KR102111817B1 - 관형 타겟 - Google Patents

관형 타겟 Download PDF

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Publication number
KR102111817B1
KR102111817B1 KR1020157005831A KR20157005831A KR102111817B1 KR 102111817 B1 KR102111817 B1 KR 102111817B1 KR 1020157005831 A KR1020157005831 A KR 1020157005831A KR 20157005831 A KR20157005831 A KR 20157005831A KR 102111817 B1 KR102111817 B1 KR 102111817B1
Authority
KR
South Korea
Prior art keywords
target
connecting piece
target body
locking means
bodies
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020157005831A
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English (en)
Korean (ko)
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KR20150056768A (ko
Inventor
발터 무트슐레히너
안드레 드론호퍼
크리스티안 린케
Original Assignee
플란제 에스이
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 플란제 에스이 filed Critical 플란제 에스이
Publication of KR20150056768A publication Critical patent/KR20150056768A/ko
Application granted granted Critical
Publication of KR102111817B1 publication Critical patent/KR102111817B1/ko
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3414—Targets
    • H01J37/342—Hollow targets
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3414—Targets
    • H01J37/3423—Shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3435—Target holders (includes backing plates and endblocks)
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32—Processing objects by plasma generation
    • H01J2237/33—Processing objects by plasma generation characterised by the type of processing
    • H01J2237/332—Coating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
  • Connection Of Plates (AREA)
KR1020157005831A 2012-09-17 2013-09-13 관형 타겟 Active KR102111817B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
ATGM365/2012 2012-09-17
ATGM365/2012U AT13609U1 (de) 2012-09-17 2012-09-17 Rohrförmiges Target
PCT/AT2013/000152 WO2014040100A1 (de) 2012-09-17 2013-09-13 Rohrförmiges target

Publications (2)

Publication Number Publication Date
KR20150056768A KR20150056768A (ko) 2015-05-27
KR102111817B1 true KR102111817B1 (ko) 2020-05-18

Family

ID=50277396

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020157005831A Active KR102111817B1 (ko) 2012-09-17 2013-09-13 관형 타겟

Country Status (8)

Country Link
US (1) US20150221485A1 (enExample)
EP (1) EP2896064B1 (enExample)
JP (1) JP6341917B2 (enExample)
KR (1) KR102111817B1 (enExample)
CN (1) CN104641449B (enExample)
AT (1) AT13609U1 (enExample)
TW (1) TWI550116B (enExample)
WO (1) WO2014040100A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014102407B4 (de) * 2014-02-25 2024-07-18 Sindlhauser Materials Gmbh Sputtertargetanordnung
US9992917B2 (en) 2014-03-10 2018-06-05 Vulcan GMS 3-D printing method for producing tungsten-based shielding parts
AT14911U1 (de) * 2015-05-06 2016-08-15 Plansee Se Rohrtarget
US11158491B2 (en) * 2017-06-01 2021-10-26 Oerlikon Surface Solutions Ag, Pfäffikon Target assembly for safe and economic evaporation of brittle materials
CN108486540B (zh) * 2018-05-16 2019-07-02 上海大学 一种旋转靶材绑定方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020096430A1 (en) * 2001-01-19 2002-07-25 W. C. Heraeus Gmbh & Co. Kg. Hollow cylindrical cathode sputtering target and process for producing it
US20040159539A1 (en) * 2003-02-13 2004-08-19 Crowley Daniel T. Cylindrical magnetron target and spindle apparatus
US20090208280A1 (en) * 2008-02-15 2009-08-20 Bekaert Advanced Coatings Multiple grooved vacuum coupling
WO2012002383A1 (ja) * 2010-06-28 2012-01-05 アルバックテクノ株式会社 ターゲット取付機構

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5738921A (en) * 1993-08-10 1998-04-14 E. Khashoggi Industries, Llc Compositions and methods for manufacturing sealable, liquid-tight containers comprising an inorganically filled matrix
US5591314A (en) * 1995-10-27 1997-01-07 Morgan; Steven V. Apparatus for affixing a rotating cylindrical magnetron target to a spindle
US6551477B2 (en) * 2000-09-25 2003-04-22 Isoflux, Inc. Interlocking cylindrical magnetron cathodes and targets
US20060096855A1 (en) * 2004-11-05 2006-05-11 Richard Newcomb Cathode arrangement for atomizing a rotatable target pipe
DE202006018079U1 (de) * 2006-03-02 2007-03-29 FNE Forschungsinstitut für Nichteisen-Metalle Freiberg GmbH Targetanordnung
DE102006009749A1 (de) * 2006-03-02 2007-09-06 FNE Forschungsinstitut für Nichteisen-Metalle Freiberg GmbH Targetanordnung
DE102006017455A1 (de) * 2006-04-13 2007-10-25 Applied Materials Gmbh & Co. Kg Rohrkathode
JP5576562B2 (ja) * 2010-07-12 2014-08-20 マテリオン アドバンスト マテリアルズ テクノロジーズ アンド サービシーズ インコーポレイティド 回転式ターゲット裏当て管結合用組立

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020096430A1 (en) * 2001-01-19 2002-07-25 W. C. Heraeus Gmbh & Co. Kg. Hollow cylindrical cathode sputtering target and process for producing it
US20040159539A1 (en) * 2003-02-13 2004-08-19 Crowley Daniel T. Cylindrical magnetron target and spindle apparatus
US20090208280A1 (en) * 2008-02-15 2009-08-20 Bekaert Advanced Coatings Multiple grooved vacuum coupling
WO2012002383A1 (ja) * 2010-06-28 2012-01-05 アルバックテクノ株式会社 ターゲット取付機構

Also Published As

Publication number Publication date
KR20150056768A (ko) 2015-05-27
US20150221485A1 (en) 2015-08-06
TWI550116B (zh) 2016-09-21
EP2896064B1 (de) 2020-02-26
JP6341917B2 (ja) 2018-06-13
WO2014040100A1 (de) 2014-03-20
CN104641449B (zh) 2018-10-23
EP2896064A1 (de) 2015-07-22
CN104641449A (zh) 2015-05-20
AT13609U1 (de) 2014-04-15
TW201413028A (zh) 2014-04-01
JP2015533940A (ja) 2015-11-26

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