CN101363596A - Method of manufacturing LED lamp - Google Patents
Method of manufacturing LED lamp Download PDFInfo
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- CN101363596A CN101363596A CNA2008102160781A CN200810216078A CN101363596A CN 101363596 A CN101363596 A CN 101363596A CN A2008102160781 A CNA2008102160781 A CN A2008102160781A CN 200810216078 A CN200810216078 A CN 200810216078A CN 101363596 A CN101363596 A CN 101363596A
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- led light
- heat
- light source
- light fixture
- housing
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Abstract
The invention discloses a manufacturing method of LED lamps, which comprises the following steps: weldable treatment is carried out on the surfaces to be connected of an LED light source and a shell body; a tin-based brazing material, a copper-based brazing material and a silver-based brazing material are put on the surfaces treated by the weldable treatment; the LED light source and the shell body are shut, and a certain pressure is applied and the heating is carried out to melt the tin-based brazing material, the copper-based brazing material and the silver-based brazing material so as to weld the LED light source and the shell body together. As almost no aging problems of the tin-based brazing material, the copper-based brazing material and the silver-based brazing material exist, therefore, the problem that 'the thermosetting or liquid heat conduction glue (lipid) can go aging easily during the long using process, which leads the heat transfer capacity among interfaces of the light source and the shell (a radiator) to decrease greatly and leads the performance of LED lamps to decrease' does not exist. By adopting the invention, the heat transfer capacity of the LED lamp can be more excellent.
Description
Technical field
The present invention relates to the manufacture method of a kind of light emitting diode (Light Emitting Diode is called for short LED) lamp radiator.
Background technology
The manufacture method of existing LED light fixture is to be coated with one deck thermosetting heat-conducting glue or liquid phase thermal grease conduction on the interface between led light source and housing.With screw led light source and housing are fastened together again; The LED light fixture for the treatment of that is coated with hot-setting adhesive is lighted the back heating and is linked together through forming construction bonds after a period of time between adhesive curing light source and housing (radiator).
Thermosetting heat-conducting glue that is coated with on the interface between led light source and housing or liquid phase thermal grease conduction, it mainly acts on is the heat-transfer capability that increases between the interface.Cause heat-transfer capability between light source and shell interface to decline to a great extent to cause LED light fixture performance to descend but thermosetting or liquid phase heat-conducting glue (fat) are aging easily in long-term use.
Summary of the invention
Technical problem to be solved by this invention is exactly in order to overcome above deficiency, has proposed the manufacture method of the LED light fixture that a kind of heat-sinking capability can not descend.
Technical problem of the present invention is solved by following technical scheme:
A kind of manufacture method of LED light fixture comprises the steps: that the surface that led light source and housing is to be connected carries out solderability and handle; Place tinbase, copper base, money base cored solder on the surface after handling through solderability; Led light source and housing are closed up, grant certain pressure and heating therebetween tinbase, copper base, the fusing of money base cored solder are welded together led light source and housing.
Also comprise the steps: A, thermal conductivity factor is not less than 0.9 modified resin and normal direction radiance is not less than 0.89 powder and is modulated into coating, electrophoresis material; B, the radiating fin of LED lamp casing is carried out plasma treatment, be prepared in the surface of radiating fin again with the described coating that is modulated into, electrophoresis material in modes such as spraying, dipping, electrophoresis, chemical vapour deposition (CVD)s.
Described modified resin comprises in modified epoxy, silicon class, polyimides, the diphenylene ether resin at least a, and described powder comprises in CNT, carborundum, the zirconia at least a.
Also comprise the steps: a, make at least two heat-sink units, each heat-sink unit all comprises led light source and housing respectively; B, each heat-sink unit is become one.
Described step b is specific as follows: by support or connector or welding or aluminium die casting each heat-sink unit is become one.
The beneficial effect that the present invention is compared with the prior art is: because the light source of LED light fixture is connected with welding manner with housing, interface between light source and housing is tinbase, copper base, money base scolder, tinbase, copper base, money base scolder almost do not have aging problem, therefore just do not have the problem of " thermosetting or liquid phase heat-conducting glue (fat) in long-term use aging easily cause heat-transfer capability between light source and housing (radiator) interface to decline to a great extent cause the decline of LED light fixture performance ".And the thermal conductivity of thermosetting heat-conducting glue or liquid phase thermal grease conduction seldom is higher than 12W/MK, and tinbase, copper base, money base solder heat conductance generally are higher than 12W/MK, and it is more superior than the heat-transfer capability that connects the LED light fixture with thermosetting heat-conducting glue or liquid phase thermal grease conduction connected mode therefore to use this kind welding manner to connect the LED light fixture.
