CN104409432A - Connection structure of power device and heat emission device and manufacture method thereof - Google Patents
Connection structure of power device and heat emission device and manufacture method thereof Download PDFInfo
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- CN104409432A CN104409432A CN201410705816.4A CN201410705816A CN104409432A CN 104409432 A CN104409432 A CN 104409432A CN 201410705816 A CN201410705816 A CN 201410705816A CN 104409432 A CN104409432 A CN 104409432A
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- power device
- radiating element
- heat
- heat emission
- emission device
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Abstract
The invention discloses a connection structure of a power device and a heat emission device. The connection structure of the power device and the heat emission device comprises the power device and the heat emission device, wherein the power device is connected and fixed with the heat emission device through heat conducting metal. The invention further discloses a manufacture method of the connection structure of the power device and the heat emission device. The power device and the heat emission device are fixed to each other by melting tin metal, so that the power device and the heat emission device are tightly adhered to each other, the tin layer in the middle can transfer heat, the heat emitted by the power device can be rapidly emitted to the heat emission device through the tin layer, the heat conducting performance is improved, the heat transfer efficiency is quickened, the connection between the power device and the heat emission device is firmer and more stable, the reliability and the anti-vibration performance of the structure are enhanced during practical use, the structure can be applied to various high-vibration and high-strength harsh environments, the service life is prolonged, and the machining cost is reduced.
Description
Technical field
The invention belongs to Heat Dissipation Technology for Power Device field, be specifically related to syndeton of a kind of power device and radiating element and preparation method thereof.
Background technology
Mostly use the compound mode of power device such as MOS and fin in the radiating effect commonly used at present, in compound mode, mostly coordinate the mode such as heat conductive silica gel or silicone grease based on common laminating, rivet, bolt and nut locking etc. again.Manufacturing procedure complexity is there is in these modes, combination high in cost of production problem, topmost problem is that the bottleneck in all modes is that heat is owing to needing the transmission by intermediate layer silica gel or silicone grease, cause heat-transfer effect not good, radiating effect is limited, and in practical service environment firmly in reliability not high.Simultaneously in use between longly easily to come off afterwards, useful life is short.
Summary of the invention
In view of this, the technical problem to be solved in the present invention be a kind ofly to be connected firmly, heat transference efficiency is high, thermal diffusivity good, the syndeton of resistant to elevated temperatures power device and radiating element and preparation method thereof.
In order to solve the problems of the technologies described above, the present invention adopts following scheme to realize: the syndeton of a kind of power device and radiating element, comprises power device and radiating element, is connected and fixed between power device and radiating element by heat-conducting metal.
Wherein, described heat-conducting metal is tin cream, solder.
A manufacture method for the syndeton of power device and radiating element, comprises power device and radiating element 2, comprises the steps:
(1) one deck heat-conducting metal is coated with on the surface of power device or the surface of radiating element;
(2) power device and radiating element laminating compress, and then carry out Reflow Soldering or pressure welding;
(3) power device and radiating element put into hot environment, melt heat-conducting metal, and power device and radiating element laminating are fixed.
Wherein, the temperature of described hot environment is 270 DEG C ~ 400 DEG C.
Compared with prior art, melted fixing between power device of the present invention and radiating element by tin metalloid, both are made to fit tightly together, middle tin layers can pass to heat energy, the heat energy that power device is distributed can be imported in radiating element fast by tin layers, improve heat conductivility, accelerate heat transfer efficiency, and the connection between radiating element and power device is more firmly with stable, enhance product reliability in actual use and shockproof properties, can use under the adverse circumstances of multiple height vibration high strength, improve useful life, reduce processing cost.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention.
Embodiment
In order to allow those skilled in the art understand technical scheme of the present invention better, below in conjunction with accompanying drawing, the present invention is further elaborated.
Embodiment 1
As shown in Figure 1, the syndeton of a kind of power device and radiating element, comprise power device 1 and radiating element 2, between power device 1 and radiating element 2, weld one deck heat-conducting metal 3, by the heat-conducting metal of welding, power device 1 and radiating element 2 are connected and fixed.The heat-conducting metal used is tin cream, solder etc.
