CN204694983U - Wavelength converting device, light-source system and projector equipment - Google Patents

Wavelength converting device, light-source system and projector equipment Download PDF

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Publication number
CN204694983U
CN204694983U CN201520269384.7U CN201520269384U CN204694983U CN 204694983 U CN204694983 U CN 204694983U CN 201520269384 U CN201520269384 U CN 201520269384U CN 204694983 U CN204694983 U CN 204694983U
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layer
wavelength converting
metal layer
converting device
ceramic layer
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CN201520269384.7U
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田梓峰
许颜正
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Shenzhen Appotronics Corp Ltd
Shenzhen Appotronics Technology Co Ltd
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Appotronics Corp Ltd
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Priority to PCT/CN2016/080641 priority patent/WO2016173526A1/en
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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B21/00Projectors or projection-type viewers; Accessories therefor
    • G03B21/14Details
    • G03B21/20Lamp housings

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Projection Apparatus (AREA)

Abstract

This application discloses a kind of wavelength converting device, comprise luminescent layer, reflecting ceramic layer and metal layer; Described luminescent layer is arranged at the surface of the side of described reflecting ceramic layer, and described metal layer to be arranged on described reflecting ceramic layer and not overlapping with described luminescent layer.Wavelength converting device in the application, because reflecting ceramic layer has good thermal stability, can keep higher reflectivity, can bright dipping efficiently and stably.Meanwhile, metal layer is set at the part surface of reflecting ceramic layer, improves the temperature conductivity of reflecting ceramic layer on the one hand, can when high-power light-emitting, dispel the heat fast, ensure that bright dipping efficiently and stably, improve the structural strength of reflecting ceramic layer on the other hand.Disclosed herein as well is the light-source system of this wavelength converting device of a kind of application and apply the projector equipment of this light-source system.

