AT13609U1 - Rohrförmiges Target - Google Patents

Rohrförmiges Target Download PDF

Info

Publication number
AT13609U1
AT13609U1 ATGM365/2012U AT3652012U AT13609U1 AT 13609 U1 AT13609 U1 AT 13609U1 AT 3652012 U AT3652012 U AT 3652012U AT 13609 U1 AT13609 U1 AT 13609U1
Authority
AT
Austria
Prior art keywords
target body
target
connecting piece
locking means
target according
Prior art date
Application number
ATGM365/2012U
Other languages
German (de)
English (en)
Inventor
Walter Mutschlechner
André Dronhofer
Christian Linke
Original Assignee
Plansee Se
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Plansee Se filed Critical Plansee Se
Priority to ATGM365/2012U priority Critical patent/AT13609U1/de
Priority to TW102130558A priority patent/TWI550116B/zh
Priority to KR1020157005831A priority patent/KR102111817B1/ko
Priority to JP2015531400A priority patent/JP6341917B2/ja
Priority to US14/428,837 priority patent/US20150221485A1/en
Priority to CN201380048331.6A priority patent/CN104641449B/zh
Priority to PCT/AT2013/000152 priority patent/WO2014040100A1/de
Priority to EP13785810.6A priority patent/EP2896064B1/de
Publication of AT13609U1 publication Critical patent/AT13609U1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3414—Targets
    • H01J37/3423—Shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3414—Targets
    • H01J37/342—Hollow targets
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3435—Target holders (includes backing plates and endblocks)
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32—Processing objects by plasma generation
    • H01J2237/33—Processing objects by plasma generation characterised by the type of processing
    • H01J2237/332—Coating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
  • Connection Of Plates (AREA)
ATGM365/2012U 2012-09-17 2012-09-17 Rohrförmiges Target AT13609U1 (de)

Priority Applications (8)

Application Number Priority Date Filing Date Title
ATGM365/2012U AT13609U1 (de) 2012-09-17 2012-09-17 Rohrförmiges Target
TW102130558A TWI550116B (zh) 2012-09-17 2013-08-27 管狀靶件
KR1020157005831A KR102111817B1 (ko) 2012-09-17 2013-09-13 관형 타겟
JP2015531400A JP6341917B2 (ja) 2012-09-17 2013-09-13 管状ターゲット
US14/428,837 US20150221485A1 (en) 2012-09-17 2013-09-13 Tubular target
CN201380048331.6A CN104641449B (zh) 2012-09-17 2013-09-13 管状靶件
PCT/AT2013/000152 WO2014040100A1 (de) 2012-09-17 2013-09-13 Rohrförmiges target
EP13785810.6A EP2896064B1 (de) 2012-09-17 2013-09-13 Rohrförmiges target

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ATGM365/2012U AT13609U1 (de) 2012-09-17 2012-09-17 Rohrförmiges Target

Publications (1)

Publication Number Publication Date
AT13609U1 true AT13609U1 (de) 2014-04-15

Family

ID=50277396

Family Applications (1)

Application Number Title Priority Date Filing Date
ATGM365/2012U AT13609U1 (de) 2012-09-17 2012-09-17 Rohrförmiges Target

Country Status (8)

Country Link
US (1) US20150221485A1 (enExample)
EP (1) EP2896064B1 (enExample)
JP (1) JP6341917B2 (enExample)
KR (1) KR102111817B1 (enExample)
CN (1) CN104641449B (enExample)
AT (1) AT13609U1 (enExample)
TW (1) TWI550116B (enExample)
WO (1) WO2014040100A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014102407B4 (de) * 2014-02-25 2024-07-18 Sindlhauser Materials Gmbh Sputtertargetanordnung
US9992917B2 (en) 2014-03-10 2018-06-05 Vulcan GMS 3-D printing method for producing tungsten-based shielding parts
AT14911U1 (de) * 2015-05-06 2016-08-15 Plansee Se Rohrtarget
EP3631837B1 (en) * 2017-06-01 2021-01-27 Oerlikon Surface Solutions AG, Pfäffikon Target assembly for safe and economic evaporation of brittle materials
CN108486540B (zh) * 2018-05-16 2019-07-02 上海大学 一种旋转靶材绑定方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040159539A1 (en) * 2003-02-13 2004-08-19 Crowley Daniel T. Cylindrical magnetron target and spindle apparatus
DE202006018079U1 (de) * 2006-03-02 2007-03-29 FNE Forschungsinstitut für Nichteisen-Metalle Freiberg GmbH Targetanordnung
WO2012002383A1 (ja) * 2010-06-28 2012-01-05 アルバックテクノ株式会社 ターゲット取付機構

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5738921A (en) * 1993-08-10 1998-04-14 E. Khashoggi Industries, Llc Compositions and methods for manufacturing sealable, liquid-tight containers comprising an inorganically filled matrix
US5591314A (en) * 1995-10-27 1997-01-07 Morgan; Steven V. Apparatus for affixing a rotating cylindrical magnetron target to a spindle
US6551477B2 (en) * 2000-09-25 2003-04-22 Isoflux, Inc. Interlocking cylindrical magnetron cathodes and targets
DE10102493B4 (de) * 2001-01-19 2007-07-12 W.C. Heraeus Gmbh Rohrförmiges Target und Verfahren zur Herstellung eines solchen Targets
US20060096855A1 (en) * 2004-11-05 2006-05-11 Richard Newcomb Cathode arrangement for atomizing a rotatable target pipe
DE102006009749A1 (de) * 2006-03-02 2007-09-06 FNE Forschungsinstitut für Nichteisen-Metalle Freiberg GmbH Targetanordnung
DE102006017455A1 (de) * 2006-04-13 2007-10-25 Applied Materials Gmbh & Co. Kg Rohrkathode
JP5520839B2 (ja) * 2008-02-15 2014-06-11 ソレラス・アドヴァンスト・コーティングス・ビーヴイビーエー 多重溝付き真空連結具
RU2013103041A (ru) * 2010-07-12 2014-08-20 Мэтиреон Эдвансд Мэтириэлз Текнолоджиз Энд Сервисез Инк. Узел соединения опорной трубки с вращающейся мишенью

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040159539A1 (en) * 2003-02-13 2004-08-19 Crowley Daniel T. Cylindrical magnetron target and spindle apparatus
DE202006018079U1 (de) * 2006-03-02 2007-03-29 FNE Forschungsinstitut für Nichteisen-Metalle Freiberg GmbH Targetanordnung
WO2012002383A1 (ja) * 2010-06-28 2012-01-05 アルバックテクノ株式会社 ターゲット取付機構

Also Published As

Publication number Publication date
WO2014040100A1 (de) 2014-03-20
KR20150056768A (ko) 2015-05-27
CN104641449A (zh) 2015-05-20
EP2896064A1 (de) 2015-07-22
CN104641449B (zh) 2018-10-23
US20150221485A1 (en) 2015-08-06
JP6341917B2 (ja) 2018-06-13
TWI550116B (zh) 2016-09-21
KR102111817B1 (ko) 2020-05-18
EP2896064B1 (de) 2020-02-26
TW201413028A (zh) 2014-04-01
JP2015533940A (ja) 2015-11-26

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Effective date: 20220930