CN104538328B - 一种硅片真空吸附机械手 - Google Patents
一种硅片真空吸附机械手 Download PDFInfo
- Publication number
- CN104538328B CN104538328B CN201410697433.7A CN201410697433A CN104538328B CN 104538328 B CN104538328 B CN 104538328B CN 201410697433 A CN201410697433 A CN 201410697433A CN 104538328 B CN104538328 B CN 104538328B
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- vacuum suction
- vacuum
- silicon chip
- comb teeth
- teeth shape
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 55
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 51
- 239000010703 silicon Substances 0.000 title claims abstract description 51
- 238000001179 sorption measurement Methods 0.000 claims abstract description 7
- 238000005086 pumping Methods 0.000 claims description 26
- 238000001514 detection method Methods 0.000 claims description 19
- 238000007667 floating Methods 0.000 claims description 16
- 230000005484 gravity Effects 0.000 claims description 14
- 230000007246 mechanism Effects 0.000 claims description 11
- 238000006073 displacement reaction Methods 0.000 claims description 6
- 239000003638 chemical reducing agent Substances 0.000 claims description 5
- 238000010521 absorption reaction Methods 0.000 claims description 4
- 238000007789 sealing Methods 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 14
- 230000000694 effects Effects 0.000 abstract description 3
- 230000009471 action Effects 0.000 abstract description 2
- 239000013078 crystal Substances 0.000 abstract description 2
- 230000009467 reduction Effects 0.000 description 8
- 239000010453 quartz Substances 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 238000009792 diffusion process Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000033083 heart process Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 210000003739 neck Anatomy 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000001960 triggered effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
Description
Claims (12)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410697433.7A CN104538328B (zh) | 2014-11-26 | 2014-11-26 | 一种硅片真空吸附机械手 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410697433.7A CN104538328B (zh) | 2014-11-26 | 2014-11-26 | 一种硅片真空吸附机械手 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104538328A CN104538328A (zh) | 2015-04-22 |
CN104538328B true CN104538328B (zh) | 2018-01-02 |
Family
ID=52853834
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201410697433.7A Active CN104538328B (zh) | 2014-11-26 | 2014-11-26 | 一种硅片真空吸附机械手 |
Country Status (1)
Country | Link |
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CN (1) | CN104538328B (zh) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104992922B (zh) * | 2015-07-30 | 2018-03-13 | 南通皋鑫电子股份有限公司 | 一种扩散进出炉自动推拉舟系统装置 |
CN105216001B (zh) * | 2015-10-28 | 2017-05-24 | 惠州Tcl移动通信有限公司 | 一种自动化搬运设备及其旋转式吸取装置 |
CN105448795B (zh) * | 2015-11-30 | 2018-03-16 | 北京中电科电子装备有限公司 | 一种晶圆抓取系统 |
CN106350438B (zh) * | 2016-10-27 | 2018-05-22 | 上海理工大学 | 提高单克隆挑选仪通量的装置 |
CN110854237B (zh) * | 2019-11-20 | 2021-04-20 | 西北电子装备技术研究所(中国电子科技集团公司第二研究所) | 便于单齿更换的基于高精度装配的疏齿托架 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2644434Y (zh) * | 2003-08-12 | 2004-09-29 | 北京七星华创电子股份有限公司 | 刻蚀机自动传片机构 |
CN101529555A (zh) * | 2006-10-23 | 2009-09-09 | 赛博光学半导体公司 | 改进的衬底操作机械手校准 |
CN201685264U (zh) * | 2010-05-25 | 2010-12-29 | 无锡华润上华半导体有限公司 | 硅片机械手 |
CN201936861U (zh) * | 2010-07-13 | 2011-08-17 | 江门市新侨光电科技有限公司 | 一种应用于晶固机的旋转型输送盘装置 |
CN202454545U (zh) * | 2011-12-22 | 2012-09-26 | 南京华伯仪器科技有限公司 | 吸盘片和吸盘夹具 |
-
2014
- 2014-11-26 CN CN201410697433.7A patent/CN104538328B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2644434Y (zh) * | 2003-08-12 | 2004-09-29 | 北京七星华创电子股份有限公司 | 刻蚀机自动传片机构 |
CN101529555A (zh) * | 2006-10-23 | 2009-09-09 | 赛博光学半导体公司 | 改进的衬底操作机械手校准 |
CN201685264U (zh) * | 2010-05-25 | 2010-12-29 | 无锡华润上华半导体有限公司 | 硅片机械手 |
CN201936861U (zh) * | 2010-07-13 | 2011-08-17 | 江门市新侨光电科技有限公司 | 一种应用于晶固机的旋转型输送盘装置 |
CN202454545U (zh) * | 2011-12-22 | 2012-09-26 | 南京华伯仪器科技有限公司 | 吸盘片和吸盘夹具 |
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Publication number | Publication date |
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CN104538328A (zh) | 2015-04-22 |
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Address after: 100015 No. 1 East Jiuxianqiao Road, Beijing, Chaoyang District Patentee after: North China Science and technology group Limited by Share Ltd. Address before: 100015 Jiuxianqiao Chaoyang District, East Beijing Road, building M2, floor 1, No. 2 Patentee before: BEIJING SEVENSTAR ELECTRONIC Co.,Ltd. |
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Effective date of registration: 20180314 Address after: 100176 Beijing economic and Technological Development Zone, Wenchang Road, No. 8, No. Patentee after: BEIJING NAURA MICROELECTRONICS EQUIPMENT Co.,Ltd. Address before: 100015 No. 1 East Jiuxianqiao Road, Beijing, Chaoyang District Patentee before: North China Science and technology group Limited by Share Ltd. |
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