CN206349333U - The encapsulating structure of fingerprint sensor - Google Patents
The encapsulating structure of fingerprint sensor Download PDFInfo
- Publication number
- CN206349333U CN206349333U CN201621262068.8U CN201621262068U CN206349333U CN 206349333 U CN206349333 U CN 206349333U CN 201621262068 U CN201621262068 U CN 201621262068U CN 206349333 U CN206349333 U CN 206349333U
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- fingerprint sensor
- back side
- cover plate
- encapsulating structure
- fingerprint
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Abstract
The utility model provides a kind of encapsulating structure of fingerprint sensor, comprising：Cover plate；Fingerprint sensor, its front is provided with fingerprint sensing area and the weld pad positioned at fingerprint sensing area periphery, and the weld pad electrically leads to the back side of the fingerprint sensor, and the back side of the fingerprint sensor has the first conductive structure electrically connected with weld pad；Fit at the positive back side with the cover plate of the fingerprint sensor；FPC, its back side, which has, sets opening on the second conductive structure, the FPC；The positive back side with the cover plate of the FPC is fitted, and the fingerprint sensor is located in the opening；First conductive structure is electrically connected with second conductive structure.So as to reduce the package dimension of fingerprint sensor to meet electronic product high integration, the demand of high stability, and improve the stability of fingerprint sensor encapsulation.
Description
Technical field
The utility model is related to technical field of semiconductor encapsulation, more particularly to fingerprint sensor encapsulation technology.
Background technology
With the progress of modern society, the importance of person identification and personal information security is progressively by people's
Concern.Because somatic fingerprint has uniqueness and consistency so that fingerprint identification technology has security good, reliability is high, makes
The characteristics of using simple and convenient so that fingerprint identification technology is widely used in protecting the various fields of personal information security.And with
Continuing to develop for science and technology, the information security issue of each electronic product is one of concern main points of technology development all the time.
Especially for mobile terminal, such as mobile phone, notebook computer, the computer of flat board, digital camera, for Information Security
Demand is more prominent, accordingly, and the demand to fingerprint sensing technology increases increasingly.
Due to electronic product continue towards miniaturization and multifunction development, fingerprint identification device encapsulation need to meet small size and
The requirement of high fingerprint recognition sensitivity.How to reduce the package dimension of fingerprint sensor, optimize the encapsulation of fingerprint sensor
Structure turns into the study hotspot of this area.
Utility model content
The purpose of this utility model is to provide a kind of fingerprint sensor encapsulating structure, the envelope of optimization fingerprint sensor
Assembling structure, so that the package dimension of fingerprint sensor is reduced to meet electronic product high integration, the demand of high stability, and
Improve the stability of fingerprint sensor encapsulation.
The utility model provides a kind of encapsulating structure of fingerprint sensor, comprising：Cover plate；Fingerprint sensor, it is just
Face is provided with fingerprint sensing area and the weld pad positioned at fingerprint sensing area periphery, and the weld pad electrically leads to the fingerprint sensing
The back side of chip, the back side of the fingerprint sensor has the first conductive structure electrically connected with weld pad；The fingerprint sensing
Fit at the positive back side with the cover plate of chip；FPC, its back side has the second conductive structure, the flexible circuitry
Opening is set on plate；The positive back side with the cover plate of the FPC is fitted, and the fingerprint sensor is located at institute
State in opening；First conductive structure is electrically connected with second conductive structure.
It is preferred that, the cover plate is to be coated with black out ink on transparent substrates, the back side of the cover plate.
It is preferred that, the encapsulating structure also includes DAF films, the two sides of the DAF films respectively with the cover plate and described
Fingerprint sensor is pasted.
It is preferred that, there is viscose to be used to fit the fingerprint sensor with the cover plate in the backsize of the cover plate
Fixed, the dielectric constant of the viscose is more than or equal to 4.
It is preferred that, first conductive structure is included：It is formed at the groove at the fingerprint sensor back side, the groove
Position with the weld pad is corresponding, and the depth of the groove is less than the thickness of the fingerprint sensor；It is formed in groove and leads to
Hole, one weld pad of each through hole correspondence, the through hole exposes the weld pad；Insulating barrier, covers the back of the body of the fingerprint sensor
In face, groove and through hole, weld pad described in the insulating layer exposing；Wiring layer again, on the insulating barrier, the cloth again
Line layer extends to the back side of the fingerprint sensor and electrically connected with the weld pad；Protective layer, wiring layer again described in covering；Shape
Perforate on protective layer described in Cheng Yu, the perforate is located at wiring layer again described in the back side of the fingerprint sensor and exposure.
