16. A bulging portion 14 ′ is formed around the connection portion 16 by a portion where the low melting point metal coating 14 protrudes.
【００４１】また、圧着終了後、冷却すると、軟化した
２枚の熱可塑性樹脂フィルム１０a、１０bは一体にな
り、一枚の熱可塑性樹脂フィルム１５が形成される。熱
可塑性樹脂フィルム１０a、１０bは、軟化すると接着性
が発現されるため、２枚の非熱可塑性樹脂フィルム１１
a、１１bは、一枚の熱可塑性樹脂フィルム１５によって
互いに接着される。After the completion of the pressure bonding, when cooled, the two softened thermoplastic resin films 10a and 10b are united to form a single thermoplastic resin film 15. Since the thermoplastic resin films 10 a and 10 b exhibit adhesiveness when softened, the two non-thermoplastic resin films 11
a, 11 b are adhered to each other by a single thermoplastic resin film 15.
【００４２】以上説明したフレキシブル基板２a、２
bは、２枚とも接点部１２a、１２bは熱可塑性樹脂フィ
ルム１０a、１０b上に形成されていたが、いずれか一方
のフレキシブル基板の接点部が熱可塑性樹脂フィルム上
に形成されていればよい。The flexible substrates 2 a , 2 described above
b is also two contact portions 12 a, 12 b has been been formed in the thermoplastic resin film 10 a, the 10 b, the contact portion of one of the flexible substrate is formed on a thermoplastic resin film Just do it.
【００４３】例えば、図２(ａ)に示すように、２枚のフ
レキシブル基板のうち、一方のフレキシブル基板３とし
て、非熱可塑性樹脂フィルム３１上に接点部３２及び配
線部３７が形成されたものを用い、他方のフレキシブル
基板として、図１の符号２で示したフレキシブル基板を
用いることができる。For example, as shown in FIG. 2A, one of the two flexible substrates, in which a contact portion 32 and a wiring portion 37 are formed on a non-thermoplastic resin film 31, as one flexible substrate 3. , And the flexible substrate indicated by reference numeral 2 in FIG. 1 can be used as the other flexible substrate.
【００４４】この場合も、２枚のフレキシブル基板２、
３の接点部１２、３２上の低融点金属被膜１３、３３同
士を接触させた状態で、熱圧着し、一層の低融点金属被
膜１４を形成し、この低融点金属被膜１４及び接点部１
２、３２とで接続部３６を構成させ、フレキシブル基板
２、３同士を機械的、電気的に接続させ、１枚のフレキ
シブル基板５を作製することができる。Also in this case, the two flexible substrates 2
In a state where the low melting point metal films 13 and 33 on the contact portions 12 and 32 are in contact with each other, they are thermocompressed to form a single layer of the low melting point metal film 14.
The connection portions 36 are formed by the flexible substrates 2 and 32, and the flexible substrates 2 and 3 are mechanically and electrically connected to each other, whereby one flexible substrate 5 can be manufactured.
【００４５】一方のフレキシブル基板２の熱可塑性樹脂
フィルム１０が軟化すると、他方のフレキシブル基板３
の非熱可塑性樹脂フィルム３１上に直接形成されている
接点部３２間も熱可塑性樹脂フィルム１０によって充填
され、その後、低融点金属被膜１３、３３が溶融するた
め、低融点金属が飛散し、ブリッジが形成されることは
ない。When the thermoplastic resin film 10 of one flexible substrate 2 softens, the other flexible substrate 3
The space between the contact portions 32 directly formed on the non-thermoplastic resin film 31 is also filled with the thermoplastic resin film 10, and then the low-melting metal films 13 and 33 are melted. Is not formed.
【００４６】なお、上記張り合わせに用いたプリント基
板２(２a、２b)、３は、片面にだけ金属配線８が形成さ
れていたが、両面に金属配線が形成されたものを用いて
もよい。The printed circuit boards 2 ( 2a , 2b) and 3 used for the lamination have the metal wirings 8 formed on only one side, but may have the metal wirings formed on both sides. .
【００４７】また、上記非熱可塑性樹脂フィルム１１
(１１a、１１b)、３１及び熱可塑性樹脂フィルム１０
(１０a、１０b)は、ポリイミド系の樹脂フィルムであっ
たが、本発明はそれに限定されるものではない。熱可塑
性樹脂フィルムとしては、要するに、熱圧着される際に
分解しない樹脂フィルムを広く用いることができる。但
し、軟化した際に接着性が発現されるものが望ましい。
また、耐薬品性、難燃性の観点からはポリイミド系樹脂
フィルムを用いることが望ましい。The non-thermoplastic resin film 11
( 11a , 11b ), 31 and thermoplastic resin film 10
( 10a , 10b ) is a polyimide resin film, but the present invention is not limited thereto. In short, as the thermoplastic resin film, a resin film that does not decompose when subjected to thermocompression bonding can be widely used. However, a material that exhibits adhesiveness when softened is desirable.
