CN112526809A

CN112526809A - Fluorescent conversion member, method for manufacturing fluorescent conversion member, light source device, and display system

Info

Publication number: CN112526809A
Application number: CN201910888244.0A
Authority: CN
Inventors: 张勇; 韩五月
Original assignee: Qingdao Hisense Laser Display Co Ltd
Current assignee: Qingdao Hisense Laser Display Co Ltd
Priority date: 2019-09-19
Filing date: 2019-09-19
Publication date: 2021-03-19

Abstract

The application discloses a fluorescence conversion component, a manufacturing method thereof, a light source device and a display system, and relates to the technical field of projection display. The fluorescence conversion member may include: fluorescence conversion subassembly, load-bearing component and heat-conducting layer. The heat generated after the fluorescent powder layer in the fluorescent conversion assembly is irradiated by the laser beam can be conducted to each area of the heat conducting layer, the problem that the temperature of a local area in the fluorescent powder layer is high is avoided, the efficiency of converting fluorescent light by the fluorescent powder layer is guaranteed, and the display effect of the display system is further guaranteed.

Description

Fluorescent conversion member, method for manufacturing fluorescent conversion member, light source device, and display system

Technical Field

The present disclosure relates to the field of projection display technologies, and in particular, to a fluorescent conversion member, a manufacturing method thereof, a light source device, and a display system.

Background

Laser is used in the field of projection display because of its advantages of high brightness, strong monochromaticity, wide color gamut, etc. The laser light source generally uses a laser beam to excite the phosphor powder to emit light, and the light of the laser beam and the generated fluorescence are irradiated on the imaging component to realize image display.

In the related art, a laser light source generally includes a laser and a fluorescent wheel. The fluorescent wheel may include: the fluorescent powder layer, the bearing substrate and the driving assembly. The carrier substrate may include a reflective region and a transmissive region. The phosphor layer may be located in a reflective region of the carrier substrate, and the driving assembly may be configured to drive the phosphor layer and the carrier substrate to rotate. When the laser beam emitted by the laser irradiates the fluorescent powder layer (i.e., the reflection area), the fluorescent powder layer can generate fluorescent light under the irradiation of the laser beam, the fluorescent light can be reflected by the bearing substrate and irradiates the display assembly, and when the laser beam emitted by the laser irradiates the transmission area, the laser beam can be transmitted and then irradiates the display assembly. The fluorescent wheel can rotate under the driving of the driving assembly, so that fluorescent light and laser beams can be sequentially irradiated to the display assembly, and image display is realized.

However, since the phosphor layer generates a large amount of heat after being irradiated by the laser beam, the heat cannot be dissipated quickly and can be gathered on the phosphor layer, which results in higher heat of the phosphor layer, poorer conversion efficiency of the phosphor, and further poorer display effect of the display system.

Disclosure of Invention

The application provides a fluorescence conversion component, a manufacturing method thereof, a light source device and a display system, which can solve the problem that the display effect of the display system is poor due to poor conversion efficiency of fluorescence in the related technology. The technical scheme is as follows:

in one aspect, there is provided a fluorescence conversion member comprising: the device comprises a fluorescence conversion assembly, a bearing assembly, a heat conduction layer and a solder layer;

the fluorescence conversion assembly comprises: the fluorescent powder layer and the reflecting layer are arranged in a stacked mode;

the bearing assembly comprises: a carrier substrate;

the solder layer is positioned between the fluorescent conversion component and the bearing component, and the fluorescent conversion component and the bearing component are welded through the solder layer;

the heat conduction layer is located in the fluorescence conversion assembly, or the heat conduction layer is located on the bearing substrate.

Optionally, the fluorescence conversion component further comprises: a first metal solderable layer;

the first metal solderable layer is located between the solder layer and the reflection layer.

Optionally, the fluorescence conversion component further comprises: a first solder resist layer;

the first solder mask layer is positioned on one side of the first metal weldable layer close to the reflecting layer.

Optionally, the fluorescence conversion component further comprises: a second metal solderable layer;

the second metal solderable layer is located on one surface of the bearing substrate.

Optionally, the fluorescence conversion component further comprises: a second solder resist layer;

the second solder mask layer is positioned on one surface of the second metal weldable layer close to the bearing substrate.

Optionally, when the heat conducting layer is located in the fluorescent conversion assembly,

the solder layer, the heat conduction layer, the reflection layer and the fluorescent powder layer are sequentially stacked along the direction far away from the bearing substrate.

Optionally, the material of the solder layer includes: gold-tin alloy.

Optionally, the material of the heat conducting layer includes: at least one of silver, copper, gold, and aluminum.

Optionally, the thickness of the thermally conductive layer ranges from 10 microns to 200 microns.

Optionally, the fluorescence conversion component further includes: an optical antireflection film;

the optical antireflection film is positioned on one surface of the fluorescent powder layer far away from the reflecting layer.

Optionally, the fluorescence conversion component further comprises: a drive assembly;

the driving assembly is connected with the bearing substrate and used for driving the bearing substrate, the solder layer, the heat conduction layer and the fluorescence conversion assembly to rotate.

