CN104576562A - Packaging structure for fingerprint identification chip - Google Patents
Packaging structure for fingerprint identification chip Download PDFInfo
- Publication number
- CN104576562A CN104576562A CN201410812446.4A CN201410812446A CN104576562A CN 104576562 A CN104576562 A CN 104576562A CN 201410812446 A CN201410812446 A CN 201410812446A CN 104576562 A CN104576562 A CN 104576562A
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- China
- Prior art keywords
- fingerprint recognition
- recognition chip
- fingerprint
- packaging structure
- conductive electrode
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/568—Temporary substrate used as encapsulation process aid
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/04105—Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L2224/19—Manufacturing methods of high density interconnect preforms
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L2224/20—Structure, shape, material or disposition of high density interconnect preforms
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/82—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
- H01L2224/82001—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI] involving a temporary auxiliary member not forming part of the bonding apparatus
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/1015—Shape
- H01L2924/10155—Shape being other than a cuboid
- H01L2924/10156—Shape being other than a cuboid at the periphery
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
- H01L2924/1816—Exposing the passive side of the semiconductor or solid-state body
- H01L2924/18162—Exposing the passive side of the semiconductor or solid-state body of a chip with build-up interconnect
Abstract
The invention relates to a packaging structure for a fingerprint identification chip. The packaging structure comprises a columnar conductive electrode, a fingerprint identification chip and a plastic package body, wherein the columnar conductive electrode and the fingerprint identification chip are arranged in the plastic package body; the upper surface and the lower surface of the columnar conductive electrode, and an electrode welding plate and a fingerprint acquisition region of the fingerprint identification chip are exposed outside the plastic package body; the columnar conductive electrode is connected with the electrode welding plate of the fingerprint identification chip through a conductive line; an insulated protection layer is arranged on the conductive line; an acquisition protection region is arranged on the fingerprint acquisition region of the fingerprint identification chip. The packaging structure does not have special requirements on the fingerprint identification chip, and the whole packaging structure is ultrathin.
Description
Technical field
The present invention relates to chip encapsulation technology field, particularly relate to a kind of fingerprint recognition chip-packaging structure.
Background technology
In recent years, along with the progress of society and the development of technology, the application of electronic commerce affair on Intelligent mobile equipment such as mobile phone wallet, mobile banking, shopping at network are increasingly extensive.The importance of person identification and personal information security progressively receives the concern of people.The public is also more and more higher for the requirement of integrated electronic devices and components performance and the network information security.Fingerprint recognition, as the one of biometrics identification technology, is applied more and more widely with its remarkable advantage in security and convenience.
Especially for mobile terminal, such as mobile phone, notebook computer, dull and stereotyped computer, digital camera etc., the demand for Information Security is more outstanding.How to make fingerprint Identification sensor encapsulating structure should at mobile electronic device, as smart mobile phone etc., and the image sensed be more clear and the efficiency that improves fingerprint recognition is the problem that industry continues to study.
Existing popular fingerprint recognition chip-packaging structure as shown in Figure 1, first on chip, 100 do groove process, by line transitions electrode pad 101 in groove, chip 100 is mounted on substrate 200, by going between, the pad 101 in groove is connected with pad on substrate 201 by 300 bondings.Existing fingerprint recognition chip package process is complicated, and difficulty larger (particularly guttering corrosion technique, the excessive glue of sealing adhesive process controls), require high to chip design, yield is not high, and overall package thickness is difficult to reduce.
Summary of the invention
Technical matters to be solved by this invention is to provide a kind of fingerprint recognition chip-packaging structure, particular/special requirement is not had to fingerprint recognition chip, technique is simple, and can carry out wafer level processing, efficiency is high, cycle is short, thickness after encapsulation and chip thickness close, overall package structure is ultra-thin, chip package process and substrate process technology is combined together, application is more extensive, can meet the frivolous demand of consumer electronics.
The technical solution adopted for the present invention to solve the technical problems is: provide a kind of fingerprint recognition chip-packaging structure, comprises post-like conductive electrode, fingerprint recognition chip and plastic-sealed body, has described post-like conductive electrode and fingerprint recognition chip in described plastic-sealed body; The thickness of described fingerprint recognition chip is identical with the height of post-like conductive electrode, and electrode pad and the fingerprint collecting district of the upper surface of described post-like conductive electrode, lower surface, described fingerprint recognition chip are exposed to outside plastic-sealed body; Described post-like conductive electrode is connected by conducting wire with the electrode pad of fingerprint recognition chip; Described conducting wire is provided with one deck insulating protective layer; The fingerprint collecting district of described fingerprint recognition chip is provided with collection protective seam.
