CN206489574U - A kind of fingerprint recognition module cover plate and the fingerprint recognition module with the cover plate - Google Patents
A kind of fingerprint recognition module cover plate and the fingerprint recognition module with the cover plate Download PDFInfo
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- CN206489574U CN206489574U CN201620666764.9U CN201620666764U CN206489574U CN 206489574 U CN206489574 U CN 206489574U CN 201620666764 U CN201620666764 U CN 201620666764U CN 206489574 U CN206489574 U CN 206489574U
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- Prior art keywords
- fingerprint recognition
- cover plate
- chip
- recognition module
- electrically conductive
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Abstract
The utility model provides a kind of fingerprint recognition module, including a fingerprint recognition chip and a fingerprint recognition module cover plate.The fingerprint recognition module cover plate includes integrally formed cover plate main body portion, chip lid and sets portion and the accepting groove surrounded jointly by cover plate main body portion and the chip lid portion of setting.The fingerprint recognition chip is oppositely arranged and interfixed with the chip lid portion of setting.Fingerprint recognition module of the present utility model simplifies module group assembling step by the design of integration, reduces production difficulty, strengthens the protection to electronic equipment, user is experienced the good experience that ceramic texture is brought in use.It is packaged simultaneously by the way that fingerprint recognition module is embedded in accepting groove, reduces the space shared by module, realizes the slimming design of electronic equipment.
Description
Technical field
The utility model is related to fingerprint identification technology field, more particularly to a kind of fingerprint recognition module cover plate and with the lid
The fingerprint recognition module of plate.
Background technology
Common fingerprint recognition module can be divided into electric capacity swiping formula and touch, optical imagery type and mechanical compression formula, its
In requirement of the swiping formula to processor and software algorithm it is very high, touch sensitivity is high but assembly cost coordinates difficulty with yield
Greatly, optical imagery and mechanical compression formula resolution and sensitivity is relatively low and modular structure is larger, are unfavorable for electronic equipment slimization
Design.
Current capacitance touching control type fingerprint recognition module is more popular, and such die set mainly includes medium cover plate, with being situated between
The bonding fingerprint recognition chip of matter cover plate, the FPC for connecting fingerprint recognition chip, the reinforcement of enhancing FPC
The ground wire of piece, the connector of connection FPC and processor and connection finger and processor.Now, dielectric cover plate one
As use sapphire, dielectric ceramic, glass or coating, the group of cover plate and chip need to be completed by gluing technology in assembling
Close, and by after assembling module carry out it is secondary be assembled in the corresponding position of electronic equipment, technical process is more complicated, is unfavorable for yield
Lifting, while also increasing the volume of electronic equipment.
Utility model content
The purpose of this utility model is to overcome the deficiencies in the prior art there is provided a kind of simplified fingerprint recognition module group
Fill the fingerprint recognition module cover plate of step.
On the other hand, a kind of fingerprint recognition module with the cover plate of offer is provided.
The purpose of this utility model and solve its technical problem using following technical scheme to realize：
A kind of cover plate of fingerprint recognition module, including integrally formed cover plate main body portion and chip lid set portion, the cover plate
Main part and the chip lid portion of setting are integrally formed, and the material in the cover plate main body portion is metal, and the chip lid sets portion as metal oxygen
Compound ceramics.
In wherein one embodiment, the cover plate main body portion includes being formed at the layer of ceramic film on its surface, described
Ceramic membrane is to set portion's identical metal oxide ceramic with the chip lid.
In wherein one embodiment, the ceramic film thickness is 50~150 μm.
In wherein one embodiment, the chip lid sets portion's thickness as 50~300 μm.
In wherein one embodiment, the cover plate also includes the first electrically conductive film and the second electrically conductive film, and described first leads
Body film and the second electrically conductive film are respectively formed at relative two surfaces in the cover plate main body portion, and first electrically conductive film is around the core
The piece lid portion of setting is set, and first electrically conductive film and the second electrically conductive film form conductive path by the cover plate main body portion, described
Second electrically conductive film is used for the FPC for being electrically connected to a fingerprint recognition chip.