It is preferred that, the encapsulating structure also includes what is exposed in metal wire, one end of the metal wire and the perforate
Wiring layer is electrically connected again, and the other end of the metal wire is electrically connected with second conductive structure.
It is preferred that, the encapsulating structure also includes plastic packaging layer, and the plastic packaging layer at least coats the metal wire.
It is preferred that, being provided with the front of the cover plate in front frame, front frame has window, and the window exposes the fingerprint
The corresponding Panel area in sensing unit, bonnet is provided with the back side of the FPC, and the bonnet engages with the front frame
It is fixed.
It is preferred that, capsulation material fills the front frame and surrounds the host cavity to be formed with the bonnet.
The beneficial effects of the utility model are the method for packing and encapsulating structure by optimizing fingerprint sensor, so that
The package dimension of fingerprint sensor is reduced to meet electronic product high integration, the demand of high stability, and improves fingerprint biography
The stability of sense chip encapsulation.
Brief description of the drawings
Fig. 1 is the encapsulating structure schematic diagram of the utility model preferred embodiment fingerprint sensor.
Fig. 2 is the encapsulating structure schematic diagram of another embodiment fingerprint sensor of the utility model.
Fig. 3 (a) is the floor map of the utility model preferred embodiment wafer.
Fig. 3 (b) is the schematic cross-section in Fig. 3 (a) along A-A.
Fig. 4 is protective substrate and the structural representation of Wafer alignment pressing in the utility model preferred embodiment.
Fig. 5 (a) is the floor map of formation groove and through hole in the utility model preferred embodiment.
Fig. 5 (b) is the schematic cross-section of formation groove and through hole in the utility model preferred embodiment.
Fig. 6 is the structural representation of formation insulating barrier in the utility model preferred embodiment.
Fig. 7 is to form again the structural representation of wiring layer in the utility model preferred embodiment.
Fig. 8 is formation solder mask and the structural representation of solder mask upper shed in the utility model preferred embodiment.
Fig. 9 is the structural representation of removal protective substrate in the utility model preferred embodiment.
Figure 10 is the schematic cross-section of fingerprint sensor in the utility model preferred embodiment.
Figure 11 is the schematic cross-section of the utility model preferred embodiment cover plate.
Figure 12 is the schematic cross-section that the utility model preferred embodiment cover plate is fitted with fingerprint sensor.
Figure 13 is the schematic cross-section that the utility model preferred embodiment cover plate is fitted with FPC.
Figure 14 is the schematic cross-section of the utility model preferred embodiment formation plastic packaging layer.
Embodiment
Embodiment of the present utility model is described in detail below with reference to accompanying drawing.But these embodiments are simultaneously
The utility model is not limited, structure, method or function that one of ordinary skill in the art is made according to these embodiments
On conversion be all contained in protection domain of the present utility model.
It should be noted that the purpose for providing these accompanying drawings is to help to understand embodiment of the present utility model, and
It should not be construed as to improper restriction of the present utility model.For the sake of becoming apparent from, size is not necessarily to scale shown in figure, can
It can make and amplify, reduce or other changes.In addition, the three dimensions chi of length, width and depth should be included in actual fabrication
It is very little.In addition, fisrt feature described below second feature it " on " structure can be formed as including the first and second features
The embodiment directly contacted, can also include embodiment of the other feature formation between the first and second features, and such the
One and second feature may not be direct contact.
Fig. 1 is refer to, is the encapsulating structure schematic diagram of the utility model preferred embodiment fingerprint sensor.Fingerprint sensing
Chip-packaging structure is included：Fingerprint sensor 10, cover plate 20 and FPC 30.
The front of fingerprint sensor 10 is provided with fingerprint sensing area 100 and the weldering positioned at the periphery of fingerprint sensing area 100
Pad 200, weld pad 200 is electrically connected to form electric signal transmission path with fingerprint sensing area 100.Weld pad 100 electrically leads to fingerprint biography
The back side of sense chip 10, the back side of fingerprint sensor 10 has the first conductive structure electrically connected with weld pad 200.
