CN104518070A - 一种高灰度高对比度smd led及其点胶工艺 - Google Patents
一种高灰度高对比度smd led及其点胶工艺 Download PDFInfo
- Publication number
- CN104518070A CN104518070A CN201410649808.2A CN201410649808A CN104518070A CN 104518070 A CN104518070 A CN 104518070A CN 201410649808 A CN201410649808 A CN 201410649808A CN 104518070 A CN104518070 A CN 104518070A
- Authority
- CN
- China
- Prior art keywords
- low reflective
- contrast
- smd led
- colloid layer
- gray scale
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005516 engineering process Methods 0.000 title abstract description 4
- 239000000853 adhesive Substances 0.000 title abstract 2
- 230000001070 adhesive effect Effects 0.000 title abstract 2
- 239000003292 glue Substances 0.000 claims abstract description 22
- 239000000084 colloidal system Substances 0.000 claims description 72
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 26
- 238000004806 packaging method and process Methods 0.000 claims description 23
- 239000003973 paint Substances 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 17
- 239000000377 silicon dioxide Substances 0.000 claims description 13
- 238000004026 adhesive bonding Methods 0.000 claims description 12
- 238000007711 solidification Methods 0.000 claims description 9
- 230000008023 solidification Effects 0.000 claims description 9
- 239000002245 particle Substances 0.000 claims description 6
- 239000007787 solid Substances 0.000 claims description 6
- 239000012790 adhesive layer Substances 0.000 abstract 2
- 239000010410 layer Substances 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 5
- 208000003164 Diplopia Diseases 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000000007 visual effect Effects 0.000 description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410649808.2A CN104518070B (zh) | 2014-11-17 | 2014-11-17 | 一种高灰度高对比度smd led及其点胶工艺 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410649808.2A CN104518070B (zh) | 2014-11-17 | 2014-11-17 | 一种高灰度高对比度smd led及其点胶工艺 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104518070A true CN104518070A (zh) | 2015-04-15 |
CN104518070B CN104518070B (zh) | 2018-09-07 |
Family
ID=52793069
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201410649808.2A Active CN104518070B (zh) | 2014-11-17 | 2014-11-17 | 一种高灰度高对比度smd led及其点胶工艺 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN104518070B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111013942A (zh) * | 2019-12-06 | 2020-04-17 | 青岛歌尔智能传感器有限公司 | 心率模组灌胶方法 |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009176798A (ja) * | 2008-01-22 | 2009-08-06 | Citizen Electronics Co Ltd | 発光装置 |
CN201430161Y (zh) * | 2009-06-17 | 2010-03-24 | 宁波升谱光电半导体有限公司 | 一种led器件的封装结构 |
CN202275867U (zh) * | 2011-09-07 | 2012-06-13 | 广州市鸿利光电股份有限公司 | 一种led支架及贴片led |
CN202495474U (zh) * | 2012-03-19 | 2012-10-17 | 佛山市国星光电股份有限公司 | 一种发光二极管封装结构 |
CN202633373U (zh) * | 2012-02-16 | 2012-12-26 | 深圳莱特光电有限公司 | 具有局部隔离结构的led封装器件 |
CN103194905A (zh) * | 2013-04-01 | 2013-07-10 | 淮阴工学院 | 用于皮革表面消光的皮革涂料、制备方法及消光方法 |
CN103489997A (zh) * | 2012-06-09 | 2014-01-01 | 王树生 | Led及led制作方法 |
CN203733846U (zh) * | 2014-02-25 | 2014-07-23 | 深圳市晶台股份有限公司 | 一种具有浅黑色封装胶体的表面装贴型led |
CN203859114U (zh) * | 2013-12-31 | 2014-10-01 | 厦门乾照光电股份有限公司 | 一种使用荧光粉模块激发的led光源结构 |
CN204243079U (zh) * | 2014-11-17 | 2015-04-01 | 浙江英特来光电科技有限公司 | 一种高灰度高对比度smd led |
-
2014
- 2014-11-17 CN CN201410649808.2A patent/CN104518070B/zh active Active
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009176798A (ja) * | 2008-01-22 | 2009-08-06 | Citizen Electronics Co Ltd | 発光装置 |
CN201430161Y (zh) * | 2009-06-17 | 2010-03-24 | 宁波升谱光电半导体有限公司 | 一种led器件的封装结构 |
CN202275867U (zh) * | 2011-09-07 | 2012-06-13 | 广州市鸿利光电股份有限公司 | 一种led支架及贴片led |
CN202633373U (zh) * | 2012-02-16 | 2012-12-26 | 深圳莱特光电有限公司 | 具有局部隔离结构的led封装器件 |
CN202495474U (zh) * | 2012-03-19 | 2012-10-17 | 佛山市国星光电股份有限公司 | 一种发光二极管封装结构 |
CN103489997A (zh) * | 2012-06-09 | 2014-01-01 | 王树生 | Led及led制作方法 |
CN103194905A (zh) * | 2013-04-01 | 2013-07-10 | 淮阴工学院 | 用于皮革表面消光的皮革涂料、制备方法及消光方法 |
CN203859114U (zh) * | 2013-12-31 | 2014-10-01 | 厦门乾照光电股份有限公司 | 一种使用荧光粉模块激发的led光源结构 |
CN203733846U (zh) * | 2014-02-25 | 2014-07-23 | 深圳市晶台股份有限公司 | 一种具有浅黑色封装胶体的表面装贴型led |
CN204243079U (zh) * | 2014-11-17 | 2015-04-01 | 浙江英特来光电科技有限公司 | 一种高灰度高对比度smd led |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111013942A (zh) * | 2019-12-06 | 2020-04-17 | 青岛歌尔智能传感器有限公司 | 心率模组灌胶方法 |
Also Published As
Publication number | Publication date |
---|---|
CN104518070B (zh) | 2018-09-07 |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A high gray and high contrast SMD LED and its dispensing process Effective date of registration: 20220111 Granted publication date: 20180907 Pledgee: Yiwu Branch of China Construction Bank Co.,Ltd. Pledgor: ZHEJIANG INTELED OPTOELETRONIC TECHNOLOGY Co.,Ltd. Registration number: Y2022330000050 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20230720 Granted publication date: 20180907 Pledgee: Yiwu Branch of China Construction Bank Co.,Ltd. Pledgor: ZHEJIANG INTELED OPTOELETRONIC TECHNOLOGY Co.,Ltd. Registration number: Y2022330000050 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right |