Described plastic-sealed body is made up of epoxy resin.
The Mohs value of described collection protective seam is greater than 7H, and specific inductive capacity is greater than 6.
Described collection protective seam is glassivation, ceramic protective layer or protective finish.
Beneficial effect
Owing to have employed above-mentioned technical scheme, the present invention compared with prior art, there is following advantage and good effect: the present invention does not need substrate, support plate can carry out the disposable encapsulation of whole wafer, again chip top electrode pad is connected with column conductive electrode on support plate by the mode of cabling, overall package thickness can reduce, make the thickness after encapsulation and chip thickness close, overall package structure is ultra-thin, chip package process and substrate process technology are combined together, application is more extensive, can meet the frivolous demand of consumer electronics.
Accompanying drawing explanation
Fig. 1 is fingerprint identification chip encapsulating structure schematic diagram in prior art;
Fig. 2 is encapsulating structure schematic diagram of the present invention;
Fig. 3-Figure 10 is the process schematic of a kind of method for packing in the present invention;
Figure 11 is another kind of encapsulating structure schematic diagram in the present invention;
Figure 12-Figure 16 is the process schematic of another kind of method for packing in the present invention;
Figure 17 is the encapsulating structure schematic diagram that in the present invention, another kind of method for packing is formed;
Figure 18 is the another kind of encapsulating structure schematic diagram that in the present invention, another kind of method for packing is formed.
Embodiment
Below in conjunction with specific embodiment, set forth the present invention further.Should be understood that these embodiments are only not used in for illustration of the present invention to limit the scope of the invention.In addition should be understood that those skilled in the art can make various changes or modifications the present invention, and these equivalent form of values fall within the application's appended claims limited range equally after the content of having read the present invention's instruction.
Embodiments of the present invention relate to a kind of fingerprint recognition chip-packaging structure, as shown in Figure 2, this encapsulating structure does not need substrate, support plate can carry out the disposable encapsulation of whole wafer, again chip top electrode pad is connected with support plate top electrode pad by the mode of cabling, and overall package thickness can reduce.This encapsulating structure comprises: post-like conductive electrode 200, fingerprint recognition chip 300, plastic-sealed body 400.Described post-like conductive electrode 200 and fingerprint recognition chip 300 is had in described plastic-sealed body 400; The thickness of described fingerprint recognition chip 300 is identical with the height of post-like conductive electrode 200, and electrode pad 301 and the fingerprint collecting district of the upper surface of described post-like conductive electrode 200, lower surface, described fingerprint recognition chip 300 are exposed to outside plastic-sealed body; Described post-like conductive electrode 200 is connected by conducting wire 500 with the electrode pad 301 of fingerprint recognition chip 300; Described conducting wire 500 is provided with one deck insulating protective layer 600; The fingerprint collecting district of described fingerprint recognition chip 300 is provided with collection protective seam.
Support plate 100 carries out the making of post-like conductive pole, fingerprint recognition chip 300 (similar with post-like conductive electrode height) is mounted on support plate 100, then spin coating is passed through, the modes such as spraying or injection moulding make plastic-sealed body 400, and pass through exposure imaging, the electrode pad of fingerprint recognition chip 300 and fingerprint collecting district expose by the mode such as laser ablation or wet etching, pass through sputtering etching, chemogenic deposit, the mode of printing or spraying makes conducting wire 500 and is connected with the electrode pad on support plate by the electrode pad on chip, conducting wire makes one deck insulating protective layer 600, attachment glass, ceramic protective layer 700 or making one deck protective finish 800 pairs of fingerprint identification area are protected, this protective seam Mohs value is greater than 7H, specific inductive capacity is greater than 6.
The present invention can adopt following method for packing to obtain, and comprises the following steps:
(1) support plate 100 is provided, this support plate 100 can be in metal, glass, silicon crystal unit, epoxy resin base plate any one, see Fig. 3.
(2) on support plate, make multiple post-like conductive electrodes (20-200um) of certain altitude (with the consistency of thickness of fingerprint recognition chip) on 100, post-like conductive electrode makes by the mode of chemogenic deposit, attachment, sees Fig. 4.
(3) fingerprint recognition chip 300 is mounted on support plate 100, sees Fig. 5.
