CN104518055B - 发光二极管组件及制造方法 - Google Patents

发光二极管组件及制造方法 Download PDF

Info

Publication number
CN104518055B
CN104518055B CN201410507456.7A CN201410507456A CN104518055B CN 104518055 B CN104518055 B CN 104518055B CN 201410507456 A CN201410507456 A CN 201410507456A CN 104518055 B CN104518055 B CN 104518055B
Authority
CN
China
Prior art keywords
carrier
led
manufacturing
led chips
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201410507456.7A
Other languages
English (en)
Chinese (zh)
Other versions
CN104518055A (zh
Inventor
郑子淇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Addison LED Limited
Original Assignee
Epistar Corp
Huga Optotech Inc
Interlight Optotech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Epistar Corp, Huga Optotech Inc, Interlight Optotech Corp filed Critical Epistar Corp
Priority to CN201811167740.9A priority Critical patent/CN109268709A/zh
Publication of CN104518055A publication Critical patent/CN104518055A/zh
Application granted granted Critical
Publication of CN104518055B publication Critical patent/CN104518055B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/90—Methods of manufacture
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07302—Connecting or disconnecting of die-attach connectors using an auxiliary member
    • H10W72/07304—Connecting or disconnecting of die-attach connectors using an auxiliary member the auxiliary member being temporary, e.g. a sacrificial coating
    • H10W72/07307—Connecting or disconnecting of die-attach connectors using an auxiliary member the auxiliary member being temporary, e.g. a sacrificial coating the auxiliary member being a temporary substrate, e.g. a removable substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H10W72/07338—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy hardening the adhesive by curing, e.g. thermosetting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/074—Connecting or disconnecting of anisotropic conductive adhesives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)
CN201410507456.7A 2013-10-07 2014-09-28 发光二极管组件及制造方法 Active CN104518055B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201811167740.9A CN109268709A (zh) 2013-10-07 2014-09-28 发光二极管组件及制造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW102136175 2013-10-07
TW102136175A TWI601225B (zh) 2013-10-07 2013-10-07 發光二極體組件及製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN201811167740.9A Division CN109268709A (zh) 2013-10-07 2014-09-28 发光二极管组件及制造方法

Publications (2)

Publication Number Publication Date
CN104518055A CN104518055A (zh) 2015-04-15
CN104518055B true CN104518055B (zh) 2018-11-02

Family

ID=52777262

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201410507456.7A Active CN104518055B (zh) 2013-10-07 2014-09-28 发光二极管组件及制造方法
CN201811167740.9A Pending CN109268709A (zh) 2013-10-07 2014-09-28 发光二极管组件及制造方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN201811167740.9A Pending CN109268709A (zh) 2013-10-07 2014-09-28 发光二极管组件及制造方法

Country Status (4)

Country Link
US (1) US9534747B2 (enExample)
JP (1) JP6626612B2 (enExample)
CN (2) CN104518055B (enExample)
TW (1) TWI601225B (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106876286B (zh) * 2017-02-04 2019-08-20 武汉华威科智能技术有限公司 一种极薄柔性电子芯片封装方法及产品
TWI712188B (zh) 2019-11-13 2020-12-01 隆達電子股份有限公司 發光封裝結構及其製造方法
EE01681U1 (et) * 2025-06-19 2026-05-15 OÜ Metamobilis Meetod vähemalt ühe tabamispunkti osutamiseks sihtmärgil

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008159937A (ja) * 2006-12-25 2008-07-10 Kyocera Corp 発光素子用集合基板および発光装置集合基板
US20100190280A1 (en) * 2009-01-27 2010-07-29 Citizen Electronics Co., Ltd. Manufacturing method of light-emitting diode
US20120153328A1 (en) * 2010-12-15 2012-06-21 Tsuyoshi Tsutsui Light-emitting device, light-emitting device package, method of manufacturing light-emitting device, and method of packaging light-emitting device