In another aspect, there is provided a method of manufacturing a fluorescence conversion member, the method including:

providing a fluorescent conversion assembly, a bearing assembly and a heat conduction layer, wherein the fluorescent conversion assembly comprises a fluorescent powder layer and a reflecting layer which are arranged in a stacked mode, and the bearing assembly comprises a bearing substrate;

providing a solder layer;

welding the fluorescent conversion component and the bearing component through the solder layer;

the heat conduction layer is located in the fluorescent conversion assembly, or the heat conduction layer is located on the bearing substrate.

In yet another aspect, there is provided a light source device, including: a laser and a fluorescence conversion member as described in the above aspect.

In yet another aspect, a display system is provided, the display system comprising: the light source device according to the above aspect.

The beneficial effect that technical scheme that this application provided brought includes at least:

the present application provides a fluorescence conversion member, a method of manufacturing the same, a light source device, and a display system, the fluorescence conversion member may include: fluorescence conversion subassembly, load-bearing component and heat-conducting layer. The heat generated after the fluorescent powder layer in the fluorescent conversion assembly is irradiated by the laser beam can be conducted to each area of the heat conducting layer, the problem that the temperature of a local area in the fluorescent powder layer is high is avoided, the efficiency of converting fluorescent light by the fluorescent powder layer is guaranteed, and the display effect of the display system is further guaranteed.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

FIG. 1 is a schematic structural diagram of a fluorescence conversion member according to an embodiment of the present invention;

FIG. 2 is a schematic structural diagram of another fluorescence conversion member provided in an embodiment of the present invention;

FIG. 3 is a schematic structural diagram of another fluorescence conversion component provided in the embodiment of the present invention;

FIG. 4 is a schematic structural diagram of another fluorescence conversion member according to an embodiment of the present invention;

FIG. 5 is a schematic structural diagram of still another fluorescence conversion member according to an embodiment of the present invention;

FIG. 6 is a schematic structural diagram of still another fluorescence conversion member according to an embodiment of the present invention;

FIG. 7 is a schematic structural diagram of still another fluorescence conversion member according to an embodiment of the present invention;

FIG. 8 is a schematic structural diagram of still another fluorescence conversion member according to an embodiment of the present invention;

FIG. 9 is a schematic structural diagram of still another fluorescence conversion member according to an embodiment of the present invention;

FIG. 10 is a schematic structural view of still another fluorescence conversion member according to an embodiment of the present invention;

FIG. 11 is a schematic structural view of still another fluorescence conversion member according to an embodiment of the present invention;

FIG. 12 is a schematic structural view of still another fluorescence conversion member according to an embodiment of the present invention;

FIG. 13 is a schematic structural view of still another fluorescence conversion member according to an embodiment of the present invention;

FIG. 14 is a schematic structural view of still another fluorescence conversion member according to an embodiment of the present invention;

FIG. 15 is a schematic structural view of still another fluorescence conversion member according to an embodiment of the present invention;

FIG. 16 is a schematic structural view of still another fluorescence conversion member according to an embodiment of the present invention;

FIG. 17 is a flow chart of a method of manufacturing a fluorescence conversion member according to an embodiment of the present invention;

FIG. 18 is a flow chart of another method of manufacturing a fluorescence conversion member according to an embodiment of the present invention;

FIG. 19 is a flow chart of yet another method of fabricating a fluorescence conversion member according to an embodiment of the present invention;

fig. 20 is a schematic structural diagram of a light source device according to an embodiment of the present invention;

fig. 21 is a schematic structural diagram of a display system according to an embodiment of the present invention.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Fig. 1 is a schematic structural diagram of a fluorescence conversion component according to an embodiment of the present invention. As can be seen with reference to fig. 1, the fluorescence conversion member 00 may include: phosphor conversion assembly 001, carrier assembly 002, thermally conductive layer 003, and solder layer 004.

The fluorescence conversion assembly 001 may include: a phosphor layer 0011 and a reflective layer 0012 are stacked. The bearing assembly 002 may include: a carrier substrate 0021. A solder layer 004 can be positioned between the phosphor conversion assembly 001 and the carrier assembly 002, and the phosphor conversion assembly 001 and the carrier assembly 002 can be soldered through the solder layer 004.

In fig. 1, the heat conducting layer 003 can be located in the phosphor conversion assembly 001, or in fig. 2, the heat conducting layer 003 can also be located on the carrier substrate 0021.

In the embodiment of the present invention, the phosphor layer 0011 may generate fluorescence under the irradiation of the laser beam, and the fluorescence may be reflected by the reflective layer 0012 and then irradiated on the display component. The reflective layer 0012 can be located between the phosphor layer 0011 and the heat conduction layer 003, so that the reflective layer 0012 can effectively reflect the phosphor generated by the phosphor layer 0011.