Description

Wavelength converting device, light-source system and projector equipment
Technical field
The utility model relates to illumination and display technique field, the particularly wavelength converting device of one.Also relate to the light-source system of this wavelength converting device of a kind of application and apply the projector equipment of this light-source system.
Background technology
Along with the development of display and lighting technology, original halogen bulb more and more can not meet the demand of display and lighting field to high power and high brightness as light source.The exciting light adopting solid state light emitter to send as LD (Laser Diode, laser diode) can obtain the visible ray of shades of colour with the method for excitation wavelength transition material, this technology is applied in illumination and display more and more.This technology has the advantage that efficiency is high, less energy consumption, cost are low, the life-span is long, is the desirable replacement scheme of existing white light or monochromatic light light source.
At present, the efficiency of reflective Wavelength converter is high, and be widely used in illumination and display device, the primary structure form of reflective Wavelength converter is colour wheel, and it comprises the luminescent layer, reflector layer and the heat-conducting substrate that are cascading.Existing colour wheel is mainly divided into two types: one is mirror-reflection structure, directly solidifying by organic silica gel phosphor powder layer bonds on specular aluminium metal substrate, organosilicon phosphor powder layer is luminescent layer, and specular aluminium metal substrate plays reflector layer and heat-conducting substrate simultaneously; The second is diffuse reflector structure, i.e. direct sintering diffuse reflector and fluorescence coating successively on heat-conducting substrate.
For above-mentioned mirror-reflection structure, the reflectivity of reflector layer thermal conductivity height that is high and heat-conducting substrate is its advantage, but fluorescence coating is made up of organic adhesive sealing-in fluorescent powder, the thermal conductivity of fluorescence coating and temperature tolerance are all lower, and the weather resistance of the reflectance coating of specular aluminium sheet metal is poor, easily at high temperature there is sulfidation-oxidation, make reflection reliability lower.
And for above-mentioned diffuse reflector structure, generally be made up of scattering particles and glass dust, the thermal stability of its reflectivity is far above mirror-reflection structure, but, be mainly scattering particles, the reflectivity that scattering particles will make diffuse reflector reach enough due to what play reflex in diffuse reflector, need certain thickness be laminated to, and the thickness that the existence of glass dust causes diffuse reflector to reach required reflectivity increases further, the heat causing luminescent layer to produce is difficult to be exhaled by diffuse reflector by this.In addition, because the capacity of heat transmission of glass dust is poor, cause heat accumulation, the heat making luminescent layer produce further cannot be dispersed, thus reduces the luminescence efficiency that light source reliability also reduces luminescent layer simultaneously, causes source efficiency low.
In sum, how to make wavelength converting device have high reflectance and high thermal stability simultaneously, thus meet the bright dipping keeping efficient stable when high-power light-emitting, become those skilled in the art's problem demanding prompt solution.
Utility model content
In view of this, the purpose of this utility model is to provide a kind of wavelength converting device, can have high reflectance and high thermal stability simultaneously, thus meet the bright dipping keeping efficient stable when high-power light-emitting.
Another object of the present utility model is provide the light-source system of this wavelength converting device of a kind of application and apply the projector equipment of this light-source system.
For achieving the above object, the utility model provides following technical scheme:
A kind of wavelength converting device, comprises luminescent layer, reflecting ceramic layer and metal layer; Described luminescent layer is arranged at the surface of the side of described reflecting ceramic layer, and described metal layer is arranged on the surface of described reflecting ceramic layer, and described metal layer is not overlapping with described luminescent layer.
Preferably, in above-mentioned wavelength converting device, described metal layer is arranged on the surface of the side relative with described luminescent layer of described reflecting ceramic layer, and the area of described metal layer is less than the area of this side surface of described reflecting ceramic layer.
Preferably, in above-mentioned wavelength converting device, the area of described metal layer is 1/36 ~ 1/4 of the area on the surface of this side of the reflecting ceramic layer at its place.
Preferably, in above-mentioned wavelength converting device, described metal layer comprises the first metal layer and the second metal layer, described first metal layer and described luminescent layer are positioned on the same surface of described reflecting ceramic layer, and described second metal layer is positioned on the surface of the opposite side of described reflecting ceramic layer.
Preferably, in above-mentioned wavelength converting device, described first metal layer is arranged symmetrically with the relative described reflecting ceramic layer of described second metal layer.