In the present embodiment, the first conductive structure is included：It is formed at the groove 121 at the back side of fingerprint sensor 10, groove
121 is corresponding with the position of weld pad 200, and the depth of groove 121 is less than the thickness of fingerprint sensor 10；It is formed in groove 121
Through hole 122, one weld pad 200 of each correspondence of through hole 122, the exposure weld pad 200 of through hole 122；Insulating barrier 123, covers fingerprint sensing
In the back side, the inwall of groove 121 and the through hole 122 of chip 10, the exposure weld pad 200 of insulating barrier 123；Wiring layer 124, are located at again
In groove 121 and through hole 122 and extend on the back side of fingerprint sensor 10, then wiring layer 124 is electrically connected with weld pad 200
Connect；Protective layer 125, covers wiring layer 124 again；The perforate on protective layer 125 is formed at, perforate is located at fingerprint sensor 10
The back side and aperture bottom exposure wiring layer 124 again.
Fitted with the back side of cover plate 20 in the front of fingerprint sensor 10.Cover plate 20 is the material with high dielectric constant
Matter, can be glass or ceramics.In the present embodiment, cover plate 20 is to be coated with shading on transparent substrates, the back side of cover plate 20
Ink 23.
Fingerprint sensor 10 and cover plate 20 are fitted fixation by DAF films or viscose, in the present embodiment, in cover plate 20
The back side be provided with DAF films 24, the front of fingerprint sensor 10 is fitted on DAF films 24, it is ensured that fingerprint sensor 10
The fixed flatness of laminating.If using viscose, in order to avoid reducing the sensitivity of fingerprint sensing, viscose, which is used, to be had compared with Gao Jie
The material of electric constant, the dielectric constant of viscose is more than or 4.
Opening is set on FPC 30, and the front of FPC 30 is fitted with the back side of cover plate 20, fingerprint sensing
Chip 10 is located in opening, reduces the encapsulating structure thickness of fingerprint sensor.The back side of FPC 30 has second
Conductive structure, in the present embodiment, the second conductive structure is the metal gasket 34 that FPC 30 exposes, and passes through metal wire 40
Metal gasket 34 is electrically connected with the first conductive structure of fingerprint sensor 10.One end of metal wire 40 is sudden and violent with the bottom of perforate 126
The wiring layer again 124 of dew is electrically connected, and the other end of metal wire 40 is electrically connected with the metal gasket 34 on FPC 30.Plastic packaging layer
50 at least coat metal wire 40 completely, realize to the fixation of metal wire 40, insulation, protection.
Fig. 2 is refer to, further, fingerprint sensor encapsulating structure also includes front frame 60 and engaged with front frame 60
Fixed bonnet 70.Front frame 60, which is arranged in the front 21 of cover plate 20, front frame 60, has window 61, the exposure fingerprint cover plate of window 61
20 subregion, the subregion is corresponding with fingerprint sensing area 100, facilitates fingerprint sensor 10 to obtain finger print information.
Bonnet 70 is arranged at the back side of FPC 30, and front frame 60 is surrounded with bonnet 70 and forms host cavity, refers to further improve
The steadiness of line sensing chip encapsulating structure, capsulation material is filled in all spaces in host cavity.The part of FPC 30 is sudden and violent
It is exposed to outside host cavity, facilitates FPC 30 to be electrically connected with external circuit.
Accordingly, the utility model provides a kind of method for packing of fingerprint sensor.
Fig. 3 (a) and Fig. 3 (b) be refer to there is provided wafer 1, Fig. 3 (a) is the floor map of wafer 1, Fig. 3 (b) is crystalline substance
The schematic cross-section of circle 1.Wafer 1 includes the fingerprint sensor 10 of many latticed arrangements, and each fingerprint sensor 10 has
There are fingerprint identification area 100 and the weld pad 200 positioned at fingerprint identification area periphery, in the present embodiment, in single fingerprint sensing core
In piece 10, multiple weld pads 200 line up two row positioned at two relative sides of fingerprint identification area 100.Wafer 1 has relative to each other
Front 11 and the back side 12, fingerprint identification area 100 and weld pad 200 are arranged at the front 11 of wafer 1.