Because the heat conducting layer 003 is arranged in the fluorescent conversion part 00 in the embodiment of the invention, the heat generated after the fluorescent powder layer 0011 is irradiated by the laser beam can be conducted to each area of the heat conducting layer 003, the heat difference of each area of the fluorescent conversion part 00 is small, and the problem that the fluorescent conversion efficiency of the fluorescent powder layer 0011 is poor due to the fact that the heat of the area irradiated by the laser beam in the fluorescent conversion part 00 is high, and the display effect of a display system is further influenced is avoided.

In summary, embodiments of the present invention provide a fluorescence conversion component, which may include: the fluorescent conversion component, the bearing component, the heat conduction layer and the solder layer. The heat generated after the fluorescent powder layer in the fluorescent conversion assembly is irradiated by the laser beam can be conducted to each area of the heat conducting layer, the problem that the temperature of a local area in the fluorescent powder layer is high is avoided, the efficiency of converting fluorescent light by the fluorescent powder layer is guaranteed, and the display effect of the display system is further guaranteed.

In the embodiment of the present invention, the material of the heat conductive layer 003 may be a metal with high heat conduction efficiency. Optionally, the material of the heat conductive layer 003 may include: at least one of silver, copper, gold, and aluminum. The heat conduction efficiency of silver, copper, gold and aluminum is high, heat generated after the fluorescent powder layer 0011 is irradiated by the laser beams can be rapidly conducted to each area of the heat conduction layer 003, the temperature of the area, irradiated by the laser beams, of the fluorescent powder layer 0011 is reduced, the local temperature of the fluorescent powder layer 0011 can be prevented from being high, and the heat dissipation capacity of the fluorescent conversion part can be improved.

For example, the material of the heat conductive layer 003 may be copper, or may be gold. In consideration of the high cost of gold, the material of the heat conductive layer 003 provided by the embodiment of the present invention may be copper. Of course, the material of the heat conductive layer 003 in the embodiment of the present invention may also be other materials having heat conductive performance, which is not limited in the embodiment of the present invention.

Alternatively, the thickness of the thermally conductive layer 003 may range from 10 μm (micrometers) to 200 μm. Illustratively, the thickness of the thermally conductive layer 003 may be 100 μm.

In an embodiment of the present invention, the material of the solder layer 004 may include: gold-tin alloy. For example, the material of the solder layer 004 is a gold-tin eutectic alloy including 80 mass% gold and 20 mass% tin, i.e., Au80Sn 20. This solder layer 004 can also be referred to as a gold-tin eutectic layer.

Alternatively, the thickness of the solder layer 004 may range from 10 μm to 100 μm. Illustratively, the thickness of the solder layer 004 may be 50 μm.

In an embodiment of the present invention, the material of the phosphor layer 0011 may include: yttrium Aluminum Garnet (YAG) phosphors and ceramics. Alternatively, the material of the phosphor layer 0011 may include only: YAG fluorescent powder. The YAG phosphor in the phosphor layer 0011 can generate fluorescence under irradiation of a laser beam.

By way of example, assuming that the material of the phosphor layer 0011 includes red YAG phosphor, the red YAG phosphor in the phosphor layer 0011 may generate red phosphor under irradiation of a laser beam, that is, phosphor having a wavelength ranging from 625nm (nanometers) to 740 nm.

Alternatively, the thickness of the phosphor layer 0011 may range from 0.05mm (millimeters) to 1 mm. Illustratively, the thickness of the phosphor layer 0011 may be 0.5 mm.

It should be noted that the material of the phosphor layer 0011 may include a plurality of different colors of YAG phosphors, and each color of YAG phosphor may be located in a different region of the phosphor layer 0011, so that when the laser beam is irradiated to the different region of the phosphor layer 0011, different colors of fluorescence are generated.

As an example, the material of the phosphor layer 0011 may include red YAG phosphor and green YAG phosphor, and red phosphor may be generated when a laser beam is irradiated to a region where the red YAG phosphor is disposed, and green phosphor may be generated when the laser beam is irradiated to a region where the green YAG phosphor is disposed.

In an embodiment of the present invention, the material of the reflective layer 0012 may include: a dielectric or a metal. The reflective layer 0012 may be used to reflect the fluorescence generated by the phosphor layer 0011 under irradiation of the laser beam. In order to ensure the reflection efficiency of the reflective layer 0012, the material of the reflective layer 0012 may be a medium.

For example, assuming that the phosphor layer 0011 can generate red fluorescence under irradiation of laser light, the emission layer 0042 may be used to reflect the red fluorescence, i.e., to reflect fluorescence having a wavelength ranging from 625nm to 740 nm.

Alternatively, the thickness of the reflective layer 0012 may be in the range of 0.5 μm to 10 μm. Illustratively, the thickness of the reflective layer 0012 may be 5 μm.

In an embodiment of the present invention, the material of the carrier substrate 0021 may include: a metal. For example, the material of the supporting substrate 0021 may be aluminum or tungsten copper alloy. The carrier substrate 0021 may also be referred to as an aluminum substrate or a tungsten copper substrate. Of course, the material of the supporting substrate 0021 may also include a non-metallic material that can meet the supporting requirement, for example, the material of the supporting substrate 0021 may be alumina or ceramic. The alumina may be referred to as sapphire, and the supporting substrate 0021 may be referred to as a sapphire substrate or a ceramic substrate.

