CN104427775A - 布线基板的制造方法 - Google Patents
布线基板的制造方法 Download PDFInfo
- Publication number
- CN104427775A CN104427775A CN201410429133.0A CN201410429133A CN104427775A CN 104427775 A CN104427775 A CN 104427775A CN 201410429133 A CN201410429133 A CN 201410429133A CN 104427775 A CN104427775 A CN 104427775A
- Authority
- CN
- China
- Prior art keywords
- metal forming
- insulating barrier
- cavity
- circuit board
- separable
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1322—Encapsulation comprising more than one layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
- H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Manufacturing & Machinery (AREA)
Abstract
Description
Claims (8)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013180767A JP2015050309A (ja) | 2013-08-31 | 2013-08-31 | 配線基板の製造方法 |
JP2013-180767 | 2013-08-31 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN104427775A true CN104427775A (zh) | 2015-03-18 |
Family
ID=52581164
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201410429133.0A Pending CN104427775A (zh) | 2013-08-31 | 2014-08-27 | 布线基板的制造方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US9655248B2 (zh) |
JP (1) | JP2015050309A (zh) |
KR (1) | KR20150026901A (zh) |
CN (1) | CN104427775A (zh) |
TW (1) | TW201524297A (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2022160220A1 (zh) * | 2021-01-28 | 2022-08-04 | 京东方科技集团股份有限公司 | 布线基板、阵列基板和发光模组 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6423313B2 (ja) * | 2015-05-26 | 2018-11-14 | 新光電気工業株式会社 | 電子部品内蔵基板及びその製造方法と電子装置 |
JP6292216B2 (ja) * | 2015-12-10 | 2018-03-14 | 日立金属株式会社 | 多層セラミック基板の製造方法および多層セラミック基板 |
KR20200055432A (ko) | 2018-11-13 | 2020-05-21 | 삼성전기주식회사 | 인쇄회로기판 |
JP7405591B2 (ja) * | 2019-12-12 | 2023-12-26 | 株式会社伸光製作所 | プリント配線板の製造方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1722935A (zh) * | 2004-07-14 | 2006-01-18 | 三星电机株式会社 | 包含嵌入式无源芯片的pcb的制造方法 |
CN101010994A (zh) * | 2004-06-15 | 2007-08-01 | 伊姆贝拉电子有限公司 | 制造包括电连接到导体图案层的元件的电子模块的方法 |
US20070269590A1 (en) * | 2006-05-22 | 2007-11-22 | Hitachi Cable, Ltd. | Electronic device substrate, electronic device and methods for making same |
JP2009200389A (ja) * | 2008-02-25 | 2009-09-03 | Shinko Electric Ind Co Ltd | 電子部品内蔵基板の製造方法 |
US20090301766A1 (en) * | 2008-06-04 | 2009-12-10 | Samsung Electro-Mechanics Co., Ltd. | Printed circuit board including electronic component embedded therein and method of manufacturing the same |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100704936B1 (ko) | 2005-06-22 | 2007-04-09 | 삼성전기주식회사 | 전자부품 내장 인쇄회로기판 및 그 제작방법 |
-
2013
- 2013-08-31 JP JP2013180767A patent/JP2015050309A/ja active Pending
-
2014
- 2014-08-21 TW TW103128752A patent/TW201524297A/zh unknown
- 2014-08-26 US US14/468,707 patent/US9655248B2/en not_active Expired - Fee Related
- 2014-08-27 CN CN201410429133.0A patent/CN104427775A/zh active Pending
- 2014-08-27 KR KR20140112147A patent/KR20150026901A/ko not_active Application Discontinuation
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101010994A (zh) * | 2004-06-15 | 2007-08-01 | 伊姆贝拉电子有限公司 | 制造包括电连接到导体图案层的元件的电子模块的方法 |
CN1722935A (zh) * | 2004-07-14 | 2006-01-18 | 三星电机株式会社 | 包含嵌入式无源芯片的pcb的制造方法 |
US20070269590A1 (en) * | 2006-05-22 | 2007-11-22 | Hitachi Cable, Ltd. | Electronic device substrate, electronic device and methods for making same |
JP2009200389A (ja) * | 2008-02-25 | 2009-09-03 | Shinko Electric Ind Co Ltd | 電子部品内蔵基板の製造方法 |
US20090301766A1 (en) * | 2008-06-04 | 2009-12-10 | Samsung Electro-Mechanics Co., Ltd. | Printed circuit board including electronic component embedded therein and method of manufacturing the same |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2022160220A1 (zh) * | 2021-01-28 | 2022-08-04 | 京东方科技集团股份有限公司 | 布线基板、阵列基板和发光模组 |
GB2609810A (en) * | 2021-01-28 | 2023-02-15 | Boe Technology Group Co Ltd | Wiring substrate, array substrate, and light emitting module |
Also Published As
Publication number | Publication date |
---|---|
US20150059170A1 (en) | 2015-03-05 |
TW201524297A (zh) | 2015-06-16 |
US9655248B2 (en) | 2017-05-16 |
KR20150026901A (ko) | 2015-03-11 |
JP2015050309A (ja) | 2015-03-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C53 | Correction of patent of invention or patent application | ||
CB02 | Change of applicant information |
Address after: Kyoto Prefecture Applicant after: Circuit science and technology Co., Ltd. of KYOCERA Address before: Shiga Applicant before: Kyocera SLC Technologies Corporation |
|
COR | Change of bibliographic data |
Free format text: CORRECT: APPLICANT; FROM: KYOCERA SLC TECHNOLOGIES CORP. TO: KYOCERA CIRCUIT SOLUTIONS, INC. Free format text: CORRECT: ADDRESS; FROM: |
|
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20160615 Address after: Kyoto Japan Applicant after: KYOCERA Corporation Address before: Kyoto Prefecture Applicant before: Circuit science and technology Co., Ltd. of KYOCERA |
|
WD01 | Invention patent application deemed withdrawn after publication | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20150318 |