Description of drawings
Fig. 1 is the structural representation of housing of LED light fixture of the manufacturing of the specific embodiment of the invention;
Fig. 2 is the structural representation of the manufacturing heat-sink unit of the specific embodiment of the invention;
Fig. 3 is the structural representation of first kind of LED light fixture heat-sink unit making of the specific embodiment of the invention;
Fig. 4 is the structural representation of second kind of LED light fixture heat-sink unit making of the specific embodiment of the invention;
Fig. 5 is the structural representation of the third LED light fixture heat-sink unit of making of the specific embodiment of the invention;
Fig. 6 is the structural representation of the 4th kind of LED light fixture heat-sink unit making of the specific embodiment of the invention;
Fig. 7 is to use the specific embodiment of the invention to make the cross-sectional schematic of LED light fixture.
The specific embodiment
Also in conjunction with the accompanying drawings the present invention is described in further details below by concrete embodiment.
A kind of manufacture method of LED light fixture comprises the steps:
The surface that led light source and housing is to be connected is carried out solderability and is handled.
Place tinbase, copper base, money base cored solder on the surface after handling through solderability.
Led light source and housing are closed up, grant certain pressure and heating therebetween tinbase, copper base, the fusing of money base cored solder are welded together led light source and housing.
Because the light source of LED light fixture is connected with welding manner with housing, interface between light source and housing is tinbase, copper base, money base scolder, tinbase, copper base, money base scolder almost do not have aging problem, therefore just do not have the problem of " thermosetting or liquid phase heat-conducting glue (fat) in long-term use aging easily cause heat-transfer capability between light source and housing (radiator) interface to decline to a great extent cause the decline of LED light fixture performance ".And the thermal conductivity of thermosetting heat-conducting glue or liquid phase thermal grease conduction seldom is higher than 12W/MK, and tinbase, copper base, money base solder heat conductance generally are higher than 12W/MK, and it is more superior than the heat-transfer capability that connects the LED light fixture with thermosetting heat-conducting glue or liquid phase thermal grease conduction connected mode therefore to use this kind welding manner to connect the LED light fixture.
Further refinement of manufacture method of the present invention:
According to the design power of final LED light fixture, can produce at least LED light fixture junior unit (making the light fixture of 2 5W or 5 2W as the LED light fixture of a 10W earlier) earlier, then with these junior units or integrated than little two times powers of Design of Luminaires power.The manufacture method of described LED light fixture can comprise the steps:
The first step: make at least two heat-sink units, each heat-sink unit all comprises LED and housing respectively.
As shown in Figure 1, make the heat-sink unit housing earlier, described heat-sink unit housing comprises thermal balance plate 14 and radiating fin 15.Again the high-heating radiation coating being carried out on radiating fin 15 surfaces of heat-sink unit housing handles.Described high-heating radiation coating is handled and is referred to: thermal conductivity factor is not less than 0.9 modified resin and normal direction radiance is not less than 0.89 powder and is modulated into coating, electrophoresis material.Described modified resin comprises modified epoxy, silicon class, polyimides (Polyimide is called for short PI), diphenylene ether resin (PPO), and described powder comprises CNT, carborundum, zirconia.The LED lamp radiator is carried out plasma treatment, be prepared in radiating fin 15 surfaces of LED lamp radiator again with the described coating that is modulated into, electrophoresis material in modes such as spraying, dipping, electrophoresis, chemical vapour deposition (CVD)s.Handle the LED light fixture of making through above-mentioned high-heating radiation coating, under the same test condition, the more existing anodized of its heat-sinking capability promotes 10～12%, handles heat-sinking capability than existing black and promotes 5～7%.Because the lifting of heat-sinking capability, LED lamp casing (radiator) weight under the constant situation of heat-sinking capability can be done gentlyer, and then alleviates the weight of whole LED light fixture.
As shown in Figure 2, by welding manner LED is connected with housing then, particularly, led light source 11 is to be welded on the thermal balance plate 14.Particularly, earlier solderability being carried out on the led light source 11 and the surface to be connected of thermal balance plate 14 handles.Place tinbase, copper base, money base cored solder on the surface after handling then through solderability.At last led light source 11 and thermal balance plate 14 are closed up, grant certain pressure and heating therebetween tinbase, copper base, the fusing of money base cored solder are welded together led light source 11 and thermal balance plate 14.As shown in Figure 7, the led light source 11 on each heat-sink unit 1 and housing 13 are connected by welding manner.Interface between led light source 11 and the housing 13 is a scolder 5, and scolder 5 does not almost have aging problem.Therefore the problem that does not just have " thermosetting or liquid phase heat-conducting glue (fat) in long-term use aging easily cause heat-transfer capability between light source and housing (radiator) interface to decline to a great extent cause the decline of LED light fixture performance ".And scolder is higher than great majority " thermosetting or liquid phase heat-conducting glue (fat) " thermal conductivity, and the capacity of heat transmission of the present invention is stronger.
