CN104641449B - 管状靶件 - Google Patents

管状靶件 Download PDF

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Publication number
CN104641449B
CN104641449B CN201380048331.6A CN201380048331A CN104641449B CN 104641449 B CN104641449 B CN 104641449B CN 201380048331 A CN201380048331 A CN 201380048331A CN 104641449 B CN104641449 B CN 104641449B
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CN
China
Prior art keywords
target
connector
target body
piece
locking mechanism
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201380048331.6A
Other languages
English (en)
Chinese (zh)
Other versions
CN104641449A (zh
Inventor
沃尔特·穆施勒希纳
安德烈·德龙豪弗
克里斯汀·林克
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Plansee SE
Original Assignee
Plansee SE
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Plansee SE filed Critical Plansee SE
Publication of CN104641449A publication Critical patent/CN104641449A/zh
Application granted granted Critical
Publication of CN104641449B publication Critical patent/CN104641449B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3414—Targets
    • H01J37/3423—Shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3414—Targets
    • H01J37/342—Hollow targets
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3435—Target holders (includes backing plates and endblocks)
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32—Processing objects by plasma generation
    • H01J2237/33—Processing objects by plasma generation characterised by the type of processing
    • H01J2237/332—Coating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
  • Connection Of Plates (AREA)
CN201380048331.6A 2012-09-17 2013-09-13 管状靶件 Active CN104641449B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
ATGM365/2012 2012-09-17
ATGM365/2012U AT13609U1 (de) 2012-09-17 2012-09-17 Rohrförmiges Target
PCT/AT2013/000152 WO2014040100A1 (de) 2012-09-17 2013-09-13 Rohrförmiges target

Publications (2)

Publication Number Publication Date
CN104641449A CN104641449A (zh) 2015-05-20
CN104641449B true CN104641449B (zh) 2018-10-23

Family

ID=50277396

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201380048331.6A Active CN104641449B (zh) 2012-09-17 2013-09-13 管状靶件

Country Status (8)

Country Link
US (1) US20150221485A1 (enExample)
EP (1) EP2896064B1 (enExample)
JP (1) JP6341917B2 (enExample)
KR (1) KR102111817B1 (enExample)
CN (1) CN104641449B (enExample)
AT (1) AT13609U1 (enExample)
TW (1) TWI550116B (enExample)
WO (1) WO2014040100A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014102407B4 (de) * 2014-02-25 2024-07-18 Sindlhauser Materials Gmbh Sputtertargetanordnung
US9992917B2 (en) 2014-03-10 2018-06-05 Vulcan GMS 3-D printing method for producing tungsten-based shielding parts
AT14911U1 (de) * 2015-05-06 2016-08-15 Plansee Se Rohrtarget
US11158491B2 (en) * 2017-06-01 2021-10-26 Oerlikon Surface Solutions Ag, Pfäffikon Target assembly for safe and economic evaporation of brittle materials
CN108486540B (zh) * 2018-05-16 2019-07-02 上海大学 一种旋转靶材绑定方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012002383A1 (ja) * 2010-06-28 2012-01-05 アルバックテクノ株式会社 ターゲット取付機構

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5738921A (en) * 1993-08-10 1998-04-14 E. Khashoggi Industries, Llc Compositions and methods for manufacturing sealable, liquid-tight containers comprising an inorganically filled matrix
US5591314A (en) * 1995-10-27 1997-01-07 Morgan; Steven V. Apparatus for affixing a rotating cylindrical magnetron target to a spindle
US6551477B2 (en) * 2000-09-25 2003-04-22 Isoflux, Inc. Interlocking cylindrical magnetron cathodes and targets
DE10102493B4 (de) * 2001-01-19 2007-07-12 W.C. Heraeus Gmbh Rohrförmiges Target und Verfahren zur Herstellung eines solchen Targets
US6905579B2 (en) * 2003-02-13 2005-06-14 Sputtering Components, Inc. Cylindrical magnetron target and spindle apparatus
US20060096855A1 (en) * 2004-11-05 2006-05-11 Richard Newcomb Cathode arrangement for atomizing a rotatable target pipe
DE202006018079U1 (de) * 2006-03-02 2007-03-29 FNE Forschungsinstitut für Nichteisen-Metalle Freiberg GmbH Targetanordnung
DE102006009749A1 (de) * 2006-03-02 2007-09-06 FNE Forschungsinstitut für Nichteisen-Metalle Freiberg GmbH Targetanordnung
DE102006017455A1 (de) * 2006-04-13 2007-10-25 Applied Materials Gmbh & Co. Kg Rohrkathode
PL2243149T3 (pl) * 2008-02-15 2012-02-29 Bekaert Advanced Coatings Nv Wielorowkowe złącze próżniowe
JP5576562B2 (ja) * 2010-07-12 2014-08-20 マテリオン アドバンスト マテリアルズ テクノロジーズ アンド サービシーズ インコーポレイティド 回転式ターゲット裏当て管結合用組立

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012002383A1 (ja) * 2010-06-28 2012-01-05 アルバックテクノ株式会社 ターゲット取付機構

Also Published As

Publication number Publication date
KR20150056768A (ko) 2015-05-27
US20150221485A1 (en) 2015-08-06
TWI550116B (zh) 2016-09-21
EP2896064B1 (de) 2020-02-26
JP6341917B2 (ja) 2018-06-13
WO2014040100A1 (de) 2014-03-20
KR102111817B1 (ko) 2020-05-18
EP2896064A1 (de) 2015-07-22
CN104641449A (zh) 2015-05-20
AT13609U1 (de) 2014-04-15
TW201413028A (zh) 2014-04-01
JP2015533940A (ja) 2015-11-26

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