In wherein one embodiment, first electrically conductive film and the second electrically conductive film are metal coating, and are prepared described
The material of first electrically conductive film and the second electrically conductive film is other metals in addition to aluminium, magnesium, titanium and its alloy.
In addition, the utility model also provides a kind of fingerprint recognition module, including fingerprint recognition chip and refer to as described above
Line recognizes module cover plate, and the fingerprint recognition chip is oppositely arranged and interfixed with the chip lid portion of setting.
In wherein one embodiment, the cover plate also encloses jointly including setting portion and cover plate main body portion by the chip lid
Into accepting groove, the fingerprint recognition module also includes substrate and FPC, the fingerprint recognition chip, substrate and soft
Property wiring board is cascading, and the FPC is covered at the opening of the accepting groove, the fingerprint recognition core
Piece and substrate are contained in the accepting groove, and the encapsulation for being used for sealing fingerprint recognition chip and substrate is filled with the accepting groove
Glue.
In wherein one embodiment, the fingerprint recognition module also includes being stacked at FPC on substrate
The dispensing hole with the accepting groove insertion is offered on the stiffening plate on surface, the stiffening plate, the dispensing hole is used to inject institute
State encapsulation glue.
Above-mentioned fingerprint recognition module at least has the advantage that：
Cover plate main body portion and the chip lid portion of setting be integrally formed design, it is to avoid cover plate main body portion and institute described in assembling process
State the complicated splicing process that chip lid sets portion；
Fingerprint recognition module is embedded in the accepting groove of cover plate, it is not necessary to which the fingerprint sensing module is individually sealed
Dress, reduces the space that the fingerprint recognition module takes, is conducive to electronic equipment thin typeization to design；
Stiffening plate in fingerprint recognition module opens up dispensing hole, and the injection of convenient encapsulation glue is further completed to fingerprint
The encapsulation and protection of identification chip, technical process are simple, and effect is better than chip direct package.
Brief description of the drawings
Fig. 1 is the electronic equipment schematic rear view with the utility model fingerprint recognition module；
Fig. 2 be in Fig. 1 electronic equipment along line A-A schematic cross-sectional view；
Fig. 3 is the schematic cross-sectional view for manufacturing the cover plate base material of electronic equipment described in Fig. 2；
Fig. 4 is the schematic cross-sectional view of the cover plate of electronic equipment shown in Fig. 2.
Wherein, description of reference numerals：
100：Electronic equipment
10：Fingerprint recognition module
11：Cover plate
11′：Base material
111：Cover plate main body portion
1111：Ceramic membrane
1112：Metal coating
1113：Ground wire
112：Chip lid sets portion
112′：Dielectric Panel area
113：Accepting groove
12：Fingerprint recognition chip
13：Substrate
14：FPC
141：Interface
15：Stiffening plate
151：Dispensing hole
16：Connector
17：Lead
18：Glued membrane
19：Encapsulate glue
Embodiment
Further to illustrate that the utility model is to reach technological means and effect that predetermined utility model purpose is taken,
Below in conjunction with accompanying drawing and preferred embodiment, to according to the utility model proposes a kind of fingerprint recognition module and electronic equipment its tool
Body embodiment, structure, feature and its effect, are described in detail as follows.
Refer to shown in Fig. 1, a kind of electronic equipment 100 with fingerprint recognition module 10 of the utility model design.
In present embodiment, the electronic equipment 100 is illustrated by taking a mobile phone as an example.In other embodiments, the electronics is set
Standby 100 can also be financial terminal device in tablet personal computer, notebook computer and banking system etc..
Refer to shown in Fig. 1 and Fig. 2, the fingerprint recognition module 10 includes cover plate 11, fingerprint recognition chip 12, substrate
13rd, FPC 14 and stiffening plate 15.The fingerprint recognition chip 12, the substrate 13, the FPC 14 and
The stiffening plate 15 is cascading.
