CN107146779B - Packaging structure and packaging method of fingerprint identification chip - Google Patents
Packaging structure and packaging method of fingerprint identification chip Download PDFInfo
- Publication number
- CN107146779B CN107146779B CN201710523587.8A CN201710523587A CN107146779B CN 107146779 B CN107146779 B CN 107146779B CN 201710523587 A CN201710523587 A CN 201710523587A CN 107146779 B CN107146779 B CN 107146779B
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- China
- Prior art keywords
- fingerprint identification
- identification chip
- layer
- packaging
- metal
- Prior art date
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- 238000000034 method Methods 0.000 title claims abstract description 111
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 60
- 229910052751 metal Inorganic materials 0.000 claims abstract description 75
- 239000002184 metal Substances 0.000 claims abstract description 75
- 230000008569 process Effects 0.000 claims abstract description 73
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 48
- 239000010703 silicon Substances 0.000 claims abstract description 48
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 47
- 239000000758 substrate Substances 0.000 claims abstract description 44
- 239000005022 packaging material Substances 0.000 claims abstract description 23
- 238000004021 metal welding Methods 0.000 claims abstract description 10
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims abstract description 4
- 239000010410 layer Substances 0.000 claims description 126
- 239000000463 material Substances 0.000 claims description 22
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 15
- 229910052782 aluminium Inorganic materials 0.000 claims description 15
- 239000003822 epoxy resin Substances 0.000 claims description 15
- 229920000647 polyepoxide Polymers 0.000 claims description 15
- 229910052802 copper Inorganic materials 0.000 claims description 14
- 239000010949 copper Substances 0.000 claims description 14
- 239000010931 gold Substances 0.000 claims description 14
- 229910052737 gold Inorganic materials 0.000 claims description 13
- 239000011241 protective layer Substances 0.000 claims description 13
- 229910052709 silver Inorganic materials 0.000 claims description 13
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 12
- 239000011521 glass Substances 0.000 claims description 10
- 239000000853 adhesive Substances 0.000 claims description 9
- 230000001070 adhesive effect Effects 0.000 claims description 9
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 8
- 229910002027 silica gel Inorganic materials 0.000 claims description 8
- 239000000741 silica gel Substances 0.000 claims description 8
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 7
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 7
- 239000004332 silver Substances 0.000 claims description 7
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 6
- 239000004642 Polyimide Substances 0.000 claims description 6
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 6
- 238000005229 chemical vapour deposition Methods 0.000 claims description 6
- 229910052731 fluorine Inorganic materials 0.000 claims description 6
- 239000011737 fluorine Substances 0.000 claims description 6
- 229910052759 nickel Inorganic materials 0.000 claims description 6
- 229920001721 polyimide Polymers 0.000 claims description 6
- 239000010944 silver (metal) Substances 0.000 claims description 6
- 229910052719 titanium Inorganic materials 0.000 claims description 6
- 239000010936 titanium Substances 0.000 claims description 6
- 238000005530 etching Methods 0.000 claims description 5
- 238000003475 lamination Methods 0.000 claims description 5
- 239000000126 substance Substances 0.000 claims description 4
- 238000000748 compression moulding Methods 0.000 claims description 3
- 238000009713 electroplating Methods 0.000 claims description 3
- 230000008020 evaporation Effects 0.000 claims description 3
- 238000001704 evaporation Methods 0.000 claims description 3
- 238000000227 grinding Methods 0.000 claims description 3
- 239000007788 liquid Substances 0.000 claims description 3
- 238000000465 moulding Methods 0.000 claims description 3
- 238000005240 physical vapour deposition Methods 0.000 claims description 3
- 238000007747 plating Methods 0.000 claims description 3
- 238000004528 spin coating Methods 0.000 claims description 3
- 238000004544 sputter deposition Methods 0.000 claims description 3
- 238000001721 transfer moulding Methods 0.000 claims description 3
- 238000007723 die pressing method Methods 0.000 claims description 2
- 238000003466 welding Methods 0.000 abstract description 13
- 238000005538 encapsulation Methods 0.000 description 10
- 238000005516 engineering process Methods 0.000 description 8
- 229910052594 sapphire Inorganic materials 0.000 description 8
- 239000010980 sapphire Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 6
- WABPQHHGFIMREM-YPZZEJLDSA-N lead-205 Chemical compound [205Pb] WABPQHHGFIMREM-YPZZEJLDSA-N 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 241001391944 Commicarpus scandens Species 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000012858 packaging process Methods 0.000 description 2
- 238000012536 packaging technology Methods 0.000 description 2
- 239000005360 phosphosilicate glass Substances 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 239000002360 explosive Substances 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000007781 pre-processing Methods 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
- H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3157—Partial encapsulation or coating