So just make and finished heat-sink unit.As required, can make a plurality of heat-sink units.
Second step: a plurality of heat-sink units are become one.Specific as follows: as shown in Figure 3, can each heat-sink unit 1 to be become one by support.As shown in Figure 4, can each heat-sink unit be become one by connector 3.As shown in Figure 5, each heat-sink unit 1 also can become one by welding.As shown in Figure 6, each heat-sink unit 1 also can become one by aluminium die casting.
The LED light fixture that makes as shown in Figure 7.
The present invention is by breaking the whole up into parts, and existing LED lamp radiator structural table area significantly increases.Under the constant situation of weight, heat-sinking capability increases significantly; Under the identical situation of heat-sinking capability, weight significantly reduces, and material is significantly saved.If certain LED has fault, as long as just will have the heat-sink unit at fault LED place change can, will not pull down by the whole LED light fixture, simplified maintenance cost.Clear superiorities such as the present invention has the radiating efficiency height, economizes on resources, in light weight, dependable performance.
Above content be in conjunction with concrete preferred implementation to further describing that the present invention did, can not assert that concrete enforcement of the present invention is confined to these explanations.For the general technical staff of the technical field of the invention, without departing from the inventive concept of the premise, can also make some simple deduction or replace, all should be considered as belonging to protection scope of the present invention.
Claims (5)
1. the manufacture method of a LED light fixture is characterized in that: comprise the steps:
The first step: the surface that led light source and housing is to be connected is carried out solderability and is handled;
Second step: place tinbase, copper base, money base cored solder on the surface after handling through solderability;
The 3rd step: led light source and housing are closed up, grant certain pressure and heating therebetween tinbase, copper base, the fusing of money base cored solder are welded together led light source and housing.
2. the manufacture method of LED light fixture according to claim 1 is characterized in that: also comprise the steps:
A, thermal conductivity factor is not less than 0.9 modified resin and normal direction radiance is not less than 0.89 powder and is modulated into coating, electrophoresis material;
B, the radiating fin of LED lamp casing is carried out plasma treatment, be prepared in the surface of radiating fin again with the described coating that is modulated into, electrophoresis material in modes such as spraying, dipping, electrophoresis, chemical vapour deposition (CVD)s.
3. the manufacture method of LED light fixture according to claim 2, it is characterized in that: described modified resin comprises in modified epoxy, silicon class, polyimides, the diphenylene ether resin at least a, and described powder comprises in CNT, carborundum, the zirconia at least a.
4. the manufacture method of LED light fixture according to claim 1 is characterized in that: also comprise the steps:
A, at least two heat-sink units of manufacturing, each heat-sink unit all comprises led light source and housing respectively;
B, each heat-sink unit is become one.
5. the manufacture method of LED light fixture according to claim 3 is characterized in that: described step b is specific as follows: by support or connector or welding or aluminium die casting each heat-sink unit is become one.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008102160781A CN101363596A (en) | 2008-09-10 | 2008-09-10 | Method of manufacturing LED lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008102160781A CN101363596A (en) | 2008-09-10 | 2008-09-10 | Method of manufacturing LED lamp |
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| Publication Number | Publication Date |
|---|---|
| CN101363596A true CN101363596A (en) | 2009-02-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2008102160781A Pending CN101363596A (en) | 2008-09-10 | 2008-09-10 | Method of manufacturing LED lamp |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101709853A (en) * | 2009-11-03 | 2010-05-19 | 山东浪潮华光照明有限公司 | Welding method of LED light source |
| WO2013189184A1 (en) * | 2012-06-20 | 2013-12-27 | Lin Peilin | Straight-soldered led luminaire structure and method for processing same |
| CN107559631A (en) * | 2017-08-16 | 2018-01-09 | 芜湖晶鑫光电照明有限公司 | A kind of LED flat lamp technological process of production |
-
2008
- 2008-09-10 CN CNA2008102160781A patent/CN101363596A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101709853A (en) * | 2009-11-03 | 2010-05-19 | 山东浪潮华光照明有限公司 | Welding method of LED light source |
| CN101709853B (en) * | 2009-11-03 | 2014-01-29 | 山东浪潮华光照明有限公司 | Welding method of LED light source |
| WO2013189184A1 (en) * | 2012-06-20 | 2013-12-27 | Lin Peilin | Straight-soldered led luminaire structure and method for processing same |
| WO2013189129A1 (en) * | 2012-06-20 | 2013-12-27 | 林培林 | Process for producing heat-dissipation structure of led luminaire formed by soldering copper substrate and aluminum base |
| CN107559631A (en) * | 2017-08-16 | 2018-01-09 | 芜湖晶鑫光电照明有限公司 | A kind of LED flat lamp technological process of production |
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