(4) make insulating protective layer to form plastic-sealed body 400 by modes such as spin coating, spraying or plastic packagings, this insulating protective layer can use epoxy resin to make, such as: poly-sub-acyl ethamine or phenylpropyl alcohol cyclobutane.As shown in Figure 6, the electrode pad of the upper surface of described post-like conductive electrode, lower surface, described fingerprint recognition chip and fingerprint collecting district are exposed to outside plastic-sealed body.
(5) be electrically connected by the electrode pad of conducting wire 500 by post-like conductive pole and fingerprint recognition chip, see Fig. 7.Wherein, conducting wire makes by the mode of sputtering etching, chemogenic deposit, printing or spraying.
(6) on conducting wire 500, make insulating protective layer 600, insulating protective layer 600 is made on conducting wire by the mode of gluing exposure imaging mode, printing and spraying, sees Fig. 8.
(7) in the fingerprint collecting district of fingerprint recognition chip, collection protective seam is made.Protective seam (see Fig. 9) is gathered as made in the mode of the fingerprint collecting district of fingerprint recognition chip attachment glass or pottery 700; Collection protective seam (see Figure 10) is made in the mode of the plating of the fingerprint collecting district of fingerprint recognition chip or spray-on coating 800
(8) remove support plate, obtain encapsulating structure.Make the encapsulating structure of collection protective seam as shown in Figure 2 in the mode of the fingerprint collecting district of fingerprint recognition chip attachment glass or pottery 700, make the encapsulating structure of collection protective seam as shown in figure 11 in the mode of the plating of the fingerprint collecting district of fingerprint recognition chip or spray-on coating 800.
The present invention also can adopt following method for packing to obtain, and step (the 1)-step (3) of the method is identical with above-mentioned method for packing, does not repeat them here.
(4) make insulating protective layer to form plastic-sealed body 400 by modes such as spin coating, spraying or plastic packagings, this insulating protective layer can use epoxy resin to make, such as: poly-sub-acyl ethamine or phenylpropyl alcohol cyclobutane.As shown in figure 12, post-like conductive electrode surface and fingerprint recognition chip surface all cover by described plastic-sealed body.
(5) by the mode of exposure imaging or laser ablation, the electrode pad of post-like conductive electrode, fingerprint recognition chip and fingerprint collecting district are come out, see Figure 13.
(6) be electrically connected with the electrode pad 301 of fingerprint recognition chip 300 with the electrode pad 101 of the mode of unilateral cabling by substrate 100 by conducting wire 500; and on conducting wire 500, make insulating protective layer 600; insulating protective layer electroplates by printing, gold-tinted or the mode of injection conducting wire realizes, and sees Figure 14.
(7) in the fingerprint collecting district of fingerprint recognition chip, collection protective seam is made.Protective seam (see Figure 15) is gathered as made in the mode of the fingerprint collecting district of fingerprint recognition chip attachment glass or pottery 700; Collection protective seam (see Figure 16) is made in the mode of the plating of the fingerprint collecting district of fingerprint recognition chip or spray-on coating 800.
(8) remove support plate, obtain encapsulating structure.Make the encapsulating structure of collection protective seam as shown in figure 17 in the mode of the fingerprint collecting district of fingerprint recognition chip attachment glass or pottery 700, make the encapsulating structure of collection protective seam as shown in figure 18 in the mode of the plating of the fingerprint collecting district of fingerprint recognition chip or spray-on coating 800.
Be not difficult to find, the present invention does not need substrate, support plate can carry out the disposable encapsulation of whole wafer, again chip top electrode pad is connected with support plate top electrode pad by the mode of cabling, and overall package thickness can reduce, make the thickness after encapsulation and chip thickness close, overall package structure is ultra-thin, chip package process and substrate process technology are combined together, application is more extensive, can meet the frivolous demand of consumer electronics.
Claims (4)
1. a fingerprint recognition chip-packaging structure, comprises post-like conductive electrode, fingerprint recognition chip and plastic-sealed body, it is characterized in that, has described post-like conductive electrode and fingerprint recognition chip in described plastic-sealed body; The thickness of described fingerprint recognition chip is identical with the height of post-like conductive electrode, and electrode pad and the fingerprint collecting district of the upper surface of described post-like conductive electrode, lower surface, described fingerprint recognition chip are exposed to outside plastic-sealed body; Described post-like conductive electrode is connected by conducting wire with the electrode pad of fingerprint recognition chip; Described conducting wire is provided with one deck insulating protective layer; The fingerprint collecting district of described fingerprint recognition chip is provided with collection protective seam.
2. fingerprint recognition chip-packaging structure according to claim 1, is characterized in that, described plastic-sealed body is made up of epoxy resin.