The cover plate 11 includes integrally formed cover plate main body portion 111 and chip lid sets portion 112.The cover plate 11 also includes
One sets the accepting groove 113 that portion 112 is surrounded jointly by the cover plate main body portion 111 and the chip lid.The accepting groove 113 is used for
Collecting is stacked in the fingerprint recognition chip 12, substrate 13, FPC 14 and stiffening plate 15 together.The cover plate
The material of main part 111 be metal, the chip lid set the material in portion 112 as with the same material shape of cover plate main body portion 111
Into oxide ceramics.For example, in the present embodiment, the material in the cover plate main body portion 111 is aluminium alloy, the chip lid
If the material in portion 112 is aluminium oxide ceramics.It is appreciated that in other embodiments, the material in the cover plate main body portion 111 is also
Can be almag or titanium alloy, the chip lid sets the material in portion 112 as corresponding almag or titanium alloy
Oxide ceramics.
The cover plate main body portion 111 and the chip lid set portion 112 and be formed in one design, it is to avoid prior art middle finger
Complicated splicing process between the cover sheet and electronic equipment object of line identification module.In the present embodiment, the cover plate
11 be the bonnet of the electronic equipment 100.
The chip lid sets portion 112 as oxide ceramics, and its hardness is high, ceramic texture is strong, anti-fingerprint and with good
Pliability, can realize protection setting in setting the fingerprint recognition chip in the corresponding accepting groove 113 in portion 112 with the chip lid
12.In the present embodiment, the thickness that the chip lid sets portion 112 is preferably 50~300 μm.Portion 112 is set in guarantee chip lid
On the premise of hardness, relatively thin thickness can improve the fingerprint image quality of the collection of fingerprint recognition chip 12.
Further, the surface in the cover plate main body portion 111 is also formed with layer of ceramic film 1111, the ceramic membrane 1111
Portion 112 is set with the chip lid to be formed from the same material, i.e. ceramic membrane 1111 is membrane of oxide ceramics.Ceramic membrane 1111 causes
The cover plate main body portion 111 has fine and smooth ceramic texture, and with higher intensity.For example, when ceramic membrane 1111 is oxidation
During aluminium ceramic membrane, its intensity is 3~4 times of general aluminium alloy so that the integral hardness in cover plate main body portion 111 is accordingly carried
Rise, protection setting can be realized in each component of the lower section of cover plate main body portion 111.In the present embodiment, the ceramics
The thickness of film 1111 is preferably 50~150 μm.
The cover plate 11 also includes the first electrically conductive film 1112 and the second electrically conductive film 1113.First electrically conductive film 1112 and
Two branches are formed on relative two surfaces in the cover plate main body portion 111, and first electrically conductive film 1112 is set around the chip lid
Portion 112 is set, and the electrically conductive film 1113 of first electrically conductive film 1112 and second forms conductive logical by the cover plate main body portion 111
Road.In the present embodiment, the electrically conductive film 1113 of the first electrically conductive film 1112 and second is metal coating, forms described first
The material of the electrically conductive film 1113 of electrically conductive film 1112 and second is the metal material that is not acted on by differential arc oxidation, including but not limited to nickel,
Copper, silver, gold or iron etc..Certainly, in other embodiments, the electrically conductive film 1113 of the first electrically conductive film 1112 and second is prepared
Metal can also be other metals in addition to aluminium, magnesium, titanium and its alloy.The shape of first electrically conductive film 1112 with it is described
The shape that chip lid sets portion 112 is adapted, and can be circular, rectangle or polygon etc..
The fingerprint recognition chip 12 is used for the fingerprint image for gathering user, composition and the original of the fingerprint recognition chip 12
Reason can use any suitable prior art, will not be repeated here.Relative two surfaces of the fingerprint recognition chip 12 lead to respectively
The gluing of glued membrane 18 is crossed to set in portion 112 and the substrate 13 in the chip lid.The fingerprint recognition chip 12 is real by lead 17
Now it is electrically connected with and signal transmission with the substrate 13.Specific in present embodiment, the lead 17 is gold thread.Certainly, exist
In other embodiment, the lead 17 can also be times in aluminum steel, copper cash, al-mg-si alloy line and Al-zn-mg-cu alloy line
Meaning is a kind of.
The substrate 13 is fixed in the flexibility through SMT (Surface Mount Technology, surface mounting technology)
On wiring board 14.Specifically, in the upper surface print solder paste of FPC 14, the substrate 13 is positioned over into the flexibility
At the upper surface print solder paste of wiring board 14, the electric connection of the FPC 14 and the substrate 13 is realized.