Preferably, in above-mentioned wavelength converting device, the area being provided with the surface of the side of described second metal layer of described reflecting ceramic layer is more than or equal to the area of described second metal layer.
Preferably, in above-mentioned wavelength converting device, the coat of metal of the outer surface being arranged on described metal layer is also comprised.
Preferably, in above-mentioned wavelength converting device, also comprise heat dissipation metal substrate, described heat dissipation metal substrate is fixedly connected with the described coat of metal.
Preferably, in above-mentioned wavelength converting device, the described coat of metal is nickel coating or the two coating of nickel gold.
Preferably, in above-mentioned wavelength converting device, described reflecting ceramic layer is aluminium oxide ceramics, zirconia ceramics or alumina zirconia composite ceramics.
Preferably, in above-mentioned wavelength converting device, described reflecting ceramic layer is annular disk or disc structure, and described luminescent layer is annular or fan annular.
The utility model additionally provides a kind of light-source system, comprises illuminator and wavelength converting device, and described wavelength converting device is the wavelength converting device described in above any one.
The utility model additionally provides a kind of projector equipment, comprises light-source system, and described light-source system is light-source system described above.
Compared with prior art, the beneficial effects of the utility model are:
In the wavelength converting device that the utility model provides, comprise luminescent layer, reflecting ceramic layer and metal layer, luminescent layer is arranged at the surface of the side of reflecting ceramic layer, not overlapping with luminescent layer on the surface that metal layer is arranged on reflecting ceramic layer.Reflected by the surface of emitting ceramic layer, because reflecting ceramic layer itself has good thermal stability, the situation that the specular layer that there will not be mirror-reflection structure to exist at high temperature is oxidized, therefore, the part surface of reflecting ceramic layer is utilized to reflect, higher reflectivity can be kept, can bright dipping efficiently and stably.Meanwhile, metal layer is set at the part surface of reflecting ceramic layer, improves the temperature conductivity of reflecting ceramic layer on the one hand, can when high-power light-emitting, dispel the heat fast, ensure that bright dipping efficiently and stably, improve the structural strength of reflecting ceramic layer on the other hand.
The light-source system that the utility model provides owing to have employed the wavelength converting device in the application, therefore, it is possible to the luminescence of efficient stable.Projector equipment have employed the light-source system in the application, therefore, it is possible to ensure the stability of the light of projection.
Accompanying drawing explanation
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only embodiment of the present utility model, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to the accompanying drawing provided.
Fig. 1 to walk around the schematic top plan view of device for a kind of wavelength that the utility model embodiment provides;
Fig. 2 is A-A schematic cross-section in Fig. 1;
Fig. 3 is close-up schematic view in the dotted line frame in Fig. 2;
The partial enlargement cross-sectional schematic of the wavelength converting device of the second that Fig. 4 provides for the utility model embodiment;
The partial enlargement cross-sectional schematic of the third wavelength converting device that Fig. 5 the utility model embodiment provides.
Wherein, 1 be luminescent layer, 2 be reflecting ceramic layer, 3 be the coat of metal, 5 be heat dissipation metal substrate for metal layer, 301 to be the first metal layer, 302 be the second metal layer, 4.
Embodiment
Core of the present utility model there is provided a kind of wavelength converting device, has high reflectance and high thermal stability simultaneously, when high-power light-emitting, can keep bright dipping efficiently and stably.
The utility model additionally provides the light-source system of this wavelength converting device of a kind of application and applies the projector equipment of this light-source system.
Below in conjunction with the accompanying drawing in the utility model embodiment, be clearly and completely described the technical scheme in the utility model embodiment, obviously, described embodiment is only the utility model part embodiment, instead of whole embodiments.Based on the embodiment in the utility model, those of ordinary skill in the art are not making the every other embodiment obtained under creative work prerequisite, all belong to the scope of the utility model protection.
Please refer to Fig. 1-Fig. 5, wherein, the structure in Fig. 3-Fig. 5 is the enlarged diagram in Fig. 2 in dotted line frame.Fig. 1 and Fig. 2 gives a kind of shape of wavelength converting device; shape is annular; the shape of certain wavelength converting device can also be other structure; be not specifically limited at this; the arrangement focusing on the layer section of wavelength converting device of the present utility model; therefore, as long as the arrangement of layer section, other variform wavelength converting device all belongs to protection domain of the present utility model.The utility model embodiment provides a kind of wavelength converting device, comprises luminescent layer 1, reflecting ceramic layer 2 and metal layer 3; Wherein, reflecting ceramic layer 2 is annular disk structure, as shown in Figure 1, also can be disc structure; Luminescent layer 1 is arranged