Alternatively, the thickness of the carrier substrate 0021 may range from 0.1mm to 2 mm. The diameter D of the carrier substrate 0021 may range from 20mm to 120 mm. By way of example, the carrier substrate 0021 can have a thickness of 1 mm. The diameter D of the carrier substrate 0021 can be 100 mm. The diameter D of the carrier substrate 0021 may be a length of the carrier substrate 0021 along a first direction X, and the first direction X may be perpendicular to a stacking direction of the thermal conductive layer 003, the phosphor layer 0011, the reflective layer 0012, and the solder layer 004.

As an alternative implementation, referring to fig. 1, when the heat conducting layer 003 is located in the phosphor conversion assembly 001, the solder layer 004, the heat conducting layer 003, the reflective layer 0012 and the phosphor layer 0011 may be sequentially stacked in a direction away from the carrier substrate 0021. The solder layer 004 can be used to solder the carrier substrate 0021 and the heat conductive layer 003 on both sides of the solder layer 004.

As another alternative implementation, referring to fig. 2, when the heat conducting layer 003 is located on the carrier substrate 0021, the heat conducting layer 003, the solder layer 004, the reflective layer 0012 and the phosphor layer 0011 may be sequentially stacked in a direction away from the carrier substrate 0021. The solder layer 004 can be used to solder the thermally conductive layer 0013 and the reflective layer 0012 on both sides of the solder layer 004.

As can be seen with reference to fig. 3 and 4, the fluorescence conversion member 00 may further include: the first metal solderable layer 005. Referring to fig. 3, the first metal solderable layer 005 can be located between a solder layer 004 and a heat conductive layer 003, and the solder layer 004 can be used for soldering the first metal solderable layer 005 and a carrier substrate 0021 on two sides of the solder layer 004. Alternatively, referring to fig. 4, the first metal solderable layer 005 can be located between the solder layer 004 and the reflective layer 0012, and the solder layer 004 can be used to solder the thermally conductive layer 003 and the first metal solderable layer 005 on both sides of the solder layer 004.

As can be seen with reference to fig. 5 and 6, the fluorescence conversion member 00 may further include: the first solder resist layer 006. The first solder mask layer 006 can be located on a side of the first metal solderable layer 005 away from the solder layer 004. That is, referring to fig. 5, the first solder resist layer 006 may be located between the first metal solderable layer 005 and the thermally conductive layer 003, and the solder layer 004 may be used to solder the carrier substrate 0021 and the first metal solderable layer 005 on both sides of the solder layer 004. Alternatively, referring to fig. 6, the first solder resist layer 006 may be located between the first metal solderable layer 005 and the reflective layer 0012, and the solder layer 004 may be used to solder the heat conductive layer 003 and the first metal solderable layer 005 on both sides of the solder layer 004.

As can be seen with reference to fig. 7 and 8, the fluorescence conversion member 00 may further include: the second metal layer 007. Referring to fig. 7, the second metal layer 007 is located on one side of the carrier substrate 0021, that is, the second metal layer 007 may be located between the carrier substrate 0021 and the solder layer 004, and the solder layer 004 may be used for soldering the heat conductive layer 003 and the second metal layer 007 located on two sides of the solder layer 004. Alternatively, referring to fig. 8, the second metal layer 007 may be located on a side of the heat conductive layer 003 away from the carrier substrate 0021, that is, the second metal layer 007 may be located between the heat conductive layer 003 and the solder layer 004, and the solder layer 004 may be used for soldering the reflective layer 0012 and the second metal layer 007 located on two sides of the solder layer 004.

Referring to fig. 9 and 10, the fluorescence conversion member 00 may further include: and a second solder mask layer 008. The second solder mask 008 may be located on a side of the second metal solderable layer 007 close to the carrier substrate 0021. Referring to fig. 9, the second solder resist layer 008 may be located between the second metal layer 007 and the carrier substrate 0021, and the solder layer 004 may be used to solder the second metal layer 007 and the thermally conductive layer 003 on both sides of the solder layer 004. Referring to fig. 10, the second solder resist layer 008 may be located between the second metal solder layer 007 and the heat conductive layer 003, and the solder layer 004 may be used to solder the reflective layer 0012 and the second metal solder layer 007 on both sides of the solder layer 004.

Of course, referring to fig. 11 and 12, the fluorescent conversion member 00 may further include a first metal solderable layer 005, a first solder resist layer 006, a second metal solderable layer 007 and a second solder resist layer 008 at the same time, and the solder layer 004 may be used to solder the first metal solderable layer 005 and the second metal solderable layer 007 on both sides of the solder layer 004.

Through set up first metal can weld layer 005, first solder mask 006, the second metal can weld layer 007 and second solder mask 008 in fluorescence conversion part 00, can avoid solder layer 004 when the welding lies in the structural layer of this solder layer 004 both sides, causes the damage to the structural layer of this solder layer 004 both sides, guarantees the quality of this fluorescence conversion part 00.