Embodiment 2
A manufacture method for the syndeton of power device and radiating element, comprises power device 1 and radiating element 2, comprises the steps:
(1) at surperficial pre-coating one deck tin cream 3 of power device 1;
(2) power device 1 being coated with the side of tin cream fitted with radiating element 2 compress, then carry out power device and radiator and put into vertical reflow soldering and carry out Reflow Soldering, make power device 1 and radiating element 2 tentatively fixing;
(3) power device 1 and radiating element 2 put into the hot environment of 340 DEG C, are melted by tin cream, realize fixing between power device 1 and radiating element 2, make power device 1 and radiating element 2 fit tightly and fixedly secure with the tin melted.
Embodiment 3
A manufacture method for the syndeton of power device and radiating element, comprises power device 1 and radiating element 2, comprises the steps:
(1) at surperficial pre-coating one deck solder 3 of radiating element 1;
(2) power device 1 being coated with the side of solder fitted with radiating element 2 compress, then carry out power device and radiator carries out pressure welding, make power device 1 and radiating element 2 tentatively fixing;
(3) power device 1 and radiating element 2 put into the hot environment of 400 DEG C, are melted by tin cream, realize fixing between power device 1 and radiating element 2, make power device 1 and radiating element 2 fit tightly and fixedly secure with the tin melted.
Temperature in hot environment in above embodiment to be not limited in above embodiment 340 DEG C and 400 DEG C, can be said to be and other the arbitrary temperature values in 270 DEG C ~ 400 DEG C can be selected to carry out melting heat-conducting metal, make power device and radiating element fit tightly and fixedly secure.
Above-described embodiment is only wherein specific implementation of the present invention, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these apparent replacement forms all belong to protection scope of the present invention.
Claims (4)
1. a syndeton for power device and radiating element, is characterized in that, comprises power device (1) and radiating element (2), is connected and fixed between power device (1) and radiating element (2) by heat-conducting metal (3).
2. the syndeton of power device according to claim 1 and radiating element, is characterized in that, described heat-conducting metal (3) is tin cream, solder.
3. a manufacture method for the syndeton of power device and radiating element, comprises power device (1) and radiating element (2), it is characterized in that, comprise the steps:
(1) one deck heat-conducting metal (3) is coated with on the surface of the surface of power device (1) or radiating element (2);
(2) power device (1) and radiating element (2) laminating compress, and then carry out Reflow Soldering or pressure welding;
(3) power device (1) and radiating element (2) put into hot environment, melt heat-conducting metal (3), and power device (1) and radiating element (2) laminating are fixed.
4. the manufacture method of the syndeton of power device according to claim 3 and radiating element, is characterized in that, the temperature of described hot environment is 270 DEG C ~ 400 DEG C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410705816.4A CN104409432A (en) | 2014-12-01 | 2014-12-01 | Connection structure of power device and heat emission device and manufacture method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410705816.4A CN104409432A (en) | 2014-12-01 | 2014-12-01 | Connection structure of power device and heat emission device and manufacture method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104409432A true CN104409432A (en) | 2015-03-11 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410705816.4A Pending CN104409432A (en) | 2014-12-01 | 2014-12-01 | Connection structure of power device and heat emission device and manufacture method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104409432A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6294244B1 (en) * | 1997-12-22 | 2001-09-25 | Kyocera Corporation | Wiring board having excellent heat-radiating property |
| CN101325165A (en) * | 2008-07-24 | 2008-12-17 | 哈尔滨海格科技发展有限责任公司 | Method for joining radiator and power component with low heat |
| JP2009032996A (en) * | 2007-07-28 | 2009-02-12 | Sumitomo Electric Ind Ltd | Manufacturing method of heat radiation structure |
-
2014
- 2014-12-01 CN CN201410705816.4A patent/CN104409432A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6294244B1 (en) * | 1997-12-22 | 2001-09-25 | Kyocera Corporation | Wiring board having excellent heat-radiating property |
| JP2009032996A (en) * | 2007-07-28 | 2009-02-12 | Sumitomo Electric Ind Ltd | Manufacturing method of heat radiation structure |
| CN101325165A (en) * | 2008-07-24 | 2008-12-17 | 哈尔滨海格科技发展有限责任公司 | Method for joining radiator and power component with low heat |
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Application publication date: 20150311 |
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| RJ01 | Rejection of invention patent application after publication |