on the surface of the side of reflecting ceramic layer 2, and luminescent layer 1 can sinter the surface at reflecting ceramic layer 2, and luminescent layer 1 is annular or fan annular; Utilize the card of reflecting ceramic layer 2 directly to reflect, the surface for reflecting can be the surface that reflecting ceramic layer 2 contacts with luminescent layer 1, visible, and the surface of reflecting ceramic layer 2 can directly be reflected; Metal layer 3 is arranged on the surface of reflecting ceramic layer 2, and be positioned on the surface outside luminescent layer 1, namely metal layer 3 and luminescent layer 1 not overlapping, the material of metal layer 3 is preferably copper, also can be other materials such as aluminium, can the modes such as direct copper method, vacuum brazing or diffusion in vacuum soldering be adopted on the surface of reflecting ceramic layer 2 metal layer 3 to be arranged at the surface of reflecting ceramic layer 2.
Above-mentioned wavelength converting device have employed reflecting ceramic layer 2, reflecting ceramic layer 2 is preferably white, and the reflecting ceramic layer 2 of white can not produce interference to the color of light, certainly, when needing the light obtaining particular color, reflecting ceramic layer 2 also can adopt other color.Because reflecting ceramic layer 2 has high thermal stability compared to specular aluminium metal substrate, reflectivity is also higher, there will not be the situation that specular aluminium sheet metal is at high temperature oxidized, thus can keep bright dipping efficiently and stably.Simultaneously, arrange metal layer 3 at the part surface of reflecting ceramic layer 2, improve the thermal conductivity of reflecting ceramic layer 2 on the one hand, the heat that luminescent layer 1 is produced spreads rapidly and distributes in time, temperatures involved can not be produced to luminescent layer 1, maintain bright dipping efficiently and stably further; On the other hand, metal layer 3 solves the poor problem of the toughness of reflecting ceramic layer 2, and improve structural strength, thermal shock resistance is improved, thus can directly as substrate, and structure is more simple and reliable.
As shown in Figure 3, the utility model embodiment provides a kind of arrangement form of metal layer 3, metal layer 3 is arranged on the surface of the side relative with luminescent layer 1 of reflecting ceramic layer 2, and the area of metal layer 3 is less than the area of this side surface of reflecting ceramic layer 2.Namely metal layer 3 is set in the single side surface of reflecting ceramic layer 2, because the coefficient of thermal expansion of metal layer 3 is much larger than the coefficient of thermal expansion of reflecting ceramic layer 2, reflecting ceramic layer 2 is prepared metal layer 3 and be there is larger thermal stress, and in the process of further high temperature sintering luminescent layer 1, also can accumulating section thermal stress between reflecting ceramic layer 2 and metal layer 3, its structural stress causes bonding loosely even reflecting ceramic layer 2 buckling deformation of metal layer 3, therefore, in order to weaken this impact, the area of metal layer 3 is considered to reduce, the area of metal layer 3 is made to be less than the area of the single side surface of reflecting ceramic layer 2, the thermal stress because coefficient of thermal expansion difference causes deformation difference to produce can be weakened like this, thus improve anti-seismic performance and the structural stability of reflecting ceramic layer 2.
According to convention, the area area relative reflection ceramic layer 2 of metal layer 3 being provided with the surface of the side of this metal layer 3 is less, then thermal stress is less, but consider that heat dissipation metal substrate 5 needs and metal layer 3 welds, the too small heat dissipation metal substrate 5 that causes of the area of metal layer 3 is too small with the bonding area of metal layer 3, and its weld strength can be affected; Meanwhile, luminescent layer 1 conducts to heat dissipation metal substrate 5 at the heat of excitation process, and too small metal layer 3 area can reduce heat transfer area, and unfavorable for heat transfer, thus its area can not be too little.In the present embodiment, the area of metal layer 3 is preferably 1/36 ~ 1/4 of the area on the surface of side reflecting ceramic layer 2 being provided with this metal layer 3, is more preferably 1/16 ~ 1/9.Now, the present embodiment does not limit at this for the area of luminescent layer 1 and shape, and the area of luminescent layer 1 can be less than or equal to the area on the surface of side reflecting ceramic layer 2 being provided with this luminescent layer 1.
Although have employed the one-sided mode arranging metal layer 3 at reflecting ceramic layer in figure 3, still there is thermal stress.In order to eliminate thermal stress better, as shown in Figure 4 and Figure 5, the utility model embodiment provides the arrangement form of another kind of metal layer 3, metal layer 3 comprises the first metal layer 301 and the second metal layer 302, first metal layer 301 is positioned on the same surface of reflecting ceramic layer 2 with luminescent layer 1, and the second metal layer 302 is positioned on the surface (surface relative with luminescent layer 1) of the opposite side of reflecting ceramic layer 2.Namely metal layer 3 is all set in the both side surface of reflecting ceramic layer 2, the thermal stress that the both side surface of reflecting ceramic layer 2 exists can partly be cancelled out each other, thus further increase structural stability and the anti-seismic performance of reflecting ceramic layer 2, and metal layer 3 more not easily occur bonding loosely with the situation of reflecting ceramic layer 2 buckling deformation.
