CN104518002B - 显示装置和显示装置的制造方法 - Google Patents

显示装置和显示装置的制造方法 Download PDF

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Publication number
CN104518002B
CN104518002B CN201410521919.5A CN201410521919A CN104518002B CN 104518002 B CN104518002 B CN 104518002B CN 201410521919 A CN201410521919 A CN 201410521919A CN 104518002 B CN104518002 B CN 104518002B
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China
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layer
substrate
supporting course
display area
display device
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CN201410521919.5A
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English (en)
Chinese (zh)
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CN104518002A (zh
Inventor
鹤冈历人
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Magno Haote Co ltd
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Japan Display Central Inc
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/129—Chiplets
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/441—Interconnections, e.g. scanning lines
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/853—On the same surface
    • H10W72/856—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Electroluminescent Light Sources (AREA)
  • Wire Bonding (AREA)
  • Thin Film Transistor (AREA)
CN201410521919.5A 2013-10-02 2014-09-30 显示装置和显示装置的制造方法 Active CN104518002B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013-207137 2013-10-02
JP2013207137A JP6310668B2 (ja) 2013-10-02 2013-10-02 表示装置及び表示装置の製造方法

Publications (2)

Publication Number Publication Date
CN104518002A CN104518002A (zh) 2015-04-15
CN104518002B true CN104518002B (zh) 2019-01-08

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CN201410521919.5A Active CN104518002B (zh) 2013-10-02 2014-09-30 显示装置和显示装置的制造方法

Country Status (3)

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US (2) US9660007B2 (enExample)
JP (1) JP6310668B2 (enExample)
CN (1) CN104518002B (enExample)

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US5760359A (en) * 1995-07-31 1998-06-02 Matsushita Electric Industrial Co., Ltd. Motor control apparatus equipped with a controller for controlling rotational position of motor
KR102086644B1 (ko) 2013-12-31 2020-03-09 엘지디스플레이 주식회사 플렉서블표시장치 및 이의 제조방법
WO2016017516A1 (ja) * 2014-07-30 2016-02-04 シャープ株式会社 表示装置およびその製造方法
TWI536074B (zh) * 2015-03-31 2016-06-01 業鑫科技顧問股份有限公司 電連接結構及陣列基板
US20160313838A1 (en) * 2015-04-21 2016-10-27 Lg Display Co., Ltd. Touch Screen Integrated Display Device
CN105513499B (zh) * 2016-02-04 2018-03-30 京东方科技集团股份有限公司 一种柔性显示面板、显示装置及其绑定方法
JP2018004948A (ja) 2016-07-01 2018-01-11 株式会社ジャパンディスプレイ 表示装置
US10714552B2 (en) * 2016-09-05 2020-07-14 Sharp Kabushiki Kaisha Active matrix substrate having plurality of circuit thin film transistors and pixel thin film transistors
US10340256B2 (en) * 2016-09-14 2019-07-02 Innolux Corporation Display devices
KR102343573B1 (ko) * 2017-05-26 2021-12-28 삼성디스플레이 주식회사 플렉서블 디스플레이 장치
CN107768415B (zh) * 2017-10-30 2024-03-08 京东方科技集团股份有限公司 柔性显示器件、显示装置以及制造方法
CN113169190A (zh) * 2018-12-03 2021-07-23 深圳市柔宇科技股份有限公司 显示装置
CN109709695B (zh) * 2019-01-10 2021-12-24 京东方科技集团股份有限公司 显示基板及其制造方法、显示装置
CN110164874B (zh) * 2019-06-04 2021-06-22 上海天马微电子有限公司 柔性显示模组、显示装置及柔性显示模组的制作方法
WO2021009811A1 (ja) * 2019-07-12 2021-01-21 シャープ株式会社 表示装置
KR20210011529A (ko) 2019-07-22 2021-02-02 삼성디스플레이 주식회사 표시 장치 및 표시 장치의 제조 방법
CN112242099A (zh) * 2020-11-09 2021-01-19 上海中航光电子有限公司 阵列基板、显示面板及显示装置
CN114898662B (zh) * 2022-05-06 2023-09-26 武汉天马微电子有限公司 模组及基板

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CN102422338A (zh) * 2009-05-02 2012-04-18 株式会社半导体能源研究所 显示设备
KR20130053280A (ko) * 2011-11-15 2013-05-23 엘지디스플레이 주식회사 씨오지 타입 플렉서블 유기발광소자

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JP3850915B2 (ja) 1996-04-09 2006-11-29 ローム株式会社 フレキシブル基板の補強形成方法およびフレキシブル基板
JP2000294895A (ja) * 1998-12-21 2000-10-20 Seiko Epson Corp 回路基板およびその製造方法ならびに回路基板を用いた表示装置および電子機器
JP2000294894A (ja) * 1998-12-21 2000-10-20 Seiko Epson Corp 回路基板およびその製造方法ならびに回路基板を用いた表示装置および電子機器
KR100737896B1 (ko) * 2001-02-07 2007-07-10 삼성전자주식회사 어레이 기판과, 액정표시장치 및 그 제조방법
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US7859055B2 (en) * 2005-09-16 2010-12-28 Sharp Kabushiki Kaisha Thin film transistor
KR100742376B1 (ko) * 2005-09-30 2007-07-24 삼성에스디아이 주식회사 패드부 및 그 제조 방법
JP2009058618A (ja) * 2007-08-30 2009-03-19 Hitachi Displays Ltd 液晶表示装置
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JP5313590B2 (ja) * 2008-08-29 2013-10-09 エルジー ディスプレイ カンパニー リミテッド 画像表示装置
JP5399683B2 (ja) * 2008-10-24 2014-01-29 株式会社ジャパンディスプレイ 表示装置及び電子機器
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CN102422338A (zh) * 2009-05-02 2012-04-18 株式会社半导体能源研究所 显示设备
CN101833904A (zh) * 2010-05-13 2010-09-15 友达光电股份有限公司 可挠式显示器及其制造方法
KR20130053280A (ko) * 2011-11-15 2013-05-23 엘지디스플레이 주식회사 씨오지 타입 플렉서블 유기발광소자

Also Published As

Publication number Publication date
JP2015072764A (ja) 2015-04-16
US20170221981A1 (en) 2017-08-03
CN104518002A (zh) 2015-04-15
US9997589B2 (en) 2018-06-12
US20150090990A1 (en) 2015-04-02
JP6310668B2 (ja) 2018-04-11
US9660007B2 (en) 2017-05-23

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Effective date of registration: 20250729

Address after: Tokyo, Japan

Patentee after: Magno Haote Co.,Ltd.

Country or region after: Japan

Address before: Tokyo, Japan

Patentee before: JAPAN DISPLAY Inc.

Country or region before: Japan