FPC 14 is covered at the opening of the accepting groove 113, so that by the fingerprint recognition chip 12 and base
Plate 13 is contained in the accepting groove 113 completely.The one end of the FPC 14 away from the substrate 13 is provided with connection
Device 16.The connector 16 is used for the processor (not shown) for being connected to the electronic equipment 100, so as to realize the flexible wires
Electric connection between road plate 14 and the processor of the electronic equipment 100, finally realize the fingerprint recognition chip 12 with it is described
Electric connection between the processor of electronic equipment 100.
Ground connection line interface 141 is additionally provided with the FPC 14.The interface 141 is electrically connected to the cover plate master
On second electrically conductive film 1113 in body portion 111, so as to realize the processor of first electrically conductive film 1112 and the electronic equipment 100
Between electric connection and signal transmission.When user's finger, which touches the chip lid, sets the first electrically conductive film 1112 in portion 112,
Finger transmits the electric current of a very little to the first electrically conductive film 1112, produces charge inducing.The processor of electronic equipment 100 sensing
During to charge inducing, start fingerprint recognition chip 12 and start to gather user fingerprint image.Meanwhile, led when user's finger touches first
During body film 1112, the electronic equipment 100 can also pass through second electrically conductive film 1113 and human finger release electrostatic, it is to avoid
Other function elements in electronic equipment 100 described in electrostatic damage.In the present embodiment, the interface 141 passes through conducting resinl (figure
Do not show) it is electrically connected to second electrically conductive film 1113 in the cover plate main body portion 111.
Stiffening plate 15 is fixed on the side that the FPC 14 deviates from the substrate 13, knows for carrying the fingerprint
Other chip 12, the substrate 13 and the FPC 14.The stiffening plate 15 can pass through glue and the flexible circuitry
Plate 14 is fixedly connected on together.In the present embodiment, the stiffening plate 15 is steel disc.Certainly, in other embodiment mode,
The stiffening plate 15 can also be hard plastic sheet.
The fingerprint recognition chip 12 in the fingerprint recognition module 10 needs to carry out in vacuum or sealed environment
Work, to ensure that the fingerprint recognition chip 12, not by the corrosion, oxidation such as steam, oxygen in air, extends its service life, institute
So that the fingerprint recognition module 10 needs to seal filling.In the present embodiment, dispensing hole is opened up on the stiffening plate 15
151.The dispensing hole 151 connects with the accepting groove 113, for injecting the sealing fingerprint recognition chip 12, substrate 13
And the encapsulation glue 19 of the grade of lead 17.Encapsulate glue 19 to be molded by crosslinking curing, fingerprint recognition chip 12, base are stated in embedding residence
Plate 13 and the grade element of lead 17, while it is more firm the fingerprint recognition chip 12 is combined with the cover plate 11.In order to reach
More preferable filling effect, the quantity at least two of dispensing hole 151.
The utility model also provides a kind of manufacture method of fingerprint recognition module, and the manufacture method comprises the following steps：
Referring to Fig. 3, providing a base material 11 ', the base material 11 ' includes integrally formed cover plate main body portion 111, dielectric cap
Plate region 112 ' and the accepting groove 113 surrounded by cover plate main body portion 111 and dielectric Panel area 112 '.In the present embodiment,
The material of the base material 11 ' is metal and its alloy, i.e. the cover plate main body portion 111 and the dielectric Panel area 112 '
Material is metal and its alloy.For example, in the present embodiment, the material in the cover plate main body portion 111 is aluminium alloy.Can be with
Understand, in other embodiments, the material in the cover plate main body portion 111 can also be almag or titanium alloy.It is described
The thickness of dielectric Panel area 112 ' is preferably 100~300 μm.
Referring to Fig. 4, evaporation forms the first electrically conductive film 1112 and second respectively on relative two surfaces of the base material 11 '
Electrically conductive film 1113 so that the first electrically conductive film 1112 is around the dielectric Panel area 112 '.Evaporation forms first electrically conductive film
1112 and second electrically conductive film 1113 material for not by the metal material of differential arc oxidation, including but not limited to nickel, copper, silver, Jin Huo
Person's iron etc..Certainly, in other embodiments, the metal for preparing the electrically conductive film 1113 of the first electrically conductive film 1112 and second also may be used
Think other metals in addition to aluminium, magnesium, titanium and its alloy.The electrically conductive film 1113 of first electrically conductive film 1112 and second is not by oxygen
Change, therefore, can be connected with each other between multiple electrically conductive films, to transmit pumping signal and electrostatic protection.In present embodiment
In, the quantity of the electrically conductive film can be two or more.