As optimization, as shown in Figure 4, first metal layer 301 and the second metal layer 302 relative reflection ceramic layer 2 are arranged symmetrically with, concrete, the first metal layer 301 and the second metal layer 302 are circular ring, and both shapes are identical, be separately positioned on the both side surface of reflecting ceramic layer 2, wherein, luminescent layer 1 is circular ring, and between two annulus being embedded in the first metal layer 301.It is symmetrical that the thermal stress that can make reflecting ceramic layer 2 both side surface is set like this, thus cancels out each other further, improve its structural stability.
Certainly, first metal layer 301 and the second metal layer 302 also can unsymmetrical arrangement, as shown in Figure 5, be described for annular disk structure for reflecting ceramic layer 2, the area of the second metal layer 302 is less than or equal to the area of the one-sided card of reflecting ceramic layer 2, the area that Fig. 5 gives the second metal layer 302 equals the situation of the one-sided card area of reflecting ceramic layer 2, namely the second metal layer 302 covers in the one-sided card of reflecting ceramic layer 2, and the structure of the first metal layer 301 is identical with the structure of a upper embodiment, now, the area of the second metal layer 302 is greater than the area of the first metal layer 301, certainly, the second metal layer 302 area can be less than or be greater than the area of the first metal layer 301, can reach equally and slacken thermal stress, improve the effect of structural stability.
On the basis of above metal layer 3 arrangement, present embodiments provide another kind of wavelength converting apparatus structure, as shown in Figure 3-Figure 5, also comprise the coat of metal 4 of the outer surface being arranged on metal layer 3.The coat of metal 4 covers the outer surface of metal layer 3, plays the effect preventing metal layer 3 to be oxidized, and protects metal layer 3.Certainly, also can not arrange the coat of metal 4, arranging the coat of metal 4 is preferred schemes.
As shown in Figure 1, in order to accelerate the heat radiation of wavelength converting device, the wavelength converting device in the present embodiment also comprises heat dissipation metal substrate 5, and heat dissipation metal substrate 5 is fixedly connected with the coat of metal 4, is generally and is welded and fixed.By heat dissipation metal substrate 5 increasing heat radiation area, thus accelerate the heat radiation of wavelength converting device.Certainly, also can not arrange heat dissipation metal substrate 5, arranging heat dissipation metal substrate 5 is preferred schemes.
The present embodiment is optimized the coat of metal 4, and the coat of metal 4 is nickel coating or the two coating layer of nickel gold, namely can be plating single metal, also can electroplate various metals, as long as can play the not oxidized effect of protection metal layer 3.
In the present embodiment, the material of reflecting ceramic layer 2 is preferably aluminium oxide ceramics, zirconia ceramics or alumina zirconia composite ceramics.These materials have the surface of diffuse reflection effect, and thermal stability is high, and reflectivity is high, are suitable as very much reflecting ceramic layer 2.
Metal layer 3 in above embodiment can utilize pattern technology to make, and produces the metal layer figure of different area and shape, meets the dimensional requirement of various Wavelength converter.
Because reflecting ceramic layer 2 can as load bearing board, on its surface sintering luminescent layer 1 (fluorescent glass layer), relative to the heat-conducting substrate made by luminescent ceramic of the prior art, fluorescent glass layer more easily makes various different size and shape, as annulus, the Wavelength converter of eccentric circular ring, and cost is lower, more easily realizes mass production.Particularly easily volume production makes the thin slice fluorescent glass layer of thickness 0.01 ~ 0.5mm scope, and in this thickness range, luminescent ceramic processing difficulties, particularly like this for large scale thin slice.
The utility model embodiment still provides a kind of light-source system, comprises illuminator and wavelength converting device, wherein, and the wavelength converting device of wavelength converting device described by above whole embodiment.Owing to have employed the wavelength converting device in the application, therefore this light-source system can the bright dipping of more efficient stable.
The utility model additionally provides a kind of projector equipment, comprises light-source system, wherein, and the light-source system of light-source system described in the application.This light-source system has the advantage of efficient stable luminescence.Concrete reason repeats no more.
In this instructions, each embodiment adopts the mode of going forward one by one to describe, and what each embodiment stressed is the difference with other embodiments, between each embodiment identical similar portion mutually see.
To the above-mentioned explanation of the disclosed embodiments, professional and technical personnel in the field are realized or uses the utility model.To be apparent for those skilled in the art to the multiple amendment of these embodiments, General Principle as defined herein when not departing from spirit or scope of the present utility model, can realize in other embodiments.Therefore, the utility model can not be restricted to these embodiments shown in this article, but will meet the widest scope consistent with principle disclosed herein and features of novelty.