It is desirable to use a polyimide resin film from the viewpoint of chemical resistance and flame retardancy.
【００４８】上記熱可塑性樹脂フィルム１１(１１a、１
１b)、３１の軟化温度は、低融点金属被膜１３、３３が
溶融する温度よりも低温であることが必要であるが、一
般の熱可塑性樹脂フィルムであれは、その条件は満たし
ている。The thermoplastic resin film 11 ( 11a , 1
1 b), the softening temperature of 31, but the low melting point metal film 13 and 33 is required to be lower than the temperature at which the melt, in any general thermoplastic resin film, the condition is satisfied.
【００４９】なお、本発明に用いることができる低融点
金属には、半田の他、スズ系金属、ビスマス系金属等が
ある。また、低融点金属被膜の表面には、更に耐酸化
性、耐腐食性を有する金被膜を形成しておいてもよい。The low-melting point metal that can be used in the present invention includes tin-based metals, bismuth-based metals, and the like, in addition to solder. Further, a gold coating having oxidation resistance and corrosion resistance may be formed on the surface of the low melting point metal coating.
【００５０】また、本発明によれば、一方のフレキシブ
ル基板の非熱可塑性樹脂フィルムと、他方のフレキシブ
ル基板の非熱可塑性樹脂フィルムとが、熱可塑性樹脂フ
ィルムによって互いに貼付される。従って、本発明のフ
レキシブル基板は、金属配線表面に低融点金属被膜を形
成せずに接点部とし、一方のフレキシブル基板の接点部
と他方のフレキシブル基板の接点部とを接触させた状態
で加圧、加熱し、接点部間を密着させることで、２枚の
フレキシブル基板が互いに電気的に接続されて形成され
た１枚のフレキシブル基板を得ることができる。Further, according to the present invention, the non-thermoplastic resin film of one flexible substrate and the non-thermoplastic resin film of the other flexible substrate are adhered to each other by the thermoplastic resin film. Therefore, the flexible substrate of the present invention is used as a contact portion without forming a low melting point metal film on the surface of the metal wiring, and is pressed while the contact portion of one flexible substrate and the contact portion of the other flexible substrate are in contact with each other. By heating and bringing the contact portions into close contact with each other, one flexible substrate formed by electrically connecting the two flexible substrates to each other can be obtained.
【００５１】[0051]
【発明の効果】複数枚のフレキシブル基板を貼り合わせ
て１枚のフレキシブル基板を構成できるので、異形フレ
キシブル基板の取れ率が向上する。また、種々の形状に
柔軟に対応することができる。According to the present invention, a single flexible substrate can be formed by bonding a plurality of flexible substrates, so that the odd-shaped flexible substrate can be obtained more efficiently. Further, it can flexibly cope with various shapes.
【図１】(ａ)〜(ｇ)：張り合わせに用いる本発明のフレ
キシブル基板、及び貼り合わせて１枚にする本発明のフ
レキシブル基板の製造工程図FIGS. 1 (a) to 1 (g): manufacturing process diagrams of a flexible substrate of the present invention used for lamination and a flexible substrate of the present invention to be laminated into one sheet.
【図２】(ａ)、(ｂ)：本発明の他の例のフレキシブル基
板の製造工程図FIGS. 2 (a) and 2 (b): manufacturing process diagrams of a flexible substrate according to another example of the present invention.
【図３】(ａ)〜(ｃ)：従来技術のフレキシブル基板の製
造工程図3 (a) to 3 (c): manufacturing process diagrams of a flexible substrate according to the prior art.
【図４】(ａ)、(ｂ)：フレキシブル基板の裁断図 (ｃ)：張り合わせを説明するための図4A and 4B are cutaway views of a flexible substrate. FIG. 4C is a view for explaining bonding.
