TWI550116B - 管狀靶件 - Google Patents

管狀靶件 Download PDF

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Publication number
TWI550116B
TWI550116B TW102130558A TW102130558A TWI550116B TW I550116 B TWI550116 B TW I550116B TW 102130558 A TW102130558 A TW 102130558A TW 102130558 A TW102130558 A TW 102130558A TW I550116 B TWI550116 B TW I550116B
Authority
TW
Taiwan
Prior art keywords
target
locking mechanism
connector
connectors
connecting members
Prior art date
Application number
TW102130558A
Other languages
English (en)
Chinese (zh)
Other versions
TW201413028A (zh
Inventor
瓦特 慕奇勒尼
安卓 多霍夫
克里斯汀 林克
Original Assignee
攀時歐洲公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 攀時歐洲公司 filed Critical 攀時歐洲公司
Publication of TW201413028A publication Critical patent/TW201413028A/zh
Application granted granted Critical
Publication of TWI550116B publication Critical patent/TWI550116B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3414—Targets
    • H01J37/342—Hollow targets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3414—Targets
    • H01J37/3423—Shape
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3435—Target holders (includes backing plates and endblocks)
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32—Processing objects by plasma generation
    • H01J2237/33—Processing objects by plasma generation characterised by the type of processing
    • H01J2237/332—Coating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
  • Connection Of Plates (AREA)
TW102130558A 2012-09-17 2013-08-27 管狀靶件 TWI550116B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ATGM365/2012U AT13609U1 (de) 2012-09-17 2012-09-17 Rohrförmiges Target

Publications (2)

Publication Number Publication Date
TW201413028A TW201413028A (zh) 2014-04-01
TWI550116B true TWI550116B (zh) 2016-09-21

Family

ID=50277396

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102130558A TWI550116B (zh) 2012-09-17 2013-08-27 管狀靶件

Country Status (8)

Country Link
US (1) US20150221485A1 (enExample)
EP (1) EP2896064B1 (enExample)
JP (1) JP6341917B2 (enExample)
KR (1) KR102111817B1 (enExample)
CN (1) CN104641449B (enExample)
AT (1) AT13609U1 (enExample)
TW (1) TWI550116B (enExample)
WO (1) WO2014040100A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014102407B4 (de) * 2014-02-25 2024-07-18 Sindlhauser Materials Gmbh Sputtertargetanordnung
US9992917B2 (en) 2014-03-10 2018-06-05 Vulcan GMS 3-D printing method for producing tungsten-based shielding parts
AT14911U1 (de) * 2015-05-06 2016-08-15 Plansee Se Rohrtarget
EP3631837B1 (en) * 2017-06-01 2021-01-27 Oerlikon Surface Solutions AG, Pfäffikon Target assembly for safe and economic evaporation of brittle materials
CN108486540B (zh) * 2018-05-16 2019-07-02 上海大学 一种旋转靶材绑定方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040159539A1 (en) * 2003-02-13 2004-08-19 Crowley Daniel T. Cylindrical magnetron target and spindle apparatus
DE202006018079U1 (de) * 2006-03-02 2007-03-29 FNE Forschungsinstitut für Nichteisen-Metalle Freiberg GmbH Targetanordnung
EP1225249B1 (de) * 2001-01-19 2009-12-02 W.C. Heraeus GmbH Rohrförmiges Target und Verfahren zur Herstellung eines solchen Targets
WO2012002383A1 (ja) * 2010-06-28 2012-01-05 アルバックテクノ株式会社 ターゲット取付機構

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5738921A (en) * 1993-08-10 1998-04-14 E. Khashoggi Industries, Llc Compositions and methods for manufacturing sealable, liquid-tight containers comprising an inorganically filled matrix
US5591314A (en) * 1995-10-27 1997-01-07 Morgan; Steven V. Apparatus for affixing a rotating cylindrical magnetron target to a spindle
US6551477B2 (en) * 2000-09-25 2003-04-22 Isoflux, Inc. Interlocking cylindrical magnetron cathodes and targets
US20060096855A1 (en) * 2004-11-05 2006-05-11 Richard Newcomb Cathode arrangement for atomizing a rotatable target pipe
DE102006009749A1 (de) * 2006-03-02 2007-09-06 FNE Forschungsinstitut für Nichteisen-Metalle Freiberg GmbH Targetanordnung
DE102006017455A1 (de) * 2006-04-13 2007-10-25 Applied Materials Gmbh & Co. Kg Rohrkathode
JP5520839B2 (ja) * 2008-02-15 2014-06-11 ソレラス・アドヴァンスト・コーティングス・ビーヴイビーエー 多重溝付き真空連結具
RU2013103041A (ru) * 2010-07-12 2014-08-20 Мэтиреон Эдвансд Мэтириэлз Текнолоджиз Энд Сервисез Инк. Узел соединения опорной трубки с вращающейся мишенью

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1225249B1 (de) * 2001-01-19 2009-12-02 W.C. Heraeus GmbH Rohrförmiges Target und Verfahren zur Herstellung eines solchen Targets
US20040159539A1 (en) * 2003-02-13 2004-08-19 Crowley Daniel T. Cylindrical magnetron target and spindle apparatus
DE202006018079U1 (de) * 2006-03-02 2007-03-29 FNE Forschungsinstitut für Nichteisen-Metalle Freiberg GmbH Targetanordnung
WO2012002383A1 (ja) * 2010-06-28 2012-01-05 アルバックテクノ株式会社 ターゲット取付機構

Also Published As

Publication number Publication date
WO2014040100A1 (de) 2014-03-20
KR20150056768A (ko) 2015-05-27
CN104641449A (zh) 2015-05-20
EP2896064A1 (de) 2015-07-22
CN104641449B (zh) 2018-10-23
US20150221485A1 (en) 2015-08-06
AT13609U1 (de) 2014-04-15
JP6341917B2 (ja) 2018-06-13
KR102111817B1 (ko) 2020-05-18
EP2896064B1 (de) 2020-02-26
TW201413028A (zh) 2014-04-01
JP2015533940A (ja) 2015-11-26

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