Fig. 4 be refer to there is provided protective substrate 2 and protective substrate 2 and wafer 1 are aligned into pressing.Specifically, protective substrate 2
Consistent with the shape and size of wafer 1, both thickness can be different.In a surface of protective substrate 2 or wafer 1 just
Ephemeral key rubber alloy layer 21 is formed on face, then, wafer 1 and protective substrate 2 pressing is aligned into.
In the present embodiment, protective substrate 2 is transparent substrates, and the material of ephemeral key rubber alloy layer 21 is special with UV photaesthesia
Property UV glue, when UV light is irradiated to ephemeral key rubber alloy layer 21 through protective substrate 2, ephemeral key rubber alloy layer 21 will lose viscosity.
In order to avoid the abrasion protection substrate 2 in encapsulation process, protection is provided with another surface of protective substrate 2
Adhesive tape 22.
Fig. 5 (a) and Fig. 5 (b), respectively floor map and schematic cross-section are refer to, in the second table of wafer 1
Multiple independent grooves 121 are formed on face 12, the position of groove 121 is corresponding with the position of weld pad 200, and the depth of groove 121 is small
In the thickness of wafer 1.Through hole 122, one weld pad 200 of each correspondence of through hole 122, the exposure weldering of through hole 122 are formed in groove 121
Pad 200.
In order to avoid wafer 1 in encapsulation process because the setting of groove 121 causes the intensity of wafer 1 too low and reduces encapsulation
Yield, the utility model, which is tried one's best, controls the size of groove 121, and the utility model sets the length of groove 121 to be less than the institute of groove 121
Fingerprint sensor 10 side the length of side.Therefore, form enough between fingerprint sensor 10 adjacent in wafer 1
Many bonding strengths being left white for ensureing between adjacent fingerprint sensing chip 10, it is to avoid wafer 1 is produced in encapsulation process to be split
The risk of piece, improves encapsulation yield.
In the present embodiment, using etch process formation groove 121.One groove 121 is across two fingerprint sensors
There are two row weld pads 200 in the groove of 10, i.e., one 121, and two row weld pads 200 are belonging respectively to two adjacent fingerprint sensors
10.Subsequently after encapsulation is completed, along the center line cutting crystal wafer 1 of groove 121.
After wafer 1 performs cutting technique, fingerprint sensor 10 adjacent to each other is separated, for single fingerprint
For sensing chip 10, emphasis is the intensity for ensureing fingerprint sensor corner, in the present embodiment, fingerprint sensor 10
With first side and second side relative to each other, the two ends of the side where the groove respectively with the first side
And second side connects, the two ends of the groove do not contact the first side and the second side.
Fig. 6 is refer to, insulating barrier 123, the second of the covering wafer 1 of insulating barrier 123 are formed on the second surface 12 of wafer 1
In surface 12, groove 121 and in through hole 122, the exposure weld pad of insulating barrier 123.
The material of insulating barrier 123 is silica, silicon nitride, silicon oxynitride or resinae dielectric material.
Fig. 7 is refer to, wiring layer 124 again are formed, then wiring layer 124 is electrically connected with weld pad 200, positioned at groove 121 with leading to
In hole 122 and extend to the second surface 12 of wafer 1.
Wiring layer 124 is distributed in the surface of insulating barrier 123 using ripe RDL process selectivities and welded with corresponding again
Pad 200 is electrically connected, then wiring layer 124 is discontinuous, and it corresponds to different weld pads 200 respectively, and insulated from each other.
Fig. 8 is refer to, protective layer 125 is formed, protective layer 125 at least covers wiring layer 124 again, in the present embodiment, protected
Sheath 125 is covered in the second surface 12 of wafer 1 and is covered in groove 121 and through hole 122.
Perforate 126 is set in protective layer 125, perforate 126 exposes wiring layer 124 again, and perforate 126 is located at the of wafer 1
On two surfaces 12.
The material of protective layer 125 can be the anti-solder ink with photobehavior, and perforate 126 is existed by exposure imaging technique
Formed on protective layer 125.
Fig. 9 is refer to, protective substrate 2 is removed.The material of ephemeral key rubber alloy layer 21 is UV glue in the present embodiment, by removing
Protection glue band 22 on protective substrate 2, and UV light is irradiated into ephemeral key rubber alloy layer 21 through protective substrate 2 makes it lose viscosity,
Then protective substrate 2 is removed.