２(２a、２b)、３、５……フレキシブル基板 ８……金属配線 １０(１０a、１０b)……熱可塑性樹脂フィルム １１(１１a、１１b)……非熱可塑性樹脂フィルム １２……露出した金属配線 １３(１３a、１３b)……低融点金属被膜 １７……樹脂フィルムで覆われた金属配線 １９……樹脂フィルム 2 (2 a, 2 b) , 3,5 ...... flexible substrate 8 ...... metal wires 10 (10 a, 10 b) ...... thermoplastic resin film 11 (11 a, 11 b) ...... non-thermoplastic resin film 12: Exposed metal wiring 13 ( 13a , 13b ): Low-melting metal coating 17: Metal wiring covered with resin film 19: Resin film
───────────────────────────────────────────────────── フロントページの続き (72)発明者 篠原 敏浩 栃木県鹿沼市さつき町12−３ ソニーケミ カル株式会社第２工場内 (72)発明者 福田 光博 栃木県鹿沼市さつき町12−３ ソニーケミ カル株式会社第２工場内 Ｆターム(参考） 5E338 AA11 AA12 AA16 BB63 BB75 BB80 CC01 CD03 CD33 CD40 EE33 5E344 AA01 AA02 AA22 BB02 BB05 CC13 CC21 CC24 CD12 DD04 DD10 DD14 EE06 EE21 EE27 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Toshihiro Shinohara 12-3 Satsukicho, Kanuma-shi, Tochigi Sony Chemical Co., Ltd. Second Factory (72) Inventor Mitsuhiro Fukuda 12-3 Satsukicho, Kanuma-shi, Tochigi Sony Chemical stock F-term in company 2nd factory (reference) 5E338 AA11 AA12 AA16 BB63 BB75 BB80 CC01 CD03 CD33 CD40 EE33 5E344 AA01 AA02 AA22 BB02 BB05 CC13 CC21 CC24 CD12 DD04 DD10 DD14 EE06 EE21 EE27
Claims (9)
脂フィルムと、 前記熱可塑性樹脂フィルム表面に形成された金属配線と
を有することを特徴とするフレキシブル基板。1. A flexible material comprising: a non-thermoplastic resin film; a thermoplastic resin film formed on the non-thermoplastic resin film; and a metal wiring formed on a surface of the thermoplastic resin film. substrate.
れたことを特徴とする請求項１記載のフレキシブル基
板。2. The flexible substrate according to claim 1, wherein a part of said metal wiring is covered with a resin film.
ミドフィルムが用いられたことを特徴とする請求項１又
は請求項２のいずれか１項記載のフレキシブル基板。3. The flexible substrate according to claim 1, wherein a polyimide film is used as the non-thermoplastic resin film.
ポリイミドフィルムが用いられたことを特徴とする請求
項１乃至請求項３のいずれか１項記載のフレキシブル基
板。4. The flexible substrate according to claim 1, wherein a thermoplastic polyimide film is used as the thermoplastic resin film.
徴とする請求項１乃至請求項４のいずれか１項記載のフ
レキシブル基板。5. The flexible substrate according to claim 1, wherein a part of the metal wiring is exposed.
には、低融点金属被膜が形成されたことを特徴とする請
求項５記載のフレキシブル基板。6. The flexible substrate according to claim 5, wherein a low-melting metal coating is formed on at least a part of the exposed metal wiring.
られたことを特徴とする請求項６記載のフレキシブル基
板。7. The flexible substrate according to claim 6, wherein solder is used as a material of said low melting point metal coating.
同士が当接されて貼り合わされたフレキシブル基板であ
って、 少なくとも一方のフレキシブル基板には、請求項５乃至
請求項７のいずれか１項記載のフレキシブル基板が用い
られ、前記２枚のフレキシブル基板が熱圧着されて張り
合わされたことを特徴とするフレキシブル基板。8. A flexible substrate in which metal wirings of two or more flexible substrates are abutted and bonded to each other, and at least one of the flexible substrates is attached to at least one of the flexible substrates. A flexible substrate, wherein the two flexible substrates are thermocompression-bonded and bonded to each other.