- H01L23/3171—Partial encapsulation or coating the coating being directly applied to the semiconductor body, e.g. passivation layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/492—Bases or plates or solder therefor
- H01L23/4924—Bases or plates or solder therefor characterised by the materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
- H01L2224/83399—Material
- H01L2224/8349—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
- H01L2224/83491—The principal constituent being an elastomer, e.g. silicones, isoprene, neoprene
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Human Computer Interaction (AREA)
- Multimedia (AREA)
- Theoretical Computer Science (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
Claims (15)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710523587.8A CN107146779B (en) | 2017-06-30 | 2017-06-30 | Packaging structure and packaging method of fingerprint identification chip |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710523587.8A CN107146779B (en) | 2017-06-30 | 2017-06-30 | Packaging structure and packaging method of fingerprint identification chip |
Publications (2)
Publication Number | Publication Date |
---|---|
CN107146779A CN107146779A (en) | 2017-09-08 |
CN107146779B true CN107146779B (en) | 2020-03-24 |
Family
ID=59784804
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201710523587.8A Active CN107146779B (en) | 2017-06-30 | 2017-06-30 | Packaging structure and packaging method of fingerprint identification chip |
Country Status (1)
Country | Link |
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CN (1) | CN107146779B (en) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107491772A (en) * | 2017-09-26 | 2017-12-19 | 硕诺科技(深圳)有限公司 | A kind of fingerprint recognition module and PCB main board |
CN108155160A (en) * | 2018-01-29 | 2018-06-12 | 中芯长电半导体(江阴)有限公司 | The encapsulating structure and packaging method of fingerprint recognition chip |
CN109181558A (en) * | 2018-08-16 | 2019-01-11 | 昆山建皇光电科技有限公司 | Adhesive process is welded in precuring |
CN110692135B (en) * | 2019-06-14 | 2021-03-19 | 深圳市汇顶科技股份有限公司 | Chip packaging structure and electronic equipment |
CN110571307B (en) * | 2019-09-16 | 2021-06-01 | 无锡中微晶园电子有限公司 | Photoelectric detection product bonding wire coating process |
CN110600496A (en) * | 2019-09-20 | 2019-12-20 | 上海显耀显示科技有限公司 | Micro-LED chip packaging structure |
CN111029261B (en) * | 2019-11-22 | 2021-09-24 | 云南安防科技有限公司 | Biological identification module and preparation method thereof |
CN111092019B (en) * | 2019-11-22 | 2021-11-02 | 绥化市鸿骏智能科技有限公司 | Fingerprint identification module and preparation method thereof |
CN111498791A (en) * | 2020-04-30 | 2020-08-07 | 青岛歌尔微电子研究院有限公司 | Micro-electro-mechanical system packaging structure and manufacturing method thereof |
CN111952203B (en) * | 2020-08-25 | 2022-09-23 | 深圳市天成照明有限公司 | Fingerprint identification package and forming method thereof |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103681362A (en) * | 2012-09-14 | 2014-03-26 | 新科金朋有限公司 | Semiconductor device and method of forming dual-sided interconnect structures in Fo-WLCSP |
CN105140213A (en) * | 2015-09-24 | 2015-12-09 | 中芯长电半导体(江阴)有限公司 | Chip packaging structure and chip packaging method |
CN105470207A (en) * | 2015-12-24 | 2016-04-06 | 华天科技(西安)有限公司 | Fingerprint identification chip packaging structure based on high-flatness substrate and manufacturing method thereof |
CN207165545U (en) * | 2017-06-30 | 2018-03-30 | 中芯长电半导体(江阴)有限公司 | The encapsulating structure of fingerprint recognition chip |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006128625A (en) * | 2004-09-30 | 2006-05-18 | Oki Electric Ind Co Ltd | Semiconductor device and its manufacturing method |
-
2017
- 2017-06-30 CN CN201710523587.8A patent/CN107146779B/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103681362A (en) * | 2012-09-14 | 2014-03-26 | 新科金朋有限公司 | Semiconductor device and method of forming dual-sided interconnect structures in Fo-WLCSP |
CN105140213A (en) * | 2015-09-24 | 2015-12-09 | 中芯长电半导体(江阴)有限公司 | Chip packaging structure and chip packaging method |
CN105470207A (en) * | 2015-12-24 | 2016-04-06 | 华天科技(西安)有限公司 | Fingerprint identification chip packaging structure based on high-flatness substrate and manufacturing method thereof |
CN207165545U (en) * | 2017-06-30 | 2018-03-30 | 中芯长电半导体(江阴)有限公司 | The encapsulating structure of fingerprint recognition chip |
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Publication number | Publication date |
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CN107146779A (en) | 2017-09-08 |
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PB01 | Publication | ||
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SE01 | Entry into force of request for substantive examination | ||
CB03 | Change of inventor or designer information | ||
CB03 | Change of inventor or designer information |
Inventor after: Chen Yanheng Inventor after: Lin Zhengzhong Inventor after: He Zhihong Inventor after: Wu Zhengda Inventor before: Chen Yanheng Inventor before: Lin Zhengzhong Inventor before: He Zhihong Inventor before: Lin Zhengda |
|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CP03 | Change of name, title or address | ||
CP03 | Change of name, title or address |
Address after: No.78 Changshan Avenue, Jiangyin City, Wuxi City, Jiangsu Province (place of business: No.9 Dongsheng West Road, Jiangyin City) Patentee after: Shenghejing micro semiconductor (Jiangyin) Co.,Ltd. Address before: No.78 Changshan Avenue, Jiangyin City, Wuxi City, Jiangsu Province Patentee before: SJ Semiconductor (Jiangyin) Corp. |