Claims (13)

1. a wavelength converting device, is characterized in that, comprises luminescent layer (1), reflecting ceramic layer (2) and metal layer (3); Described luminescent layer (1) is arranged at the surface of the side of described reflecting ceramic layer (2), described metal layer (3) is arranged on the surface of described reflecting ceramic layer (2), and described metal layer (3) is not overlapping with described luminescent layer (1).
2. wavelength converting device according to claim 1, it is characterized in that, described metal layer (3) is arranged on the surface of the side relative with described luminescent layer of described reflecting ceramic layer (2), and the area of described metal layer (3) is less than the area of this side surface of described reflecting ceramic layer (2).
3. wavelength converting device according to claim 2, is characterized in that, the area of described metal layer (3) is 1/36 ~ 1/4 of the area of this side surface of the described reflecting ceramic layer (2) at its place.
4. wavelength converting device according to claim 1, it is characterized in that, described metal layer (3) comprises the first metal layer (301) and the second metal layer (302), described first metal layer (301) and described luminescent layer (1) are positioned on the same surface of described reflecting ceramic layer (2), and described second metal layer (302) is positioned on the surface of the opposite side of described reflecting ceramic layer (2).
5. wavelength converting device according to claim 4, is characterized in that, described first metal layer (301) described reflecting ceramic layer (2) relative to described second metal layer (302) is arranged symmetrically with.
6. wavelength converting device according to claim 4, it is characterized in that, the area being provided with the surface of the side of described second metal layer (302) of described reflecting ceramic layer (2) is more than or equal to the area of described second metal layer (302).
7. the wavelength converting device according to any one of claim 1-6, is characterized in that, also comprises the coat of metal (4) of the outer surface being arranged on described metal layer (3).
8. wavelength converting device according to claim 7, is characterized in that, also comprises heat dissipation metal substrate (5), and described heat dissipation metal substrate (5) is fixedly connected with the described coat of metal (4).
9. wavelength converting device according to claim 7, is characterized in that, the described coat of metal (4) is nickel coating or the two coating of nickel gold.
10. wavelength converting device according to claim 1, is characterized in that, the material of described reflecting ceramic layer (2) is aluminium oxide ceramics, zirconia ceramics or alumina zirconia composite ceramics.
11. wavelength converting devices according to claim 1, is characterized in that, described reflecting ceramic layer (2) is annular disk or disc structure, and described luminescent layer (1) is annular or fan annular.
12. 1 kinds of light-source systems, comprise illuminator and wavelength converting device, it is characterized in that, described wavelength converting device is the wavelength converting device described in any one of claim 1-11.
13. 1 kinds of projector equipments, comprise light-source system, it is characterized in that, described light-source system is light-source system according to claim 12.
CN201520269384.7U 2015-04-29 2015-04-29 Wavelength converting device, light-source system and projector equipment Active CN204694983U (en)