If the material of ephemeral key rubber alloy layer 21 is thermo-responsive glue, ephemeral key rubber alloy layer 21 is lost by being pyrolyzed bonding technology
Vanishing viscosity, and in order to avoid solder-bump 127 is influenceed by pyrolysis bonding technology, re-formed after protective substrate 2 is removed
Solder-bump 127.
The ephemeral key rubber alloy remained on the front of wafer 1 is removed by cleaning after protective substrate 2 is removed.
Figure 10 is refer to, is separated adjacent fingerprint sensor 10 each other using cutting technique cutting crystal wafer 1.
Figure 11 be refer to there is provided cover plate 20, with front 21 relative to each other and the back side, on the back side of cover plate 20 according to
Secondary formation black out ink 23 and DAF films 24.
Figure 12 is refer to, the front of fingerprint sensor 10 is fitted with the back side of cover plate 20.
Figure 13 is refer to, the front of FPC 30 is fitted with the back side of cover plate 20.FPC 30 has that
This relative front and the back side, the back side of FPC 30 has the second conductive structure, in the present embodiment, and second is conductive
Structure 34 is that opening 33 is set on the metal gasket 34 that FPC 30 exposes, FPC 30, and opening 33 avoids flexibility
Conducting wire in wiring board 30, the shape of opening 33 is not particularly limited, as long as it can penetrate out fingerprint induction chip
Mouth 33.The conducting terminal with external electrical connections is additionally provided with FPC, the utility model is repeated no more to this.
Fingerprint sensor 10 is located in opening 33, using routing technique by the bottom of perforate 126 on fingerprint sensor 10
Exposed wiring layer again 124 is electrically connected with the metal gasket 34 on the back side of FPC 30 by metal wire 40.
Compared in the prior art, using fingerprint sensor 10 as pressure loading plate, the utility model is by using lid
Plate 20 increases pressure loaded area as the pressure support plate of routing technique, it is to avoid prior art damages fingerprint sensor
Risk and the stability and yield for improving technological operation.
Figure 14 is refer to, plastic packaging layer 50 is formed, plastic packaging layer 50 at least coats metal wire 40.In the present embodiment, plastic packaging layer
The whole opening 33 of cladding, fingerprint sensor 10, metal wire 40, metal gasket 34 are coated wherein, improve fingerprint sensor
Encapsulating structure stability.
In another embodiment of the present utility model, after the step of completing Figure 14, front frame 60 and block with front frame 60
Fixed bonnet 70 is closed, Fig. 2 is refer to.Being set in the front 21 of cover plate 20 has window 61, window 61 in front frame 60, front frame 60
The subregion of exposure fingerprint cover plate 20, the subregion is corresponding with fingerprint sensing area 100, facilitates fingerprint sensor 10 to obtain
Print information.Bonnet 70 is set in the back side of FPC 30, front frame 60 is surrounded with bonnet 70 and forms host cavity.
In order to further improve the steadiness of fingerprint sensor encapsulating structure, remaining gap filling modeling in host cavity
Closure material.The part of FPC 30 is exposed to outside host cavity, facilitates FPC 30 to be electrically connected with external circuit.
The beneficial effects of the utility model are the method for packing and encapsulating structure by optimizing fingerprint sensor, so that
The package dimension of fingerprint sensor is reduced to meet electronic product high integration, the demand of high stability, and improves fingerprint biography
The stability of sense chip encapsulation.
It should be understood that, although the present specification is described in terms of embodiments, but not each embodiment only includes one
Individual independent technical scheme, this narrating mode of specification is only that for clarity, those skilled in the art will should say
Bright book is as an entirety, and the technical scheme in each embodiment may also be suitably combined to form those skilled in the art can
With the other embodiment of understanding.
The a series of tool described in detail only for feasibility embodiment of the present utility model of those listed above
Body illustrates that they are simultaneously not used to limit protection domain of the present utility model, all to be made without departing from the utility model skill spirit
Equivalent implementations or change should be included within protection domain of the present utility model.
Claims (9)
1. a kind of encapsulating structure of fingerprint sensor, it is characterised in that include：
Cover plate；
Fingerprint sensor, its front is provided with fingerprint sensing area and the weld pad positioned at fingerprint sensing area periphery, the weld pad
The back side of the fingerprint sensor is electrically led to, the back side of the fingerprint sensor has electrically connected with weld pad first
Conductive structure；
Fit at the positive back side with the cover plate of the fingerprint sensor；
FPC, its back side, which has, sets opening on the second conductive structure, the FPC；
The positive back side with the cover plate of the FPC is fitted, and the fingerprint sensor is located in the opening；
First conductive structure is electrically connected with second conductive structure.