In an embodiment of the present invention, the materials of the first solder resist layer 006 and the second solder resist layer 008 may include: at least one of nickel or titanium. Because the heat conductivity of nickel is good, the material of the first solder resist layer 006 and the second solder resist layer 008 can be nickel, and the heat generated after the fluorescent powder layer 0011 is irradiated by the laser beam can be conducted to the first solder resist layer 006 and the second solder resist layer 008, so that the heat dissipation capacity of the fluorescent conversion component is further improved.

Alternatively, the thickness of the first and second solder resist

layers

006 and 008 may range from 0.1 μm to 5 μm. For example, the thicknesses of the first solder resist layer 006 and the second solder resist layer 008 may be both 3 μm.

In an embodiment of the present invention, the material of the first and second metallic

solderable layers

005 and 007 may include: and (3) gold. The first and second metal

solderable layers

005 and 007 may have a thickness ranging from 0.1 μm to 2 μm. For example, the first and second metallic

solderable layers

005 and 007 may each have a thickness of 1 μm.

In the fluorescent conversion member 00 shown in fig. 11, the second solder resist layer 008, the second metal solderable layer 007, the solder layer 004, the first metal solderable layer 005, the first solder resist layer 006, the heat conductive layer 003, the reflective layer 0012, and the phosphor layer 0011 may be stacked in a direction away from the carrier substrate 0021.

In the fluorescent conversion member 00 shown in fig. 12, the heat conductive layer 003, the second solder resist layer 008, the second metal solderable layer 007, the solder layer 004, the first metal solderable layer 005, the first solder resist layer 006, the reflective layer 0012, and the phosphor layer 0011 may be stacked in a direction away from the carrier substrate 0021.

In an embodiment of the invention, an orthogonal projection of the thermally conductive layer 003 on the carrier substrate 0021 may overlap an orthogonal projection of the phosphor layer 0011 on the carrier substrate 0021. That is, the region where the heat generated by the phosphor layer 0011 after being irradiated by the laser beam can be conducted is the same as the region where the phosphor layer 0011 is orthographically projected on the carrier substrate 0021.

Alternatively, referring to fig. 13, when the heat conductive layer 003 is on the carrier substrate 0021, the orthographic projection of the phosphor layer 0011 on the carrier substrate 0021 may be within the orthographic projection of the heat conductive layer 003 on the carrier substrate 0021. That is, the orthographic projection area of the phosphor layer 0011 on the carrier substrate 0021 is located in the area where the heat generated after the phosphor layer 0011 is irradiated by the laser beam can be conducted, the range where the heat can be conducted is large, and the heat dissipation capability of the fluorescent conversion component 00 is increased.

For example, the area of the orthographic projection of the heat conductive layer 003 on the carrier substrate 0021 may be one to three times as large as the area of the orthographic projection of the phosphor layer 0011 on the carrier substrate 0021.

Fig. 14 is a schematic structural diagram of another fluorescence conversion member according to an embodiment of the present invention. Fig. 15 is a schematic structural view of still another fluorescence conversion member according to an embodiment of the present invention. As can be seen with reference to fig. 14 and 15, the fluorescence conversion member 00 may further include: optical antireflection film 009. The optical antireflection film 009 may be located at a side of the phosphor layer 0011 away from the reflective layer 0012.

That is, when the laser beam is irradiated to the fluorescent conversion member 00, the laser beam may be transmitted through the optical antireflection film 009 and then irradiated to the phosphor layer 0011. The optical antireflection film 009 can effectively prevent the color corresponding to the laser beam from being reflected. For example, if the laser beam is a blue laser beam, the optical antireflection film 009 may prevent the blue light from being reflected, i.e., may prevent the light having a wavelength ranging from 420nm to 470nm from being reflected.

Alternatively, the thickness of optical antireflection film 009 may range from 0.5 μm to 10 μm. Illustratively, the thickness of optical antireflection film 009 may be 5 μm.

Fig. 16 is a schematic structural diagram of another fluorescence conversion member according to an embodiment of the present invention. As can be seen with reference to fig. 16, the fluorescence conversion member 00 may further include: the drive assembly 010. This drive assembly 010 can be connected with load-bearing substrate 0021, and this drive assembly 010 can be used for driving load-bearing substrate 0021, solder layer 004, heat-conducting layer 003 and fluorescence conversion subassembly 001 and rotate.

For example, referring to fig. 16, the driving assembly 010 may be located on a side of the supporting substrate 0021 away from the fluorescence conversion assembly 001, and connected to the supporting substrate 0021.

Alternatively, the driving assembly 010 may be a driving motor or a driving motor. The embodiment of the present invention does not limit the specific implementation form of the driving assembly 010.

In the embodiment of the present invention, by providing the driving assembly 010, the fluorescent conversion assembly 001 can be driven to rotate at a higher speed, so that the problem that the efficiency of converting the fluorescent light of the phosphor layer 0011 into the fluorescent light is poor due to the higher heat of the area irradiated by the laser beam in the phosphor layer 0011 is avoided.