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CN201520269384.7U CN204694983U (en) 2015-04-29 2015-04-29 Wavelength converting device, light-source system and projector equipment
PCT/CN2016/080641 WO2016173526A1 (en) 2015-04-29 2016-04-29 Wavelength conversion device, light source system, and projection device

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Cited By (4)

* Cited by examiner, † Cited by third party
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WO2016173526A1 (en) * 2015-04-29 2016-11-03 深圳市光峰光电技术有限公司 Wavelength conversion device, light source system, and projection device
CN112526808A (en) * 2019-09-19 2021-03-19 青岛海信激光显示股份有限公司 Fluorescent conversion member, method for manufacturing fluorescent conversion member, light source device, and display system
CN112526809A (en) * 2019-09-19 2021-03-19 青岛海信激光显示股份有限公司 Fluorescent conversion member, method for manufacturing fluorescent conversion member, light source device, and display system
CN112526805A (en) * 2019-09-19 2021-03-19 青岛海信激光显示股份有限公司 Fluorescent conversion member, method for manufacturing fluorescent conversion member, light source device, and display system

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JP2012185980A (en) * 2011-03-04 2012-09-27 Nippon Electric Glass Co Ltd Wavelength conversion element, light source including the same and manufacturing method of the same
CN103968332B (en) * 2013-01-25 2015-10-07 深圳市光峰光电技术有限公司 A kind of Wavelength converter, light-emitting device and optical projection system
CN203259763U (en) * 2013-05-17 2013-10-30 深圳市绎立锐光科技开发有限公司 Wavelength conversion device and light-emitting device
CN203549686U (en) * 2013-10-16 2014-04-16 深圳市绎立锐光科技开发有限公司 Wavelength conversion device and relevant light source system and projection system
CN104534409B (en) * 2014-12-15 2017-02-22 杨毅 wavelength conversion device and light-emitting device
CN204694983U (en) * 2015-04-29 2015-10-07 深圳市光峰光电技术有限公司 Wavelength converting device, light-source system and projector equipment

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016173526A1 (en) * 2015-04-29 2016-11-03 深圳市光峰光电技术有限公司 Wavelength conversion device, light source system, and projection device
CN112526808A (en) * 2019-09-19 2021-03-19 青岛海信激光显示股份有限公司 Fluorescent conversion member, method for manufacturing fluorescent conversion member, light source device, and display system
CN112526809A (en) * 2019-09-19 2021-03-19 青岛海信激光显示股份有限公司 Fluorescent conversion member, method for manufacturing fluorescent conversion member, light source device, and display system
CN112526805A (en) * 2019-09-19 2021-03-19 青岛海信激光显示股份有限公司 Fluorescent conversion member, method for manufacturing fluorescent conversion member, light source device, and display system

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Address after: 518000 20-22, 20-22 headquarters building, 63 high tech Zone, Xuefu Road, Nanshan District, Guangdong Province, Guangdong.

Patentee after: APPOTRONICS Corp.,Ltd.

Address before: 518000 Nanshan District, Shenzhen, Guangdong, Guangdong Province, Guangdong Road, 63 Xuefu Road, high-tech zone, 21 headquarters building, 22 floor.

Patentee before: SHENZHEN GUANGFENG TECHNOLOGY Co.,Ltd.

Address after: 518000 Nanshan District, Shenzhen, Guangdong, Guangdong Province, Guangdong Road, 63 Xuefu Road, high-tech zone, 21 headquarters building, 22 floor.

Patentee after: SHENZHEN GUANGFENG TECHNOLOGY Co.,Ltd.

Address before: 518055 Shenzhen, Shenzhen, Guangdong 1089 Nanshan District road 1089, Shenzhen integrated circuit design application Industrial Park, 4 floor.

Patentee before: APPOTRONICS Corp.,Ltd.

CP03 Change of name, title or address