融点金属被膜によって接続されていることを特徴とする
請求項８記載のフレキシブル基板。9. The flexible substrate according to claim 8, wherein the metal wirings are connected by a low-melting metal coating solidified after melting.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10215047A JP2000049423A (en) | 1998-07-30 | 1998-07-30 | Flexible substrate |
| US10/458,175 US6840430B2 (en) | 1998-07-30 | 2003-06-10 | Board pieces, flexible wiring boards and processes for manufacturing flexible wiring boards |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10215047A JP2000049423A (en) | 1998-07-30 | 1998-07-30 | Flexible substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2000049423A true JP2000049423A (en) | 2000-02-18 |
Family
ID=16665887
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10215047A Pending JP2000049423A (en) | 1998-07-30 | 1998-07-30 | Flexible substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000049423A (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001056340A1 (en) * | 2000-01-28 | 2001-08-02 | Sony Chemicals Corp. | Substrate material piece, flexible circuit board, and method of manufacturing the flexible circuit board |
| JP2002232132A (en) * | 2001-01-30 | 2002-08-16 | Denso Corp | Board connecting method |
| JP2007191674A (en) * | 2005-12-19 | 2007-08-02 | Hitachi Chem Co Ltd | Adhesive with wiring |
| JP2008085216A (en) * | 2006-09-28 | 2008-04-10 | Fujikura Ltd | Method of aligning printed circuit board and apparatus thereof |
| WO2008096794A1 (en) * | 2007-02-07 | 2008-08-14 | Nec Corporation | Thin acoustic component mounting structure, portable acoustic apparatus, cellular phone and thin acoustic component mounting method |
| JP2008235665A (en) * | 2007-03-22 | 2008-10-02 | Toyota Motor Corp | Flexible substrate and manufacturing method therefor |
| JP2015023059A (en) * | 2013-07-16 | 2015-02-02 | 住友電工プリントサーキット株式会社 | Connection structure of flexible printed wiring board, flexible printed wiring board, and manufacturing method thereof |
| CN104717850A (en) * | 2013-12-12 | 2015-06-17 | 深南电路有限公司 | Method for manufacturing local-thick-copper circuit board and local-thick-copper circuit board |
| KR101880535B1 (en) * | 2015-10-02 | 2018-07-20 | 주식회사 리비콘 | New busbar make Method for PDLCD film using FPCB |
| WO2020166555A1 (en) * | 2019-02-13 | 2020-08-20 | 日本航空電子工業株式会社 | Wiring structure and method for producing wiring structure |
| WO2024070518A1 (en) * | 2022-09-30 | 2024-04-04 | 株式会社村田製作所 | Wiring board |
-
1998
- 1998-07-30 JP JP10215047A patent/JP2000049423A/en active Pending
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001056340A1 (en) * | 2000-01-28 | 2001-08-02 | Sony Chemicals Corp. | Substrate material piece, flexible circuit board, and method of manufacturing the flexible circuit board |
| US6596947B1 (en) | 2000-01-28 | 2003-07-22 | Sony Chemicals Corp. | Board pieces, flexible wiring boards, and processes for manufacturing flexible wiring boards |
| JP2002232132A (en) * | 2001-01-30 | 2002-08-16 | Denso Corp | Board connecting method |
| JP2007191674A (en) * | 2005-12-19 | 2007-08-02 | Hitachi Chem Co Ltd | Adhesive with wiring |
| JP2008085216A (en) * | 2006-09-28 | 2008-04-10 | Fujikura Ltd | Method of aligning printed circuit board and apparatus thereof |
| JP2008193613A (en) * | 2007-02-07 | 2008-08-21 | Nec Saitama Ltd | Low-profile acoustic component mounting structure, portable acoustic apparatus, mobile phone, low-profile acoustic component mounting method |
| WO2008096794A1 (en) * | 2007-02-07 | 2008-08-14 | Nec Corporation | Thin acoustic component mounting structure, portable acoustic apparatus, cellular phone and thin acoustic component mounting method |
| US8792667B2 (en) | 2007-02-07 | 2014-07-29 | Nec Corporation | Thin audio component mounting structure, portable audio device, cellular phone and method for mounting thin audio component |
| JP2008235665A (en) * | 2007-03-22 | 2008-10-02 | Toyota Motor Corp | Flexible substrate and manufacturing method therefor |
| JP2015023059A (en) * | 2013-07-16 | 2015-02-02 | 住友電工プリントサーキット株式会社 | Connection structure of flexible printed wiring board, flexible printed wiring board, and manufacturing method thereof |
| CN104717850A (en) * | 2013-12-12 | 2015-06-17 | 深南电路有限公司 | Method for manufacturing local-thick-copper circuit board and local-thick-copper circuit board |
| KR101880535B1 (en) * | 2015-10-02 | 2018-07-20 | 주식회사 리비콘 | New busbar make Method for PDLCD film using FPCB |
| WO2020166555A1 (en) * | 2019-02-13 | 2020-08-20 | 日本航空電子工業株式会社 | Wiring structure and method for producing wiring structure |
| WO2024070518A1 (en) * | 2022-09-30 | 2024-04-04 | 株式会社村田製作所 | Wiring board |
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