Differential arc oxidation processing is carried out to base material 11 ', makes the complete oxidation of dielectric Panel area 112 ' to form chip
Lid sets portion 112, and the surface of cover plate main body portion 111 forms layer of ceramic film 1111, obtains the cover plate with ceramic membrane material
Main part 111, so that the cover plate 11 is made.The thickness of the ceramic membrane 1111 is preferably 50~150 μm.
Referring back to Fig. 2, together with stiffening plate 15 is fixedly connected on FPC 14 by glue.Substrate 13 is through SMT
(Surface Mount Technology, surface mounting technology) is fixed on FPC 14.
The surface of fingerprint recognition chip 12 sticks glued membrane 18, the fingerprint recognition chip 12 by the gluing of glued membrane 18 in
On the substrate 13, formation is stacked gradually in fingerprint recognition chip 12 together, substrate 13, FPC 14 and stiffening plate
15。
To fingerprint recognition chip 12 and the welding lead 17 of substrate 13 so that the fingerprint recognition chip 12 is realized and the base
Plate 13 is electrically connected with and signal transmission.
Fingerprint recognition chip 12 sticks glued membrane 18 away from the surface of substrate 13, stacks gradually in fingerprint recognition chip together
12nd, substrate 13, FPC 14 and the gluing of stiffening plate 15 set portion 112 in the chip lid.Accordingly positioned, it is ensured that described
The ground connection line interface 141 reserved on FPC 14 is with the second electrically conductive film 1113 in the cover plate main body portion 111 by leading
Electric glue is electrically connected with and signal transmission.
Dispensing hole 151 is opened up on stiffening plate 15, by the dispensing hole 151 to the encapsulated space of fingerprint recognition module 10
Injection mobility preferably encapsulates glue 19, and crosslinking curing is molded, embedding residence state fingerprint recognition chip 12, substrate 13 and
The grade element of lead 17.
Overall to the fingerprint recognition module 10 to carry out reflow process, solidified glue prevents the fingerprint recognition module later stage
Loosening is produced during use.
Above-mentioned fingerprint recognition module at least has the advantage that：
Cover plate main body portion 111 and chip lid set portion 112 and be integrally formed design, it is to avoid cover plate main body described in assembling process
Portion 111 sets the complicated splicing process in portion 112 with the chip lid；
Fingerprint recognition module 10 is embedded in the accepting groove 113 of cover plate 11, it is not necessary to which the fingerprint sensing module 10 is entered
Row individually encapsulation, reduces the space that the fingerprint recognition module 10 takes, is conducive to electronic equipment thin typeization to design；
Stiffening plate 15 in the fingerprint recognition module 10 opens up dispensing hole 151, and the injection of convenient encapsulation glue 19 enters one
Step completes the encapsulation and protection to fingerprint recognition chip 12, and technical process is simple, and effect is better than chip direct package.
Although it will be appreciated by those of skill in the art that embodiment described herein includes being wrapped in other embodiment
The some features rather than further feature included, but the combination of the feature of different embodiments means in of the present utility model
Within the scope of and form different embodiments.For example, in the following claims, embodiment claimed
One of any mode can use in any combination.
Finally it should be noted that：Embodiment of above is only limited to illustrate the technical solution of the utility model, rather than to it
System；Although the utility model is described in detail with reference to aforementioned embodiments, one of ordinary skill in the art should
Understand：It can still modify to the technical scheme described in aforementioned embodiments, or to which part or whole
Technical characteristic carries out equivalent substitution；And these modifications or replacement, the essence of appropriate technical solution is departed from this practicality newly
The scope of type embodiment technical scheme, it all should cover among claim of the present utility model and the scope of specification.