Fig. 17 is a flowchart of a method of manufacturing a fluorescence conversion member according to an embodiment of the present invention. As can be seen with reference to fig. 17, the method may include:

step 101, providing a fluorescence conversion assembly, a bearing assembly and a heat conduction layer.

The phosphor conversion assembly 001 may include a phosphor layer 0011 and a reflective layer 0012 stacked in layers, and the carrier assembly 002 may include a carrier substrate 0021.

Step 102, providing a solder layer.

And 103, welding the fluorescent conversion assembly and the bearing assembly through the solder layer.

In embodiments of the present invention, the solder layer 004 can be disposed between the reflective layer 0012 and the carrier substrate 0021, the thermally conductive layer 003 can be located in the phosphor conversion assembly 001, or the thermally conductive layer 003 can be located on the carrier substrate 0021. The phosphor layer 0011 can generate fluorescence under the irradiation of the laser beam, the fluorescence can be reflected by the reflective layer 0012 and then irradiated on the display component, and the reflective layer 0012 can effectively reflect the fluorescence generated by the phosphor layer 0011.

The heat conducting layer 003 is arranged in the fluorescent conversion part 00 manufactured by the manufacturing method provided by the embodiment of the invention, heat generated after the fluorescent powder layer 0011 is irradiated by the laser beam can be conducted to each area of the heat conducting layer 003, the heat difference of each area of the fluorescent conversion part 00 is small, and the problem that the fluorescent powder layer 0011 has poor efficiency of converting fluorescence due to high heat of the area irradiated by the laser beam in the fluorescent conversion part 00, and further the display effect of a display system is influenced, is avoided.

In summary, embodiments of the present invention provide a method of manufacturing a fluorescence conversion member, including: fluorescence conversion subassembly, load-bearing component and heat-conducting layer. The fluorescent conversion assembly includes a phosphor layer and a reflective layer. The heat generated after the fluorescent powder layer is irradiated by the laser beam can be conducted to each area of the heat conducting layer, the problem that the temperature of a local area in the fluorescent powder layer is high is solved, the efficiency of converting fluorescence of the fluorescent powder layer is guaranteed, and the display effect of the display system is good.

Fig. 18 is a flowchart of another method for manufacturing a fluorescence conversion member according to an embodiment of the present invention. As can be seen with reference to fig. 18, the method may include:

step 201, forming a phosphor layer by adopting a crystal growth mode.

In the embodiment of the invention, the YAG phosphor and the ceramic may be used to form the phosphor layer 0011 through crystal growth, and the phosphor layer 0011 may also be referred to as a ceramic phosphor layer. Alternatively, the phosphor layer may be formed by crystal growth using only YAG phosphor, and the phosphor layer 0011 may also be referred to as a single crystal phosphor layer.

Of course, the YAG phosphor and the ceramic may be sintered at a high temperature to form the phosphor layer 0011. Or the phosphor layer 0011 may be formed by sintering only YAG phosphor at a high temperature. The embodiment of the invention does not limit the material and the manner of forming the phosphor layer 0011.

Step 202, forming an optical antireflection film on one surface of the phosphor layer.

In the embodiment of the invention, the optical antireflection film 009 may be formed on one surface of the phosphor layer 0011 by evaporation or sputtering. The optical antireflection film 009 can effectively prevent the color corresponding to the laser beam from being reflected. For example, when a blue laser beam is irradiated to the fluorescence conversion member 00, the optical antireflection film 009 may effectively prevent the blue light from being reflected.

It should be noted that the optical antireflection film 008 may not be formed on one side of the phosphor layer 0011, and when the optical antireflection film 008 is not formed on one side of the phosphor layer 0011, a surface of the phosphor layer 0011 close to the laser beam may be roughened to increase roughness of the surface of the phosphor layer 0011 close to the laser beam, so as to reduce reflection of the laser beam.

Step 203, electroplating on the surface of the fluorescent powder layer away from the optical antireflection film to form a reflecting layer.

In an embodiment of the present invention, the material of the reflective layer 0012 may include: a dielectric or a metal. When the reflective layer 0012 is made of metal, the reflective layer 0012 can be formed on the surface of the phosphor layer 0011 away from the optical antireflection film 009 by electroplating. When the material of the reflective layer 0012 is a medium, the reflective layer 0012 can be formed on the surface of the phosphor layer 0011 away from the optical antireflection film 009 by evaporation or sputtering. The reflective layer 0012 may be used to reflect the fluorescence generated by the phosphor layer 0011 under irradiation of the laser beam.

And step 204, forming a heat conduction layer on one surface of the reflection layer far away from the fluorescent powder layer.

In the embodiment of the invention, the heat conducting layer 003 can be formed on the side of the reflecting layer 0012 far away from the phosphor layer 0011 by electroplating or vapor deposition. The heat conduction efficiency of the heat conduction layer 003 is high, heat generated after the fluorescent powder layer 0011 is irradiated by the laser beams can be rapidly conducted to each area of the heat conduction layer 003, the local temperature of the fluorescent powder layer 0011 can be prevented from being high, and the heat dissipation capacity of the fluorescent conversion part is improved.