3. fingerprint recognition chip-packaging structure according to claim 1, is characterized in that, the Mohs value of described collection protective seam is greater than 7H, and specific inductive capacity is greater than 6.
4. fingerprint recognition chip-packaging structure according to claim 1, is characterized in that, described collection protective seam is glassivation, ceramic protective layer or protective finish.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410812446.4A CN104576562A (en) | 2014-12-23 | 2014-12-23 | Packaging structure for fingerprint identification chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410812446.4A CN104576562A (en) | 2014-12-23 | 2014-12-23 | Packaging structure for fingerprint identification chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104576562A true CN104576562A (en) | 2015-04-29 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410812446.4A Pending CN104576562A (en) | 2014-12-23 | 2014-12-23 | Packaging structure for fingerprint identification chip |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105224934A (en) * | 2015-10-26 | 2016-01-06 | 联想(北京)有限公司 | A kind of fingerprint sensor and electronic equipment |
| CN105789064A (en) * | 2016-03-18 | 2016-07-20 | 深圳芯邦科技股份有限公司 | Package method and package structure for fingerprint identification chip |
| CN107066946A (en) * | 2017-03-13 | 2017-08-18 | 广东欧珀移动通信有限公司 | fingerprint module, display screen and mobile terminal |
| CN107481980A (en) * | 2017-09-22 | 2017-12-15 | 浙江卓晶科技有限公司 | A kind of thin type fingerprint chip packaging method and encapsulating structure |
| EP3639198A4 (en) * | 2017-06-16 | 2020-12-23 | Fingerprint Cards AB | Fingerprint sensor module and method for manufacturing a fingerprint sensor module |
| CN112366140A (en) * | 2020-11-11 | 2021-02-12 | 济南南知信息科技有限公司 | Multi-memory-chip stacked packaging component for 5G intelligent equipment and preparation method thereof |
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| WO2013172604A1 (en) * | 2012-05-15 | 2013-11-21 | 크루셜텍(주) | Fingerprint sensor package and method for manufacturing same |
| CN104201115A (en) * | 2014-09-12 | 2014-12-10 | 苏州晶方半导体科技股份有限公司 | Wafer-level fingerprint recognition chip packaging structure and method |
| CN204303796U (en) * | 2014-12-23 | 2015-04-29 | 宁波芯健半导体有限公司 | Fingerprint recognition chip-packaging structure |
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2014
- 2014-12-23 CN CN201410812446.4A patent/CN104576562A/en active Pending
Patent Citations (4)
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| US20020109137A1 (en) * | 2001-01-31 | 2002-08-15 | Norio Sato | Surface shape recognition sensor and method of manufacturing the same |
| WO2013172604A1 (en) * | 2012-05-15 | 2013-11-21 | 크루셜텍(주) | Fingerprint sensor package and method for manufacturing same |
| CN104201115A (en) * | 2014-09-12 | 2014-12-10 | 苏州晶方半导体科技股份有限公司 | Wafer-level fingerprint recognition chip packaging structure and method |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105224934A (en) * | 2015-10-26 | 2016-01-06 | 联想(北京)有限公司 | A kind of fingerprint sensor and electronic equipment |
| CN105789064A (en) * | 2016-03-18 | 2016-07-20 | 深圳芯邦科技股份有限公司 | Package method and package structure for fingerprint identification chip |
| CN107066946A (en) * | 2017-03-13 | 2017-08-18 | 广东欧珀移动通信有限公司 | fingerprint module, display screen and mobile terminal |
| CN107066946B (en) * | 2017-03-13 | 2019-10-01 | Oppo广东移动通信有限公司 | Fingerprint mould group, display screen and mobile terminal |
| EP3639198A4 (en) * | 2017-06-16 | 2020-12-23 | Fingerprint Cards AB | Fingerprint sensor module and method for manufacturing a fingerprint sensor module |
| CN107481980A (en) * | 2017-09-22 | 2017-12-15 | 浙江卓晶科技有限公司 | A kind of thin type fingerprint chip packaging method and encapsulating structure |
| CN112366140A (en) * | 2020-11-11 | 2021-02-12 | 济南南知信息科技有限公司 | Multi-memory-chip stacked packaging component for 5G intelligent equipment and preparation method thereof |
| CN112366140B (en) * | 2020-11-11 | 2022-09-23 | 苏州钜升精密模具有限公司 | Multi-memory-chip stacked packaging component for 5G intelligent equipment and preparation method thereof |
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Application publication date: 20150429 |