2. the encapsulating structure of fingerprint sensor according to claim 1, it is characterised in that the cover plate is printing opacity base
Black out ink is coated with plate, the back side of the cover plate.
3. the encapsulating structure of fingerprint sensor according to claim 1, it is characterised in that the encapsulating structure also includes
Pasted respectively with the cover plate and the fingerprint sensor on DAF films, the two sides of the DAF films.
4. the encapsulating structure of fingerprint sensor according to claim 1, it is characterised in that applied at the back side of the cover plate
Being furnished with viscose is used to fit the fingerprint sensor fixation with the cover plate, and the dielectric constant of the viscose is more than or equal to
4。
5. the encapsulating structure of fingerprint sensor according to claim 1, it is characterised in that the first conductive structure bag
Contain：
The groove at the fingerprint sensor back side is formed at, the groove is corresponding with the position of the weld pad, the groove
Depth is less than the thickness of the fingerprint sensor；
Through hole in groove is formed at, one weld pad of each through hole correspondence, the through hole exposes the weld pad；
In insulating barrier, the back side, groove and the through hole that cover the fingerprint sensor, weld pad described in the insulating layer exposing；
Wiring layer again, on the insulating barrier, the wiring layer again extend to the back side of the fingerprint sensor and with
The weld pad electrical connection；
Protective layer, wiring layer again described in covering；
Perforate on the protective layer is formed at, the perforate is located at described in the back side of the fingerprint sensor and exposure to be connected up again
Layer.
6. the encapsulating structure of fingerprint sensor according to claim 5, it is characterised in that the encapsulating structure also includes
Metal wire, one end of the metal wire is electrically connected with the wiring layer again exposed in the perforate, the other end of the metal wire
Electrically connected with second conductive structure.
7. the encapsulating structure of fingerprint sensor according to claim 6, it is characterised in that the encapsulating structure also includes
Plastic packaging layer, the plastic packaging layer at least coats the metal wire.
8. the encapsulating structure of fingerprint sensor according to claim 1, it is characterised in that set in the front of the cover plate
Being equipped with front frame, front frame has window, and the window exposes the corresponding Panel area in the fingerprint sensing area, in the flexible wires
The back side of road plate is provided with bonnet, and the bonnet is fixed with the front frame.
9. the encapsulating structure of fingerprint sensor according to claim 8, it is characterised in that before capsulation material filling is described
Frame surrounds the host cavity to be formed with the bonnet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621262068.8U CN206349333U (en) | 2016-11-22 | 2016-11-22 | The encapsulating structure of fingerprint sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621262068.8U CN206349333U (en) | 2016-11-22 | 2016-11-22 | The encapsulating structure of fingerprint sensor |
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| Publication Number | Publication Date |
|---|---|
| CN206349333U true CN206349333U (en) | 2017-07-21 |
Family
ID=59322538
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| Application Number | Title | Priority Date | Filing Date |
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| CN201621262068.8U Active CN206349333U (en) | 2016-11-22 | 2016-11-22 | The encapsulating structure of fingerprint sensor |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106653616A (en) * | 2016-11-22 | 2017-05-10 | 苏州晶方半导体科技股份有限公司 | Encapsulation method and encapsulation structure of fingerprint sensor chip |
| WO2020253146A1 (en) * | 2019-06-17 | 2020-12-24 | 潍坊歌尔微电子有限公司 | Method for packaging chip |
-
2016
- 2016-11-22 CN CN201621262068.8U patent/CN206349333U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106653616A (en) * | 2016-11-22 | 2017-05-10 | 苏州晶方半导体科技股份有限公司 | Encapsulation method and encapsulation structure of fingerprint sensor chip |
| US10497728B2 (en) | 2016-11-22 | 2019-12-03 | China Wafer Level Csp Co., Ltd. | Fingerprint sensing chip packaging method and fingerprint sensing chip package |
| WO2020253146A1 (en) * | 2019-06-17 | 2020-12-24 | 潍坊歌尔微电子有限公司 | Method for packaging chip |
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