And step 205, forming a first solder mask layer on one surface of the heat conduction layer, which is far away from the reflection layer.

In the embodiment of the present invention, the first solder resist layer 006 may be formed on a side of the heat conductive layer 003 away from the reflective layer 0012 by electroplating or vapor deposition using nickel. Because of the good thermal conductivity of nickel, the heat generated after the phosphor layer 0011 is irradiated by the laser beam can also be conducted to the first solder resist layer 006, further improving the heat dissipation capability of the phosphor conversion component.

And step 206, forming a first metal solderable layer on one surface, far away from the heat conducting layer, of the first solder mask layer.

In the embodiment of the present invention, the first metal solderable layer 005 can be formed on the side of the first solder mask layer 006 away from the thermal conductive layer 003 by electroplating or vapor deposition using gold.

Step 207, forming a second solder mask layer on one side of the carrier substrate.

In the embodiment of the present invention, the second solder resist layer 008 may be formed on one side of the carrier substrate 0021 by electroplating or vapor deposition using nickel. Since the heat conductivity of nickel is good, the heat generated after the phosphor layer 0011 is irradiated by the laser beam can also be conducted to the second solder resist layer 008, and the heat dissipation capability of the phosphor conversion component is further improved.

And 208, forming a second metal solderable layer on one surface, away from the bearing substrate, of the second solder mask layer.

In the embodiment of the invention, the second metal solderable layer 007 may be formed on the side of the second solder mask 008 far from the carrier substrate 0021 by electroplating or vapor deposition using gold.

Step 209 provides a solder layer.

In the embodiment of the present invention, the solder layer may be a gold-tin alloy composed of 80% by mass of gold and 20% by mass of tin, and the solder layer 004 may also be referred to as a gold-tin eutectic layer.

Step 210, heating the solder layer, and soldering the first metal solderable layer and the second metal solderable layer through the solder layer.

In the embodiment of the present invention, the solder layer 004 may be disposed between the first metal solderable layer 005 and the second metal solderable layer 007, and then the solder layer 004 may be heated, so that the first metal solderable layer 005 and the second metal solderable layer 007 are soldered by the solder layer 004, thereby ensuring the quality of the manufactured fluorescence conversion component 00.

Fig. 19 is a flowchart of another method for manufacturing a fluorescence conversion member according to an embodiment of the present invention. As can be seen with reference to fig. 19, the method may include:

and 301, forming a fluorescent powder layer by adopting a crystal growth mode.

Step 302, forming an optical antireflection film on one surface of the phosphor layer.

Step 303, forming a reflective layer on the surface of the phosphor layer away from the optical antireflection film.

And 304, forming a first solder mask layer on one surface of the heat conduction layer far away from the reflection layer.

Step 305, forming a first metal solderable layer on one surface of the first solder mask layer away from the reflective layer.

And step 306, forming a heat conduction layer on one surface of the bearing substrate.

And 307, forming a second solder mask layer on one surface of the heat conduction layer far away from the bearing substrate.

And 308, forming a second metal solderable layer on one surface, far away from the heat conducting layer, of the second solder mask layer.

Step 309 provides a solder layer.

Step 310, heating the solder layer, and soldering the first metal solderable layer and the second metal solderable layer through the solder layer.

In the embodiment of the present invention, the manufacturing method in steps 301 to 310 may refer to steps 201 to 210, and the embodiment of the present invention is not described herein again.

The sequence of the steps of the method for manufacturing a fluorescence conversion member according to the embodiment of the present invention may be appropriately adjusted, and the steps may be increased or decreased according to the circumstances. For example, steps 207 to 209 may be performed before step 201, steps 306 to 309 may be performed before step 301, and steps 202 and 302 may be deleted as appropriate. Any method that can be easily conceived by those skilled in the art within the technical scope of the present disclosure is covered by the protection scope of the present disclosure, and thus, the detailed description thereof is omitted.

In summary, embodiments of the present invention provide a method of manufacturing a fluorescence conversion member, including: fluorescence conversion subassembly, load-bearing component and heat-conducting layer. The heat generated after the fluorescent powder layer in the fluorescent conversion assembly is irradiated by the laser beam can be conducted to each area of the heat conducting layer, the problem that the temperature of the local area in the fluorescent powder layer is high is avoided, the efficiency of converting the fluorescent light by the fluorescent powder layer is guaranteed, and the display effect of the display system is good.

Fig. 20 is a schematic structural diagram of a light source device according to an embodiment of the present invention. As can be seen with reference to fig. 20, the light source device 40 may include a laser 401 and the fluorescence conversion member 00 provided in the above embodiment. The fluorescence conversion member 00 may be the fluorescence conversion member shown in any one of fig. 1 to 16.

The laser 401 may be used to generate a laser beam, and the fluorescence conversion member 00 may be used to generate fluorescence under irradiation of the laser beam.