Claims (9)
1. a kind of fingerprint recognition module cover plate, it is characterised in that the cover plate includes integrally formed cover plate main body portion and chip
Lid sets portion, and the cover plate main body portion and the chip lid portion of setting are integrally formed, and the material in the cover plate main body portion is metal, the chip
Lid sets portion as metal oxide ceramic.
2. fingerprint recognition module cover plate according to claim 1, it is characterised in that the cover plate main body portion includes being formed at
The layer of ceramic film on its surface, the ceramic membrane is to set portion's identical metal oxide ceramic with the chip lid.
3. fingerprint recognition module cover plate according to claim 2, it is characterised in that the ceramic film thickness is 50~150 μ
m。
4. fingerprint recognition module cover plate according to claim 1, it is characterised in that the chip lid set portion's thickness as 50~
300μm。
5. fingerprint recognition module cover plate according to claim 1, it is characterised in that the cover plate also includes the first electrically conductive film
And second electrically conductive film, first electrically conductive film and the second electrically conductive film be respectively formed at relative two surfaces in the cover plate main body portion,
First electrically conductive film is set around the chip lid portion of setting, and first electrically conductive film and the second electrically conductive film pass through the cover plate
Main part formation conductive path, second electrically conductive film is used for the flexible PCB for being electrically connected to a fingerprint recognition chip.
6. fingerprint recognition module cover plate according to claim 5, it is characterised in that first electrically conductive film and the second conductor
Film is metal coating, and it is in addition to aluminium, magnesium, titanium and its alloy to prepare the material of first electrically conductive film and the second electrically conductive film
Other metals.
7. a kind of fingerprint recognition module, including fingerprint recognition chip, it is characterised in that：Also include such as any one of claim 1-6
Described cover plate, the fingerprint recognition chip is oppositely arranged and interfixed with the chip lid portion of setting.
8. fingerprint recognition module according to claim 7, it is characterised in that：The cover plate also includes being set by the chip lid
The accepting groove that portion and cover plate main body portion are surrounded jointly, the fingerprint recognition module also includes substrate and FPC, described
Fingerprint recognition chip, substrate and FPC are cascading, and the FPC is covered on the accepting groove
At opening, the fingerprint recognition chip and substrate are contained in the accepting groove, are filled with and are referred to for sealing in the accepting groove
The encapsulation glue of line identification chip and substrate.
9. fingerprint recognition module according to claim 8, it is characterised in that：Also include being stacked at FPC away from base
The dispensing hole with the accepting groove insertion is offered on the stiffening plate of plate upper surface, the stiffening plate, the dispensing hole is used to note
Enter the encapsulation glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620666764.9U CN206489574U (en) | 2016-06-30 | 2016-06-30 | A kind of fingerprint recognition module cover plate and the fingerprint recognition module with the cover plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620666764.9U CN206489574U (en) | 2016-06-30 | 2016-06-30 | A kind of fingerprint recognition module cover plate and the fingerprint recognition module with the cover plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206489574U true CN206489574U (en) | 2017-09-12 |
Family
ID=59768796
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620666764.9U Expired - Fee Related CN206489574U (en) | 2016-06-30 | 2016-06-30 | A kind of fingerprint recognition module cover plate and the fingerprint recognition module with the cover plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206489574U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107742610A (en) * | 2017-09-25 | 2018-02-27 | 南昌欧菲生物识别技术有限公司 | Manufacture method, fingerprint recognition chip, fingerprint recognition module and electronic installation |
| CN108803943A (en) * | 2018-08-08 | 2018-11-13 | 牧东光电科技有限公司 | A kind of touch panel and preparation method thereof of two-sided blind hole finger print safety identification |
-
2016
- 2016-06-30 CN CN201620666764.9U patent/CN206489574U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107742610A (en) * | 2017-09-25 | 2018-02-27 | 南昌欧菲生物识别技术有限公司 | Manufacture method, fingerprint recognition chip, fingerprint recognition module and electronic installation |
| CN108803943A (en) * | 2018-08-08 | 2018-11-13 | 牧东光电科技有限公司 | A kind of touch panel and preparation method thereof of two-sided blind hole finger print safety identification |
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| CF01 | Termination of patent right due to non-payment of annual fee |
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| CF01 | Termination of patent right due to non-payment of annual fee |