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63262259A (ja) * 1987-04-20 1988-10-28 Matsushita Electric Ind Co Ltd 光プリンタ用書き込みヘツド
JPH03233978A (ja) * 1990-02-08 1991-10-17 Matsushita Electric Ind Co Ltd 発光装置
JPH08330633A (ja) * 1995-05-29 1996-12-13 Kyocera Corp 半導体発光装置
JP3641122B2 (ja) * 1997-12-26 2005-04-20 ローム株式会社 半導体発光素子、半導体発光モジュール、およびこれらの製造方法
JP4715301B2 (ja) * 2005-05-20 2011-07-06 ソニー株式会社 素子転写装置、素子転写方法および表示装置の製造方法
CN200969348Y (zh) * 2006-10-17 2007-10-31 宏齐科技股份有限公司 发光二极管芯片的封装结构
US7834365B2 (en) * 2007-09-12 2010-11-16 Harvatek Corporation LED chip package structure with high-efficiency light-emitting effect and method of packing the same
TWI411092B (en) * 2009-06-24 2013-10-01 Led package structure with external lateral cutting beveled edges and method for manufacturing the same
US7811843B1 (en) * 2010-01-13 2010-10-12 Hon Hai Precision Industry Co., Ltd. Method of manufacturing light-emitting diode
CN102339925B (zh) * 2010-07-22 2015-11-18 赛恩倍吉科技顾问（深圳）有限公司 发光元件封装方法
US8227271B1 (en) * 2011-01-27 2012-07-24 Himax Technologies Limited Packaging method of wafer level chips
JP2013197236A (ja) * 2012-03-19 2013-09-30 Asahi Glass Co Ltd 発光装置および発光装置の製造方法
CN203339225U (zh) * 2013-06-06 2013-12-11 邱东扬 无封装芯片led发光照明结构

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008159937A (ja) * 2006-12-25 2008-07-10 Kyocera Corp 発光素子用集合基板および発光装置集合基板
US20100190280A1 (en) * 2009-01-27 2010-07-29 Citizen Electronics Co., Ltd. Manufacturing method of light-emitting diode
US20120153328A1 (en) * 2010-12-15 2012-06-21 Tsuyoshi Tsutsui Light-emitting device, light-emitting device package, method of manufacturing light-emitting device, and method of packaging light-emitting device

Also Published As

Publication number Publication date
US9534747B2 (en) 2017-01-03
TW201515131A (zh) 2015-04-16
JP6626612B2 (ja) 2019-12-25
JP2015076613A (ja) 2015-04-20
CN109268709A (zh) 2019-01-25
TWI601225B (zh) 2017-10-01
US20150099320A1 (en) 2015-04-09
CN104518055A (zh) 2015-04-15

Similar Documents

Publication Publication Date Title
TWI602322B (zh) 發光二極體組件及製作方法
TWI651871B (zh) 發光組件及製作方法
CN109545938A (zh) 发光模块的制作方法
US20130114255A1 (en) Broad-area lighting systems
TWI444633B (zh) 半導體發光二極體晶片、其製造方法及其品質控制方法
US20120021542A1 (en) Method of packaging light emitting device
CN110165041A (zh) 发光装置、其制造方法及显示模块
TWI320237B (en) Si-substrate and structure of opto-electronic package having the same
CN101295754A (zh) 发光二极管的芯片倒装焊封装结构与方法
US20200135996A1 (en) Led mounting method and device
CN109268709A (zh) 发光二极管组件及制造方法
US20130234184A1 (en) Light emitting diode package and method of manufacturing the same
CN107731985B (zh) 一种led芯片阵列排布的高精度定位方法
US8871535B2 (en) Method for manufacturing LED
US8828754B2 (en) Method for manufacturing LED
CN104282671A (zh) 发光二极管组件及制作方法
CN104282817B (zh) 发光二极管组件及制作方法
US20140183569A1 (en) Led chip unit and manufacturing method thereof, and led module
CN118053962B (zh) 一种幻彩灯珠结构及其制造方法
TWI711188B (zh) 發光二極體組件
CN106960821B (zh) 一种led组件及其制备方法
CN205355072U (zh) 一种发光二极管灯丝芯片及发光二极管灯丝
CN105023932A (zh) 一种结合led外延结构与led封装基板为一体的垂直式led阵列元件
CN102339819A (zh) 发光二极管封装结构及其形成方法
TW201025656A (en) Manufacturing method of light-emitting apparatus

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
TA01 Transfer of patent application right

Effective date of registration: 20170515

Address after: Hsinchu City, Taiwan, China

Applicant after: EPISTAR Corp.

Address before: Hsinchu City, Taiwan, China

Applicant before: EPISTAR Corp.

Applicant before: INTERLIGHT OPTOTECH Corp.

Effective date of registration: 20170515

Address after: Hsinchu City, Taiwan, China

Applicant after: EPISTAR Corp.

Applicant after: INTERLIGHT OPTOTECH Corp.

Address before: Taichung City, Taiwan, China

Applicant before: HUGA OPTOTECH INC.

Applicant before: INTERLIGHT OPTOTECH Corp.

TA01 Transfer of patent application right
GR01 Patent grant
GR01 Patent grant
TR01 Transfer of patent right

Effective date of registration: 20260227

Address after: 17330 Preston Road, Suite 200D, Dallas, Texas, United States

Patentee after: Addison LED Limited

Country or region after: U.S.A.

Address before: Hsinchu City, Taiwan, China

Patentee before: EPISTAR Corp.

Country or region before: Taiwan, China

TR01 Transfer of patent right