As can be seen with reference to fig. 20, the light source device 40 may further include: a shaping optical path 402, a first diffusion component 403, a dichroic mirror 404, a second diffusion component 405, and a reflecting plate 406.

In the embodiment of the present invention, the laser 401 may be configured to emit a blue laser beam, and the blue laser beam may sequentially pass through the shaping optical path 402, the first diffusion component 403, and the dichroic mirror 404 to be focused and irradiated to the phosphor layer 0011 in the fluorescence conversion component 00, where the phosphor layer 0011 generates fluorescence under high-energy excitation of the blue laser beam. The fluorescence conversion member 00 may include a reflection part and a projection part. Wherein the reflection part may be coated with at least one of red phosphor and green phosphor. The transmission part may be made of a transparent material and may be used to transmit the blue laser beam.

The side of the fluorescence conversion part 00 close to the laser 401 is provided with a first lens assembly 407, and the first lens assembly 407 has dual functions of focusing and collimating. When the laser 401 emits a blue laser beam through the first lens assembly 407, the first lens assembly 407 can focus the blue laser beam into a smaller spot.

When the fluorescence conversion member 00 is rotated to the position of the reflection portion, the blue laser beam may be irradiated to the phosphor of the reflection portion, thereby exciting red fluorescence or green fluorescence. The excited red fluorescence or green fluorescence may be reflected by the reflective layer 0012 in the fluorescence conversion component 00, and transmit through the first lens component 407, and finally be reflected to the light source outlet through the dichroic mirror 404, so as to output the red fluorescence or green fluorescence.

When the fluorescence conversion member 00 is rotated to the position of the transmission portion, the fluorescence conversion member 00 can allow the blue laser beam to transmit therethrough. Since the blue laser beam is also diverged after being focused by the first lens assembly 407, the blue laser beam needs to be collimated when reaching the other side of the fluorescence conversion part 00 far from the laser 401. Therefore, a second transmission assembly 408 is disposed on the side of the fluorescence conversion part away from the laser 401, and the second transmission assembly 408 can be used for collimating the blue laser beam transmitted from the fluorescence conversion part 00, irradiating the parallel beam to the reflection plate 406, diffusing and homogenizing the beam by the second diffusion assembly 405, and then transmitting the dichroic mirror 404 to the light source outlet, so as to output blue light.

In the embodiment of the present invention, since the light path is reversible, the first lens assembly 407 and the second lens assembly 408 may be symmetrical with respect to the fluorescence conversion member, and the types of the first lens assembly 407 and the second lens assembly 408 may be the same.

Alternatively, the first lens assembly 407 and the second lens assembly 408 may each include one spherical lens and one hypersphere lens.

As can also be seen with reference to fig. 20, the light source device 40 may include: a color filter assembly 409 and a dodging integrator device 410. The color filter assembly 409 may be used to filter out light of colors other than the color to be output. For example, if the light to be output is blue light, the color filter component 409 may be used to filter out light of colors other than blue. The light homogenizing and integrating device 410 may irradiate the output light to the display assembly, thereby outputting an image.

Fig. 21 is a schematic structural diagram of a display system according to an embodiment of the present invention. As can be seen with reference to fig. 21, the display system may include: the above embodiment provides a light source device 40, a Digital Micromirror Device (DMD) 50, and a display assembly 60.

The DMD 50 may reflect the light output from the light source device 40 to the display component 60 under the control of the chip, and the display component 60 may implement image display. The display element 60 may be a display lens.

The above description is only exemplary of the present application and should not be taken as limiting, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims

1. A fluorescence conversion member, characterized by comprising: the device comprises a fluorescence conversion assembly, a bearing assembly, a heat conduction layer and a solder layer;

the bearing assembly comprises: a carrier substrate;

2. The fluorescence conversion member according to claim 1, further comprising: a first metal solderable layer;

3. The fluorescence conversion member according to claim 2, further comprising: a first solder resist layer;

4. The fluorescence conversion member according to claim 1, further comprising: a second metal solderable layer;

5. The fluorescence conversion member according to claim 4, further comprising: a second solder resist layer;

6. The fluorescence conversion member of claim 1, wherein when said thermally conductive layer is in said fluorescence conversion assembly,

7. The fluorescence conversion member according to any one of claims 1 to 6, wherein the material of the solder layer includes: gold-tin alloy.

8. The fluorescence conversion member according to any one of claims 1 to 6, wherein a material of the heat conductive layer includes: at least one of silver, copper, gold, and aluminum.

9. The fluorescence conversion member according to any one of claims 1 to 6, wherein a thickness of the heat conductive layer is in a range of 10 to 200 μm.

10. The fluorescence conversion member according to any one of claims 1 to 6, further comprising: an optical antireflection film;

11. The fluorescence conversion member according to any one of claims 1 to 6, further comprising: a drive assembly;

12. A method of manufacturing a fluorescence conversion member, characterized in that the method comprises:

providing a solder layer;

13. A light source device, characterized in that the light source device comprises: a laser and a fluorescence conversion member according to any one of claims 1 to 11.

14. A display system, characterized in that the display system comprises: the light source device of claim 13.